STPS8H100DEE-TR

## **STPS8H100DEE** 

## High voltage power Schottky rectifier 

**Datasheet** - **production data** 

## **Description** 

This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters. 

Packaged in PowerFLAT™, this device is intended for use in low voltage, high frequency, inverters, free-wheeling, bypass diode and polarity protection applications. Its low profile was especially designed to be used in applications with space-saving constraints. 

**Table 1. Device summary** 

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|||
|---|---|
|Symbol|Value|
|I|8 A|
|F(AV)|
|VRRM|100 V|
|Tj (max)|175 °C|
|VF (typ)|0.68 V|

**----- End of picture text -----**<br>


## **Features** 

- Very low conduction losses 

- Negligible switching losses 

- Extremely fast switching 

- Low thermal resistance 

- Avalanche capacity specified 

- High junction temperature 

- ECOPACK[®] 2 compliant component 

TM: PowerFLAT is a trademark of STMicroelectronics 

1/8 

December 2016 

DocID023272 Rev 3 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STPS8H100DEE** 

## **1 Characteristics** 

**Table 2. Absolute ratings (limiting values Tamb = 25 °C unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM<br>|Repetitive peak reverse voltage||100|V|
|IF(RMS)<br>|Forward rms current||15|A|
|IF(AV)<br>|Average forward current,= 0.5|Tc = 150 °C|8|A|
|IFSM<br>|Surge non repetitive forward current<br>|tp= 10 ms sinusoidal|100|A|
|PARM(1)<br>|Repetitive peak avalanche power<br>|tp = 10 µs Tj=125 °C|480|W|
|Tstg<br>|Storage temperature range||-65 to +175|°C|
|Tj<br>|Maximum operating junction temperature||175|°C|



1. For pulse time duration deratings, please refer to _Figure 3_ . More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics application notes AN1768, “Admissible avalanche power of Schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”. 

**Table 3. Thermal resistance** 

||**Table 3. Thermal resistance**|||
|---|---|---|---|
|**Symbol**|**Parameter**|**Value**|**Unit**|
|Rth(j-c)|Junction to case|4|°C/W|



**Table 4. Static electrical characteristics** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR<br>(1)|Reverse leakage<br>current|Tj= 25 °C|VR= VRRM|-||4.5|µA|
|||Tj= 125 °C||-|2|6|mA|
|VF<br>(2)|Forward voltage drop|Tj= 25 °C|IF= 8 A|||0.82|V|
|||Tj= 125 °C||-|0.60|0.68||
|||Tj= 25 °C|IF= 10 A|||0.85||
|||Tj= 125 °C||-|0.62|0.70||
|||Tj= 25 °C|IF= 16 A|||0.90||
|||Tj= 125 °C||-|0.68|0.75||



1. Pulse test: tp = 5 ms, δ < 2% 

2. Pulse test: tp = 380 µs, δ < 2% 

To evaluate the conduction losses use the following equation: 

P = 0.61 x IF(AV) + 0.0088 x IF[2] (RMS) 

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**Characteristics** 

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Figure 1. Average forward power dissipation  Figure 2. Average forward current versus<br>versus average forward current ambient temperature ( δ  = 0.5)<br>PF(AV)(W) IF(AV)(A)<br>7 10<br>δ = 0.5<br>δ  = 0.2<br>6 Rth(j-a)=Rth(j-c)<br>δ = 0.1 8<br>5 δ = 0.05 δ = 1<br>4 6<br>3<br>4<br>T T<br>2<br>2<br>1<br>IF(AV)(A) δ [=tp/T] tp δ [=tp/T] tp Tamb(°C)<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 0 25 50 75 100 125 150 175<br>Figure 3. Normalized avalanche power derating  Figure 4. Relative variation of thermal<br>versus pulse duration impedance junction to case versus pulse<br>duration<br>PARM(tp)<br>Zth(j-c)/Rth(j-c)<br>1 PARM(10 µs) 1.0<br>0.9<br>0.8<br>0.7<br>0.1<br>0.6<br>0.5<br>0.4<br>0.01 0.3<br>0.2<br>0.1 Single pulse<br>0.001 t p(µs) 0.0<br>1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>1 10 100 1000<br>**----- End of picture text -----**<br>


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Figure 5. Reverse leakage current versus  Figure 6. Junction capacitance versus reverse<br>reverse voltage applied (typical values) voltage applied (typical values)<br>IR(mA) C(pF)<br>1.E+02 1000<br>F=1 MHz<br>V OSC =30 mV RMS<br>1.E+01 Tj = 150  ° C T j = 25°C<br>T j  = 125 °C<br>1.E+00<br>Tj = 100 °C<br>1.E-01 100<br>Tj = 75 °C<br>1.E-02<br>Tj = 50 °C<br>1.E-03 T j  = 25 °C<br>VR(V)<br>VR(V)<br>1.E-04 10<br>0 10 20 30 40 50 60 70 80 90 100 1 10 100<br>**----- End of picture text -----**<br>


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**Characteristics** 

**STPS8H100DEE** 

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Figure 7. Forward voltage drop versus forward  Figure 8. Thermal resistance junction to<br>current ambient versus copper surface under tab<br>IFM(A) Rth(j-a)(°C/W)<br>100.0 250<br>T j =125 °C epoxy printed board FR4, copper thickness=35µm PowerFLAT (3.3x3.3)<br>(Maximum values)<br>200<br>10.0<br>T j =125 °C 150<br>(Typical values) Tj=25 °C<br>(Maximum values)<br>100<br>1.0<br>50<br>VFM(V) S Cu (cm²)<br>0.1 0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 1 2 3 4 5 6 7 8 9 10<br>**----- End of picture text -----**<br>


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**Package information** 

## **2 Package information** 

- Epoxy meets UL94, V0 

- Cooling method: by conduction (C) 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: _www.st.com._ ECOPACK[®] is an ST trademark. 

## **2.1 PowerFLAT™ (3.3x3.3)package information** 

## **Figure 9. PowerFLAT™ (3.3 x 3.3) package outline** 

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Exposed pad L E<br>L1 E2 A3 E/2<br>b nc<br>nc D/2<br>e/2<br>D2 D<br>D3<br>e a k k a<br>L2 A<br>Index area<br>(D/2 x E/2)<br>A4 Projection<br>**----- End of picture text -----**<br>


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**Package information** 

**Table 5. PowerFLAT™ (3.3 x 3.3) mechanical data** 

||**Table 5. PowerFLAT™(3.3 x 3.3) mechanical data**|**Table 5. PowerFLAT™(3.3 x 3.3) mechanical data**|**Table 5. PowerFLAT™(3.3 x 3.3) mechanical data**|**Table 5. PowerFLAT™(3.3 x 3.3) mechanical data**|**Table 5. PowerFLAT™(3.3 x 3.3) mechanical data**|**Table 5. PowerFLAT™(3.3 x 3.3) mechanical data**|
|---|---|---|---|---|---|---|
|**Ref.**|**Dimensions**||||||
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.95|1.00|1.05|0.037|0.039|0.041|
|A3||0.20|||0.0079||
|A4||0.20|||0.0079||
|b|0.30|0.37|0.44|0.012|0.015|0.017|
|D|3.20|3.30|3.40|0.126|0.130|0.134|
|D2|2.24|2.31|2.38|0.088|0.091|0.094|
|D3|1.60|1.67|1.74|0.063|0.066|0.069|
|e||0.65|||0.026||
|E|3.20|3.30|3.40|0.126|0.130|0.134|
|E2|1.68|1.75|1.82|0.066|0.069|0.072|
|L|0.31|0.38|0.45|0.012|0.015|0.018|
|L1|0.55|0.62|0.69|0.22|0.024|0.027|
|L2|0.86|0.93|1.00|0.034|0.037|0.039|



## **Figure 10. Footprint (dimensions in mm)** 

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3.50<br>1.75<br>1.25 0.21<br>1.79 0.52<br>1.75<br>2.28<br>3.50<br>0.42 0.80<br>**----- End of picture text -----**<br>


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**Ordering information** 

## **3 Ordering information** 

**Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS8H100DEE-TR|S8H100|PowerFLAT™<br>(3.3 x 3.3)|34 mg|3000|Tape and reel<br>13” reel|



## **4 Revision history** 

**Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|9-Sep-2012|1|First issue.|
|16-Jan-2015|2|Updated order code name and reformatted to current<br>standard.|
|13-Dec-2016|3|Updated restriction and order code.|



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