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STPS1L30A
Small Signal Schottky Diode, Single, 30 V, 1 A, 395 mV, 75 A, 150 °C
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- Manufacturer: STMICROELECTRONICS
- Product type:
- Diode Configuration:Single; Repetitive Reverse Voltage Vrrm Max:30V; Forward Current If(AV):1A; Forward Voltage VF Max:395mV; Forward Surge Current Ifsm Max:75A; Operating Temperature Max:150°C;
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 2Pins
- Product Range: -
- Qualification: -
- Diode Mounting: Surface Mount
- Diode Case Style: DO-214AC (SMA)
- Diode Configuration: Single
- Forward Voltage Max: 395mV
- Forward Surge Current: 75A
- Reverse Recovery Time: -
- Average Forward Current: 1A
- Operating Temperature Max: 150°C
- Repetitive Peak Reverse Voltage: 30V
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.073 € |
| Current stock | 1000+ |
| Lead time | 30 days |
Datasheet
**STPS1L30** Datasheet ## 30 V, 1 A low drop power Schottky rectifier ## **Features** - Very low forward voltage drop for less power dissipation - Surface mount miniature packages - Avalanche rated - ECOPACK2 compliant ## **Applications** - Cordless appliance - SSD - Battery charger - Telecom power - DC / DC converter ## **Description** Schottky rectifiers designed for high frequency miniature switched mode power supplies such as adaptors and on board DC/DC converters. Packaged in SMA, SMA Flat Notch or SMB, the STPS1L30 is ideal for use in parallel with MOSFETs in synchronous rectification. ## **Product status** STPS1L30 |**Product summary**|**Product summary**| |---|---| |**Symbol**|**Value**| |**IF(AV)**|1 A| |**VRRM**|30 V| |**T j(max.)**|150 °C| |**VF(typ.)**|0.26 V| **DS1243** - **Rev 8** - **September 2019** For further information contact your local STMicroelectronics sales office. www.st.com **STPS1L30 Characteristics** **1** ## **Characteristics** **Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)** |**Symbol**|**Parameter**|||**Value**|**Unit**| |---|---|---|---|---|---| |VRRM|Repetitive peak reverse voltage|||30|V| |IF(RMS)|Forward rms current|||10|A| |IF(AV)|Average forward current, δ = 0.5, square wave|SMA|TL= 135 °C|1|A| |||SMA Flat Notch|TL= 140 °C||| |||SMB|TL= 140 °C||| |IFSM|Surge non repetitive forward current|SMA|tp= 10 ms sinusoidal|75|A| |||SMA Flat Notch||90|| |||SMB||75|| |PARM|Repetitive peak avalanche power||tp= 10 µs, Tj= 125 °C|110|W| |Tstg|Storage temperature range|||-65 to +150|°C| |Tj|Maximum operating junction temperature(1)|||+150|°C| _1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink._ **Table 2. Thermal resistance parameter** |**Symbol**|**Parameter**||**Max. value**|**Unit**| |---|---|---|---|---| |Rth(j-l)|Junction to lead|SMA|30|°C/W| |||SMA Flat Notch|20|| |||SMB|25|| For more information, please refer to the following application note : - AN5088 : Rectifiers thermal management, handling and mounting recommendations **Table 3. Static electrical characteristics** |**Symbol**|**Parameter**|**Test conditions**|**Test conditions**|**Min.**|**Typ.**|**Max.**|**Unit**| |---|---|---|---|---|---|---|---| |IR(1)|Reverse leakage current|Tj= 25 °C|VR= VRRM|-||200|µA| |||Tj= 100 °C||-|6|15|mA| |VF(1)|Forward voltage drop|Tj= 25 °C|IF= 1 A|-||0.395|V| |||Tj= 125 °C||-|0.260|0.300|| |||Tj= 25 °C|IF= 2 A|-||0.445|| |||Tj= 125 °C||-|0.325|0.375|| _1. Pulse test: tp = 380 µs, δ < 2%_ To evaluate the conduction losses, use the following equation: P = 0.225x IF(AV) + 0.075 x IF[2] (RMS) **DS1243** - **Rev 8** **page 2/15** **STPS1L30 Characteristics (curves)** For more information, please refer to the following application notes related to the power losses : - AN604: Calculation of conduction losses in a power rectifier - AN4021: Calculation of reverse losses on a power diode ## **1.1 Characteristics (curves)** **==> picture [513 x 432] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 2. Average forward current versus ambient<br>Figure 1. Average forward power dissipation versus<br>temperature (δ = 0.5)<br>average forward current<br>PF(AV)(W) 6 IF(AV)(A)<br>0.50 Rth(j-a)= [R] th(j-l)<br>0.45 δ = 0.05 δ = 0.1 δ = 0.2 δ = 0.5<br>5<br>0.40 SMB<br>0.35 4<br>0.30 SMA<br>δ = 1<br>3<br>0.25<br>0.20 2<br>0.15 T<br>0.10 T 1<br>0.05 δ [=tp/T] tp Tamb(°C)<br>IF(A V) (A) δ [=tp/T] tp 0<br>0.00 0 25 50 75 100 125 150<br>0.0 0.2 0.4 0.6 0.8 1.0 1.2<br>Figure 3. Normalized avalanche power derating versus<br>junction temperature (Tj = 125 °C) Figure 4. Relative variation of thermal impedance junction<br>to ambient versus pulse duration (SMB)<br>PARM(tp)<br>PARM(10 µs) Zth(j-a)/Rth(j-a)<br>1 1.00<br>SMB<br>0.1<br>0.10<br>Single pulse<br>0.01<br>tp(s)<br>0.001 t p(µs) 0.011.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03<br>1 10 100 1000<br>**----- End of picture text -----**<br> **DS1243** - **Rev 8** **page 3/15** **STPS1L30 Characteristics (curves)** **==> picture [513 x 206] intentionally omitted <==** **----- Start of picture text -----**<br> Figure 6. Reverse leakage current versus reverse voltage<br>Figure 5. Relative variation of thermal impedance junction applied (typical values)<br>to ambient versus pulse duration (SMA)<br>IR(mA)<br>Zth(j-a)/Rth(j-a) 1.E+2<br>1.00 T j=150°C<br>SMA<br>1.E+1 T j=125°C<br>T j=100°C<br>1.E+0<br>0.10<br>1.E-1<br>Single pulse T j=25°C<br>1.E-2<br>tp(s) VR (V)<br>0.01 1.E-3<br>1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 0 5 10 15 20 25 30<br>**----- End of picture text -----**<br> **Figure 7. Junction capacitance versus reverse voltage applied (typical values)** **Figure 8. Forward voltage drop versus forward current (typical values, high level)** **==> picture [513 x 391] intentionally omitted <==** **----- Start of picture text -----**<br> C(pF) IF(A)<br>500 10.00<br>F=1MHz<br>VOSC=30mVRMS<br>T =25°Cj<br>T =150°Cj<br>100<br>1.00 T =100°Cj T =25°Cj<br>10 VR(V) VF(V)<br>0.10<br>1 2 5 10 20 50 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7<br>Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus<br>(maximum values, low level) copper surface under each lead (SMB)<br>IF(A) Rth(j-a) (°C/W)<br>3.0 200<br>Tj =150°C Epoxy p rinted circuit board FR4, copper t hickness: 35 µm SMB<br>2.5<br>T =100°Cj 150<br>2.0 T =125°Cj<br>1.5 100<br>T =25°Cj<br>1.0<br>50<br>0.5<br>S (Cu) (cm²)<br>VF(V)<br>0.0 0<br>0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br> **DS1243** - **Rev 8** **page 4/15** **STPS1L30 Characteristics (curves)** **Figure 11. Thermal resistance junction to ambient versus Figure 12. Thermal resistance junction to ambient versus copper surface under each lead (SMA) copper surface under each lead (SMA Flat Notch)** **==> picture [480 x 152] intentionally omitted <==** **----- Start of picture text -----**<br> Rth(j-a) (°C/W) Rth(j-a) (°C/W)<br>200 200<br>Epoxy printed circuit board FR4,copper thickness: 35 µm SMA Epoxy printed circuit board FR4,copper thickness: 35 µm<br>SMA Flat Notch<br>150 150<br>100 100<br>50 50<br>S(Cu)(cm²) S(Cu)(cm²)<br>0 0<br>0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0<br>**----- End of picture text -----**<br> **DS1243** - **Rev 8** **page 5/15** **STPS1L30 Package information** **2 Package information** In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. **DS1243** - **Rev 8** **page 6/15** **STPS1L30 SMA package information** ## **2.1 SMA package information** - Epoxy meets UL94, V0 - Cooling method : by conduction (C) ## **Figure 13. SMA package outline** **==> picture [303 x 223] intentionally omitted <==** **----- Start of picture text -----**<br> E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br> **Table 4. SMA package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---| |**Ref.**|**Millimeters**||**Inches (for reference only)**|| ||**Min.**|**Max.**|**Min.**|**Max.**| |A1|1.90|2.45|0.074|0.097| |A2|0.05|0.20|0.001|0.008| |b|1.25|1.65|0.049|0.065| |c|0.15|0.40|0.005|0.016| |D|2.25|2.90|0.088|0.115| |E|4.80|5.35|0.188|0.211| |E1|3.95|4.60|0.155|0.182| |L|0.75|1.50|0.029|0.060| **DS1243** - **Rev 8** **page 7/15** **STPS1L30 SMA package information** ## **Figure 14. SMA recommended footprint in mm (inches)** **==> picture [226 x 113] intentionally omitted <==** **----- Start of picture text -----**<br> 1.4 2.63 1.4<br>(0.055) (0.104) (0.055)<br>1.64<br>(0.065)<br>5.43<br>(0.214)<br>**----- End of picture text -----**<br> **DS1243** - **Rev 8** **page 8/15** **STPS1L30 SMA Flat Notch package information** ## **2.2 SMA Flat Notch package information** - Epoxy meets UL94, V0 - Cooling method: by conduction (C) - Band indicates cathode **Figure 15. SMA Flat Notch package outline** **Table 5. SMA Flat Notch package mechanical data** |**Ref.**<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~|**Dimensions**<br>~~ee~~<br>~~=~~| |---|---|---|---|---|---|---| ||**Millimeters**<br>~~es~~<br>~~=~~|||**Inches (for reference only)**<br>~~es~~<br>~~=~~||| ||**Min.**<br>~~=~~|**Typ.**<br>~~=~~|**Max.**<br>~~=~~|**Min.**<br>~~=~~|**Typ.**<br>~~=~~|**Max.**<br>~~=~~| |A1|0.90||1.10|0.035||0.044| |A1||0.05|||0.002|| |b|1.25||1.65|0.049||0.065| |C|0.15||0.40|0.005||0.016| |D|2.25||2.90|0.088||0.115| |E|5.00||5.35|0.196||0.211| |E1|3.95||4.60|0.155||0.182| |G||2.00|||0.079|| |G1||0.85|||0.033|| |L|0.75||1.20|0.029||| |L1||0.45|||0.018|| |L2||0.45|||0.018|| |L3||0.05|||0.002|| |V|||8°|||8°| |V1|||8°|||8°| **DS1243** - **Rev 8** **page 9/15** **STPS1L30 SMA Flat Notch package information** **Figure 16. SMA Flat Notch recommended footprint in mm (inches)** **==> picture [287 x 140] intentionally omitted <==** **----- Start of picture text -----**<br> 1.20 3.12 1.20<br>(0.047) (0.123) (0.047)<br>1.52<br>(0.060)<br>5.52<br>(0.217)<br>**----- End of picture text -----**<br> **DS1243** - **Rev 8** **page 10/15** **STPS1L30 SMB package information** ## **2.3 SMB package information** - Epoxy meets UL94, V0 - Lead-free package **Figure 17. SMB package outline** **==> picture [303 x 237] intentionally omitted <==** **----- Start of picture text -----**<br> E1<br>D<br>E<br>A1<br>C A2<br>L b<br>**----- End of picture text -----**<br> **Table 6. SMB package mechanical data** ||**Dimensions**|**Dimensions**|**Dimensions**|**Dimensions**| |---|---|---|---|---| |**Ref.**|**Millimeters**||**Inches (for reference only)**|| ||**Min.**|**Max.**|**Min.**|**Max.**| |A1|1.90|2.45|0.074|0.097| |A2|0.05|0.20|0.001|0.008| |b|1.95|2.20|0.076|0.087| |c|0.15|0.40|0.005|0.016| |D|3.30|3.95|0.129|0.156| |E|5.10|5.60|0.200|0.221| |E1|4.05|4.60|0.159|0.182| |L|0.75|1.50|0.029|0.060| **DS1243** - **Rev 8** **page 11/15** **STPS1L30 SMB package information** ## **Figure 18. SMB recommended footprint** **==> picture [226 x 113] intentionally omitted <==** **----- Start of picture text -----**<br> 1.62 2.60 1.62<br>(0.064) (0.102) (0.064)<br>2.18<br>(0.086)<br>5.84<br>(0.230)<br>**----- End of picture text -----**<br> **DS1243** - **Rev 8** **page 12/15** **STPS1L30 Ordering Information** ## **3 Ordering Information** **Table 7. Ordering information** |**Order code**|**Marking**|**Package**|**Weight**|**Base qty.**|**Delivery mode**| |---|---|---|---|---|---| |STPS1L30A|GB3|SMA|0.068 g|5000|Tape and reel| |STPS1L30AFN|A13|SMA Flat Notch|0.039 g|10 000|Tape and reel| |STPS1L30U|G23|SMB|0.107 g|2500|Tape and reel| **DS1243** - **Rev 8** **page 13/15** **STPS1L30** ## **Revision history** **Table 8. Document revision history** |**Date**|**Version**|**Changes**| |---|---|---| |Jul-2003|5A|Last update.| |Aug-2004|6|SMA package dimensions update. Reference A1 max changed from 2.70 mm (0.106 inc.) to 2.03 mm<br>(0.080 inc).| |17-Sep-2018|7|UpdatedTable 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)and<br>Figure 3. Normalized avalanche power derating versus junction temperature (Tj= 125 °C).| |26-Sep-2019|8|AddedSection 2.2 SMA Flat Notch package information.| **DS1243** - **Rev 8** **page 14/15** **STPS1L30** ## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. © 2019 STMicroelectronics – All rights reserved **DS1243** - **Rev 8** **page 15/15**
Updated at April 29, 2026
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