STPS30L30DJF-TR

**==> picture [61 x 39] intentionally omitted <==**

## **STPS30L30DJF** 

## High efficiency power Schottky diode 

**Datasheet** − **production data** 

## **Features** 

- Low forward voltage drop 

- Very small conduction losses 

- Negligible switching losses 

- Avalanche rated 

- Extremely fast switching 

- Low thermal resistance 

- 1 mm package thickness 

- ECOPACK[®] 2 compliant component 

## **Description** 

Single Schottky rectifier suited for switch mode power supply and high frequency DC to DC converters. 

Packaged in PowerFLAT™ 5x6, this device is intended for use in low voltage high frequency inverters. 

**==> picture [182 x 234] intentionally omitted <==**

**----- Start of picture text -----**<br>
A<br>K<br>A<br>K K<br>A<br>A<br>PowerFLAT 5x6<br>STPS30L30DJF<br>**----- End of picture text -----**<br>


**Table 1.** 

## **Device summary** 

|**Symbol**|**Value**|
|---|---|
|IF(AV)|30 A|
|VRRM|30 V|
|Tj(max)|150 °C|
|VF(typ)|0.30 V|



TM: PowerFLAT is a trademark of STMicroelectronics 

1/7 

March 2012 

Doc ID 022946 Rev 1 

This is information on a product in full production. 

_www.st.com_ 

**Characteristics** 

**STPS30L30DJF** 

## **1 Characteristics** 

**Table 2. Absolute ratings (limiting values with anode terminals short-circuited)** 

|**Symbol**|**Symbol**|**Parameter**|**Parameter**|**Value**|**Unit**|
|---|---|---|---|---|---|
|VRRM||Repetitive peak reverse voltage||30|V|
|IF(RMS)||Forward rms current||45|A|
|IF(AV)||Average forward currentδ= 0.5|Tc= 110 °C|30|A|
|IFSM||Surge non repetitive forward current|tp= 10 ms sinusoidal|250|A|
|PARM||Repetitive peak avalanche power|tp= 1 µs, Tj= 25 °C|1300|W|
|VARM||Maximum repetitive peak avalanche<br>voltage|tp<1 µs, Tj< 150 °C,<br>IAR< 11 A|35|V|
|Tstg||Storage temperature range||-65 to + 175|°C|
||Tj|Maximum operating junction temperature(1)||150|°C|
|1.<br>condition to avoid thermal runaway for a diode on its own heatsink<br>**Table 3.**<br>**Thermal resistance**<br>dPtot<br>dTj<br><<br>1<br>Rth(j-a)||||||
|**Symbol**||**Parameter**||**Value**|**Unit**|
|Rth(j-c)||Junction to case||2|°C/W|



**Table 4. Static electrical characteristics (anode terminals short-circuited)** 

|**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|---|---|---|
|IR<br>(1)|Reverse leakage<br>current|Tj= 25 °C|VR= 30 V|-|-|0.75|mA|
|||Tj= 125 °C||-|100|230|mA|
|VF<br>(1)|Forward voltage drop|Tj= 25 °C|IF= 15 A|-|-|0.44|V|
|||Tj= 125 °C|IF= 15 A|-|0.30|0.35||
|||Tj= 25 °C|IF= 30 A|-|-|0.51||
|||Tj= 125 °C|IF= 30 A|-|0.38|0.45||



1. Pulse test: tp = 380 µs, δ < 2% 

To evaluate the conduction losses use the following equation: 

P = 0.27 x IF(AV) + 0.006 x IF2(RMS) 

2/7 

Doc ID 022946 Rev 1 

**STPS30L30DJF** 

**Characteristics** 

**Figure 1. Average forward power dissipation Figure 2. Average forward current versus versus average forward current ambient temperature (** δ **= 0.5)** 

**==> picture [433 x 131] intentionally omitted <==**

**----- Start of picture text -----**<br>
PF(AV)(W) IF(AV)(A)<br>25 35<br>Piette δ=0.5 δ=1 30 a Rth(j -a)=Rth(j-c)<br>20 PEt; eT yeyeT tTyyy PT a<br>δ=0.2 7 7 25<br>δ=0.1<br>δ=0.05<br>15 SERCO an | LA et | | 20 eeA E<br>PITT IAYI AV AeA7 [7 es<br>15<br>10<br>Oe OLIL fixeLx | | EER 10 A;<br>5 mm444>Zaeeee T T a<br>EE ao 5 es<br>Lig Cf |<br>0 ALew | IF(AV)(A) a δ [=tp/T] io tp 0 δ [=tp/T] m: tp Re Tamb(°C)<br>0 5 10 15 20 25 30 35 40 0 25 50 75 100 125 150<br>**----- End of picture text -----**<br>


**Figure 3. Normalized avalanche power derating versus pulse duration** 

**Figure 4. Normalized avalanche power derating versus junction temperature** 

**==> picture [438 x 129] intentionally omitted <==**

**----- Start of picture text -----**<br>
PARM(tp) PARM (Tj)<br>1 PARM(1µs) 1.2 PARM(25°C)<br>1 ING<br>SSH ™ i | 6 SE R E ESE GER See<br>0.1 UII | ETE INTE TTT 0.8 EASES EEE<br>eeeEARaca Od 0d cs 0.6 Npes<br>a | La OT EERE<br>0.01 an a | StI 0.4 EEREEe SEE<br>0.2<br>T (°C)j<br>0.001 SS coi ont tp(µs) Conon | 025 BEREEEEEeee 50 ERR 75 EERE 100 eeeEERE 125 150<br>0.01 0.1 1 10 100 1000<br>**----- End of picture text -----**<br>


**Figure 5. Relative variation of thermal impedance, junction to case, versus pulse duration** 

**Figure 6. Reverse leakage current versus reverse voltage applied (typical values)** 

**==> picture [434 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
Zth(j-c)/Rth(j-c) IR(mA)<br>1.0 Cor Toon 1.E+03 SS SS SSSSS<br>0.9 Tj =150°C<br>ag ee<br>0.8 Te 2 ni ont 1.E+02 pee== Tj=125°C —————————<br>0.7<br>0.60.5 ETEorCT TU TTZn 1.E+01 SSaSS SS eS S TTj=100°Cj=75°C sS<br>0.4 O_oFETEa |voEton 1.E+00 pa_—————=——— see Tj=50°C<br>0.3 EE ——— — — Tj=25°C<br>0.2 1.E-01<br>ee oe a<br>0.1 Single pulse tp(s) VR(V)<br>0.0 Lot E  tereLT TT ET SrTTL TT TT) 1.E-02 LCSSS[| [| [~T [| {| SSS{[ | JT | [|<br>1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 0 5 10 15 20 25 30<br>**----- End of picture text -----**<br>


3/7 

Doc ID 022946 Rev 1 

**Characteristics** 

**STPS30L30DJF** 

## **Figure 7. Junction capacitance versus reverse voltage applied (typical values)** 

## **Figure 8. Forward voltage drop versus forward current** 

**==> picture [462 x 340] intentionally omitted <==**

**----- Start of picture text -----**<br>
10000C(pF) 100.0IFM(A)<br>VoscF=1MHzT=30mVj=25°CRMS (Maximum values)Tj=125°C<br>10.0<br>(Typical values)Tj=125°C<br>1000 (Maximum values)Tj=25°C<br>1.0<br>VR(V) VFM(V)<br>100 0.1<br>1 10 100 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7<br>Figure 9. Thermal resistance junction to  Figure 10. Reverse safe operating area<br>ambient versus copper surface  (tp < 1 µs and Tj < 150 °C)<br>under each tab<br>Rth(j-a)(°C/W)<br>250<br>Epoxy printed board FR4 Iarm (A)<br>copper thickness = 35 µm 15.0<br>200<br>13.0<br>150 11.0<br>9.0<br>100<br>7.0<br>50 5.0<br>Varm (V)<br>Scu (cm [2] ) 3.030 35 40 45 50 55 60 65 70<br>0<br>0 1 2 3 4 5 6 7 8 9 10<br>**----- End of picture text -----**<br>


4/7 

Doc ID 022946 Rev 1 

**STPS30L30DJF** 

**Package information** 

## **2 Package information** 

- Epoxy meets UL94,V0 

- Lead-free package 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK[®] packages, depending on their level of environmental compliance. ECOPACK[®] specifications, grade definitions and product status are available at: www.st.com. ECOPACK[®] is an ST trademark. 

**==> picture [190 x 9] intentionally omitted <==**

**----- Start of picture text -----**<br>
Table 5. PowerFLAT 5x6 dimensions<br>**----- End of picture text -----**<br>


**==> picture [406 x 251] intentionally omitted <==**

**----- Start of picture text -----**<br>
Dimensions<br>Ref. Millimeters Inches<br>D2 Min. Typ. Max. Min. Typ. Max.<br>E2 A 0.80 1.00 0.031 0.039<br>K A1 0.02 0.05 0.001 0.002<br>A2 0.25 0.010<br>e b L<br>b 0.30 0.50 0.012 0.020<br>A<br>A1 D A2 D 5.20 0.205<br>D2 4.11 4.31 0.162 0.170<br>e 1.27 0.050<br>E<br>E 6.15 0.242<br>E2 3.50 3.70 0.138 0.146<br>L 0.50 0.80 0.020 0.031<br>K 1.275 1.575 0.050 0.062<br>**----- End of picture text -----**<br>


## **Figure 11. Footprint (dimensions in mm)** 

**==> picture [116 x 147] intentionally omitted <==**

**----- Start of picture text -----**<br>
5.35<br>4.41<br>0.98<br>0.95<br>0.62<br>1.27<br>3.86 4.33 6.29<br>**----- End of picture text -----**<br>


5/7 

Doc ID 022946 Rev 1 

**Ordering information** 

**STPS30L30DJF** 

**==> picture [405 x 267] intentionally omitted <==**

**----- Start of picture text -----**<br>
Figure 12. Tape and reel specifications<br>Dot identifying Pin A1 location Ø 1.55<br>2.0 4.0<br>0.30<br>0.20<br>Ø 1.5<br>R 0.50<br>6.30<br>8.0<br>1.20<br>All dimensions are typical values in mm User direction of unreeling<br>1.75<br>5.5<br>12.0<br>5.30<br>**----- End of picture text -----**<br>


## **3 Ordering information** 

**Table 6. Ordering information** 

|**Order code**|**Marking**|**Package**<br>|**Weight **|**Base qty**|**Delivery mode**|
|---|---|---|---|---|---|
|STPS30L30DJF-TR|PS30 L30|PowerFLAT 5x6<br>|0.095 g|3000|Tape and reel|



## **4 Revision history** 

## **Table 7. Document revision history** 

|**Date**|**Revision**|**Changes**|
|---|---|---|
|16-Mar-2012|1|First issue.|



6/7 

Doc ID 022946 Rev 1 

**STPS30L30DJF** 

## **Please Read Carefully:** 

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 

All ST products are sold pursuant to ST’s terms and conditions of sale. 

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. 

**UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.** 

**UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.** 

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. 

ST and the ST logo are trademarks or registered trademarks of ST in various countries. 

Information in this document supersedes and replaces all information previously supplied. 

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. 

© 2012 STMicroelectronics - All rights reserved 

## STMicroelectronics group of companies 

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 

**www.st.com** 

7/7 

Doc ID 022946 Rev 1