SMMBD7000LT3G

## MMBD7000L, SMMBD7000L 

## Dual Switching Diode 

## **Features** 

- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

**MAXIMUM RATINGS (EACH DIODE)** 

**SOT−23 (TO−236) Rating Symbol Value Unit CASE 318** Reverse Voltage VR 100 V **STYLE 11** Forward Current IF 200 mA 1 2 Forward Surge Current IFSM 1.6 A ANODE CATHODE (60 Hz @ 1 cycle) 3 CATHODE/ANODE Repetitive Peak Forward Current IFRM 0.5 A (Pulse Wave = 1 sec, Duty Cycle = 66%) ~~=~~ Stresses exceeding those listed in the Maximum Ratings table may damage the **MARKING DIAGRAM** device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

**MARKING DIAGRAM** M5C M 1 M5C = Specific Device Code M = Date Code* = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. 

## **THERMAL CHARACTERISTICS** 

**Characteristic Symbol Max Unit** 1 Total Device Dissipation FR−5 Board PD 225 mW (Note 1)TA = 25 ° C Derate above 25 ° C 1.8 mW/ ° C M5C = Specific Device Code M = Date Code* Thermal Resistance, Junction to R JA 556 ° C/W = Pb−Free Package Ambient ~~rr~~ (Note: Microdot may be in either location) Total Device Dissipation ~~ee~~ PD 300 mW *Date Code orientation and/or overbar may Alumina Substrate, (Note 2) vary depending upon manufacturing location. TA = 25 ° C Derate above 25 ° C 2.4 mW/ ° C **ORDERING INFORMATION** Thermal Resistance, R JA ° C/W ~~pT~~ Junction−to−Ambient ~~EE~~ 417 **Device Package Shipping**[†] Junction and Storage Temperature TJ, Tstg −55 to +150 ° C MMBD7000LT1G SOT−23 3,000 / (Pb−Free) Tape & Reel 1. FR−5 = 1.0 0.75 0.062 in. 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. SMMBD7000LT1G SOT−23 3,000 / (Pb−Free) Tape & Reel MMBD7000LT3G SOT−23 10,000 / (Pb−Free) Tape & Reel SMMBD7000LT3G SOT−23 10,000 / (Pb−Free) Tape & Reel ~~=:~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: **MMBD7000LT1/D** 

**1** 

© Semiconductor Components Industries, LLC, 1994 **June, 2017 − Rev. 8** 

## **MMBD7000L, SMMBD7000L** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) **(EACH DIODE)** 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted)**(EACH D**|**IODE)**||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Reverse Breakdown Voltage<br>(I(BR)= 100�Adc)|V(BR)|100|−|Vdc|
|Reverse Voltage Leakage Current<br>(VR= 50 Vdc)<br>(VR= 100 Vdc)<br>(VR= 50 Vdc, 125°C)|IR<br>IR2<br>IR3|−<br>−<br>−|1.0<br>3.0<br>100|�Adc|
|Forward Voltage<br>(IF= 1.0 mAdc)<br>(IF= 10 mAdc)<br>(IF= 100 mAdc)|VF|0.55<br>0.67<br>0.75|0.7<br>0.82<br>1.1|Vdc|
|Reverse Recovery Time<br>(IF= IR= 10 mAdc) (Figure 1)|trr|−|4.0|ns|
|Capacitance (VR= 0 V)|C|−|1.5|pF|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

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820 �<br>IF<br>+10 V 2.0 k 0.1 �F tr t p t<br>100 �H IF 10% t rr t<br>0.1 �F<br>DUT 90%<br>50 � OUTPUT 50 � INPUT iR(REC) = 1.0 mA<br>IR<br>PULSE SAMPLING VR OUTPUT PULSE<br>GENERATOR OSCILLOSCOPE INPUT SIGNAL<br>(IF = IR = 10 mA; MEASURED<br>at iR(REC) = 1.0 mA)<br>**----- End of picture text -----**<br>


Notes: 1. A 2.0 k � variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr 

**Figure 1. Recovery Time Equivalent Test Circuit** 

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**MMBD7000L, SMMBD7000L** 

## **CURVES APPLICABLE TO EACH DIODE** 

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100<br>TA = 85°C TA = -40°C<br>10<br>TA = 25°C<br>1.0<br>0.1<br>0.2 0.4 0.6 0.8 1.0 1.2<br>VF, FORWARD VOLTAGE (VOLTS)<br>Figure 2. Forward Voltage<br>0.68<br>0.64<br>0.60<br>0.56<br>0.52<br>0 2.0 4.0 6.0 8.0<br>VR, REVERSE VOLTAGE (VOLTS)<br>, FORWARD CURRENT (mA)<br>IF<br>, DIODE CAPACITANCE (pF)<br>D<br>C<br>**----- End of picture text -----**<br>


**Figure 4. Capacitance** 

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10<br>TA = 150°C<br>1.0 TA = 125°C<br>TA = 85°C<br>0.1<br>TA = 55°C<br>0.01<br>TA = 25°C<br>0.001<br>0 10 20 30 40 50<br>VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Leakage Current<br>25<br>20<br>15<br>10<br>5<br>0<br>0.001 0.01 0.1 1 10 100 1000<br>tp, PULSE ON TIME (ms)<br>�<br>, REVERSE CURRENT (   A)<br>IR<br>, FORWARD SURGE MAX CURRENT (A)<br>IFSW<br>**----- End of picture text -----**<br>


**Figure 5. Forward Surge Current** 

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**3** 

**MMBD7000L, SMMBD7000L** 

## **PACKAGE DIMENSIONS** 

**SOT−23 (TO−236)** CASE 318−08 ISSUE AR 

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D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.<br>0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF<br>a 3 = THE BASE MATERIAL.<br>| E HE T 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.<br>1 2<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>L A 0.89 1.00 1.11 0.035 0.039 0.044<br>3X b L1 A1b 0.010.37 0.060.44 0.100.50 0.0000.015 0.0020.017 0.0040.020<br>e VIEW C c 0.08 0.14 0.20 0.003 0.006 0.008<br>TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120<br>E 1.20 1.30 1.40 0.047 0.051 0.055<br>e 1.78 1.90 2.04 0.070 0.075 0.080<br>L 0.30 0.43 0.55 0.012 0.017 0.022<br>A L1 0.35 0.54 0.69 0.014 0.021 0.027<br>H E 2.10 2.40 2.64 0.083 0.094 0.104<br>T 0 ° −−− 10 ° 0 ° −−− 10 °<br>A1 SIDE VIEW SEE VIEW C c STYLE 11:<br>PIN 1. ANODE<br>END VIEW 2. CATHODE<br>3. CATHODE−ANODE<br>RECOMMENDED<br>SOLDERING FOOTPRINT*<br>3X<br>2.90 _ 0.90<br>Lo | cr<br>3X 0.80 | LL L 0.95<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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