SMD0603B010TF

DATA SHEET POSITIVE TEMPERATURE COEFFICIENT AC/DC POWER SUPPLY SMD0603 series **RoHS compliant & Halogen free** 

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> Product Specification 2 ~~]~~ 8 

Circuit Protection 

POSITIVE TEMPERATURE COEFFICIENT 

SMD0603 

## **Positive Temperature Coefficient (PTC) Data Sheet** 

## **Description** 

The 0603 series provides miniature surface mount resettable overcurrent protection with holding current from 40mA to 500mA. This series is suitable for ultra portable applications where space is at a premium and the device current is low. 

## **Features** 

- RoHS compliant and lead-free 

- Halogen-free 

- Compact design saves board space 

- Low profile 

- Fast response to fault current 

- Compatible with high temperature solders 

## **Applications** 

- Mobile phones and PDAs 

- Portable MP3 and media player 

   - USB peripherals 

   - IC VCC protection 

- Mobile internet Device (MID) 

## **Agency Approval and Environmental Compliance** 

|Agency|File Number||Regulation|Standard|
|---|---|---|---|---|
|UL/CUL|E482628||RoHS|2011/65/EU|
|TUV|B160696048001||Halogen Free|EN 14582:2007|



## **Electrical Characteristics** 

|Part<br>Number|Ihold<br>(A)|Itrip<br>(A)|Vmax<br>(Vdc)|Imax<br>(A)|Pd typ.<br>(W)|Maximum<br>Time To Trip|Maximum<br>Time To Trip|Resistance|Resistance|
|---|---|---|---|---|---|---|---|---|---|
|||||||Time<br>(Sec.)|Current<br>(A)|Rmin<br>(Ω)|R1max<br>(Ω)|
|SMD0603B004TF<br>~~a~~<br>~~La~~|0.04<br>~~ae~~<br>~~a~~|0.12<br>~~ee~~<br>~~a~~|24<br>~~ee~~<br>~~|~~|20<br>~~ee~~<br>~~a~~|0.5<br>~~ee~~|1.00<br>~~ee~~<br>~~|~~|0.20<br>~~eee~~<br>~~|~~|4.000<br>~~eee~~<br>~~|~~|40.000<br>~~ee~~|
|SMD0603B010TF<br>~~a ~~<br>~~La~~|0.10<br> ~~ae ~~<br>~~a~~|0.30<br> ~~ee ~~<br>~~a~~|15<br> ~~ee ~~<br>~~|~~|40<br> ~~ee~~<br>~~a~~|0.5<br>~~ee~~|1.00<br>~~ee ~~<br>~~|~~|0.50<br> ~~eee~~<br>~~|~~|0.900<br>~~eee ~~<br>~~|~~|6.000<br> ~~ee~~|
|SMD0603B020TF<br>~~La~~<br>~~ee~~<br>~~Le~~<br>~~a~~|0.20<br>~~a ~~<br>~~ee~~<br>~~Le~~<br>|0.50<br> ~~a ~~<br>~~ee~~<br>~~Le~~<br>~~ee~~<br>|9<br> ~~| ~~<br>~~ee~~<br>~~Le~~<br>~~ee~~<br>|40<br> ~~a~~<br>~~ee~~<br>~~ee~~<br>~~Le~~<br>~~ee~~<br>|0.5<br>~~ee~~<br>~~ee~~<br>~~Le~~<br>~~ee~~<br>|0.60<br>~~|~~<br>~~ee~~<br>~~ee~~<br>~~Le~~<br>~~ee~~<br>|1.00<br>~~|~~<br>~~ee~~<br>~~eee~~<br>~~Le~~<br>~~ee~~<br>|0.550<br>~~|~~<br>~~ee~~<br>~~eee~~<br>~~Le~~<br>~~ee~~|3.500<br>~~ee~~<br>~~eee~~<br>~~Le~~<br>~~ee~~|
|SMD0603B025TF<br>~~Le~~<br>~~a~~|0.25<br>~~Le~~<br>|0.55<br>~~Le~~<br>~~ee~~<br>|9<br>~~Le~~<br>~~ee~~<br>|40<br>~~ee ~~<br>~~Le~~<br>~~ee~~<br>|0.5<br> ~~ee ~~<br>~~Le~~<br>~~ee~~<br>|0.08<br> ~~ee ~~<br>~~Le~~<br>~~ee~~<br>|8.00<br> ~~eee~~<br>~~Le~~<br>~~ee~~<br>|0.500<br>~~eee ~~<br>~~Le~~<br>~~ee~~|3.000<br> ~~eee~~<br>~~Le~~<br>~~ee~~|
|SMD0603B035TF<br>~~Le~~<br>~~a~~ <br>~~La~~|0.35<br>~~Le~~<br> ~~ae~~<br>~~a~~|0.75<br>~~Le~~<br>~~ee~~<br>~~ee~~<br>~~a~~|6<br>~~Le~~<br>~~ee ~~<br>~~ee~~|40<br>~~Le~~<br> ~~ee ~~<br>~~ee~~|0.5<br>~~Le~~<br> ~~ee ~~<br>~~ee~~<br>~~|~~|0.10<br>~~Le~~<br> ~~ee ~~<br>~~ee~~<br>~~|~~|8.00<br>~~Le~~<br> ~~ee ~~<br>~~ee~~<br>~~|~~|0.200<br>~~Le~~<br> ~~ee ~~<br>~~ee~~<br>~~|~~|1.000<br>~~Le~~<br> ~~ee~~<br>~~ee~~|
|SMD0603B050TF<br> <br>~~La~~|0.50<br> ~~ae~~<br>~~a~~|1.00<br>~~ee~~<br>~~a~~|6<br>~~ee~~|40<br>~~ee~~|0.5<br>~~ee~~<br>~~|~~|0.10<br>~~ee~~<br>~~|~~|8.00<br>~~ee~~<br>~~|~~|0.100<br>~~ee~~<br>~~|~~|0.680<br>~~ee~~|



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Circuit Protection 

> Product Specification 3 8 

POSITIVE TEMPERATURE COEFFICIENT 

SMD0603 

## **Note on Electrical Characteristics** 

## ■ Vocabulary 

- Ihold = Hold current: maximum current device will pass without tripping in 23 ℃ still air. 

- Itrip = Trip current: minimum current at which the device will trip in 23 ℃ still air. 

- Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 

- Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) 

- Pd typ. = Typical power dissipated from device when in the tripped state at 23 ℃ still air. 

- Rmin = Minimum resistance of device in initial (un-soldered) state. 

- R1max = Maximum resistance of device at 23 ℃ measured one hour after tripping or reflow soldering of 260 ℃ for 20 sec. 

- Value specified is determined by using the PWB with 0.020”*1.5oz copper traces. 

- Caution: Operation beyond the specified rating may result in damage and possible arcing and flame. 

- Specifications are subject to change without notice. 

## **Polymeric PTC Selecting Guide** 

## ■ Determine the following operating parameters for the circuits: 

- Normal operating current (Ihold) 

      - Maximum interrupt current (Imax) 

   - Maximum circuit voltage (Vmax) · Normal operating temperature surrounding device (min ℃ /max ℃ ) 

- Select the device from factor and dimension suitable for the application 

- Compare the maximum rating for Vmax and Imax of the PPTC device with the circuit in application and make sure the circuit’s requirement does not exceed the device rating. 

- Check that PPTC device’s trip time (time-to-trip) will protect the circuit. 

- Verify that the circuit operating temperature is within the PPTC device’s normal operating temperature range. 

- Verify that performance and suitability of the chosen PPTC device in the application. 

## ! 

## **WARNING** 

## ■ Mechanical Stress 

- PPTC devices will undergo a thermal expansion during fault condition. If PPTC devices are installed or placed in an application where the space between PPTC devices and the surrounding materials (e.g., covering materials, packaging materials, encapsulate materials and the like) is insufficient, it will cause an inhibiting effect upon the thermal expansion. Pressing, twisting, bending and other kinds of mechanical stress will also adversely affect the performance of the PPTC devices, and shall not be used or applied. 

## ■ Chemical Pollutants 

- Silicone-based oils, oils, solvents, gels, electrolytes, fuels, acids, and the like will adversely affect the properties of PPTC devices, 

- and shall not be used or applied. 

## ■ Electronic and Thermal Effect 

   - PPTC devices are secondary protection devices and are used solely for sporadic, accidental over-current or over-temperature error condition, and shall NOT be used if or when constant or repeated fault conditions (such fault conditions may be caused by, among others, incorrect pin-connection of a connector) or over-extensive trip events may occur. 

- PPTC devices are different from fuses and, when a fault condition occurs, will go into high-resistance state and do not open circuit, in which case the voltage at such PPTC devices may reach a hazardous level. 

- Operation over the maximum rating or other forms of improper use may cause failure, arcing, flame and/or other damage to the PPTC devices. 

- Conductive material contamination, such as metal particle, may induce shortage, flame or arcing. 

- Due to the inductance, the operation circuits may generate a circuit voltage (Ldi/dt) above the rated voltage of PPTC devices, which shall not be used under such circumstances. 

## ■ General 

   - Customers shall evaluate and test the properties of PPTC devices independently to verify and ensure that their individual applications will be met. 

- The performance of PPTC devices will be adversely affected if they are improperly used under electronic, thermal and/or mechanical procedures and/or conditions non-conformant to those recommended by manufacturer. 

- Customers shall be responsible for determining whether it is necessary to have back-up, failsafe and/or fool-proof protection To avoid or minimize damage that may result from extra-ordinary, irregular function or failure of PPTC devices. 

- Any and all responsibilities and liabilities are disclaimed if any item under this notice of warning is not complied with. 

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Circuit Protection 

> Product Specification 4 8 

POSITIVE TEMPERATURE COEFFICIENT 

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SMD0603<br>**----- End of picture text -----**<br>


## **Thermal Derating Curve** 

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200.00<br>150.00<br>100.00<br>50.00<br>0.00<br>-40.00 0.00 40.00 80.00 120.00<br>Device Ambient Temperature ( ℃ )<br>Percentage of Rated Current<br>**----- End of picture text -----**<br>


## **Thermal Derating Chart** 

Recommended Hold Current (A) at Ambient Temperature ( ℃ ) 

|Part|||Ambient Operation Temperature|Ambient Operation Temperature|Ambient Operation Temperature|Ambient Operation Temperature|Ambient Operation Temperature|||
|---|---|---|---|---|---|---|---|---|---|
|Number|-40℃|-20℃|0℃|23℃|40℃|50℃|60℃|70℃|85℃|
|SMD0603B004TF|0.052|0.048|0.044|0.040|0.032|0.028|0.024|0.020|0.012|
|SMD0603B010TF|0.13|0.12|0.11|0.10|0.08|0.07|0.06|0.05|0.03|
|SMD0603B020TF|0.27|0.25|0.23|0.20|0.17|0.14|0.12|0.10|0.07|
|SMD0603B025TF|0.32|0.29|0.27|0.25|0.21|0.18|0.16|0.14|0.10|
|SMD0603B035TF|0.47|0.41|0.38|0.35|0.29|0.26|0.24|0.20|0.14|
|SMD0603B050TF|0.67|0.59|0.54|0.50|0.41|0.37|0.34|0.29|0.20|



## **Average Time-Current Curve** 

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B CD E F<br>100<br>10<br>A<br>1<br>0.1<br>0.01<br>0.1 1 10<br>Fault Current (A)<br>Time to Trip (s)<br>**----- End of picture text -----**<br>


A-SMD0603B004TF B-SMD0603B010TF C-SMD0603B020TF D-SMD0603B025TF E-SMD0603B035TF F-SMD0603B050TF 

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Circuit Protection 

> Product Specification 5 8 

POSITIVE TEMPERATURE COEFFICIENT 

SMD0603 

## **Soldering Parameters** 

|TP<br>TL<br>25<br>Temperature||||||||tP|tP|tP|tP|
|---|---|---|---|---|---|---|---|---|---|---|---|
||TS max||||Ramp-up|||Ramp<br>tL||||
|||||||Ramp-up||||||
|||||||||||||
|||||||||||||
|||||||||||||
||TS min|||||||||||
||||||||||Ramp||-down|
||||tS<br>Preheat|||||||||
|||||||||||||
||||t 25℃to Peak|||||||||
||||||Time|||||||
|||||||||||||
|||||||||||||
||||Profile Feature|||||Pb-Free Assembly||||
|||||||||||||
|Average ramp-up rate (TS maxto TP)||||||||3℃/second max.||||
|Preheat<br>-Temperature Min (TS min)<br>-Temperature Max (TS max)<br>-Time (min to max) (TS minto TS max)||||||||150℃<br>200℃<br>60-180 seconds||||
|Time maintained above:<br>-Temperature (TL)<br>-Time (tL)||||||||217℃<br>60-150 seconds||||
|Peak Temperature (TP)||||||||260℃||||
|Time within 5℃of actual Peak Temperature (tP)||||||||20-40 seconds||||
|Ramp-down Rate||||||||6℃/second max.||||
|Time 25℃to Peak Temperature||||||||8 minutes max.||||
|Storage Condition||||||||0℃~35℃, ≤70%RH||||



- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free 

- Recommended maximum paste thickness is 0.25mm (0.010 inch) 

- Device can be cleaned using standard industry methods and solvents. 

- Note 1: All temperature refer to topside of the package, measured on the package body surface. 

- Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance 

- requirements. 

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Circuit Protection 

> Product Specification 6 8 

POSITIVE TEMPERATURE COEFFICIENT 

SMD0603 

## **Physical Dimensions (mm)** 

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||Part identification||||A||||||||||
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||||||B<br>**Marking**||||||||||
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||A||B||||C||||D||E||
|Part<br>Number|||||||||||||||
||Min.|Max.|Min.|Max.|||Min.|||Max.|Min.|Max.|Min.|Max.|
||||||||||||||||
||||||||||||||||
|SMD0603B004TF|1.40|1.80|0.60|1.00|||0.40|||1.00|0.15|0.50|-|0.40|
||||||||||||||||
|SMD0603B010TF|1.40|1.80|0.60|1.00|||0.40|||1.00|0.15|0.50|-|0.40|
||||||||||||||||
|SMD0603B020TF|1.40|1.80|0.60|1.00|||0.40|||1.00|0.15|0.50|-|0.40|
||||||||||||||||
|SMD0603B025TF|1.40|1.80|0.60|1.00|||0.40|||1.00|0.15|0.50|-|0.40|
||||||||||||||||
|SMD0603B035TF|1.40|1.80|0.60|1.00|||0.55|||1.55|0.15|0.50|-|0.40|
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|SMD0603B050TF|1.40|1.80|0.60|1.00|||0.55|||1.55|0.15|0.50|-|0.40|
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|**Environmental Specifications**|||||||||||||||
|Operating / Storage temperature|||||||-40℃to +85℃||||||||
|Maximum Device Surface Temperature in Tripped State|||||||125℃||||||||
|Passive Aging|||||||+85℃, 1000 hours<br>±50% typical resistance|||||change|||
|Humidity Aging|||||||+85℃, 85%R.H. 1000 hours<br>±50% typical resistance change||||||||
|Thermal Shock|||||||MIL-STD-202, Method 107G<br>+85℃/-40℃20 times<br>-50% typical resistance change||||||||
|Solvent Resistance|||||||MIL-STD-202, Method 215<br>No change||||||||
|Vibration|||||||MIL-STD-883C, Method 2007.1, Condition A<br>No change||||||||
|Moisture Level Sensitivity|||||||Level 1, J-STD-020C||||||||



## **Environmental Specifications** 

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Circuit Protection 

> Product Specification 7 8 

POSITIVE TEMPERATURE COEFFICIENT 

SMD0603 

## **Packaging Quantity and Marking** 

Recommended Pad Layout (mm) 

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0.80typ.<br>1.00typ. 1.00typ.<br>yp.<br>1.00t<br>**----- End of picture text -----**<br>


||||
|---|---|---|
|Part Number|Marking|Quantity|
||||
|SMD0603B004TF|—|4000|
||||
|SMD0603B010TF|C|4000|
||||
|SMD0603B020TF|H|4000|
||||
|SMD0603B025TF|I|4000|
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|SMD0603B035TF|F|4000|
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|SMD0603B050TF|J|4000|
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◎ 8mm tape on 7 inch reel per EIA-481 (equivalent to IEC286, part 3) 

## **Physical Specifications** 

|Terminal Material|Solder-Plated Copper (Solder Material: Matte Tin (Sn))|
|---|---|
|Lead Solderability|Meets EIA Specification RS186-9E, ANSI/J-STD-002 Category 3.|



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Circuit Protection POSITIVE TEMPERATURE COEFFICIENT ~~YA@EO~~ 

> Product Specification 8 8 

SMD0603 

## **Packaging** 

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**----- Start of picture text -----**<br>
Tape  Dimensions (mm)<br>B004TF  B035TF<br>Symbol  B010TF  B050TF<br>B020TF<br>B025TF<br>W  8.00±0.30  8.00±0.30<br>—<br>F  3.50±0.05  3.50±0.05<br>I<br>P0 P2 P1 D0 T E1  1.75±0.10  1.75±0.10<br>lees rr ee<br>a<br>D0 1.55±0.05  1.55±0.05<br>D1 0.50±0.10  0.50±0.10<br>OO} 0] P ir —— P0 4.00±0.10  4.00±0.10<br>D1 P1 4.00±0.10  4.00±0.10<br>K0<br>P2 2.00±0.05  2.00±0.05<br>A0<br>A0 1.10±0.10  1.10±0.10<br>re<br>atte a a a<br>B0 1.92±0.10  1.92±0.10<br>re<br>T  0.20±0.10  0.20±0.10<br>rr<br>K0 0.75±0.10  0.95±0.10<br>rr<br>Leader min.  390  390<br>rr<br>Trailer min.  160  160<br>re<br>Reel<br>C  Φ178.0±1.0<br>on ep<br>D  Φ60.2±0.5<br>H  11.0±0.5<br>W  9.0±1.5<br>E<br>F W<br>B0<br>**----- End of picture text -----**<br>


## **Part Number System** 

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**----- Start of picture text -----**<br>
SMD  0603  B TF<br>Lead-Free<br>Holding Current Rating<br>Delimiter<br>Device Dimensions: Length/Width (Unit: 1/100 inch)<br>Surface Mount Device<br>**----- End of picture text -----**<br>


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