SMF05C.TCT

SMF05C TVS Diode Array For ESD and Latch-Up Protection PRELIMINARY 

## PROTECTION PRODUCTS 

## Description 

The SMF series TVS arrays are designed to protect sensitive electronics from damage or latch-up due to ESD and other voltage-induced transient events.  They are designed for use in applications where board space is at a premium.  Each device will protect up to five lines.  They are unidirectional devices and may be used on lines where the signal polarities are above ground. 

TVS diodes are solid-state devices designed specifically for transient suppression.  They feature large cross-sectional area junctions for conducting high transient currents.  They offer desirable characteristics for board level protection including fast response time, low operating and clamping voltage, and no device degradation. 

The SMF series devices may be used to meet the immunity requirements of IEC 61000-4-2, level 4.  The small SC70 package makes them ideal for use in portable electronics such as cell phones, PDA’s, notebook computers, and digital cameras. 

## Features 

- ESD protection for data lines to IEC 61000-4-2 (ESD) ±15kV (air), ±8kV (contact) IEC 61000-4-4 (EFT) 40A (5/50ns) 

- Small package for use in portable electronics 

- Protects five I/O lines 

- Working voltage: 5V 

- Low leakage current 

- Low operating and clamping voltages 

- Solid-state silicon-avalanche technology 

## Mechanical Characteristics 

- EIAJ SC70-6L package 

- Molding compound flammability rating: UL 94V-0 

- Marking : Marking Code 

- Packaging : Tape and Reel per EIA 481 

## Applications 

- Cellular Handsets and Accessories 

- Cordless Phones 

- Personal Digital Assistants (PDA’s) 

- Notebooks and Handhelds 

- Portable Instrumentation 

- Digital Cameras 

- Peripherals 

- MP3 Players 

## Circuit Diagram 

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1 3 4 5 6<br>2<br>**----- End of picture text -----**<br>


## Schematic & PIN Configuration 

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**----- Start of picture text -----**<br>
1 6<br>2 5<br>3 4<br>SC70-6L  (Top View)<br>**----- End of picture text -----**<br>


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Revision 08/04/04 

1 

SMF05C 

## PROTECTION PRODUCTS 

## PRELIMINARY 

## Absolute Maximum Rating 

|PROTECTION PRODUCTS<br>Absolute Maximum Rating|PROTECTION PRODUCTS<br>Absolute Maximum Rating|PROTECTION PRODUCTS<br>Absolute Maximum Rating|||PR|PR|PR|ELIMINARY|ELIMINARY|
|---|---|---|---|---|---|---|---|---|---|
|g<br>nit<br>a<br>R|||l<br>o<br>b<br>m<br>y<br>S||e<br>ul<br>a<br>V|||s<br>ti<br>n<br>U||
|0<br>2<br>/<br>8<br>=<br>p<br>t(<br>r<br>e<br>w<br>o<br>P<br>e<br>slu<br>P<br>k<br>a<br>e<br>P<br>µ )s|||P k<br>p||0<br>0<br>1|||stt<br>a<br>W||
|0<br>2<br>/<br>8<br>=<br>p<br>t(<br>t<br>n<br>e<br>rr<br>u<br>C<br>e<br>slu<br>P<br>k<br>a<br>e<br>P<br>µ )s|||I P<br>P||8|||A||
|)riA<br>(<br>2<br>-<br>4<br>-<br>0<br>0<br>0<br>1<br>6<br>C<br>EI<br>r<br>e<br>p<br>D<br>S<br>E<br>)tc<br>a<br>t<br>n<br>o<br>C<br>(<br>2<br>-<br>4<br>-<br>0<br>0<br>0<br>1<br>6<br>C<br>EI<br>r<br>e<br>p<br>D<br>S<br>E|||V<br>D<br>S<br>E||0<br>2<br>5<br>1|||V<br>k||
|e<br>r<br>u<br>t<br>a<br>r<br>e<br>p<br>m<br>e<br>T<br>g<br>nir<br>e<br>dlo<br>S<br>d<br>a<br>e<br>L|||TL||)s<br>d<br>n<br>o<br>c<br>e<br>s<br>0<br>1<br>(<br>0<br>6<br>2|||oC||
|e<br>r<br>u<br>t<br>a<br>r<br>e<br>p<br>m<br>e<br>T<br>g<br>nit<br>a<br>r<br>e<br>p<br>O|||TJ||5<br>2<br>1<br>+<br>o<br>t<br>5<br>5<br>-|||oC||
|e<br>r<br>u<br>t<br>a<br>r<br>e<br>p<br>m<br>e<br>T<br>e<br>g<br>a<br>r<br>o<br>t<br>S|||T<br>G<br>T<br>S||0<br>5<br>1<br>+<br>o<br>t<br>5<br>5<br>-|||oC||
|Electrical Characteristics||||||||||
|C<br>5<br>0<br>F<br>M<br>S||||||||||
|r<br>e<br>t<br>e<br>m<br>a<br>r<br>a<br>P|l<br>o<br>b<br>m<br>y<br>S|s<br>n<br>oiti<br>d<br>n<br>o<br>C||m<br>u<br>m<br>i<br>ni<br>M||l<br>a<br>ci<br>p<br>y<br>T|m<br>u<br>m<br>ix<br>a<br>M||s<br>ti<br>n<br>U|
|e<br>g<br>a<br>tlo<br>V<br>ff<br>O<br>-<br>d<br>n<br>a<br>t<br>S<br>e<br>sr<br>e<br>v<br>e<br>R|V<br>M<br>W<br>R||||||5||V|
|e<br>g<br>a<br>tlo<br>V<br>n<br>w<br>o<br>d<br>k<br>a<br>e<br>r<br>B<br>e<br>sr<br>e<br>v<br>e<br>R|V R<br>B|It<br>A<br>m<br>1<br>=||6|||||V|
|t<br>n<br>e<br>rr<br>u<br>C<br>e<br>g<br>a<br>k<br>a<br>e<br>L<br>e<br>sr<br>e<br>v<br>e<br>R|IR|V<br>M<br>W<br>R<br>C<br>°<br>5<br>2<br>=<br>T<br>,V<br>5<br>=|||||5||A<br>µ|
|e<br>g<br>a<br>tlo<br>V<br>g<br>nip<br>m<br>alC|VC|I P<br>P<br>t<br>,<br>A<br>5<br>=<br>p<br>s<br>µ<br>0<br>2<br>/<br>8<br>=|||||8<br>.<br>9||V|
|e<br>g<br>a<br>tlo<br>V<br>g<br>nip<br>m<br>alC|VC|I P<br>P<br>t<br>,<br>A<br>8<br>=<br>p<br>s<br>µ<br>0<br>2<br>/<br>8<br>=|||||5<br>.<br>2<br>1||V|
|e<br>c<br>n<br>a<br>tic<br>a<br>p<br>a<br>C<br>n<br>oitc<br>n<br>u<br>J|Cj|VR<br>z<br>H<br>M<br>1<br>=<br>f<br>,V<br>0<br>=|||||0<br>3<br>1||F<br>p|



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 2004 Semtech Corp. 

2 

SMF05C 

## **PROTECTION PRODUCTS** 

## PRELIMINARY 

## Typical Characteristics 

## Non-Repetitive Peak Pulse Power vs. Pulse Time 

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**----- Start of picture text -----**<br>
10<br>Soe ee<br>| | TT TT<br>1<br>ee ee ee<br>0.1<br>TCT<br>aoooa|Po<br>0.01 PT PPT ETT TT<br>0.1 1 10 100 1000<br>Pulse Duration - tp (µs)<br>Pulse Waveform<br>110<br>Waveform<br>100 ee<br> Parameters:<br>9080 PKoN td = 20µstr = 8µs<br>70 a -t<br>e<br>6050 Pfey [ee] NKee Ne<br>40 at ZI.<br>td = IPP/2<br>30 P fo oN<br>20 Pf<br>10 en SS<br>V ee ee ee<br>0 ee<br>0 5 10 15 20 25 30<br>Time (µs)<br> (kW)<br>pk<br>Peak Pulse Power - P<br>PP<br>Percent of I<br>**----- End of picture text -----**<br>


Capacitance vs. Reverse Voltage 

## Power Derating Curve 

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**----- Start of picture text -----**<br>
110<br>1009080 esPN<br>70<br>60<br>5040 a<br>30 -—_} + SJ +<br>20<br>10 es<br>0 es<br>0 25 50 75 100 125 150<br>Ambient Temperature - TA ( [o] C)<br>PP<br>% of Rated Power or I<br>**----- End of picture text -----**<br>


## Clamping Voltage vs. Peak Pulse Current 

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9<br>8<br>BPE EEE EERE HESS FH<br>76 eeREEEEEPeeererereeeeeereee EEE EEE EEE EE<br>5 eeli<br>43 ||rrr;| | | | [trFrereree] | | | | | | thmthm rEeyrErE eeePee ee Fert Waveform<br>| | | | | | | | | | ft ft tT ft  Parameters:<br>2 tr = 8µs<br>1 oePt td = 20µs<br>e e eee<br>0 P| | | | | | |e<br>0 2 4 6 8 10<br>Peak Pulse Current - IPP (A)<br> (V)<br>C<br>Clamping Voltage - V<br>**----- End of picture text -----**<br>


ESD Clamping Characteristics (8kV Contact Discharge per IEC 61000-4-2) 

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140 Pee<br>120 REEEEEEE EEE EEE EEE ERE EEE EEE EEE<br>100 SOS EEE<br>FERRERS EEE EEE ERE EEE<br>80 EERE EER SSE EERE<br>60<br>40 ee<br>20 FREER EERE<br>f = 1MHz<br>0 FERRERLaEEEREEERE EEE J<br>0 1 2 3 4 5 6<br>Reverse Voltage - VR (V)<br> (pF)Capacitance - Cj<br>**----- End of picture text -----**<br>


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 2004 Semtech Corp. 

3 

SMF05C 

## PROTECTION PRODUCTS 

## PRELIMINARY 

## Applications Information 

## Device Connection for Protection of Five Data Lines 

The SMF05C is designed to protect up to five unidirectional data lines. The device is connected as follows: 

1. Unidirectional protection of five I/O lines is achieved by connecting pins 1, 3, 4, 5 and 6 to the data lines.  Pin 2 is connected to ground.  The ground connection should be made directly to the ground plane for best results.  The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. 

## Circuit Board Layout Recommendations for Suppression of ESD. 

Good circuit board layout is critical for the suppression of ESD induced transients.  The following guidelines are recommended: 

- Place the SMF05C near the input terminals or connectors to restrict transient coupling. 

- Minimize the path length between the SMF05C and the protected line. 

- Minimize all conductive loops including power and ground loops. 

- The ESD transient return path to ground should be kept as short as possible. 

- Never run critical signals near board edges. 

- Use ground planes whenever possible. 

## Matte Tin Lead Finish 

Matte tin has become the industry standard lead-free replacement for SnPb lead finishes.  A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small compared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques.  In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 

## SMF05C Circuit Diagram 

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1 3 4 5 6<br>2<br>**----- End of picture text -----**<br>


## Protection of Five Unidirectional Lines 

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 2004 Semtech Corp. 

4 

SMF05C 

PRELIMINARY 

## **PROTECTION PRODUCTS** 

## Typical Applications 

**==> picture [540 x 381] intentionally omitted <==**

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 2004 Semtech Corp. 

5 

SMF05C 

## PROTECTION PRODUCTS 

## PRELIMINARY 

## Outline Drawing - SC70 6L 

**==> picture [505 x 208] intentionally omitted <==**

**----- Start of picture text -----**<br>
A DIMENSIONS<br>e1 D DIM INCHES MILLIMETERS<br>MIN NOM MAX MIN NOM MAX<br>N A - - .043 - - 1.10<br>A1 .000 - .004 0.00 - 0.10<br>2X E/2 SEE DETAIL A A2 .028 .035 .039 0.70 0.90 1.00<br>EI E SIDE VIEW bc .006.003 -- .012.009 0.150.08 -- 0.300.22<br>D .075 .079 .083 1.90 2.00 2.10<br>ccc C 1 2 E1 .045 .049 .053 1.15 1.25 1.35<br>E .083 BSC 2.10 BSC<br>2X N/2 TIPS e H e .026 BSC 0.65 BSC<br>e1 .051 1.30 BSC<br>B<br>L .010 .014 .018 0.26 0.36 0.46<br>GAGE c L1 (.017) (0.42)<br>PLANE N 6 6<br>D 01 0° - 8° 0° - 8°<br>0.15 L aaa .004 0.10<br>aaa C 01 bbb .004 0.10<br>A2 A (L1) ccc .012 0.30<br>SEATING DETAIL A<br>PLANE<br>C A1<br>bxN<br>bbb C A-B D<br>**----- End of picture text -----**<br>


NOTES: 

1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). 

2. DATUMS           AND           TO BE DETERMINED AT DATUM PLANE-A-B-H- 

3. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 

4. REFERENCE JEDEC STD MO-203, VARIATION AB. 

## Land Pattern - SC70 6L 

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**----- Start of picture text -----**<br>
X<br>DIMENSIONS<br>DIM INCHES MILLIMETERS<br>C (.073) (1.85)<br>G .039 1.00<br>C G Z<br>P .026 0.65<br>X .016 0.40<br>Y Y .033 0.85<br>Z .106 2.70<br>P<br>**----- End of picture text -----**<br>


## NOTES: 

1. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. 

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 2004 Semtech Corp. 

6 

SMF05C 

PRELIMINARY 

## **PROTECTION PRODUCTS** 

## Marking Codes 

|r<br>e<br>b<br>m<br>u<br>N<br>tr<br>a<br>P|g<br>n<br>i<br>k<br>r<br>a<br>M<br>e<br>d<br>o<br>C|
|---|---|
|C<br>5<br>0<br>F<br>M<br>S|C<br>5|



Note: 

(1) Pin 1 Identified with a dot 

## Ordering Information 

|r<br>e<br>b<br>m<br>u<br>N<br>tr<br>a<br>P|h<br>si<br>ni<br>F<br>d<br>a<br>e<br>L|r<br>e<br>p<br>y<br>t<br>Q<br>l<br>e<br>e<br>R|e<br>zi<br>S<br>l<br>e<br>e<br>R|
|---|---|---|---|
|C<br>T.<br>C<br>5<br>0<br>F<br>M<br>S|b<br>P<br>n<br>S|0<br>0<br>0<br>,<br>3|h<br>c<br>nI<br>7|
|T<br>C<br>T.<br>C<br>5<br>0<br>F<br>M<br>S|n<br>S<br>e<br>tt<br>a<br>M|0<br>0<br>0<br>,<br>3|h<br>c<br>nI<br>7|



## Contact Information 

Semtech Corporation Protection Products Division 200 Flynn Road, Camarillo, CA 93012 Phone: (805)498-2111   FAX (805)498-3804 

www.semtech.com 

 2004 Semtech Corp. 

7