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SMS3.3.TCT
TVS Diode, SMS, Unidirectional, 3.3 V, 8.7 V, SOT-23, 6 Pins
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: SEMTECH
- Product type: TVS Diodes
- Product Range:SMS Series; TVS Polarity:Unidirectional; Reverse Stand-Off Voltage Vrwm:3.3V; Clamping Voltage Vc Max:8.7V; Diode Case Style:SOT-23; No. of Pins:6Pins; Breakdown Voltage Min:-; Breakdown V
- SVHC: No SVHC (15-Jan-2019)
- No. of Pins: 6Pins
- TVS Polarity: Unidirectional
- Product Range: SMS
- Qualification: -
- Diode Mounting: Surface Mount
- Diode Case Style: SOT-23
- Clamping Voltage Max: 8.7V
- Reverse Standoff Voltage: 3.3V
- Maximum Breakdown Voltage: -
- Minimum Breakdown Voltage: -
- Operating Temperature Max: 125°C
- Peak Pulse Power Dissipation: 200W
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.463 € |
| Current stock | 1000+ |
| Lead time | 30 days |
Datasheet
SMS3.3 3.3 Volt TVS Array For ESD and Latch-Up Protection ## PROTECTION PRODUCTS ## Description The SMS series of TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD, lightning, and other voltage-induced transient events. Each device will protect up to four lines operating at 3.3 volts. ## Features - Transient protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) IEC 61000-4-5 (Lightning) 12A (8/20µs) - Protects four I/O lines - Working voltage: 3.3V The SMS3.3 is a solid-state device designed specifically for transient suppression. It is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low standoff voltages with significant reductions in leakage currents and capacitance over traditional pn junction processes. They offer desirable characteristics for board level protection including fast response time, low clamping voltage and no device degradation. The SMS3.3 may be used to meet the immunity requirements of IEC 61000-4-2, level 4 (±15kV air, ±8kV contact discharge). The low cost SOT23-6L package makes them ideal for use in portable electronics such as cell phones, PDA’s, and notebook computers. - Low leakage current (<1µA) - Low clamping voltage - Low capacitance (35pF typical) - Solid-state EPD TVS technology ## Mechanical Characteristics - EIAJ SOT23-6L package - Molding compound flammability rating: UL 94V-0 - Marking : Marking Code - Packaging : Tape and Reel per EIA 481 ## Applications - Cell phone Handsets and Accessories - Microprocessor Based Equipment - Personal Digital Assistants (PDA’s) and Pagers - Desktops PC and Servers - Notebook, Laptop, and Palmtop Computers - Portable Instrumentation - Peripherals - MP3 Players - Cordless Phones ## Equivalent Circuit Diagram **==> picture [265 x 209] intentionally omitted <==** ## Schematic & PIN Configuration **==> picture [96 x 102] intentionally omitted <==** SOT23-6L (Top View) United States Patent No. www.semtech.com Revision 08/11/04 1 SMS3.3 ## **PROTECTION PRODUCTS** ## Absolute Maximum Rating |**PROTECTION PRODUCTS**<br>Absolute Maximum Rating|||| |---|---|---|---| |g<br>n<br>it<br>a<br>R|l<br>o<br>b<br>m<br>y<br>S|e<br>u<br>l<br>a<br>V|s<br>ti<br>n<br>U| |)s<br>µ<br>0<br>2<br>/<br>8<br>=<br>p<br>t(<br>r<br>e<br>w<br>o<br>P<br>e<br>slu<br>P<br>k<br>a<br>e<br>P|P k<br>p|0<br>0<br>2|stt<br>a<br>W| |)s<br>µ<br>0<br>2<br>/<br>8<br>=<br>p<br>t(<br>t<br>n<br>e<br>rr<br>u<br>C<br>e<br>slu<br>P<br>k<br>a<br>e<br>P|I P<br>P|2<br>1|A| |)riA<br>(<br>2<br>-<br>4<br>-<br>0<br>0<br>0<br>1<br>6<br>C<br>E<br>I<br>r<br>e<br>p<br>D<br>S<br>E<br>)tc<br>a<br>t<br>n<br>o<br>C<br>(<br>2<br>-<br>4<br>-<br>0<br>0<br>0<br>1<br>6<br>C<br>E<br>I<br>r<br>e<br>p<br>D<br>S<br>E|V<br>D<br>S<br>E|5<br>2<br>><br>5<br>1<br>>|V<br>k| |e<br>r<br>u<br>t<br>a<br>r<br>e<br>p<br>m<br>e<br>T<br>g<br>n<br>ir<br>e<br>dlo<br>S|TL|)s<br>d<br>n<br>o<br>c<br>e<br>s<br>0<br>1<br>(<br>0<br>6<br>2|oC| |e<br>r<br>u<br>t<br>a<br>r<br>e<br>p<br>m<br>e<br>T<br>g<br>n<br>it<br>a<br>r<br>e<br>p<br>O|TJ|5<br>2<br>1<br>+<br>o<br>t<br>5<br>5<br>-|oC| |e<br>r<br>u<br>t<br>a<br>r<br>e<br>p<br>m<br>e<br>T<br>e<br>g<br>a<br>r<br>o<br>t<br>S|T<br>G<br>T<br>S|0<br>5<br>1<br>+<br>o<br>t<br>5<br>5<br>-|oC| ## Electrical Characteristics |Electrical Characteristics|Electrical Characteristics|Electrical Characteristics|Electrical Characteristics|Electrical Characteristics|Electrical Characteristics|Electrical Characteristics| |---|---|---|---|---|---|---| |3<br>.<br>3<br>S<br>M<br>S||||||| |r<br>e<br>t<br>e<br>m<br>a<br>r<br>a<br>P|l<br>o<br>b<br>m<br>y<br>S|s<br>n<br>o<br>iti<br>d<br>n<br>o<br>C|-<br>u<br>m<br>i<br>n<br>i<br>M<br>m|l<br>a<br>c<br>i<br>p<br>y<br>T|-<br>u<br>m<br>i<br>x<br>a<br>M<br>m|-ti<br>n<br>U<br>s| |e<br>g<br>a<br>tlo<br>V<br>ff<br>O<br>-<br>d<br>n<br>a<br>t<br>S<br>e<br>s<br>r<br>e<br>v<br>e<br>R|V<br>M<br>W<br>R||||3<br>.<br>3|V| |e<br>g<br>a<br>tlo<br>V<br>h<br>g<br>u<br>o<br>r<br>h<br>T-<br>h<br>c<br>n<br>u<br>P|V T<br>P|I T<br>P<br>A<br>µ<br>2<br>=|5<br>.<br>3|||V| |e<br>g<br>a<br>tlo<br>V<br>k<br>c<br>a<br>B<br>-<br>p<br>a<br>n<br>S|V B<br>S|I B<br>S<br>A<br>m<br>0<br>5<br>=|8<br>.<br>2|||V| |t<br>n<br>e<br>rr<br>u<br>C<br>e<br>g<br>a<br>k<br>a<br>e<br>L<br>e<br>s<br>r<br>e<br>v<br>e<br>R|IR|V<br>M<br>W<br>R<br>C<br>°<br>5<br>2<br>=<br>T<br>,<br>V<br>3<br>.<br>3<br>=||5<br>0<br>.<br>0|5<br>.<br>0|A<br>µ| |e<br>g<br>a<br>tlo<br>V<br>g<br>n<br>i<br>p<br>m<br>a<br>l<br>C|VC|I P<br>P<br>s<br>µ<br>0<br>2<br>/<br>8<br>=<br>p<br>t<br>,<br>A<br>1<br>=<br>d<br>n<br>u<br>o<br>r<br>G<br>o<br>t<br>O<br>/I<br>y<br>n<br>A|||5<br>.<br>4|V| |e<br>g<br>a<br>tlo<br>V<br>g<br>n<br>i<br>p<br>m<br>a<br>l<br>C|VC|I P<br>P<br>s<br>µ<br>0<br>2<br>/<br>8<br>=<br>p<br>t<br>,<br>A<br>5<br>=<br>d<br>n<br>u<br>o<br>r<br>G<br>o<br>t<br>O<br>/I<br>y<br>n<br>A|||8<br>.<br>6|V| |e<br>g<br>a<br>tlo<br>V<br>g<br>n<br>i<br>p<br>m<br>a<br>l<br>C|VC|I P<br>P<br>s<br>µ<br>0<br>2<br>/<br>8<br>=<br>p<br>t<br>,<br>A<br>2<br>1<br>=<br>d<br>n<br>u<br>o<br>r<br>G<br>o<br>t<br>O<br>/I<br>y<br>n<br>A|||7<br>.<br>8|V| |e<br>g<br>a<br>tlo<br>V<br>d<br>r<br>a<br>w<br>r<br>o<br>F<br>e<br>d<br>o<br>i<br>D<br>g<br>n<br>ir<br>e<br>e<br>t<br>S<br>)<br>e<br>g<br>a<br>tlo<br>V<br>g<br>n<br>i<br>p<br>m<br>a<br>l<br>C<br>e<br>s<br>r<br>e<br>v<br>e<br>R<br>(|VF|I P<br>P<br>s<br>µ<br>0<br>2<br>/<br>8<br>=<br>p<br>t<br>,<br>A<br>1<br>=<br>d<br>n<br>u<br>o<br>r<br>G<br>o<br>t<br>O<br>/I<br>y<br>n<br>A|||7<br>.<br>1|V| |e<br>c<br>n<br>a<br>tic<br>a<br>p<br>a<br>C<br>n<br>o<br>it<br>c<br>n<br>u<br>J|Cj|d<br>n<br>a<br>n<br>i<br>p<br>O<br>/I<br>h<br>c<br>a<br>E<br>d<br>n<br>u<br>o<br>r<br>G<br>VR<br>z<br>H<br>M<br>1<br>=<br>f<br>,<br>V<br>0<br>=||5<br>3|0<br>4|F<br>p| www.semtech.com 2004 Semtech Corp. 2 SMS3.3 **PROTECTION** PRODUCTSPRODUCTS ## **Non-Repetitive Peak Pulse Power vs. Pulse Time** ## **Power Derating** **==> picture [234 x 154] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>1<br>0.1<br>0.01<br>0.1 1 10 100 1000<br>Pulse Duration - tp (µs)<br> (kW)<br>Pk<br>Peak Pulse Power - P<br>**----- End of picture text -----**<br> ## **Pulse Waveform** **==> picture [235 x 154] intentionally omitted <==** **----- Start of picture text -----**<br> 110<br>100<br>90<br>80<br>70<br>60<br>50<br>40<br>30<br>20<br>10<br>0<br>0 25 50 75 100 125 150<br>Ambient Temperature - TA ( [o] C)<br>PP<br>% of Rated Power or I<br>**----- End of picture text -----**<br> **Clamping Voltage vs. Peak Pulse Current** **==> picture [259 x 171] intentionally omitted <==** **----- Start of picture text -----**<br> 110<br>Waveform<br>100<br> Parameters:<br>90<br>tr = 8µs<br>80 td = 20µs<br>70<br>e [-t]<br>60<br>50<br>40<br>td = IPP/2<br>30<br>20<br>10<br>0<br>0 5 10 15 20 25 30<br>Time (µs)<br>PP<br>Percent of I<br>**----- End of picture text -----**<br> **==> picture [260 x 172] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>9<br>8<br>7<br>6<br>5<br>4<br>Waveform<br>3<br> Parameters:<br>2 tr = 8µs<br>td = 20µs<br>1<br>0<br>0 2 4 6 8 10 12 14<br>Peak Pulse Current - IPP (A)<br> (V)Clamping Voltage - VC<br>**----- End of picture text -----**<br> ## **Forward Voltage vs. Forward Current** **Capacitance vs. Reverse Voltage** **==> picture [535 x 173] intentionally omitted <==** **----- Start of picture text -----**<br> 10 40<br>I/O to GND<br>9<br>f = 1MHz<br>8<br>30<br>7<br>6<br>5 20<br>4<br>3 Waveform<br> Parameters: 10<br>2 tr = 8µs<br>1 td = 20µs<br>0 0<br>0 2 4 6 8 10 12 14 0 1 2 3 4<br>Forward Current - IF (A) Reverse Voltage - VR (V)<br> (V)F<br> (pF)Capacitance - Cj<br>Forward Voltage- V<br>**----- End of picture text -----**<br> www.semtech.com 2004 Semtech Corp. 3 SMS3.3 ## **PROTECTION PRODUCTS** ## Applications Information ## Device Connection for Protection of Four Data Lines The SMS3.3 is designed to protect up to four unidirectional data lines. The device is connected as follows: 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4 and 6 to the data lines. Pin 2 and 5 are connected to ground. The ground connections should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. ## Circuit Board Layout Recommendations for Suppression of ESD Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: - Place the TVS near the input terminals or connectors to restrict transient coupling. - Minimize the path length between the TVS and the protected line. - Minimize all conductive loops including power and ground loops. - The ESD transient return path to ground should be kept as short as possible. - Never run critical signals near board edges. - Use ground planes whenever possible. ## Matte Tin Lead Finish ## SMS3.3 Circuit Diagram **==> picture [166 x 142] intentionally omitted <==** ## Protection of Four Unidirectional Lines **==> picture [81 x 116] intentionally omitted <==** **==> picture [66 x 112] intentionally omitted <==** Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. www.semtech.com 2004 Semtech Corp. 4 SMS3.3 ## **PROTECTION** PRODUCTSPRODUCTS Typical Applications **==> picture [541 x 381] intentionally omitted <==** www.semtech.com 2004 Semtech Corp. 5 SMS3.3 ## **PROTECTION PRODUCTS** ## Outline Drawing -SOT23 6LOutline Drawing - SO-8 **==> picture [502 x 206] intentionally omitted <==** **----- Start of picture text -----**<br> A<br>DIMENSIONS<br>e1 D<br>INCHES MILLIMETERS<br>DIM<br>MIN NOM MAX MIN NOM MAX<br>N H H A .035 - .057 0.90 - 1.45<br>2X E/2 A1 .000 - .006 0.00 - 0.15<br>1 2 EI E PLANEGAGE c A2bc .035.003.010 .045-- .051.009.020 0.250.08.90 1.15-- 1.300.220.50<br>ccc C 0.25 L D .110 .114 .118 2.80 2.90 3.00<br>2X N/2 TIPS 01 E1 .060 .063 .069 1.50 1.60 1.75<br>e (L1) E .110 BSC 2.80 BSC<br>e .037 BSC 0.95 BSC<br>B DETAIL A e1 .075 BSC 1.90 BSC<br>L .012 .018 .024 0.30 0.45 0.60<br>L1 (.024) (0.60)<br>D 01N 0° 6- 10° 0° 6- 10°<br>aaa C aaa .004 0.10<br>A2 A bbb .008 0.20<br>SEATING ccc .008 0.20<br>PLANE SEE DETAIL A<br>C A1<br>SIDE VIEW<br>bxN<br>bbb C A-B D<br>**----- End of picture text -----**<br> NOTES: 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 2. DATUMS AND TO BE DETERMINED AT DATUM PLANE-A-B-H- 3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. ## Land Pattern -SOT23 6L **==> picture [345 x 124] intentionally omitted <==** **----- Start of picture text -----**<br> X<br>DIMENSIONS<br>DIM INCHES MILLIMETERS<br>C (.098) (2.50)<br>G .055 1.40<br>(C) G Z P .037 0.95<br>X .024 0.60<br>Y Y .043 1.10<br>Z .141 3.60<br>P<br>NOTES:<br>**----- End of picture text -----**<br> 1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. www.semtech.com 2004 Semtech Corp. 6 SMS3.3 ## **PROTECTION** PRODUCTSPRODUCTS Marking **==> picture [76 x 72] intentionally omitted <==** ## Ordering Information |r<br>e<br>b<br>m<br>u<br>N<br>tr<br>a<br>P|h<br>si<br>ni<br>F<br>d<br>a<br>e<br>L|r<br>e<br>p<br>y<br>t<br>Q<br>l<br>e<br>e<br>R|e<br>zi<br>S<br>l<br>e<br>e<br>R| |---|---|---|---| |C<br>T.<br>3<br>.<br>3<br>S<br>M<br>S|b<br>P<br>n<br>S|0<br>0<br>0<br>,<br>3|h<br>c<br>nI<br>7| |T<br>C<br>T.<br>3<br>.<br>3<br>S<br>M<br>S|e<br>e<br>rf<br>b<br>P|0<br>0<br>0<br>,<br>3|h<br>c<br>nI<br>7| Note: (1) No suffix indicates tube pack. Top Side Mark ## Tape and Reel Specification Device Orientation in Tape: **==> picture [377 x 84] intentionally omitted <==** Direction of Feed ## Tape Specifications (per EIA 481) Reel Material: Static Dissipative Tape Material: Static Dissipative Tape Width: 8mm +/- 0.30mm Component Pitch (max.): 4mm +/- 0.10mm Component Cavity Play: 20° ## Contact Information Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804 www.semtech.com 2004 Semtech Corp. 7
Updated at June 1, 2026
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