STPS8170DEE-TR

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## **STPS8170DEE** 

## Power Schottky rectifier 

**Datasheet**  **production data** 

## **Features** 

- Very low conduction losses 

- Negligible switching losses 

- Extremely fast switching 

- Low thermal resistance 

- Avalanche capacity specified 

- High junction temperature 

- ECOPACK[®] 2 compliant component 

## **Description** 

This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters. 

Packaged in PowerFLAT™, this device is intended for use in low voltage, high frequency, inverters, free-wheeling, by-pass diode and polarity protection applications.Its low profile was especially designed to be used in applications with space-saving constraints. 

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NC<br>A<br>K<br>A<br>A<br>A NC<br>A A<br>A A<br>NC A<br>K<br>K<br>PowerFLAT(3.3 x 3.3)<br>STPS8170DEE-TR<br>**----- End of picture text -----**<br>


## **Table 1. Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|8 A|
|VRRM|170 V|
|Tj (max)|175 °C|
|VF(typ)|0.66 V|



TM: PowerFLAT is a trademark of STMicroelectronics 

September 2012 

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This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STPS8170DEE** 

## **1 Characteristics** 

**Table 2. Absolute ratings (limiting values Tamb = 25 °C unless otherwise specified)** 

|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|
|VRRM<br>|Repetitive peak reverse voltage||170|V|
|IF(RMS)<br>|Forward rms current||15|A|
|IF(AV)<br>|Average forward current|Tc = 145 °C= 0.5|8|A|
|IFSM<br>|Surge non repetitive forward current|tp = 10 ms sinusoidal|100|A|
|PARM(1)<br>|Repetitive peak avalanche power|tp= 10 µs Tj =125 °C|400|W|
|Tstg<br>|Storage temperature range||-65 to +175|°C|
|Tj<br>|Maximum operating junction temperature||175|°C|



1. For pulse time duration deratings, please refer to _Figure 3_ . More details regarding the avalanche energy measurements and diode validation in the avalanche are provided in the STMicroelectronics Application notes AN1768, “Admissible avalanche power of schottky diodes” and AN2025, “Converter improvement using Schottky rectifier avalanche specification”. 

## **Table 3. Thermal resistance** 

|**Table 3.**|**Thermal resistance**|**Thermal resistance**|**Thermal resistance**|||||||
|---|---|---|---|---|---|---|---|---|---|
|**Symbol**|**Parameter**|||||**Value**||**Unit**||
|Rth(j-c)|Junction to case|||||4||°C/W||
|**Table 4.**<br>**Static electrical characteristics**||||||||||
|**Symbol**|**Parameter**|**Test conditions**||**Min.**|**Typ.**||**Max.**||**Unit**|
|IR<br>(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-|||15||µA|
|||Tj= 125 °C||-|1.5||15||mA|
|VF<br>(2)|Forward voltage drop|Tj= 25 °C|IF= 8A||||0.90||V|
|||Tj= 125 °C||-|0.66||0.72|||



1. Pulse test: tp = 5 ms,  < 2% 

2. Pulse test: tp = 380 µs,  < 2% 

To evaluate the conduction losses use the following equation: 

P = 0.62 x IF(AV) + 0.0125 x IF[2] (RMS) 

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**Characteristics** 

**Figure 1. Average forward power dissipation Figure 2. Average forward current versus versus average forward current ambient temperature(**  **= 0.5)** 

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PF(AV)(W) IF(AV)(A)<br>9 10<br>δ = 0.5<br>8 δ = 0.2 Rth(j-a)=Rth(j-c)<br>8<br>7 δ = 0.1<br>6 δ = 0.05 δ = 1<br>6<br>5<br>4<br>4<br>3 T T<br>2 2<br>1<br>IF(AV)(A) δ [=tp/T] tp δ [=tp/T] tp Tamb(°C)<br>0 0<br>0 1 2 3 4 5 6 7 8 9 10 11 0 25 50 75 100 125 150 175<br>)<br>(<br>**----- End of picture text -----**<br>


## **Figure 3. Normalized avalanche power derating versus pulse duration** 

**Figure 4. Relative variation of thermal impedance junction to case versus pulse duration** 

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PARM(tp) Zth(j-c)/Rth(j-c)<br>1 PARM(10 µs) 1.0<br>0.9<br>0.8<br>0.7<br>0.1<br>0.6<br>0.5<br>0.4<br>0.01<br>0.3<br>0.2<br>t p(µs) 0.1 Single pulse tp(s)<br>0.001 0.0<br>1 10 100 1000 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00<br>Figure 5. Reverse leakage current versus  Figure 6. Junction capacitance versus<br>reverse voltage applied (typical  reverse voltage applied (typical<br>values) values)<br>IR(mA) C(pF)<br>1.E+01 1000<br>Tj = 150 °C F=1 MHz<br>1.E+00 Tj = 125 °C V OSC Tj =25 °C=30 mV RMS<br>1.E-01 Tj = 100  ° C<br>T j  = 75 °C<br>1.E-02 100<br>Tj = 50 °C<br>1.E-03<br>Tj = 25 °C<br>1.E-04<br>V R (V) VR(V)<br>1.E-05 10<br>0 20 40 60 80 100 120 140 160 180 1 10 100 1000<br>**----- End of picture text -----**<br>


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**Characteristics** 

**STPS8170DEE** 

**Figure 7. Forward voltage drop versus forward current** 

**Figure 8. Thermal resistance junction to ambient versus copper surface under tab** 

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IFM(A) Rth(j-a)(°C/W)<br>100.0 250<br>(Maximum values) T j =125 °C epoxy printed board FR4, copper thickness=35µm PowerFLAT (3.3x3.3)<br>200<br>10.0<br>(Typical values)T j =125 °C (Maximum values)Tj=25 °C 150<br>100<br>1.0<br>50<br>V FM (V) S Cu (cm²)<br>0.1 0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 1 2 3 4 5 6 7 8 9 10<br>**----- End of picture text -----**<br>


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**Package information** 

## **2 Package information** 

- Epoxy meets UL94,V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

## **Figure 9. PowerFLAT-3.3x3.3-8L dimensions (definitions)** 

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Exposed pad L E<br>L1 E2 A3 E/2<br>b nc<br>nc D/2<br>e/2<br>D2 D<br>D3<br>e a k k a<br>L2 A<br>Index area<br>(D/2 x E/2)<br>A4 Projection<br>**----- End of picture text -----**<br>


## **Table 5. PowerFLAT-8L dimensions (values)** 

|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**|
|---|---|---|---|---|---|---|
||**Millimeters**|||**Inches**|||
||**Min.**|**Typ.**|**Max.**|**Min.**|**Typ.**|**Max.**|
|A|0.95|1.00|1.05|0.037|0.039|0.041|
|A3||0.20|||0.0079||
|A4||0.20|||0.0079||
|b|0.30|0.37|0.44|0.012|0.015|0.017|
|D|3.20|3.30|3.40|0.126|0.130|0.134|
|D2|2.24|2.31|2.38|0.088|0.091|0.094|
|D3|1.60|1.67|1.74|0.063|0.066|0.069|
|e||0.65|||0.026||
|E|3.20|3.30|3.40|0.126|0.130|0.134|
|E2|1.68|1.75|1.82|0.066|0.069|0.072|
|L|0.31|0.38|0.45|0.012|0.015|0.018|
|L1|0.55|0.62|0.69|0.22|0.024|0.027|
|L2|0.86|0.93|1.00|0.034|0.037|0.039|



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**Package information** 

**Figure 10. Footprint (dimensions in mm)** 

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3.50<br>1.75<br>1.25 0.21<br>1.79 0.52<br>1.75<br>2.28<br>3.50<br>0.42 0.80<br>**----- End of picture text -----**<br>


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**Ordering information** 

## **3 Ordering information** 

**Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS8170DEE-TR|PS8170|PowerFLAT<br>(3.3 x 3.3)|34 mg|3000|Tape and reel<br>13” reel|



## **4 Revision history** 

**Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|09-Sep-2012|1|First issue.|



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