ST87M01-1001

**ST87M01** 

Datasheet 

## Ultra-compact, low-power NB-IoT industrial module series with GNSS capability 

## **Features** 

- LTE, category NB2, Release 15 

- • Worldwide regional band coverage • Single tone/Multi tone/Extended TBS and 2 HARQ • Up to DL: 127 kbps, UL: 159 kbps • eDRX and PSM support • Ultralow power mode 1.2 uA typical (0.5 uA typical in power-off) • Ultra-compact size 

## **Product status link** 

ST87M01 

## **Product label** 

- Embedded IoT internet protocols 

- • Differential FOTA support • Up to 23 dBm power-out • Multiple I/F and GPIO • GCF certified 

- RED certified 

- • Optional eSIM GSMA compliant with an additional secure element • Optional GNSS and A-GNSS 

- Optional wireless M-Bus mode 

- Optional WiFi positioning for IEEE 802.11b hot spots 

- • Weight: 660mg 

## **Description** 

## **Product label** 

The ST87M01 is a high-performance, fully programmable, ultra-compact, low-power, certified LTE Cat NB2 NB-IoT and GNSS industrial module series offering worldwide band coverage, with advanced security features. 

**DS14679** - **Rev 2** - **May 2025** For further information, contact your local STMicroelectronics sales office. 

www.st.com 

**ST87M01 Generalinformation** 

## **1 General information** 

## **1.1 Acronyms and terms** 

**Table 1. Definitions of terms** 

|**Term**|**Definition**|
|---|---|
|PSM|Power Saving Mode|
|eDRX|Extended Discontinuous Reception|
|PA|Power amplifier|
|SIM / eSIM|Subscriber Identity Module / embedded Subscriber Identity Module|
|LDO regulator|Low Dropout regulator|
|MCU|Microcontroller Unit|
|RF|Radio frequency|
|DFOTA|Differential FOTA|



## **1.2 Reference documents** 

The documents listed in Table 2 provide further information. 

## **Table 2. Reference documents** 

|**Reference**|**Document**|
|---|---|
|[1]|3GPP TS 36.521-1|



**DS14679** - **Rev 2** 

**page 2/20** 

**ST87M01 Product description** 

## **2 Product description** 

This section provides an overview of the principal technical data describing the ST87M01 narrow-band Internet of Things (NB-IoT) and GNSS cellular module family. An ultra-compact, ultralow power, cost-efficient, certified NBIoT, and GNSS module family, offering multiband data transmission, is hereby introduced along with its super compact form factor. 

## **2.1** 

## **Overview** 

The ST87M01 is a high-performance, with ultralow power consumption, NB-IoT (LTE Cat NB2) 3GPP Release 15 and GNSS certified module family. 

The ST87M01 module family supports multifrequency bands, with an extended multiregional coverage, enabling almost complete worldwide NB-IoT data communication. In addition, the presence of the GNSS receiver allows to support multiple satellite constellations to address high-accuracy localization applications. 

Moreover, the ultra-compact module form factor makes the ST87M01 family the perfect choice for size critical applications, allowing for miniaturization. In fact, the ultra-compactness is a crucial characteristic addressed by the ST87M01 family, hereby presented in an LGA package of only 10.6 mm x 12.8 mm (with 51 pins). 

Furthermore, thanks to the ultralow power consumption and industrial qualification grade over the industrial temperature range, the ST87M01 family represents the best choice for a wide range of IoT applications: ranging from smart grid, energy smart metering, smart city, factory automation, industrial IoT, and asset tracking to any smart monitoring applications matching Low Power Wide Area Network (LPWAN) communication requirements. 

STMicroelectronics may update the firmware provided with the modules at any time. Pre-loaded version by ST must be checked by customer before going to production to verify if a newer version is available. The available version to load could be requested directly to ST sales office or found at www.st.com. STMicroelectronics recommends that users regularly check for documentation and the current firmware version available at www.st.com. 

Additionally, the ST87M01 family embeds PDU SMS service and internet protocols for NB-IoT products, including TCP/IP, TLS/DTLS, CoAP, LwM2M, MQTT, and HTTP/HTTPS, which enable a multiple and broad set of IoT applications. 

Lastly, full support of Power Saving Mode (PSM) and Extended Discontinuous Reception (eDRX) mechanisms, along with ultralow power silicon technology adoption and a dedicated interface to wake up the module on an interrupt-base, allow the ST87M01 family to achieve an extra long battery life on a single cell primary battery. 

The ST87M01 family is designed and qualified according to industrial grade: each manufactured module is fully tested, traced, and satisfies STMicroelectronics' stringent reliability and quality requirements, to meet the highest levels of product quality and reliability for 15 years of long-term use in the field. 

## **2.2** 

## **Safety information** 

The ST87M01 is typically used in well-defined applications such as metering equipment, however it can be used in any application requiring NB-IoT connectivity so an assessment of the human risk associated with the usage of an RF cellular terminal should be done, and precautions must be observed, in all phases of the operations of the terminal incorporating the ST87M01, by the terminal manufacturer. 

The terminal manufacturer must notify users and personnel of this safety information. STMicroelectronics is not liable if the terminal manufacturer does not properly notify the user of the precautions. 

The ST87M01 is compliant with the normative related to EMC, RF exposure, and electrical safety listed in Section 5.2.1: Table 7, however the terminal manufacturer should verify the compliance with specific norms related to the specific application, considering also the following general precautions: 

- Mobile communication equipment should not be used while driving according to specific laws and regulations. 

- Wireless devices must be switched off on aircraft during the flight to prevent interference. More specific restrictions should be verified by airline staff. 

- Wireless devices could create interference with some medical equipment. 

- Cellular communication cannot be ensured in all network conditions. Emergency communication can be done only with adequate cellular signal strength. 

- RF interference can occur if the terminal is used close to radios, computers, or other electric equipment. 

- In areas with a risk of explosion, specific indications and signs must be followed. 

**DS14679** - **Rev 2** 

**page 3/20** 

**ST87M01 Product description** 

## **2.3 Key features** 

## **Module family name** 

ST87M01 

## **Cellular radio access technology** 

LTE Cat NB2, 3GPP Release 15 

## **Hardware** 

Module form factor: metallic shielded LGA package (51 pin) Dimensions [mm]: 10.6 x 12.8 x 2.4 

## **LTE FDD certified frequency bands** 

B1, B3, B5, B8, B20, B28 selected for GCF certification over a hardware capability for almost WW coverage [B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/B19/B20/B25/B26/B28/B65/B66/B70/B71/B85, supported by the same hardware] 

## **Transmit power** 

Class-3: +23 dBm 

## **Data transmission** 

Single tone: DL: 26 kbps, UL: 16 kbps Multi-tone: DL: 26 kbps, UL: 66 kbps Extended TBS and 2 HARQ (Cat NB2): DL: 127 kbps, UL: 159 kbps **Embedded protocol stacks** IPv6, TCP/UDP, CoAP/LWM2M, MQTT, HTPP/HTTPS, DTLS **Firmware upgrade** Host via UART and DFOTA over LWM2M, ext. SPI flash (for production only) **SMS** Only PDU mode **AT commands** 3GPP & STMicroelectronics Extended AT commands **Interfaces** 

Control: reset and wake-up Peripherals: 1xUSIM (1.8 V only), 2xUART, 2xI[2] C, 1xSPI, up to 2xADC and 28xGPIO RF ports: 50 Ω antennas for NB-IoT and GNSS 

## **Localization services (only for some specific p/n)** 

Optional A-GNSS: GPS, Galileo, optimized concurrent mode Optional WiFi positioning for IEEE 802.11b hot spots Optional eSIM with additional secure element **Secondary data communication service (only for some specific p/n)** Wireless M-BUS physical layer EN-13757-4 Rel. 2019 Modes: T1 – 868.95MHz, C1 – 868.95MHz **Typical power supply range** VIO: 1.8 V to 3.3 V VPMU_x/VDCDC/VPA: 2.2 to 3.0 V **Industrial grade** : -40 °C to +85 °C 

## **2.4** 

## **Product variants** 

**ST87M01-ABCD** is the product family name that is specified for each single PN as described below: “A” indicates the subset of FDD certified frequency bands addressed by the specific PN. “B” indicates the secondary mode of operation addressed by the specific PN. “C” indicates the presence or absence of the eSIM for the specific PN. 

“D” indicates specific application features. 

**DS14679** - **Rev 2** 

**page 4/20** 

**ST87M01 Product description** 

**Table 3. Ordering codes table** 

|**Commercial product**|**Description**|
|---|---|
|ST87M01-1000|NB-IoT only (B1, B3, B5, B8, B20, B28 LTE bands)|
|ST87M01-1100|NB-IoT (B1, B3, B5, B8, B20, B28 LTE bands) and GPS|
|ST87M01-1101|NB-IoT (B1, B3, B5, B8, B20, B28 LTE bands), GPS and extra ADC|
|ST87M01-1111|NB-IoT (B1, B3, B5, B8, B20, B28 LTE bands), GPS, Vodafone eSIM and extra ADC|
|ST87M01-1400|NB-IoT only (B1, B3, B5, B8, B20, B28 LTE bands) and Wireless M-BUS|



**DS14679** - **Rev 2** 

**page 5/20** 

**ST87M01 Module pad** 

## **3 Module pad** 

## **3.1 Pad assignment overview** 

## **Figure 1. ST87M01 pin assignment** 

**DS14679** - **Rev 2** 

**page 6/20** 

**ST87M01 SMT production guide** 

## **4 SMT production guide** 

## **4.1 Reflow profile** 

**Figure 2. JEDEC STD020 reflow profile** 

**Table 4. Reflow profile parameters** 

|**Profile parameter**|**Value**|
|---|---|
|Preheat time (ts)|60 – 120 seconds|
|Preheat temperatures (Tsmin - Tsmax)|150 – 200 °C|
|TL|217 °C|
|Total time above TL|60 – 150 seconds|
|Peak temperature (TP)|245 – 250 °C|
|Time within 5 °C of peak|30 – 40 seconds|
|Ramp-up (from 217 °C to peak)|0.0 – 3.0 degrees / seconds|
|Ramp-down (from peak to 217 °C)|-6.0 – -1.0 degrees / seconds|
|Time from 25 °C to peak|5 – 8 minutes|



## **4.2 Baking requirements** 

The module is rated MSL3 as defined in JEDEC J-STD-020 and it is shipped in a sealed bag reporting the sealing date. 

**DS14679** - **Rev 2** 

**page 7/20** 

**ST87M01 SMT production guide** 

## **4.3 Module marking information** 

**Figure 3. Module marking information** 

**DS14679** - **Rev 2** 

**page 8/20** 

**ST87M01 Environmental and certifications** 

**5 Environmental and certifications** 

## **5.1 Environmental specifications** 

**Table 5. Operating condition** 

|**Parameter**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|
|Extended operating temperature|-40||+85|°C|



_Note:_ 

_In the extended operating temperature, the module remains fully functional during and after environmental exposure._ 

**Table 6. Storage condition** 

|**Parameter**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|
|Storage temperature|-40||+85|°C|



_Note: The module is delivered in tape and reel carriers and must be stored in sealed, moisture barrier, antistatic bags. Note: The module is not powered._ 

## **5.2 Regulatory** 

The ST87M01 is designed to comply with the directives and standards listed in the following sections. 

## **5.2.1** 

## **RED** 

RED certification covers the bands FDD 1, FDD 3, FDD 8, FDD 20, and FDD 28. 

**Table 7. RED information** 

||**Table 7.RED information**|
|---|---|
|EMC<br>[Radio]|EMC testing according to:<br>•<br>EN 301 489-1 V2.2.3: common technical requirements<br>•<br>EN 301 489-19 V2.2.1: GNSS<br>•<br>EN 301 489-52 V1.2.1: LTE NB-IoT|
|RF<br>[NB-IoT]|LTE NB-IoT RF conducted testing according to EN 301 908-13 V13.2.1|
|RF<br>[NB-IoT]|LTE NB-IoT Radiated Spurious Emissions (RSE) testing according to EN 301 908-1 V15.1.1|
|RF<br>[NB-IoT]|LTE NB-IoT RF conducted assessment according to EN 301 908-13 V13.2.1|
|RF<br>[GNSS]|GNSS RF testing according to EN 303 413 V1.2.1 for the following constellations<br>•<br>GPS: L1|
|RF<br>SRD 868.95MHz<br>[Wireless M-BUS]|SRD 433 MHz RF Partial Testing according to:<br>•<br>EN 300 220-1 V3.1.1<br>•<br>EN 300 220-2 V3.1.1<br>–<br>Clause 4.2 (Tx Mode)<br>–<br>Clause 4.3|
|MPE|RF exposure report according to EN 62311:2020 standard|
|Safety|Electrical safety testing according to EN 62368-1:2014/AC:2015|



**DS14679** - **Rev 2** 

**page 9/20** 

**ST87M01** 

**Environmental and certifications** 

The full text of the EU declaration of conformity is available online at the following address: https://www.st.com/ 

## **5.2.2** 

## **GCF** 

GCF certification covers the bands FDD 1, FDD 3, FDD 5, FDD 8, FDD 20, and FDD 28. 

## **Table 8. GCF information** 

||**Table 8.GCF information**|
|---|---|
|RSE|LTE: 3GPP TS 36.124|
|LTE NB-IoT|RF: 3GPP TS 36.521-1<br>RRM: 3GPP TS 36.521-3<br>Protocol: 3GPP TS 36.523-2|
|UICC<br>USIM/USAT|USIM: 3GPP TS 31.121<br>UICC (Electrical SIM): ETSI TS 102 230-1|



## **5.3** 

## **RoHS directive compliance** 

Product meets EU RoHS requirement (RoHS Directive 2011/65/EU - 8 June 2011 – Annex II amended by delegated directive 2015/863 - 31 March 2015) without any exemptions. 

**DS14679** - **Rev 2** 

**page 10/20** 

**ST87M01 Package information** 

## **6 Package information** 

To meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions, and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **6.1 Mechanical information** 

**Figure 4. POA (side and top view)** 

**DS14679** - **Rev 2** 

**page 11/20** 

**ST87M01 Package information** 

**Figure 5. POA (bottom view)** 

**Table 9. Mechanical dimensions** 

|**Item**<br>~~Pe~~|**Dimensions (mm)**|**Tolerance (mm)**|
|---|---|---|
|A<br>~~Pe~~|12.8|+/- 0.15|
|B|10.6|+/- 0.15|
|h (height)|2.4 nom.|+/- 0.2|
|Pad size|n 47 x (0.5x0.6)||
|Pad size|n 4 x Sq. 2.5||
|Pitch|SeeFigure 5. POA (bottom view)||



**DS14679** - **Rev 2** 

**page 12/20** 

**ST87M01 Package information** 

## **6.2 Footprint recommendation (land pattern)** 

**Figure 6. Land pattern (top view)** 

**DS14679** - **Rev 2** 

**page 13/20** 

**ST87M01 Packaging** 

**7 Packaging** 

The module is shipped in an ESD protected vacuum-sealed bag. The bag should be opened respecting the moisture sensitivity level specified in Section 4.2: Baking requirements. 

## **7.1 Tape and reel packaging** 

**Figure 7. Tape dimensions (mm)** 

**Figure 8. Module orientation in tape** 

**DS14679** - **Rev 2** 

**page 14/20** 

**ST87M01 Ordering information** 

## **8 Ordering information** 

## **Table 10. Order codes** 

|**Order code**|**Package**|
|---|---|
|ST87M01-1000|LGA 51pins 10.6mm x 12.8mm|
|ST87M01-1100|LGA 51pins 10.6mm x 12.8mm|
|ST87M01-1101|LGA 51pins 10.6mm x 12.8mm|
|ST87M01-1111|LGA 51pins 10.6mm x 12.8mm|
|ST87M01-1400|LGA 51pins 10.6mm x 12.8mm|



**DS14679** - **Rev 2** 

**page 15/20** 

**ST87M01** 

## **Revision history** 

## **Table 11. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|17-Jun-2024|1|Initial release.|
|09-May-2025|2|Added ST87M01-1400|



**DS14679** - **Rev 2** 

**page 16/20** 

**ST87M01 Contents** 

|**Contents**|**Contents**||
|---|---|---|
|**1**|**General information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2**||
||**1.1**|Acronyms and terms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2|
||**1.2**|Reference documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2|
|**2**|**Product description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3**||
||**2.1**|Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
||**2.2**|Safety information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3|
||**2.3**|Key features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
||**2.4**|Product variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
|**3**|**Module pad. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6**||
||**3.1**|Pad assignment overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**4**|**SMT production guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7**||
||**4.1**|Reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
||**4.2**|Baking requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
||**4.3**|Module marking information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8|
|**5**|**Environmental and certifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9**||
||**5.1**|Environmental specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
||**5.2**|Regulatory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|||**5.2.1**<br>RED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|||**5.2.2**<br>GCF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
||**5.3**|RoHS directive compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10|
|**6**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11**||
||**6.1**|Mechanical information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
||**6.2**|Footprint recommendation (land pattern). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13|
|**7**|**Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14**||
||**7.1**|Tape and reel packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14|
|**8**|**Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15**||
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16**|||



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**ST87M01 List of tables** 

## **List of tables** 

|**Table**|**1.**|Definitions of terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2|
|---|---|---|
|**Table**|**2.**|Reference documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2|
|**Table**|**3.**|Ordering codes table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**Table**|**4.**|Reflow profile parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|**Table**|**5.**|Operating condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**Table**|**6.**|Storage condition. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**Table**|**7.**|RED information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**Table**|**8.**|GCF information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
|**Table**|**9.**|Mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12|
|**Table**|**10.**|Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15|
|**Table**|**11.**|Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16|



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**page 18/20** 

**ST87M01 List of figures** 

|**List**|**of**|**figures**|
|---|---|---|
|**Figure**|**1.**|ST87M01 pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**Figure**|**2.**|JEDEC STD020 reflow profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|**Figure**|**3.**|Module marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8|
|**Figure**|**4.**|POA (side and top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**Figure**|**5.**|POA (bottom view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12|
|**Figure**|**6.**|Land pattern (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
|**Figure**|**7.**|Tape dimensions (mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14|
|**Figure**|**8.**|Module orientation in tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14|



**DS14679** - **Rev 2** 

**page 19/20** 

**ST87M01** 

## **IMPORTANT NOTICE – READ CAREFULLY** 

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**DS14679** - **Rev 2** 

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