SMS05T1G

SMS05T1 Series 

## SC-74 Quad Transient Voltage Suppressor **for ESD Protection** 

This quad monolithic silicon voltage suppressor is designed for applications requiring transient overvoltage protection capability. It is intended for use in voltage and ESD sensitive equipment such as computers, printers, business machines, communication systems and other applications. This quad device provides superior surge protection over current quad Zener MMQA series by providing up to 350 watts peak power. 

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**SC−74 QUAD TRANSIENT VOLTAGE SUPPRESSOR 350 WATTS PEAK POWER 5 VOLTS** 

## **Features** 

- SC-74 Package Allows Four Separate Unidirectional Configurations 

- Peak Power − 350 W, 8 x 20 S ) 

- ESD Rating of Class N (Exceeding 25 kV) per the Human Body Model 

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SC−74<br>6 CASE 318F<br>¢<br>1 STYLE 1<br>**----- End of picture text -----**<br>


- ESD Rating: 

IEC 61000−4−2 (ESD) 15 kV (air) 8 kV (contact) IEC 61000−4−4 (EFT) 40 A (5/50 ns) IEC 61000−4−5 (lightning) 23 A (8/20 s) 

## **MARKING DIAGRAM** 

- UL Flammability Rating of 94 V−0 

- These Devices are Pb−Free and are RoHS Compliant 

- SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

## **Typical Applications** 

- Hand Held Portable Applications such as Cell Phones, Pagers, Notebooks and Notebook Computers 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**|~~ee~~|~~ee~~||
|---|---|---|---|
|**Rating**<br>~~a~~|**Symbol**<br>~~a~~<br>~~ee~~|**Value**<br>~~a~~<br>~~ee~~|**Unit**<br>~~a~~|
|Peak Power Dissipation<br>8 x 20 S @ TA= 25°C (Note 1)<br>~~poe~~|Ppk<br>~~ee~~<br>~~poe~~|350<br>~~ee~~<br>~~poe~~|W<br>~~poe~~|
|Total Power Dissipation on FR−5 Board<br>@ TA= 25°C (Note 2)<br>Derate Above 25°C<br>~~po~~|PD<br>~~po~~|225<br>1.8<br>~~po~~|mW<br>mW/°C<br>~~po~~|
|Thermal Resistance,<br>Junction−to−Ambient<br>~~po~~<br>~~eee~~|R JA<br>~~po~~<br>~~eee~~|556<br>~~po~~<br>~~eee~~|°C/W<br>~~po~~<br>~~eee~~|
|Junction and Storage<br>Temperature Range<br>~~eee~~<br>~~ee~~<br>~~ee~~|TJ, Tstg<br>~~eee~~<br>~~ee~~<br>~~ee~~|−55 to +150<br>~~eee~~<br>~~eee~~<br>~~eee~~|°C<br>~~eee~~<br>~~eee~~<br>~~eee~~|
|Lead Solder Temperature<br>Maximum 10 Seconds Duration<br>~~ee~~<br>~~ee~~|TL<br>~~ee ~~<br>~~ee~~|260<br> ~~eee~~<br>~~eee~~|°C<br>~~eee~~<br>~~eee~~|



1. Non−repetitive current pulse 8 x 20 S exponential decay waveform 2. FR−5 = 1.0 x 0.75 x 0.62 in. 

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xxx M<br>1<br>xxx = Specific Device Code<br>M = Date Code*<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


*Date Code orientation and/or position may vary depending upon manufacturing location. 

## **PIN ASSIGNMENT** 

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PIN 1. CATHODE<br>1 6<br>2. ANODE<br>3. CATHODE<br>2 5<br>4. CATHODE<br>5. ANODE<br>3 4 6. CATHODE<br>**----- End of picture text -----**<br>


## **DEVICE MARKING INFORMATION** 

See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. 

## **ORDERING INFORMATION** 

See detailed ordering, marking and shipping information in the ordering information section on page 2 of this data sheet. 

Publication Order Number: **SMS05T1/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **September, 2014 − Rev. 8** 

**SMS05T1 Series** 

## **ELECTRICAL CHARACTERISTICS** 

(TA = 25 ° C unless otherwise noted) 

|**Symbol**|**Parameter**||||||||
|---|---|---|---|---|---|---|---|---|
|||||V<br>VC VBR|||**Uni−Directional**<br>IPP<br>IF<br>**V**<br>**I**<br>IR<br>IT<br>RWM<br>VF||
|IPP|Maximum Reverse Peak Pulse Current||||||||
|VC|Clamping Voltage @ IPP||||||||
||||||||||
|VRWM|Working Peak Reverse Voltage||||||||
|IR|Maximum Reverse Leakage Current @ VRWM||||||||
|VBR|Breakdown Voltage @ IT||||||||
|IT|Test Current||||||||
|�VBR|Maximum Temperature Coefficient of VBR||||||||
|IF|Forward Current||||||||
|VF|Forward Voltage @ IF||||||||
|ZZT|Maximum Zener Impedance @ IZT||||||||
|IZK|Reverse Current||||||||
|ZZK|Maximum Zener Impedance @ IZK||||||||
||||||||||



## **ELECTRICAL CHARACTERISTICS − UNIDIRECTIONAL** 

|**Device***|**Device**<br>**Marking**||**Breakdown**<br>**Voltage**|**Breakdown**<br>**Voltage**||**Max**<br>**Reverse**<br>**Leakage**<br>**Current**|**Max**<br>**Reverse**<br>**Leakage**<br>**Current**|**Max Reverse Voltage**<br>**(Clamping Voltage)**<br>**At Specified Reverse**<br>**Surge Current (IRSM)**|**Max Reverse Voltage**<br>**(Clamping Voltage)**<br>**At Specified Reverse**<br>**Surge Current (IRSM)**|**Max Reverse Voltage**<br>**(Clamping Voltage)**<br>**At Specified Reverse**<br>**Surge Current (IRSM)**|**Max Reverse Voltage**<br>**(Clamping Voltage)**<br>**At Specified Reverse**<br>**Surge Current (IRSM)**|**Capacitance**<br>**@ 0 Volt Bias,**<br>**1 MHz**|**Capacitance**<br>**@ 0 Volt Bias,**<br>**1 MHz**|
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
||||**VBR(V)**||**IT**|**IR**|**VR**|**IRSM**<br>**(8x20�s)**|**VRSM**<br>**(8x20�s)**|**IRSM**<br>**(8x20�s)**|**VRSM**<br>**(8x20�s)**|**(pF)**||
|||**Min**|**Nom**|**Max**|**(mA)**|**(�A)**|**(V)**|**(A)**|**(V)**|**(A)**|**(V)**|**Min**|**Max**|
|SMS05T1G|5V0|6.0|−|7.2|1.0|20|5.0|5.0|9.8|23|15.5|250|400|
|SMS12T1G|12V|13.3|−|15|1.0|1.0|12|5.0|19.0|15|23.0|80|150|
|SMS15T1G|15V|16.7|−|18.5|1.0|1.0|15|5.0|24.0|12|29.0|60|125|
|SMS24T1G|24V|26.7|−|32|1.0|1.0|24|5.0|40.0|8|44.0|40|75|



*Includes SZ−prefix devices where applicable. 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|SMS05T1G,<br>SZSMS05T1G**|SC−74<br>(Pb−Free)|3000 / Tape & Reel|
|SMS12T1G|SC−74<br>(Pb−Free)|3000 / Tape & Reel|
|SMS15T1G,<br>SZSMS15T1G**|SC−74<br>(Pb−Free)|3000 / Tape & Reel|
|SMS24T1G,<br>SZSMS24T1G**|SC−74<br>(Pb−Free)|3000 / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable. 

**http://onsemi.com** 

**2** 

**SMS05T1 Series** 

## **TYPICAL CHARACTERISTICS** 

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10 110<br>100<br>90<br>80<br>1<br>70<br>60<br>50<br>40<br>0.1<br>30<br>20<br>10<br>0.01 0<br>0.1 1 10 100 1000 0 25 50 75 100 125 150<br>tp, PULSE DURATION ( � s) TA, AMBIENT TEMPERATURE ( ° C)<br>Figure 1. Non−Repetitive Peak Pulse Power Figure 2. Power Derating Curve<br>versus Pulse Time<br>110 50<br>100 WAVEFORM 45 WAVEFORM<br>90 PARAMETERS SMS24 PARAMETERS<br>tr = 8  � s 40 tr = 8  � s<br>80 td = 20  � s 35 t d  = 20  � s<br>70<br>c−t 30<br>60 SMS15<br>25<br>50 td = IPP/2 SMS12<br>20<br>40<br>15<br>30<br>20 10 SMS05<br>10 5<br>0 0<br>0 5 10 15 20 25 30 0 5 10 15 20 25<br>t, TIME ( � s) IPP, PEAK PULSE CURRENT (A)<br>Figure 3. Pulse Waveform Figure 4. Clamping Voltage versus<br>Peak Pulse Current<br>5 300<br>PULSE<br>4 WAVEFORMtr = 8  � s 250 TJ = 25 ° C<br>td = 20  � s<br>200<br>3 8 X 20  � s SURGE SMS05<br>150<br>2<br>100<br>SMS12<br>1<br>50 SMS15<br>SMS24<br>0 0<br>0 5 10 15 20 0 5 10 15 20 25<br>IF, FORWARD CURRENT (A) VR, REVERSE VOLTAGE (V)<br>PP<br>, PEAK PULSE POWER (kW)<br>PP % OF RATED POWER OR I<br>P<br>PP<br>PERCENT OF I<br>, CLAMPING VOLTAGE (V)<br>C<br>V<br>, FORWARD VOLTAGE (V) C, CAPACITANCE (pF)<br>F<br>V<br>**----- End of picture text -----**<br>


**Figure 5. 8 x 20 � s VF** 

**Figure 6. Typical Capacitance (SMS05 Series)** 

**http://onsemi.com** 

**3** 

**SMS05T1 Series** 

## **PACKAGE DIMENSIONS** 

## **SC−74 (SC−59ML)** 

CASE 318F−05 ISSUE N 

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D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: INCH.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH<br>r al4 THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM<br>6 5 4 THICKNESS OF BASE MATERIAL.<br>HE E 4. 318F−01, −02, −03, −04 OBSOLETE. NEW STANDARD 318F−05.<br>1 2 3<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 0.90 1.00 1.10 0.035 0.039 0.043<br>is b ———— A1 0.01 0.06 0.10 0.001 0.002 0.004<br>e : b 0.25 0.37 0.50 0.010 0.015 0.020<br>c 0.10 0.18 0.26 0.004 0.007 0.010<br>D 2.90 3.00 3.10 0.114 0.118 0.122<br>E 1.30 1.50 1.70 0.051 0.059 0.067<br>e 0.85 0.95 1.05 0.034 0.037 0.041<br>A C L 0.20 0.40 0.60 0.008 0.016 0.024<br>0.05 (0.002) H E 2.50 2.75 3.00 0.099 0.108 0.118<br>0 ° − 10 ° 0 ° − 10 °<br>L<br>A1<br>cy, £443) FS===== STYLE 1:<br>PIN 1. CATHODE<br>SOLDERING FOOTPRINT* 2.3. ANODECATHODE<br>4. CATHODE<br>2.4 5. ANODE<br>0.094 6. CATHODE<br>0.95<br>1.9 0.037<br>0.074<br>0.95<br>0.7 0.037<br>0.028<br>BB<br>1.0 SCALE 10:1 mm<br>— 0.039 (—) inches<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


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## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

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**SMS05T1/D** 

**4**