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STTH1002CBY-TR
Fast / Ultrafast Diode, 200 V, 16 A, Dual Common Cathode, 1.25 V, 25 ns, 50 A
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- Manufacturer: STMICROELECTRONICS
- Product type: Fast & Ultrafast Recovery Rectifier Diodes
- Repetitive Reverse Voltage Vrrm Max:200V; Forward Current If(AV):16A; Diode Configuration:Dual Common Cathode; Forward Voltage VF Max:1.25V; Reverse Recovery Time trr Max:25ns; Forward
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 3 Pin
- Product Range: -
- Qualification: AEC-Q101
- Diode Case Style: TO-252 (DPAK)
- Diode Configuration: Dual Common Cathode
- Forward Voltage Max: 1.25V
- Forward Surge Current: 50A
- Reverse Recovery Time: 25ns
- Average Forward Current: 16A
- Operating Temperature Max: 175°C
- Repetitive Peak Reverse Voltage: 200V
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.238 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
**==> picture [62 x 39] intentionally omitted <==** ## **STTH1002C-Y** ## Automotive hi h efficienc ultrafast diode g y ## **Features** - Suited for SMPS - Low losses - Low forward and reverse recovery times - High junction temperature - Low leakage current - AEC-Q101 qualified ## **Description** **==> picture [174 x 139] intentionally omitted <==** **----- Start of picture text -----**<br> A1<br>K<br>A2<br>K K<br>K A2 K<br>A2<br>A1 A1<br>DPAK D [2] PAK<br>STTH1002CBY STTH1002CGY<br>**----- End of picture text -----**<br> Dual center tap rectifier suited for switch mode power supplies and high frequency DC to DC converters. Packaged in DPAK and D[2] PAK, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection for automotive applications. ## **Table 1. Device summary** |**Symbol**|**Value**| |---|---| |IF(AV)|Up to 2 x 8A| |VRRM|200V| |Tj(max)|175 °C| |VF(typ)|0.78 V| |trr(typ)|20 ns| 1/9 November 2011 Doc ID 17536 Rev 2 _www.st.com_ **Characteristics** **STTH1002C-Y** ## **1 Characteristics** ## **Table 2. Absolute ratings (limiting values, per diode)** |**Symbol**|**Parameter**|||**Value**|**Unit**| |---|---|---|---|---|---| |VRRM|Repetitive peak reverse voltage|||200|V| |IF(RMS)|Forward rms current||D2PAK|20|A| ||||DPAK|10|| |IF(AV)|Avarage forward currentδ= 0.5|Tc= 155 °C|Per diode|5|A| |||Tc= 150 °C|Per device|10|| |||Tc= 135 °C|Per diode|8|| |||Tc= 125 °C|Per device|16|| |IFSM|Surge non repetitive forward current|tp= 10 ms sinusoidal||50|A| |Tstg|Storage temperature range|||-65 to + 175|°C| |Tj|Operating junction temperature range|||-40 to + 175|°C| ## **Table 3. Thermal parameters** |**Table 3.**|**Thermalparameters**|||| |---|---|---|---|---| |**Symbol**|**Parameter**||**Value (max)**|**Unit**| |Rth(j-c)|Junction to case|Per diode|4.0|°C/W| |||Per device|2.5|| |Rth(j-c)|Coupling||1.0|| When the diodes 1 and 2 are used simultaneously: Δ Tj (diode1) = P(diode1) x Rth(j-c) (per diode) + P(diode2) x Rth(c) ## **Table 4. Static electrical characteristics (per diode)** |**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---|---|---| |IR<br>(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|||5|µA| |||Tj= 125 °C|||3|40|| |VF<br>(2)|Forward voltage drop|Tj= 25 °C|IF= 5 A|||1.1|V| |||Tj= 25 °C|IF= 10 A|||1.25|| |||Tj= 150 °C|IF= 5 A||0.78|0.89|| |||Tj= 150 °C|IF= 10 A|||1.05|| 1. Pulse test: tp = 5 ms, δ < 2 % 2. Pulse test: tp = 380 µs, δ < 2 % To evaluate the conduction losses use the following equation: P = 0.73 x IF(AV) + 0.032 IF2(RMS) 2/9 Doc ID 17536 Rev 2 **STTH1002C-Y** **Characteristics** **Table 5. Dynamic electrical characteristics** |**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---|---|---| |trr|Reverse recovery time|Tj= 25 °C|IF= 1 A VR= 30 V<br>dIF/dt = 100 A/µs||20|25|ns| |IRM|Reverse recovery<br>current|Tj= 125 °C|IF= 5 A VR= 160 V<br>dIF/dt = 200 A/µs||5.9|7.6|A| |tfr|Forward recovery time|Tj= 25 °C|IF= 5 A dIF/dt = 100 A/µs<br>VFR= 1.1 x VFmax|||110|ns| |VFP|Forward recovery<br>voltage|Tj= 25 °C|IF= 5 A dIF/dt = 100 A/µs||2.4||V| 3/9 Doc ID 17536 Rev 2 **Characteristics** **STTH1002C-Y** **Figure 1. Peak current versus duty cycle (per diode)** **==> picture [197 x 35] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 2. Forward voltage drop versus<br>forward current<br>(typical values, per diode)<br>**----- End of picture text -----**<br> **==> picture [462 x 146] intentionally omitted <==** **----- Start of picture text -----**<br> IM(A) IFM(A)<br>60 100<br>90<br>50<br>80<br>70<br>40<br>60<br>30 P = 10W IM T 50 T =150°Cj<br>40<br>20 P = 5W δ [=tp/T] tp 30 T =25°Cj<br>20<br>10 P = 2W<br>0 δ 100 VFM(V)<br>0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00<br>**----- End of picture text -----**<br> ## **Figure 3. Forward voltage drop versus forward current (maximum values, per diode)** ## **Figure 4. Relative variation of thermal impedance junction to case versus pulse duration** **==> picture [462 x 147] intentionally omitted <==** **----- Start of picture text -----**<br> IFM(A) Zth(j-c)/Rth(j-c)<br>100 1.0<br>90<br>80<br>70<br>60<br>50 T =150°Cj<br>40 Single pulse<br>30<br>T =25°Cj<br>20<br>10 VFM(V) tp(s)<br>0 0.1<br>0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 1.E-03 1.E-02 1.E-01 1.E+00<br>**----- End of picture text -----**<br> **Figure 5. Junction capacitance versus reverse voltage applied (typical values, per diode)** **Figure 6. Reverse recovery charges versus dIF/dt (typical values, per diode)** **==> picture [462 x 146] intentionally omitted <==** **----- Start of picture text -----**<br> C(pF) Qrr(nC)<br>100 240<br>VOSCF=1MHzT =25°C=30mVj RMS 220200 IVFR=5A=160V<br>180<br>160<br>140<br>120 T =125°Cj<br>100<br>80<br>60<br>40 T =25°Cj<br>VR(V) 20 dIF/dt(A/µs)<br>10 0<br>0 50 100 150 200 10 100 1000<br>**----- End of picture text -----**<br> 4/9 Doc ID 17536 Rev 2 **STTH1002C-Y** **Characteristics** **Figure 7. Reverse recovery time versus dIF/dt Figure 8. Peak reverse recovery current (typical values, per diode) versus dIF/dt** **(typical values, per diode)** **==> picture [462 x 151] intentionally omitted <==** **----- Start of picture text -----**<br> trr(ns) IRM(A)<br>80 13<br>70 IVFR=5A=160V 12 IVFR=5A=160V<br>11<br>60 10<br>T =125°Cj 9<br>50 8<br>7<br>40 T =125°Cj<br>6<br>30 5<br>4<br>20 T =25°Cj 32 T =25°Cj<br>10<br>dIF/dt(A/µs) 1 dIF/dt(A/µs)<br>0 0<br>10 100 1000 10 100 1000<br>**----- End of picture text -----**<br> ## **Figure 9. Dynamic parameters versus junction temperature** **Figure 10. Thermal resistance junction to ambient versus copper surface under tab for D[2] PAK** **==> picture [462 x 147] intentionally omitted <==** **----- Start of picture text -----**<br> Qrr; [I] RM[T ]/Qj rr;IRM[T =125°C]j Rth(j-a)(°C/W)<br>1.4 80<br>1.2 IVFR=5A=160V 70 Epoxy printed circuit board FR4, copper thickness = 35 µm<br>60<br>1.0<br>0.8 IRM 50<br>40<br>0.6 Qrr<br>30<br>0.4<br>20<br>0.2 10<br>T (°C)j S(Cu)(cm²)<br>0.0 0<br>25 50 75 100 125 150 0 2 4 6 8 10 12 14 16 18 20<br>**----- End of picture text -----**<br> **Figure 11. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness = 35 µm) for DPAK** **==> picture [214 x 138] intentionally omitted <==** **----- Start of picture text -----**<br> Rth(j-a)(°C/W)<br>100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10 S(Cu)(cm²)<br>0<br>0 2 4 6 8 10 12 14 16 18 20<br>**----- End of picture text -----**<br> 5/9 Doc ID 17536 Rev 2 **STTH1002C-Y** **Package mechanical data** ## **2 Package mechanical data** - Epoxy meets UL94, V0 - Cooling method: by conduction (method C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. ## **Table 6. DPAK dimensions** |**H**||||**B**<br>**L2**<br>**D**<br>**A1**<br>**R**<br>**R**<br>**C**<br>**A**<br>**C2**<br>**MIN.**<br>**V2**<br>**A2**|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---|---|---|---| |||||||**Millimeters**||**Inches**|| |||||||**Min.**|**Max.**|**Min.**|**Max.**| ||||||||||| ||||||A|2.20|2.40|0.086|0.094| ||||**E**||||||| ||||||A1|0.90|1.10|0.035|0.043| ||||**B2**||||||| ||||||A2|0.03|0.23|0.001|0.009| ||||||||||| ||||||B|0.64|0.90|0.025|0.035| ||**L4**||||B2|5.20|5.40|0.204|0.212| ||||||C|0.45|0.60|0.017|0.023| ||||**G**||C2|0.48|0.60|0.018|0.023| ||||||||||| ||||||D|6.00|6.20|0.236|0.244| ||||**0.60**||E|6.40|6.60|0.251|0.259| ||||||G|4.40|4.60|0.173|0.181| ||||||H|9.35|10.10|0.368|0.397| ||||||L2|0.80 typ.||0.031 typ.|| ||||||||||| ||||||L4|0.60|1.00|0.023|0.039| ||||||V2|0°|8°|0°|8°| |**Figure 12.**|||**Footprint(dimensions in mm)**||||||| |**6.7**<br>**6.7**<br>**3**<br>**3**<br>**1.6**<br>**1.6**<br>**2.3**<br>**2.3**|||||||||| **==> picture [177 x 94] intentionally omitted <==** **----- Start of picture text -----**<br> 6.7 3 3 1.6<br>2.3<br>6.7<br>2.3<br>1.6<br>**----- End of picture text -----**<br> 6/9 Doc ID 17536 Rev 2 **STTH1002C-Y** **Package mechanical data** |**Table 7.**|**Table 7.**|**Table 7.**|**D2PAK dimensions**|**D2PAK dimensions**|**D2PAK dimensions**||||||| |---|---|---|---|---|---|---|---|---|---|---|---| |**L**||||||**N 2mm**<br>**D**<br><br>**2**|**Ref.**|**Dimensions**|||| |||||||||**Millimeters**||**Inches**|| |||||||||**Min.**|**Max.**|**Min.**|**Max.**| ||**L2**|||**C2**|**A**||A|4.40|4.60|0.173|0.181| ||||||||A1|2.49|2.69|0.098|0.106| ||||**E**||||||||| ||||||||A2|0.03|0.23|0.001|0.009| ||||||||||||| ||**L3**||||||B|0.70|0.93|0.027|0.037| ||||||||B2|1.14|1.70|0.045|0.067| ||||||||||||| ||||||||C|0.45|0.60|0.017|0.024| ||||||**ESS THA**<br>**R**<br>**V**||||||| |||||**A1**|||C2|1.23|1.36|0.048|0.054| ||||**G**|**B**<br>**B2**<br>*** FLAT ZONE NO L**<br>**A2**<br>**M**<br>**C**<br>*|||||||| ||||||||||||| ||||||||D|8.95|9.35|0.352|0.368| ||||||||E|10.00|10.40|0.393|0.409| ||||||||G|4.88|5.28|0.192|0.208| ||||||||L|15.00|15.85|0.590|0.624| ||||||||L2|1.27|1.40|0.050|0.055| ||||||||L3|1.40|1.75|0.055|0.069| ||||||||M|2.40|3.20|0.094|0.126| ||||||||R|0.40 typ.||0.016 typ.|| ||||||||V2|0°|8°|0°|8°| ## **Figure 13. Footprint (dimensions in mm)** **==> picture [163 x 94] intentionally omitted <==** **----- Start of picture text -----**<br> 16.90<br>10.30 5.08<br>1.30<br>3.70<br>8.90<br>**----- End of picture text -----**<br> 7/9 Doc ID 17536 Rev 2 **Ordering information** **STTH1002C-Y** ## **3 Ordering information** ## **Table 8. Ordering information** |**Table 8.**<br>**Ordering **|**information**||||| |---|---|---|---|---|---| |**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**| |STTH1002CBY-TR|STTH1002CY|DPAK|0.3 g|2500|Tape and reel| |STTH1002CGY-TR|STTH1002CGY|D2PAK|1.48 g|1000|| ## **4 Revision history** ## **Table 9. Document revision history** |**Date**|**Revision**|**Changes**| |---|---|---| |21-Oct-2010|1|First issue.| |03-Nov-2011|2|Updated_Table 7_and_Table 8._| 8/9 Doc ID 17536 Rev 2 **STTH1002C-Y** ## **Please Read Carefully:** Information in this document is provided solely in connection with ST products. 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All other names are the property of their respective owners. © 2011 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America **www.st.com** 9/9 Doc ID 17536 Rev 2
Updated at June 4, 2026
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