STPS30L45CG-TR
Small Signal Schottky Diode, Dual Common Cathode, 45 V, 30 A, 740 mV, 220 A, 150 °C
- Manufacturer: STMICROELECTRONICS
- Product type: Small Signal Schottky Diodes
- No. of Pins: 3Pins
- Product Range: STPS3
- Diode Mounting: Surface Mount
- Diode Case Style: TO-263 (D2PAK)
- Diode Configuration: Dual Common Cathode
- Forward Voltage Max: 740mV
- Forward Surge Current: 220A
- Average Forward Current: 30A
- Operating Temperature Max: 150°C
- Repetitive Peak Reverse Voltage: 45V
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 0.76 € |
| Current stock | 10+ |
| Lead time | 30 days |
**STPS30L45C** Low drop power Schottky rectifier **==> picture [61 x 39] intentionally omitted <==** ## **Features** - low forward voltage drop meaning very small conduction losses - low switching losses allowing high frequency operation - low thermal resistance - avalanche rated - insulated package TO-220FPAB: - insulating voltage = 2000 V DC - capacitance = 45 pF - avalanche capability specified ## **Description** Dual center tap Schottky rectifier suited for switched mode power supplies and high frequency DC to DC converters. Packaged in TO-247, TO-220AB, TO-220FPAB, D[2] PAK and I[2] PAK this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. **==> picture [220 x 349] intentionally omitted <==** **----- Start of picture text -----**<br> A1<br>K<br>A2<br>K K<br>A2<br>A2<br>A1 A1<br>I [2] PAK D [2] PAK<br>STPS30L45CR STPS30L45CG<br>A2<br>A2 K<br>A1 K A1<br>TO-220AB TO-247<br>STPS30L45CT STPS30L45CW<br>A2<br>K<br>A1<br>TO-220FPAB<br>STPS30L45CFP<br>**----- End of picture text -----**<br> **Table 1. Device summary** |IF(AV)|2 x 15A| |---|---| |VRRM|45V| |Tj(max)|150 °C| |VF(max)|0.5 V| October 2010 1/12 Doc ID 8002 Rev 4 _www.st.com_ **Characteristics** **STPS30L45C** ## **1 Characteristics** ## **Table 2. Absolute Ratings (limiting values, per diode)** |**Symbol**||**Parameter**|**Parameter**|**Parameter**|**Value**|**Unit**| |---|---|---|---|---|---|---| |VRRM|Repetitive peak rever|se voltage|||45|V| |IF(RMS)|Forward rms current||||30|A| |IF(AV)|Average forward<br>current|TO-220FPAB<br>TO-220AB, TO-247,<br>I2PAK, D2PAK|Tc=110 °C,δ= 0.5|Per diode<br>Per device|15<br>30|A| ||||Tc= 135 °C,δ= 0.5|||| |IFSM|Surge non repetitive forward current||tp= 10 ms Sinusoidal||220|A| |IRRM|Repetitive peak reverse current||tp= 2 µs square F = 1 kHz||1|A| |IRSM|Non repetitive peak reverse current||tp= 100 µs square||3|A| |PARM|Repetitive peak avalanche power||tp= 1 µs Tj= 25 °C||6000|W| |Tstg|Storage temperature range||||-65 to + 150|°C| |Tj|Maximum operating junction temperature(1)||||150|°C| |dV/dt|Critical rate of rise of reverse voltage||||10000|V/µs| |1.<br>condition to avoid thermal runaway for a diode on its own heatsink<br>dPtot<br>dTj<br>---------------<br>1<br>Rth j<br>a<br>–<br>(<br>)<br>------------------------**-**<br><||||||| ## **Table 3. Thermal resistances** |**Symbol**||**Parameter**|**Parameter**|**Value**|**Unit**| |---|---|---|---|---|---| |Rth(j-c)|Junction to case|TO-220FPAB|Per diode<br>Total|4<br>3.2|°C/W| |||TO-220AB, TO-247, I2PAK, D2PAK|Per diode<br>Total|1.60<br>0.85|| |Rth(c)|Coupling|TO-220FPAB||2.5|°C/W| |||TO-220AB, TO-247, I2PAK, D2PAK||0.10|| When the diodes 1 and 2 are used simultaneously: ΔTj(diode 1) = P(diode1) x Rth(j-c)(Per diode) + P(diode 2) x Rth(c) 2/12 Doc ID 8002 Rev 4 **STPS30L45C** **Characteristics** **Table 4. Static electrical characteristics (per diode)** |**Symbol**|**Parameter**|**Test Conditions**|**Test Conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---|---|---| |IR<br>(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|||0.4|mA| |||Tj= 125 °C|||100|200|mA| |VF<br>(1)|Forward voltage drop|Tj= 25 °C|IF= 15 A|||0.55|V| |||Tj= 125 °C|IF= 15 A||0.42|0.50|| |||Tj= 25 °C|IF= 30 A|||0.74|| |||Tj= 125 °C|IF= 30 A||0.59|0.67|| 1. Pulse test: tp = 380 µs, δ < 2% 2 (RMS) To evaluate the conduction losses use the following equation: P = 0.330 x IF(AV) + 0.011 IF **Figure 1. Average forward power dissipation Figure 2. Average forward current versus versus average forward current ambient temperature (per diode) (** δ **= 0.5, per diode)** **==> picture [462 x 147] intentionally omitted <==** **----- Start of picture text -----**<br> PF(av)(W) IF(av)(A)<br>12 18<br>10 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5 16 Rth(j-a)=Rth(j-c) TO-220AB/TO-247/I²PAK/D²PAK<br>14<br>8 δ = 1 12<br>TO-220FPAB<br>10<br>6 Rth(j-a)=15°C/W<br>8<br>4 6<br>T T<br>4<br>2<br>IF(av) (A) δ [=tp/T] tp 2 δ [=tp/T] tp Tamb(°C)<br>0 0<br>0 2 4 6 8 10 12 14 16 18 20 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br> **Figure 3. Normalized avalanche power derating versus pulse duration** **Figure 4. Normalized avalanche power derating versus junction temperature** **==> picture [462 x 146] intentionally omitted <==** **----- Start of picture text -----**<br> 1 PPARMARM(1 µs)(tp) 1.2 PARMPARM(25 °C)(Tj)<br>1<br>0.1 0.8<br>0.6<br>0.01 0.4<br>0.2<br>0.001 tp(µs) 0 T (°C)j<br>0.01 0.1 1 10 100 1000 25 50 75 100 125 150<br>**----- End of picture text -----**<br> 3/12 Doc ID 8002 Rev 4 **Characteristics** **STPS30L45C** **Figure 5. Non repetitive surge peak forward Figure 6. Non repetitive surge peak forward current versus overload duration current versus overload duration (TO-220FPAB only)** **==> picture [216 x 127] intentionally omitted <==** **----- Start of picture text -----**<br> IM(A)<br>200<br>maximum values, per diode<br>180<br>160<br>140<br>120 Tc=25°C<br>100<br>Tc=75°C<br>80<br>60 Tc=125°C<br>40 IM<br>20 δ=0.5 t t(s)<br>0<br>1E-3 1E-2 1E-1 1E+0<br>**----- End of picture text -----**<br> **==> picture [211 x 124] intentionally omitted <==** **----- Start of picture text -----**<br> IM(A)<br>140<br>maximum values, per diode<br>120<br>100<br>80 Tc=25°C<br>60 Tc=75°C<br>40 Tc=125°C<br>IM<br>20 δ=0.5 t t(s)<br>0<br>1E-3 1E-2 1E-1 1E+0<br>**----- End of picture text -----**<br> ## **Figure 7. Relative variation of thermal impedance junction to case versus pulse duration** **==> picture [222 x 130] intentionally omitted <==** **----- Start of picture text -----**<br> Zth(j-c)/Rth(j-c)<br>1.0<br>0.8<br>0.6 δ = 0.5<br>0.4 δ = 0.2<br>δ = 0.1 T<br>0.2<br>Single pulse tp(s)<br>δ [=tp/T] tp<br>0.0<br>1E-4 1E-3 1E-2 1E-1 1E+0<br>**----- End of picture text -----**<br> **Figure 8. Relative variation of thermal impedance junction to case versus pulse duration (TO-220FPAB)** **==> picture [223 x 130] intentionally omitted <==** **----- Start of picture text -----**<br> Zth(j-c)/Rth(j-c)<br>1.0<br>0.8<br>0.6 δ = 0.5<br>0.4<br>δ = 0.2<br>T<br>0.2 δ = 0.1<br>Single pulse tp(s) δ [=tp/T] tp<br>0.0<br>1E-3 1E-2 1E-1 1E+0 1E+1<br>**----- End of picture text -----**<br> ## **Figure 9. Reverse leakage current versus reverse voltage applied (typical values, per diode)** ## **Figure 10. Junction capacitance versus reverse voltage applied (typical values, per diode)** **==> picture [462 x 146] intentionally omitted <==** **----- Start of picture text -----**<br> IR(mA) C(pF)<br>5E+2 2000<br>F=1MHz<br>1E+2 Tj=150°C Tj=25°C<br>1000<br>Tj=125°C<br>1E+1<br>Tj=100°C<br>500<br>1E+0 Tj=75°C<br>1E-1 Tj=25°C 200<br>VR(V) VR(V)<br>1E-2 100<br>0 5 10 15 20 25 30 35 40 45 1 2 5 10 20 50<br>**----- End of picture text -----**<br> 4/12 Doc ID 8002 Rev 4 **STPS30L45C** **Characteristics** ## **Figure 11. Forward voltage drop versus forward current (maximum values, per diode)** **Figure 12. Thermal resistance junction to ambient versus copper surface under tab for D[2] PAK** **==> picture [462 x 146] intentionally omitted <==** **----- Start of picture text -----**<br> IFM(A) Rth(j-a) (°C/W)<br>200 80<br>Epoxy printed circuit board FP4,<br>100 70 copper thickness = 35 µm<br>60<br>Typical values<br>Tj=150°C 50<br>40<br>10<br>30<br>Tj=125°C<br>20<br>Tj=25°C<br>VFM(V) 10 S(cm²)<br>1 0<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 5 10 15 20 25 30 35 40<br>**----- End of picture text -----**<br> 5/12 Doc ID 8002 Rev 4 **STPS30L45C** **Package Information** ## **2 Package Information** - Epoxy meets UL94, V0 - Cooling method: by conduction (C) - Recommended torque (TO-220AB, TO-220FPAB): 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. **==> picture [386 x 382] intentionally omitted <==** **----- Start of picture text -----**<br> Table 5. TO-220AB package dimensions<br>Dimensions<br>Ref Millimeters Inches<br>Min. Max. Min. Max.<br>A 4.40 4.60 0.173 0.181<br>C 1.23 1.32 0.048 0.051<br>H2 A<br>Dia C D 2.40 2.72 0.094 0.107<br>E 0.49 0.70 0.019 0.027<br>L5<br>L7<br>F 0.61 0.88 0.024 0.034<br>L6 F1 1.14 1.70 0.044 0.066<br>L2 F2 1.14 1.70 0.044 0.066<br>F2<br>G 4.95 5.15 0.194 0.202<br>F1 L9 D<br>G1 2.40 2.70 0.094 0.106<br>L4 H2 10 10.40 0.393 0.409<br>F L2 16.4 typ. 0.645 typ.<br>M<br>G1 E L4 13 14 0.511 0.551<br>L5 2.65 2.95 0.104 0.116<br>G<br>L6 15.25 15.75 0.600 0.620<br>L7 6.20 6.60 0.244 0.259<br>L9 3.50 3.93 0.137 0.154<br>M 2.6 typ. 0.102 typ.<br>Dia. 3.75 3.85 0.147 0.151<br>**----- End of picture text -----**<br> 6/12 Doc ID 8002 Rev 4 **STPS30L45C** **Package Information** Mounting (soldering) the I[2] PAK metal slug (heatsink) with alloy, like a surface mount device, IS NOT PERMITTED. A standard through-hole mounting is mandatory. **Table 6. I[2] PAK dimensions** |**L2**<br>**L**|**L2**<br>**L**|**L2**<br>**L**|||||||||**c**<br>**A**|**Ref.**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---| ||||||||||||||**Millimeters**||**Inches**|| ||||||||**E**|**b1**<br>**D**<br>**b**|**c2**|||||||| ||||||||||||||**Min.**|**Max.**|**Min.**|**Max.**| |||||||||||||||||| |||||||||||||A|4.40|4.60|0.173|0.181| |||||||||||||||||| |||||||||||||A1|2.40|2.72|0.094|0.107| |||||||||||||b|0.61|0.88|0.024|0.035| |||||||||||||b1|1.14|1.70|0.044|0.067| |||||||||||||c|0.49|0.70|0.019|0.028| |||||||||||||||||| |||||**L1**|||**e**||**A1**|||c2|1.23|1.32|0.048|0.052| |||||||||||||D|8.95|9.35|0.352|0.368| |||||||||||||||||| |||||||||||||e|2.40|2.70|0.094|0.106| |||||||||||||e1|4.95|5.15|0.195|0.203| |||||||||||||E|10|10.40|0.394|0.409| |||||||||||||||||| |||||||||||||L|13|14|0.512|0.551| ||||||||**e1**|||||L1|3.50|3.93|0.138|0.155| |||||||||||||||||| |||||||||||||L2|1.27|1.40|0.050|0.055| 7/12 Doc ID 8002 Rev 4 **STPS30L45C** **Package Information** **Table 7. TO-220FPAB package dimensions** |**L3**|||||**L7**<br>**E**|**Ref**|**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---|---|---|---|---|---|---| ||||||||**Millimeters**||**Inches**|| ||||||||**Min.**|**Max.**|**Min.**|**Max.**| |||||||A|4.4|4.6|0.173|0.181| |||||**A**<br>**B**<br>**Dia**<br>**L6**<br>**L5**<br>**F1**<br>**F2**<br>**F**<br>**D**||||||| |||||||B|2.5|2.7|0.098|0.106| ||||**H**|||||||| |||||||D|2.5|2.75|0.098|0.108| |||||||||||| |||||||E|0.45|0.70|0.018|0.027| ||**L4**<br>**L2**|||||||||| |||||||F|0.75|1|0.030|0.039| |||||||||||| |||||||F1|1.15|1.70|0.045|0.067| |||||||||||| |||||||F2|1.15|1.70|0.045|0.067| |||||||G|4.95|5.20|0.195|0.205| ||||**G1**<br>**G**|||||||| |||||||G1|2.4|2.7|0.094|0.106| |||||||||||| |||||||H|10|10.4|0.393|0.409| |||||||L2|16 Typ.||0.63 Typ.|| |||||||L3|28.6|30.6|1.126|1.205| |||||||L4|9.8|10.6|0.386|0.417| |||||||L5|2.9|3.6|0.114|0.142| |||||||L6|15.9|16.4|0.626|0.646| |||||||L7|9.00|9.30|0.354|0.366| |||||||Dia.|3.00|3.20|0.118|0.126| 8/12 Doc ID 8002 Rev 4 **STPS30L45C** **Package Information** |**Table**|**Table**|**8.**|**D2PAKpackage dimensions**|**D2PAKpackage dimensions**|||||| |---|---|---|---|---|---|---|---|---|---| |**L**||||**ESS THAN 2mm**<br>**A**<br>**D**<br>**R**<br>**V2**|**Ref**|**Dimensions**|||| |||||||**Millimeters**||**Inches**|| |||||||**Min.**|**Max.**|**Min.**|**Max.**| ||**L2**||||||||| ||||||A|4.40|4.60|0.173|0.181| ||||||||||| ||||||A1|2.49|2.69|0.098|0.106| ||||||||||| ||||||A2|0.03|0.23|0.001|0.009| ||**L3**||||B|0.70|0.93|0.027|0.037| ||||||B2|1.14|1.70|0.045|0.067| ||||||C|0.45|0.60|0.017|0.024| ||||||C2|1.23|1.36|0.048|0.054| ||||||||||| ||||||D|8.95|9.35|0.352|0.368| ||||||E|10.00|10.40|0.393|0.409| ||||||G|4.88|5.28|0.192|0.208| ||||||L|15.00|15.85|0.590|0.624| ||||||L2|1.27|1.40|0.050|0.055| ||||||L3|1.40|1.75|0.055|0.069| ||||||M|2.40|3.20|0.094|0.126| ||||||R|0.40 typ.||0.016 typ.|| ||||||V2|0°|8°|0°|8°| **Figure 13. D** _**[2]**_ **PAK footprint dimensions (in millimeters)** **==> picture [211 x 125] intentionally omitted <==** **----- Start of picture text -----**<br> 16.90<br>10.30 5.08<br>1.30<br>3.70<br>8.90<br>**----- End of picture text -----**<br> 9/12 Doc ID 8002 Rev 4 **STPS30L45C** **Package Information** |**Table 9.**<br>**T**|**Table 9.**<br>**T**|**Table 9.**<br>**T**|**O-247 dimensions**|**O-247 dimensions**|||||| |---|---|---|---|---|---|---|---|---|---| |**D**<br>**L**||||**c**<br>**BACK VIEW**<br>**Heat-sink plane**<br>**A**<br>1<br>2<br>3<br>∅**P**|**Ref.**|**Dimensions**|||| |||||||**Millimeters**||**Inches**|| |||||||**Min.**|**Max.**|**Min.**|**Max.**| ||||||A|4.85|5.15|0.191|0.203| ||||||A1|2.20|2.60|0.086|0.102| ||**S**|**E**|**L2**<br>**A1**<br>**b1**<br>**b2**<br>**b**<br><br>**e**<br>2<br>3<br>∅**R**||||||| ||||||b|1.00|1.40|0.039|0.055| ||||||b1|2.00|2.40|0.078|0.094| ||||||b2|3.00|3.40|0.118|0.133| ||||||c<br>D(1)|0.40<br>19.85|0.80<br>20.15|0.015<br>0.781|0.031<br>0.793| |||**L1**<br>1|||E|15.45|15.75|0.608|0.620| ||||||e|5.45 typ.||0.215 typ.|| ||||||L|14.20|14.80|0.559|0.582| ||||||L1|3.70|4.30|0.145|0.169| ||||||||||| ||||||L2|18.50 typ.||0.728 typ.|| ||||||∅P(2)|3.55|3.65|0.139|0.143| ||||||∅R|4.50|5.50|0.177|0.217| ||||||S|5.50 typ.||0.216 typ.|| 1. Dimension D plus gate protrusion does not exceed 20.5 mm 2. Resin thickness around the mounting hole is not less than 0.9 mm 10/12 Doc ID 8002 Rev 4 **STPS30L45C** **Ordering Information** ## **3 Ordering Information** ## **Table 10. Ordering information** |**Order code**|**Marking**|**Package**|**Weight**|**Base qty**|**Delivery mode**| |---|---|---|---|---|---| |STPS30L45CT|STPS30L45CT|TO-220AB|2g|50|Tube| |STPS30L45CG|STPS30L45CG|D2PAK|1.8g|50|Tube| |STPS30L45CG-TR|STPS30L45CG|D2PAK|1.8g|500|Tape and reel| |STPS30L45CW|STPS30L45CW|TO-247|4.4g|30|Tube| |STPS30L45CR|STPS30L45CR|I2PAK|1.4g|50|Tube| |STPS30L45CFP|STPS30L45CFP|TO-220FPAB|1.9 g|50|Tube| ## **4 Revision history** ## **Table 11. Document revision history** |**Date**|**Revision**|**Changes**| |---|---|---| |Jul-2003|3B|Previous issue| |13-Oct-2010|4|Added paragraph above_Table 6_and updated I2PAK dimensions in<br>_Table 6_. Updated TO-247 dimensions in_Table 9_.| 11/12 Doc ID 8002 Rev 4 **STPS30L45C** ## **Please Read Carefully:** Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. **UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.** **UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.** Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2010 STMicroelectronics - All rights reserved ## STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America ## **www.st.com** 12/12 Doc ID 8002 Rev 4
Updated at February 9, 2023
STMicroelectronics is a global leader in the semiconductor industry, recognized for developing highly integrated, energy-efficient solutions that power modern electronics. With a strong focus on innovation, ST provides a comprehensive portfolio of microelectronics that address the demanding requirements of industrial, automotive, communications, and consumer applications. Our extensive selection of STMicroelectronics components is built around a robust lineup of discrete semiconductors and circuit protection devices. We offer a wide variety of single MOSFETs, Schottky diodes, and fast and ultrafast recovery rectifier diodes, designed to deliver exceptional efficiency and thermal performance in power management and conversion systems. For robust circuit protection, our inventory features hundreds of transient voltage suppressors and TVS diodes that safeguard sensitive electronic components against destructive voltage spikes. In addition to core power discretes like TRIACs, SCRs, bipolar transistors, and single IGBTs, our STMicroelectronics range includes specialized integrated passive filters and MEMS sensors. Furthermore, ST offers advanced integrated passive devices, such as baluns and RF filters, which utilize high-quality monolithic RF IPD processes on glass or high-resistance silicon substrates. These components provide competitive cost structures, reduced power losses, and simplified RFIC-to-antenna matching, ensuring optimal system performance and delivering the reliability required for next-generation wireless and power designs.
About Novapart
Novapart is a B2B electronic component broker specialising in stock shortages and cost reduction. We source hard-to-find parts and identify compliant alternatives across a catalogue of 410,000+ components from 500+ manufacturers.
Learn more →Stock Shortage Specialist
When a component is unavailable, discontinued or has an unacceptable lead time, we tap into our network of vetted European and Asian distributors to source what you need — without compromising on quality or traceability.
Request a quote →Compliant Alternatives
We identify pin-to-pin, electrically equivalent substitutes that meet the same certifications (RoHS, AEC-Q100, REACH) as your original specification — validated against datasheets, not just part numbers. Often at a lower cost.
BOM Analysis service →