SPBTLE-1S

**SPBTLE-1S** 

Datasheet 

## Very low power application processor module for Bluetooth® Low Energy v4.2 

## **Features** 

- Bluetooth v4.2 compliant 

   - Supports master and slave modes 

   - Multiple roles supported simultaneously 

- High performance, ultra-low power Cortex-M0 32-bit based architecture core 

- Programmable embedded 160 kB Flash 

- 24 kB embedded RAM with data retention 

- Interfaces: 

   - 1 x UART, 1 x I²C, 1xSPI, 14 x GPIO, 2 x multifunction timer, 10-bit ADC, Watchdog and RTC, DMA controller, PDM stream processor, SWD debug interface 

- Bluetooth radio performance: 

   - Max. Tx power: + 4 dBm 

   - Excellent link reliability 

- On-board chip antenna 

- Small form factor: 11.5 mm x 13.5 mm 

• Complemented with Bluetooth low energy protocol stack library (GAP, GATT, SM, L2CAP, LL) 

- AES security co-processor 

- Bluetooth low energy SDK with wide range of profile available 

- Certifications: 

## **Product status link** 

- EU (RED) type certificate 

- FCC, IC modular approval certification 

SPBTLE-1S 

   - SRRC Chinese certification 

- BT SIG end product QDID 

- • Pre-programmed UART bootloader 

- Operating supply voltage: from 1.7 to 3.6 V 

- Operating temperature range: -40 °C to 85 °C 

## **Applications** 

- Internet of Things 

- • Smart Home 

- Building and industrial automation 

- Smart lighting 

- Remote and access control 

- Fitness, wellness and sports 

- Consumer medical 

- Security and proximity 

- Assisted living 

- • PC and smart phone peripherals 

**DS12065** - **Rev 5** - **July 2019** For further information contact your local STMicroelectronics sales office. 

www.st.com 

**SPBTLE-1S** 

## **Description** 

The SPBTLE-1S is a Bluetooth® low energy system-on-chip application processor certified module, compliant with BT specifications v4.2 and BQE qualified. The SPBTLE-1S module supports multiple roles simultaneously and can act at the same time as Bluetooth smart master and slave device. 

The SPBTLE-1S is based on BlueNRG-1 system-on-chip and entire Bluetooth low energy stack and protocols are embedded into module. 

The SPBTLE-1S module provides a complete RF platform in a tiny form factor. Radio, embedded antenna and high frequency oscillators are integrated to offer a certified solution to optimize the time to market of the final applications. 

The SPBTLE-1S can be powered directly with a pair of AAA batteries or any power source from 1.7 to 3.6 V. 

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**SPBTLE-1S General description** 

**1 General description** 

The SPBTLE-1S is a Bluetooth low energy application processor module compliant with Bluetooth® specifications v4.2 with embedded ceramic antenna. 

The SPBTLE-1S module has been designed around the ST BlueNRG-1 SoC where its Cortex-M0 core can execute both Bluetooth protocols and customer application. A complete power-optimized Bluetooth stack library provides: 

- Master, slave, multiple roles support 

- GAP: central, peripheral, observer or broadcaster roles 

- Simultaneous advertising and scanning 

- capability of being slave of up to two masters simultaneously 

- ATT/GATT: client and server 

- SM: privacy, authentication and authorization 

- L2CAP 

- Link Layer: AES-128 encryption and decryption 

The SPBTLE-1S has 160 kB embedded Flash and 24 kB embedded RAM memory. 

In the module are available 32 MHz and 32 kHz crystal oscillators. It has been designed to leverage the BlueNRG-1 integrated DC-DC step down converter in order to achieve best power consumption in active mode. It can be configured to support both application processor (host-less) and network processor (hosted) modes. Being based on the BlueNRG-1 SoC, the SPBTLE-1S module leverages all the tools and documentation of its ecosystem: development kit, application notes, user manuals, design notes and tips. A wide set of sample programs are also available in C source code. 

The SPBTLE-1S module has a wide set of peripherals available for customer application (1 x UART interface, 1 x SPI interface, 1 x I[2] C interface, 14 GPIO, 2 x multifunction timer, 10-bit ADC, watchdog and RTC, DMA controller, PDM stream processor). 

The SPBTLE-1S module enables wireless connectivity into electronic devices, not requiring any RF experience or expertise for integration into the final product. The SPBTLE-1S module provides a complete RF application platform in a tiny form factor (11.5 x 13.5 x 2.0 mm) and being a certified solution optimizes the time to market of the final applications. 

The SPBTLE-1S module allows applications to meet the tight advisable peak current requirements imposed with the use of standard coin cell batteries. Optimized results are obtained with the embedded high-efficiency DC-DC step-down. SPBTLE-1S can be powered directly with a standard 3 V coin cell battery as with a pair of AAA batteries or any power source from 1.7 to 3.6 V. 

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**SPBTLE-1S Block schematic** 

**2 Block schematic** 

## **Figure 1. Block diagram** 

**==> picture [404 x 295] intentionally omitted <==**

**----- Start of picture text -----**<br>
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**SPBTLE-1S Software development** 

## **3 Software development** 

## **3.1 Software development kit** 

The SPBTLE-1S module embeds the BlueNRG-1 application processor. Refer to the BlueNRG-1 web page (https://www.st.com) to get access to: 

- BlueNRG-1 datasheet 

- development kit 

- application notes 

- user manuals 

- tools and software 

- design note and tips 

Software and firmware should be configured taking into account the SPBTLE-1 specific configuration as described in the block diagram chapter. In particular the SPBTLE-1 module has: 

- 32 MHz crystal oscillator 

- 32 kHz crystal oscillator 

- SMPS DC-DC converter 

- 10 µH SMPS inductor 

The projects provided with the development kit should be customized defining as following: 

- HS_SPEED_XTAL=HS_SPEED_XTAL_32MHZ 

- LS_SOURCE=LS_SOURCE_EXTERNAL_32KHZ 

- SMPS_INDUCTOR=SMPS_INDUCTOR_10µH 

## **3.2 Software architecture** 

There are two possible software architectures: 

- Host-less mode (application processor): customer application runs on the SPBTLE-1S module. Many sample projects are available in the development kit 

**Figure 2. SPBTLE-1S BLE application processor** 

- Hosted mode (network processor): the module is configured as network module controlled by an external host connected via SPI or UART. A project named DTM is available in the development kit that configures the SPBTLE-1S module as a network module. 

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**SPBTLE-1S Software architecture** 

## **Figure 3. SPBTLE-1S as BLE network processor** 

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**SPBTLE-1S Hardware specifications** 

**4 Hardware specifications** 

General conditions (VIN = 3.3 V and 25 °C) 

**Table 1. Absolute maximum ratings** 

|**Ratings**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|
|Storage temperature<br>range|- 40||+ 95|°C|
|Supply voltage, VIN|- 0.3||+ 3.9|V|
|I/O pin Voltage (VIO<br>five-volt tolerant pin)|- 0.3||+ 3.9|V|
|RF saturation input<br>power||8||dBm|



**Table 2. Recommended operating conditions** 

|**Ratings**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|
|Operating temperature<br>range|- 40||+ 85|°C|
|Supply voltage, VIN|1.7|3.3|3.6|V|
|Signals and I/O pin<br>voltage (according<br>supply voltage)|1.7||3.6|V|



**Table 3. Radio features** 

|**Ratings**|**Min.**|**Typ.**|**Max.**|**Unit**|
|---|---|---|---|---|
|Bluetooth version||4.2|||
|Radiated transmit<br>power|||+ 4.48|dBm|
|Receiver sensitivity||- 84||dBm|
|RF frequency|2402||2480|MHz|
|HS_Startup_Time(1)||512||µs|



_1. The HS_Startup_Time has been measured according to the “Bringing up the BlueNRG-1 device” (AN4818). The HS_Startup_Time parameter is important because it permits minimization of the current consumption. A value that is too short prevents the SPBTLE-1S from correctly sending/receiving packets. Users should set the typical value as indicated in Table 3. Radio features ._ 

## **4.1 Current consumption** 

Characteristics measured over recommended operating conditions unless otherwise specified. Typical value are referred to TA = 25 °C, VIN = 3.0 V. 

Current consumption values has been taken using the “BlueNRG current consumption estimation tool”, configured to match the SPBTLE-1S configuration. 

The tool is available on ST.com at: 

http://www.st.com/en/embedded-software/stsw-bnrg001.html 

Reported values have been taken configuring the tool as shown in the follow figure: 

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**SPBTLE-1S Current consumption** 

**Figure 4. Configuration of the “BlueNRG current consumption estimation tool”** 

**Table 4. Current consumption** 

|**Symbol**|**Parameter**|**Test conditions**|**Typ.**|**Unit**|
|---|---|---|---|---|
|IDD|Supply current|Reset|5|nA|
|||Standby|500||
|||Sleep mode|0.9|μA|
|||Active mode|1.9|mA|
|||RX|7.7||
|||TX: +5 dBm|15||
|||TX: 0 dBm|11||



**Figure 5. Typical current consumption profile at +5 dBm** 

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**SPBTLE-1S Pin assignment** 

**Figure 6. Typical current consumption profile at 0 dBm** 

## **4.2** 

## **Pin assignment** 

**Figure 7. Pin assignment** 

As described in the previous picture the SPBTLE-1S module is using exposed pad in order to allow a full optical visual inspection in order to fulfill the needs of industrial grade applications. 

The follow table provides the association between SPBTLE-1S module pin and the related BlueNRG-1 pin. Refer to the BlueNRG-1 datasheet for detailed description. 

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**SPBTLE-1S Pin assignment** 

## **Table 5. Pinout description** 

|**Mdl i #**|**N**|**BlueNRG-1 Pin**|**Function**|**Function**|**Function**|**Function**|
|---|---|---|---|---|---|---|
|**oue pn**|**ame**|**(CSP package)**|**Mode: "000"**|**Mode: "001"**|**Mode: "100"**|**Mode: "010"**|
|1|ADC2|D5|ADC input 2||||
|2|ADC1|B4|ADC input 1||||
|3|DIO4|C3|GPIO4|UART_RXD|I2C2_CLK|PWM0|
|4|DIO5|C2|GPIO5|UART_TXD|I2C2_DAT|PWM1|
|5|Vin|A3, E6|Supply pin||||
|6|ANATEST0/<br>DIO14/|A5|GPIO14||SPI_CLK|ADC_DATA|
|7|DIO7/BOOT(1)|D2|GPIO7|UART_CTS|I2C2_DAT|PDM_CLK|
|8|GND|A4, B6, C1, F5|Ground||||
|9|DIO6|D1|GPIO6|UART_RTS|I2C2_CLK|PDM_DATA|
|10|DIO8|D3|GPIO8|UART_TXD|SPI_CLK|PDM_DATA|
|11|DIO11|E2|GPIO11|UART_RXD|SPI_CS1||
|12|DIO9|E1|GPIO9|SWCLK|SPI_IN(2)||
|13|DIO10|F1|GPIO10|SWDIO|SPI_OUT(3)||
|14|ANATES1|D4|Anatest1||||
|15|DIO0|A2|GPIO0|UART_CTS|SPI_CLK||
|16|DIO2|A1|GPIO2|PWM0|SPI_OUT|PDM_CLK|
|17|DIO3|B1|GPIO3|PWM1|SPI_IN|ADC_CLK|
|18|DIO1|B2|GPIO1|UART_RTS|SPI_CS1|PDM_DATA|
|19|RESETN|B3|Reset Pin||||
|20|DIO12|F2|GPI12(4)||||
|21|N.C.|N/A|Must be left floating||||
|22|N.C.|N/A|Must be left floating||||
|23|N.C.|N/A|Must be left floating||||



_1. The pin DIO7/BOOT is monitored by bootloader after power up or hardware Reset and it should be low to prevent unwanted bootloader activation_ 

_2. The function SPI_IN indicates that the pin is always an input when configured for SPI. Thus in case of SPI master role, it acts as MISO pin. In case of SPI slave role, this pin act as MOSI. See Table 5._ 

_3. The function SPI_OUT indicates that the pin is always an output when configured for SPI. Thus in case of SPI master role, it acts as MOSI pin. In case of SPI slave role, this pin act as MISO. See Table 5._ 

_4. DI012 can only be General Purpose Input pins (not output)._ 

**Table 6. SPI pin function** 

|**SPI function**|**SPBTLE-1S SPI role = master**|**SPBTLE-1S SPI role = Slave**|
|---|---|---|
|SPI_IN|SPI MISO|SPI MOSI|
|SPI_OUT|SPI MOSI|SPI MISO|



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**SPBTLE-1S Hardware design** 

## **5 Hardware design** 

- _Note: • All unused pins should be left floating; do not ground_ 

   - _GND pin must be well grounded_ 

   - _Traces should not be routed underneath the module_ 

_The area around the module should be free of any ground planes, power planes, trace routings, or metal for 6 mm from the module antenna position, in all directions._ 

## **5.1 Reset circuitry** 

The SPBTLE-1S module requires an external pull-up reset circuitry to ensure proper operation at power on. Refer to the “Reset management” chapter of the BlueNRG-1 datasheet for details. 

**Figure 8. Reset circuitry** 

## **5.2 Debug interface** 

The SPBTLE-1S embeds the ARM serial wire debug (SWD) port. It is two pins (clock and single bi-directional data) debug interface, providing all the debug functionality plus real time access to system memory without halting the processor or requiring any target resident code. 

**Table 7. Debug interface pin** 

|**Pin functionality**|**Module PIN**|**Pin description**|
|---|---|---|
|SWCLK|12|SWD clock signal|
|SWDIO|13|SWD data signal|



For more information refer to the BlueNRG-1 technical documentation 

(http://www.st.com/en/wireless-connectivity/bluenrg-1.html ) 

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**SPBTLE-1S Reflow soldering** 

## **5.3 Reflow soldering** 

The SPBTLE-1S is a high temperature strength surface mount Bluetooth® module supplied on a 23 pin, 4-layer PCB. 

Module is assembled with special soldering paste that allow to make the additional reflow with no changes in the module original characteristic. It’s important to respect the parameter listed in the follow table. 

The final assembly recommended reflow profiles are indicated here below. 

Soldering phase has to be executed with care: in order to avoid undesired melting phenomenon, particular attention has to be taken on the set up of the peak temperature. Here following some suggestions for the temperature profile based on following recommendations. 

**Table 8. Soldering** 

|**Profile feature**|**Pb-free assembly**|
|---|---|
|Average ramp up rate (TSMAXto Tp)|3 °C / s max.|
|Preheat||
|Temperature min. (TSmin.)|150 °C|
|Temperature max. (TSmax.)|200 °C|
|Time (tSmin. to tSmax.) (tS))|60 - 100 s|
|Time maintained above||
|Temperature TL|217 °C|
|Time tL|60 - 70 s|
|Peak temperature (TP)|245 (-0) °C|
|Time within 5 °C of peak temperature (TP-5 °C)|min. 30 s|
|Ramp down rate|6 °C / s|
|Time from 25 °C to peak temperature|8 minutes max.|



**Figure 9. Soldering profiles** 

**==> picture [404 x 182] intentionally omitted <==**

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**SPBTLE-1S Regulatory compliance** 

## **6 Regulatory compliance** 

## **6.1 FCC certification** 

This module has been tested and found to comply with the FCC part 15 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. 

However, there is no guarantee that interference may not occur in a particular installation. 

This device complies with part 15 of the FCC rules. Operation is subject to the following two conditions: 

1. This device may not cause harmful interference, 

   - and 

2. this device must accept any interference received, including interference that may cause undesired operation. 

Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the user's authority to operate this equipment. 

## **Modular approval** 

## FCC ID: S9NSPBTLE1S 

In accordance with FCC part 15, the SPBTLE-1S is listed as a modular transmitter device. 

This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must comply with colocation and RF exposure requirements in accordance with FCC multi-transmitter product procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. <20 cm from persons including but not limited to body worn and hand held devices) may require separate approval. 

## **6.1.1** 

## **Labeling instructions** 

When integrating the SPBTLE-1S into the final product, the OEM must ensure that the FCC labeling requirements are satisfied. A statement must be included on the exterior of the final product which indicates the product includes a certified module. The label should state the following (or similar wording that conveys the same meaning): 

This product uses SRRC approved Radio modular. CMIIT ID: 2017DJ5956 

## **6.1.2 Product manual instructions** 

This section applies to OEM final products containing the SPBTLE-1S module, subject to FCC compliance. The final product manual must contain the following statement (or a similar statement that conveys the same meaning) 

_Note:_ 

_Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. (Part. 15.21)_ 

In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be included in the final product manual: 

_Note:_ 

_This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:_ 

- _Reorient or relocate the receiving antenna_ 

- _Increase the separation between the equipment and receiver_ 

- _Connect the equipment into an outlet on a circuit different from that to which the receiver is connected_ 

- _Consult the dealer or an experienced radio/TV technician for help_ 

In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following statement must be included in the final product manual: 

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**SPBTLE-1S IC certification** 

_Note:_ 

_This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his expense._ 

## **6.2 IC certification** 

The SPBTLE-1S module has been tested and found compliant with the IC RSS-210 rules. These limits are designed to provide reasonable protection against harmful interference in approved installations. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. 

However, there is no guarantee that interference may not occur in a particular installation. 

This device complies with RSS-210 of the IC rules. Operation is subject to the following two conditions: 

- this device may not cause harmful interference 

   - and 

- this device must accept any interference received, including interference that may cause undesired operation 

Modifications or changes to this equipment not expressly approved by STMicroelectronics may render void the user's authority to operate this equipment. 

## **Modular approval** 

## IC: 8976C-SPBTLE1S 

In accordance with IC RSS-210, the SPBTLE-1S is listed as a modular transmitter device. 

This module is evaluated for stand-alone use only. Finished products incorporating multiple transmitters must comply with colocation and RF exposure requirements in accordance with IC multi-transmitter product procedures. Collocated transmitters operating in portable RF Exposure conditions (e.g. < 20 cm from persons including but not limited to body worn and hand held devices) may require separate approval. 

## **6.2.1** 

## **Labeling instructions** 

When integrating the SPBTLE-1S into the final product, the OEM must ensure that the IC labeling requirements are satisfied. A statement must be included on the exterior of the final product which indicates that the product includes a certified module. The label should state the following (or similar wording that conveys the same meaning): 

Contains IC: 8976C-SPBTLE1S 

OR 

This product contains IC: 8976C-SPBTLE1S 

The OEM must include the following statements on the exterior of the final product unless the product is too small (e.g. less than 4 x 4 inches): 

This device complies with RSS-210 of the IC Rules. Operation is subject to the following two conditions: 

- this device may not cause harmful interference and 

- this device must accept any interference received, including any interference that may cause undesired operation 

## **6.2.2 Product manual instructions** 

This section applies to OEM final products containing the SPBTLE-1S module, subject to IC compliance. The final product manual must contain the following statement (or a similar statement that conveys the same meaning): 

## **Warning:** 

_Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment. (RSS-210)_ 

In the case where an OEM seeks Class B (residential) limits for the final product, the following statement must be included in the final product manual: 

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**SPBTLE-1S SRRC** 

_Note:_ 

_This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:_ 

- _Reorient or relocate the receiving antenna_ 

- _Increase the separation between the equipment and receiver_ 

- _Connect the equipment into an outlet on a circuit different from that to which the receiver is connected_ 

- _Consult the dealer or an experienced radio/TV technician for help_ 

In the case where an OEM seeks the lesser category of a Class A digital device for the final product, the following statement must be included in the final product manual: 

_Note:_ 

_This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his expense._ 

## **6.3 SRRC** 

## **6.3.1 Modular approval** 

The SPBTLE-1S module complies with Chinese SRRC certification. 

– SRRC CMIIT ID: 2017DJ5956 

## **6.3.2 Labeling instructions** 

When integrating the SPBTLE-1S into the final product, the OEM must ensure that the FCC labeling requirements are satisfied. A statement must be included on the exterior of the final product which indicates the product includes a certified module. The label should state the following (or similar wording that conveys the same meaning): 

This product uses SRRC approved Radio modular. CMIIT ID: 2017DJ5956 

## **6.4 Bluetooth certification** 

The module with embedded stack and profile has been qualified in accordance with SIG qualification rules: 

- Declaration ID: D034470 

- Qualified design ID: 92838 

- Product type: End Product 

- Core spec version: 4.2 

- Product description: Bluetooth Smart v4.2 module 

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**SPBTLE-1S CE certification** 

## **7 CE certification** 

The SPBTLE-1S module has been certified according to the following certification rules : 

- EN 300 328 V 2.1.1 (2016-11) (a) 

- ETSI EN 301 489-17 V3.1.1 (2017-02) (b) 

- ETSI EN 301 489-1 V2.1.1 (2017-02) (c) 

- EN 60950-1:2006 + A11:2009 + A1:2010 + A12:2011 + A2:2013 (d) 

- EN 62479:2010 

   - a) EN 300 328 V 2.1.1 (2016 11): “electromagnetic compatibility and radio spectrum Matters (ERM); Wideband transmission systems; data transmission equipment operating in the 2.4 GHZ ISM band and using wideband modulation techniques; harmonized EN covering essential requirements under article 3.2 of the R&TTE directive”. 

b) EN 301 489-17 V 3.1.1 (2017 02): “electromagnetic compatibility and radio spectrum Matters (ERM); electromagnetic compatibility (EMC) standard for radio equipment and services; part 17: specific condition for 2.4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment. 

c) ETSI EN 301 489-1 V2.1.1 (2017 02): “electromagnetic compatibility and radio spectrum Matters (ERM); electromagnetic compatibility (EMC) standard for radio equipment and services; part 1: Common technical requirements”. 

- d) EN60950-1:2006 +A11:2009+A1:2010+A12:2011+A2:2013: “Information technology equipment - safety”. 

The module is provided by CE marking: 

**Figure 10. CE marking** 

The module has obtained the RED certificate: No. 0051-RED-0010 REV. 0 The certified module production firmware release is: 2.X For additional information please refer to: STMicroelectronics Via C. Olivetti , 2 Agrate Brianza 20864 (ITALY) 

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**SPBTLE-1S Package information** 

**8 Package information** 

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 

## **8.1 SPBTLE-1S package information** 

**Figure 11. SPBTLE-1S package outline** 

**==> picture [404 x 285] intentionally omitted <==**

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**SPBTLE-1S SPBTLE-1S package information** 

**Figure 12. Recommend land pattern** 

**==> picture [349 x 242] intentionally omitted <==**

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**SPBTLE-1S Traceability** 

**9 Traceability** 

Each module is univocally identified by serial number stored in a 2D data matrix laser marked on the bottom side of the module itself or on top of the module shieldThe serial number has the following format: 

**Table 9. Traceability information** 

|**Letter**|**Meaning**|
|---|---|
|WW|Week|
|YY|Year|
|D|Product ID family|
|FF|Production panel coordinate identification|
|NNN|Progressive serial number|



Each module bulk is identified by a bulk ID. 

BULK ID and module 2D data matrix are linked by a reciprocal traceability link. The module 2D data matrix traces the lot number of any raw material used. 

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**SPBTLE-1S Ordering information** 

## **10 Ordering information** 

## **Table 10. Ordering information** 

|**Order code**|**Description**|**Packing**|**MOQ**|
|---|---|---|---|
|SPBTLE-1S|Bluetooth® V4.2 smart module|Tray|2448|



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**SPBTLE-1S** 

## **Revision history** 

## **Table 11. Document revision history** 

|**Date**|**Version**|**Changes**|
|---|---|---|
|03-Jul-2017|1|Initial release.|
|12-Jul-2017|2|Updated Table 10. Ordering information.<br>Document status promoted from preliminary to production data.<br>Minor text changes.|
|16-Oct-2017|3|Removed section EU type approval for SPBTLE-1S module.<br>Updated Table 1. Absolute maximum ratings.<br>Added Section 7 CE certification and text updated.<br>Added Section 6.3 SRRC , Section 6.3.1 Modular approval and<br>Section 6.1.1 Labeling instructions.<br>Updated Table 5. Pinout description.<br>Minor text changes.|
|03-Jun-2019|4|Updated features, Section 1 General description, Section 4.2 Pin<br>assignment, Table 8. Soldering.|
|23-Jul-2019|5|Updated features and minor text changes.|



**DS12065** - **Rev 5** 

**page 21/25** 

**SPBTLE-1S Contents** 

## **Contents** 

|**1**|**General description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3**|
|---|---|
|**2**|**Block schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4**|
|**3**|**Software development . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5**|
||**3.1**<br>Software development Kit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
||**3.2**<br>Software architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**4**|**Hardware specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7**|
||**4.1**<br>Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
||**4.2**<br>Pin assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**5**|**Hardware design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11**|
||**5.1**<br>Reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
||**5.2**<br>Debug interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
||**5.3**<br>Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**6**|**Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13**|
||**6.1**<br>FCC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13|
||**6.1.1**<br>Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
||**6.1.2**<br>Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13|
||**6.2**<br>IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14|
||**6.2.1**<br>Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14|
||**6.2.2**<br>Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14|
||**6.3**<br>SRRC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15|
||**6.3.1**<br>Modular approval . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15|
||**6.3.2**<br>Labeling instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15|
||**6.4**<br>Bluetooth certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15|
|**7**|**Ce certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16**|
|**8**|**Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17**|
||**8.1**<br>SPBTLE-1S package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17|
|**9**|**Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19**|
|**10**|**Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20**|
|**Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21**||



**DS12065** - **Rev 5** 

**page 22/25** 

**SPBTLE-1S List of figures** 

## **List of figures** 

|**Figure**|**1.**|Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4|
|---|---|---|
|**Figure**|**2.**|SPBTLE-1S BLE application processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5|
|**Figure**|**3.**|SPBTLE-1S as BLE network processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6|
|**Figure**|**4.**|Configuration of the “BlueNRG current consumption estimation tool” . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8|
|**Figure**|**5.**|Typical current consumption profile at +5 dBm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8|
|**Figure**|**6.**|Typical current consumption profile at 0 dBm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**Figure**|**7.**|Pin assignment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9|
|**Figure**|**8.**|Reset circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**Figure**|**9.**|Soldering profiles . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12|
|**Figure**|**10.**|CE marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16|
|**Figure**|**11.**|SPBTLE-1S package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17|
|**Figure**|**12.**|Recommend land pattern. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18|



**DS12065** - **Rev 5** 

**page 23/25** 

**SPBTLE-1S List of tables** 

## **List of tables** 

|**Table**|**1.**|Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|---|---|---|
|**Table**|**2.**|Recommended operating conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|**Table**|**3.**|Radio features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7|
|**Table**|**4.**|Current consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8|
|**Table**|**5.**|Pinout description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
|**Table**|**6.**|SPI pin function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10|
|**Table**|**7.**|Debug interface pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11|
|**Table**|**8.**|Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12|
|**Table**|**9.**|Traceability information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19|
|**Table**|**10.**|Ordering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20|
|**Table**|**11.**|Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21|



**DS12065** - **Rev 5** 

**page 24/25** 

**SPBTLE-1S** 

## **IMPORTANT NOTICE – PLEASE READ CAREFULLY** 

STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement. 

Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers’ products. 

No license, express or implied, to any intellectual property right is granted by ST herein. 

Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. 

ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or service names are the property of their respective owners. 

Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 

© 2019 STMicroelectronics – All rights reserved 

**DS12065** - **Rev 5** 

**page 25/25**