SRR0805-331K

Power Inductor (SMD), 330 µH, 240 mA, Shielded, 380 mA, SRR0805 Series

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Manufacturer: BOURNS
Product type: SMD Power Inductors
Inductance:330µH; RMS Current (Irms):240mA; Inductor Construction:Shielded; Saturation Current (Isat):380mA; Product Range:-; Power Inductor Case:10.5mm x 8mm x 4.7mm; DC Resistance Max:
Inductance: 330µH
Product Range: SRR0805 Series
Product Width: 8mm
Product Height: 4.7mm
Product Length: 10.5mm
DC Resistance Max: 1.8ohm
RMS Current (Irms): 240mA
Inductance Tolerance: ± 10%
Inductor Construction: Shielded
Saturation Current (Isat): 380mA

Delivery and price
Units per pack	1000
Price	0.348 €
Current stock	10+
Lead time	30 days

Datasheet

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*RoHS COMPLIANT<br>**----- End of picture text -----**<br>


## **Features** 

n Available in E12 series n Low profile - 4.7 mm unit height n High current n RoHS compliant* 

## **Applications** 

n Input/output of DC/DC converters n Power supplies for: 

- Portable communication equipment 

- Camcorders 

- LCD TVs 

- Car radios 

## **SRR0805 Series - Shielded Power Inductors** 

## ~~**Electrical Specifcations**~~ 

## ~~**General Specifcations**~~ 

Test Voltage .......................................1 V Reflow Soldering .. 250 °C, 10 sec. max. (In compliance with JEDEC, J-STD-020C, Table 4-2) Operating Temperature ................................-40 °C to +125 °C 

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||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|Inductance|Test|SRF|RDC|I rms|I sat|
|1 KHz|Q|Frequency|Min.|Max.|Max.|Typ.|**K-|Reflow Soldering .. 250 °C, 10 sec. max.|
|Bourns Part No.|µH|Tol. %|Ref.|(MHz)|(MHz)|(|Ω|)|(A)|(A)|Factor|(In compliance with JEDEC,|
|SRR0805|-2R2M|2.2|± 20|18|7.96M|75.0|0.040|2.50|4.90|202|J-STD-020C, Table 4-2)|
|eS|SRR0805|-3R9M|3.9|± 20|SC|20|7.96M|50.0|0.055|2.10|3.70|159|Operating Temperature|
|aS|SRR0805|-5R6M|5.6|± 20|SC|20|7.96M|40.0|0.065|1.95|3.20|132|................................-40 °C to +125 °C|
|aS|SRR0805-8R2M|CC|8.2|± 20|19|7.96M|32.0|0.080|1.75|2.50|104|(Temperature rise included)|
|S|SRR0805-1|C|00M|10|± 20|40|2.52M|C|28.0|0.100|1.50|2.20|92|Storage Temperature|
|SS|SRR0805-120M|12|± 20|40|2.52M|24.0|0.120|1.40|2.10|87|................................-40 °C to +125 °C|
|SRR0805-150M|15|± 20|40|2.52M|22.0|0.140|1.30|1.80|78|Resistance to Soldering Heat|
|aa|SRR0805-180Y|1|SC|8|± 15|SC|40|2.52M|19.0|0.160|1.20|1.70|70|.......................... 260 °C, 10 sec. max.|
|SRR0805-220Y|22|± 15|38|2.52M|19.0|0.180|1.10|1.50|62|
|eS|SRR0805-270Y|27|± 15|35|2.52M|15.5|0.200|1.00|1.40|57|Materials|
|eSS|SRR0805-330Y|33|± 15|S|40|2.52M|C|13.5|a|0.240|0.92|1.20|51|Core ............................... Ferrite DR & RI|
|SC|SRR0805-390Y|39|± 15|35|2.52M|12.0|0.260|0.84|1.10|48|
|Wire ............................Enameled copper|
|SC|SRR0805-470Y|47|± 15|32|2.52M|10.5|0.280|0.75|1.00|43|Base .....................................LCP E4008|
|SC|SRR0805-560K|56|± 10|30|2.52M|9.5|0.380|0.68|0.95|40|Terminal ....................................Cu/Ni/Sn|
|SS|SRR0805-680K|68|± 10|28|2.52M|9.0|0.440|0.60|0.90|36|Rated Current|
|SS|SRR0805-820K|82|± 10|28|2.52M|8.5|0.550|0.54|0.74|33|
|...............Ind. drop of 10 % typ. at Isat|
|a|SRR0805-101K|SS|100|± 10|45|0.796M|7.5|0.600|0.50|0.70|30|
|Temperature Rise|
|a|SRR0805-121K|SC|120|± 10|42|0.796M|7.0|0.750|0.45|0.66|27|.....................40 °C max. at rated Irms|
|SRR0805-151K|150|± 10|39|0.796M|6.5|0.90|0.40|0.64|24|
|eS|SRR0805-181K|180|SC|± 10|41|SC|0.796M|4.8|1.05|0.35|0.62|22|Packaging .................. 1000 pcs. per reel|
|aSSS|SRR0805-221K|SC|220|CC|± 10|38|0.796M|4.5|1.18|0.30|0.55|20|
|SS|SRR0805-271K|270|± 10|37|0.796M|4.2|1.40|0.27|0.45|18|Product Dimensions|
|SC|SRR0805-331K|330|± 10|36|SC|0.796M|3.8|1.80|0.24|0.38|17|
|SRR0805-471K|470|± 10|34|0.796M|3.5|2.25|0.20|0.35|14|
|S|SRR0805-561K|560|± 10|CS|32|0.796M|3.0|3.00|0.18|0.34|12|Hi|OS|||
|8.0 ± 0.2|
|SRR0805-681K|680|± 10|32|0.796M|2.8|3.40|0.17|0.32|11|
|(.315 ± .008)|
|aa|SRR0805-821K|820|SCSC|± 10|35|0.796M|2.5|4.00|0.16|0.29|10|\[|yp)|||——|
|SRR0805-102K|1000|± 10|35|0.252M|2.2|5.00|0.15|0.24|9|
|**K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x                   determine core loss from|Core Loss vs. Flux Density|plot.Δ I (peak-to-peak ripple current, A),|10.5 ± 0.3|4.7|M|A|X.|
|(.413 ± .012)|(.185)|
|Core Loss vs. Flux Density|
|eS|SC|;|||_||
|1000|
|6.0|
|100|a——_—See22.|a|_|(.236)TYP.|2.1|TYP.|
|1 MHz|(.082)|
|SS|eee ea|800 KHz|r-|a|-—|
|500 KHz|
|10|||na|e|400 KHz|4|
|||eee|=|
|300 KHz|
|SS ao|200 KHz|2.0|
|1|ee|—|100 KHz|—_|(.079)|TYP.|
|——-s|——e|Recommended Layout|
|0.10|
|‘77|A|oe|oe|eeee|5.7|2.2|
|ee|(.224)|(.086)|
|—|
|0.01|ne|eee|Ly|
|10|A|100|1000|qo|oo|
|Flux Density Bp-p (gauss)|Jb|2.5|!|
|(.099)|
|MM|
|*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.|DIMENSIONS:|
|(INCHES)|

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(Temperature rise included) Storage Temperature ................................-40 °C to +125 °C Resistance to Soldering Heat .......................... 260 °C, 10 sec. max. 

Core ............................... Ferrite DR & RI Wire ............................Enameled copper Base .....................................LCP E4008 Terminal ....................................Cu/Ni/Sn Rated Current ...............Ind. drop of 10 % typ. at Isat Temperature Rise .....................40 °C max. at rated Irms Packaging .................. 1000 pcs. per reel 

*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SRR0805 Series - Shielded Power Inductors** 

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Soldering Profile<br>275<br><1> Max. of 10 seconds at 250 °C<br><1> 250 °C<br>225<br>217 °C<br>60-150<br>190 °C seconds Ramp down<br>6 °/second maximum<br>175<br>125<br>120 - 150 seconds 10 seconds min.<br>75<br>Ramp up<br>3 °/second maximum<br>0<br>0 50 100 150 200 250 300<br>Time  (seconds)<br>(°C)<br>Temperature<br>**----- End of picture text -----**<br>


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Schematic<br>**----- End of picture text -----**<br>


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Packaging Specifcations<br>330 2.0 ± 0.5 22.4<br>(12.99)  [DIA.] (.079 ± .020) (.882)<br>13.0 ± 0.5<br>21 ± .8<br>(.512 ± .020)<br>(.827 ± .031) DIA.<br>= A hk A e \ =<br>50.0<br>' | by | “7 (1.969) SA? N < oe<br>13.0 ± 0.5<br>(.512 ± .020) [DIA.]<br>18<br>(.709)<br>4<br>END (.157) oe START _.<br>16<br>(.630) DIMENSIONS: MM<br>(INCHES)<br>12<br>4.8 (.472)<br>(.189) NO COMPONENT COMPONENTS NO COMPONENT<br>200 11200 400<br>id a ae rn<br>(7.874) (440.945) (15.748)<br>USER DIRECTION OF FEED<br>——————————_)><br>QTY: 1000 PCS. PER REEL<br>**----- End of picture text -----**<br>


REV. 03/17 

Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.

Updated at April 22, 2026

Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.

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