SP8K52HZGTB

Datasheet 

100V Nch+Nch Power MOSFET 

## SP8K52HZG 

## **l Outline** 

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|||
|---|---|
|VDSS|100V|
|RDS(on)(Max.)|170mΩ|
|ID|±3.0A|
|PD|2.0W|

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SOP8 

## **l Features** 

## **l Inner circuit** 

- 1) Low on - resistance 

2) Small Surface Mount Package (SOP8) 

3) Pb-free plating ; RoHS compliant 

4) Halogen free 

5) Sn100% plating 

6) AEC-Q101 Qualified 

## **l Packaging specifications** 

## **l Application** 

Switching Motor Drive 

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||||
|---|---|---|
|Embossed|
|Packing|
|Tape|
|Reel size (mm)|330|
|Tape width (mm)|12|
|Type|
|Quantity|(pcs)|2500|
|Taping code|TB|
|Marking|SP8K52|

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## **l Absolute maximum ratings** (Ta = 25°C ,unless otherwise specified)  <Tr1 and Tr2> 

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||||||
|---|---|---|---|---|
|Parameter|Symbol|Value|Unit|
|Drain - Source voltage|VDSS|100|V|
|Continuous drain current|ID|±3.0|A|
|Pulsed drain current|IDP|[*1]|±12|A|
|Gate - Source voltage|VGSS|±20|V|
|PD|[*2]|2.0|
|Power dissipation (total)|W|
|PD|[*3]|1.4|
|Junction temperature|Tj|150|℃|
|Operating junction and storage temperature range|Tstg|-55 to +150|℃|

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**20200317 - Rev.001** 

1/11 

**SP8K52HZG** 

Datasheet 

## **l Thermal resistance** 

|**lThermal resistance**||||||
|---|---|---|---|---|---|
|Parameter|Symbol|Values|||Unit|
|||Min.|Typ.|Max.||
|Thermal resistance, junction - ambient (total)|RthJA*2|-|-|62.5|℃/W|
||RthJA*3|-|-|89.2||



## **l Electrical characteristics (Ta = 25°C)** <Tr1 and Tr2> 

|**lElectrical characteristics (Ta = 25°C)(Ta = 25°C)Ta = 25°C)**|**Electrical characteristics (Ta = 25°C)(Ta = 25°C)Ta = 25°C)a = 25°C) = 25°C))  **<Tr1 and Tr2>|<Tr1 and Tr2>|||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Values|||Unit|
||||Min.|Typ.|Max.||
|Drain - Source breakdown<br>voltage|V(BR)DSS|VGS= 0V, ID= 1mA|100|-|-|V|
|Breakdown voltage<br>temperature coefficient|ΔV(BR)DSS <br>ΔTj<br>|ID= 1mA<br> referenced to 25℃|-|116.9|-|mV/℃|
|Zero gate voltage<br>drain current|IDSS|VDS= 100V, VGS= 0V|-|-|1|μA|
|Gate - Source<br>leakage current|IGSS|VGS= ±20V, VDS= 0V|-|-|±10|μA|
|Gate threshold<br>voltage|VGS(th)|VDS= 10V, ID= 1mA|1.0|-|2.5|V|
|Gate threshold voltage<br>temperature coefficient|ΔVGS(th) <br>ΔTj<br>|ID= 1mA<br> referenced to 25℃|-|-3.6|-|mV/℃|
|Static drain - source<br>on - state resistance|RDS(on)*4|VGS= 10V, ID= 3.0A|-|120|170|mΩ|
|||VGS= 4.5V, ID= 3.0A|-|130|180||
|||VGS= 4.0V, ID= 3.0A|-|135|190||
|Gate resistance|RG|f = 1MHz, open drain|-|6.9|-|Ω|
|Forward Transfer<br>Admittance||Yfs|*4|VDS= 10V, ID= 3.0A|3.5|-|-|S|



*1 Pw ≤ 10μs, Duty cycle ≤ 1% 

- *2 Mounted on a ceramic board (30×30×0.8mm) 

- *3 Mounted on a Cu board (40×40×0.8mm) 

*4 Pulsed 

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**20200317 - Rev.001** 

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**SP8K52HZG** 

Datasheet 

## **l Electrical characteristics** (Ta = 25°C) <Tr1 and Tr2> 

|Parameter|Symbol|Conditions|Values|Values|Values|Unit|
|---|---|---|---|---|---|---|
||||Min.|Typ.|Max.||
|Input capacitance|Ciss|VGS= 0V<br>VDS= 25V<br>f = 1MHz|-|610|-|pF|
|Output capacitance|Coss||-|55|-||
|Reverse transfer capacitance|Crss||-|35|-||
|Turn - on delay time|td(on)*4|VDD ⋍50V,VGS= 10V<br>ID= 1.5A<br>RL= 33Ω<br>RG= 10Ω|-|13|-|ns|
|Rise time|tr*4||-|13|-||
|Turn - off delay time|td(off)*4||-|50|-||
|Fall time|tf*4||-|14|-||



**l Gate charge characteristics** (Ta = 25°C) <Tr1 and Tr2> 

|Parameter|Symbol|Conditions|Values|Values|Values|Unit|
|---|---|---|---|---|---|---|
||||Min.|Typ.|Max.||
|Total gate charge|Qg*4|VDD ⋍50V, ID= 3.0A<br>VGS= 5V|-|8.5|-|nC|
|Gate - Source charge|Qgs*4||-|1.8|-||
|Gate - Drain charge|Qgd*4||-|3.5|-||



## **l Body diode electrical characteristics** (Source-Drain) (Ta = 25°C) 

<Tr1 and Tr2> 

|<Tr1 and Tr2>|||||||
|---|---|---|---|---|---|---|
|Parameter|Symbol|Conditions|Values|||Unit|
||||Min.|Typ.|Max.||
|Continuous forward current|IS|Ta= 25℃|-|-|1.0|A|
|Pulse forward current|ISP*1||-|-|12||
|Forward voltage|VSD*4|VGS= 0V, IS= 3.0A|-|-|1.2|V|



www.rohm.com © 2019 ROHM Co., Ltd. All rights reserved. 

**20200317 - Rev.001** 

3/11 

**SP8K52HZG** 

Datasheet 

## **l Electrical characteristic curves** 

## Fig.1 Power Dissipation Derating Curve 

Fig.3 Normalized Transient Thermal Resistance vs. Pulse Width 

## Fig.2 Maximum Safe Operating Area 

Fig.4 Single Pulse Maximum Power Dissipation 

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Datasheet 

## **l Electrical characteristic curves** 

Fig.5 Typical Output Characteristics(I) 

## Fig.6 Typical Output Characteristics(II) 

Fig.7 Breakdown Voltage vs. Junction Temperature 

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**20200317 - Rev.001** 

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**SP8K52HZG** 

Datasheet 

## **l Electrical characteristic curves** 

Fig.8 Typical Transfer Characteristics 

Fig.9 Gate Threshold Voltage vs. Junction Temperature 

Fig.10 Forward Transfer Admittance vs. Drain Current 

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**20200317 - Rev.001** 

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**SP8K52HZG** 

Datasheet 

## **l Electrical characteristic curves** 

Fig.11 Drain Current Derating Curve 

Fig.12 Static Drain - Source On - State Resistance vs. Gate Source Voltage 

Fig.13 Static Drain - Source On - State Resistance vs. Junction Temperature 

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**20200317 - Rev.001** 

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**SP8K52HZG** 

Datasheet 

## **l Electrical characteristic curves** 

Fig.14 Static Drain - Source On - State Resistance vs. Drain Current (I) 

Fig.16 Static Drain - Source On - State Resistance vs. Drain Current (III) 

Fig.15 Static Drain - Source On - State Resistance vs. Drain Current (II) 

Fig.17 Static Drain - Source On - State Resistance vs. Drain Current (Ⅳ) 

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Datasheet 

## **l Electrical characteristic curves** 

Fig.18 Typical Capacitances vs. Drain - Source Voltage 

Fig.20 Typical Gate Charge 

Fig.19 Switching Characteristics 

Fig.21 Source Current vs. Source Drain Voltage 

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**20200317 - Rev.001** 

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Datasheet 

## **l Measurement circuits** <It is the same for the Tr1 and Tr2> 

## Fig.1-1 Switching Time Measurement Circuit 

## Fig.1-2 Switching Waveforms 

Fig.2-1 Gate Charge Measurement Circuit 

Fig.2-2 Gate Charge Waveform 

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Datasheet 

## **l Dimensions** 

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## **Notice** 

## **Precaution on using ROHM Products** 

1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment[(Note 1)] , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. 

|(Note1) Medical Equipment Classification of the Specific Applications|(Note1) Medical Equipment Classification of the Specific Applications|(Note1) Medical Equipment Classification of the Specific Applications|(Note1) Medical Equipment Classification of the Specific Applications|
|---|---|---|---|
|JAPAN|USA|EU|CHINA|
|CLASS`Ⅲ`|CLASS`Ⅲ`|CLASS`Ⅱ`b|CLASS`Ⅲ`|
|CLASS`Ⅳ`||CLASS`Ⅲ`||



2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: 

   - [a] Installation of protection circuits or other protective devices to improve system safety 

   - [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 

3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions.  If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: 

   - [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents 

   - [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust 

   - [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 

   - [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves 

   - [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items 

   - [f] Sealing or coating our Products with resin or other coating materials 

   - [g] Use of our Products without cleaning residue of flux (Exclude cases where no-clean type fluxes is used. However, recommend sufficiently about the residue.); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering 

   - [h] Use of the Products in places subject to dew condensation 

4. The Products are not subject to radiation-proof design. 

5. Please verify and confirm characteristics of the final or mounted products in using the Products. 

6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse, is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 

7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 

8. Confirm that operation temperature is within the specified range described in the product specification. 

9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. 

## **Precaution for Mounting / Circuit board design** 

1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. 

For details, please refer to ROHM Mounting specification 

> **[Notice-PAA-E ]** © 2015 ROHM Co., Ltd. All rights reserved. 

**Rev.004** 

## **Precautions Regarding Application Examples and External Circuits** 

1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 

2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use.  Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document.  ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. 

## **Precaution for Electrostatic** 

This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). 

## **Precaution for Storage / Transportation** 

1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 

   - [b] the temperature or humidity exceeds those recommended by ROHM 

   - [c] the Products are exposed to direct sunshine or condensation 

   - [d] the Products are exposed to high Electrostatic 

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 

3.  Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 

4.  Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. 

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A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. 

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## **Other Precaution** 

1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 

2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 

3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 

4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. 

> **[Notice-PAA-E ]** © 2015 ROHM Co., Ltd. All rights reserved. 

**Rev.004** 

Datasheet 

## **General Precaution** 

1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall not be in an y way responsible or liable for failure, malfunction or accident arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 

2. All information contained in this docume nt is current as  of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this  document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 

> **[Notice – WE ]** © 2015 ROHM Co., Ltd. All rights reserved. 

**Rev.001**