SP900S-0.009-00-104

Technical Data Sheet 

## **BERGQUIST SIL PAD TSP 1600S** 

Known as BERGQUIST SIL-PAD 900S November -2018 

## **PRODUCT DESCRIPTION** 

High Performance Insulator for Low-Pressure Applications. 

|**Technology**|Silicone|
|---|---|
|Appearance|Pink|
|Reinforcement Carrier|Fiberglass|
|Total Thickness , ASTM<br>D374|0.229mm|
|**Application**|Thermal management,<br>Thermally conductive adhesive|
|Operating Temperature<br>Range|-60 to 180ºC|



## **TYPICAL PROPERTIES** 

## **Physical Properties** 

Shore Hardness, ASTM D2240, Shore A 92 Elongation , 45º to warp and fill, ASTM D412,% 20 Tensile Strength, ASTM D412, MPa 9 Flammability Rating, UL 94 V-0 **Electrical Properties** Dielectric Breakdown Voltage , ASTM D149, Vac 5,500 Dielectric Constant, ASTM D150 @ 1,000 Hz 6.0 Volume Resistivity, ASTM D257, ohm-meter 1×10[10 ] 

## **Electrical Properties** 

## **Thermal Properties** 

## **FEATURES AND BENEFITS** 

- Thermal impedance: 0.61ºC-in[2] /W @ 50 psi 

- Electrically isolating 

- Low mounting pressures 

- Smooth and highly compliant surface 

- General-purpose thermal interface material solution 

## **TYPICAL APPLICATIONS** 

- Power supplies 

- Automotive electronics 

- Motor controls 

- Power semiconductors 

BERGQUIST SIL PAD TSP 1600S thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. 

BERGQUIST SIL PAD TSP 1600S material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure. 

Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor. 

The smooth surface texture of BERGQUIST SIL PAD TSP 1600S minimizes interfacial thermal resistance and maximizes thermal performance. 

Thermal Conductivity , ASTM D5470, W/(m-K) 1.6 

## **Thermal Performance vs. Pressure** 

|**Thermal Performance vs. Pressure**||
|---|---|
|TO-220 Thermal Performance, ºC/W<br>@ 10 psi<br>@ 25 psi<br>@ 50 psi|3.96<br>3.41<br>2.9|
|@ 100 psi|2.53|
|@ 200 psi|2.32|
|Thermal Impedance, ASTM D5470, ºC-in2/W(1)<br>@ 10 psi<br>@ 25 psi|0.95<br>0.75|
|@ 50 psi|0.61|
|@ 100 psi|0.47|
|@ 200 psi|0.41|



I) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied. 

## **GENERAL INFORMATION** 

**For safe handling information on this product, consult the Safety Data Sheet, (SDS).** 

## **Not for product specifications** 

The technical data contained herein are intended as reference only. Please contact your local quality department for assistance and recommendations on specifications for this product. 

## **CONFIGURATIONS AVAILABLE** 

BERGQUIST SIL PAD TSP 1600S are supplied in: 

- Sheet form, roll form and die-cut parts 

- With or without pressure-sensitive adhesive 

TDS BERGQUIST SIL PAD TSP 1600S,   November -2018 

## **Conversions** 

(°C x 1.8) + 32 = °F kV/mm x 25.4 = V/mil mm / 25.4 = inches N x 0.225 = lb N/mm x 5.71 = lb/in psi x 145 = N/mm² MPa = N/mm² N·m x 8.851 = lb·in N·m x 0.738 = lb·ft N·mm x 0.142 = oz·in mPa·s = cP 

## **Disclaimer** 

## **Note:** 

The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. 

Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. 

**In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following:** 

In case Henkel would be nevertheless held liable, on whatever legal ground, Henkel’s liability will in no event exceed the amount of the concerned delivery. **In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable:** 

The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. 

Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. 

**In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable:** 

The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user's responsibility to determine suitability for the user's purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, **Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits.** The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. 

**Trademark usage:** [Except as otherwise noted] All trademarks in this document are trademarks and/or registered trademarks of Henkel and its affiliates in the U.S. and elsewhere. 

Reference 1 

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