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SM1A00NSG
SM1A00NSG, Single MOSFET, N Channel, 100V, TO-263-2
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**==> picture [469 x 350] intentionally omitted <==** **----- Start of picture text -----**<br> SM1A0 0NSG ®<br>VN<br> N-Channel Enhancement Mode MOSFET<br>pO<br>Features Pin Description<br>• 100V/180A [a] , D<br> RDS(ON)= 4m Ω (Max.) @ VGS=10V S<br>• . v/*<br> Reliable and Rugged G<br>• Lead Free and Green Devices Available<br> Top View of TO-263-3<br>(RoHS Compliant)<br>D<br>Applications<br>• Synchronous Rectification. G<br>• Power Management in Inverter Systems.<br>• Motor Driver.<br>• Uninterruptible Power Supply. S<br>**----- End of picture text -----**<br> - Uninterruptible Power Supply. N-Channel MOSFET ## **Ordering and Marking I nform ation** **==> picture [385 x 120] intentionally omitted <==** **----- Start of picture text -----**<br> SM1A00NS Package Code<br> G : TO-263-3<br>Assembly Material Operating Junction Temperature Range<br> C : -55 to 150 [o] C<br>Handling Code<br>Handling Code<br>Temperature Range TR : Tape & Reel (800ea/reel)<br>Assembly Material<br>Package Code<br> G : Halogen and Lead Free Device<br>SM1A00NS G : SM1A00NS XXXXX - Lot Code<br>XXXXX<br>**----- End of picture text -----**<br> Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the leadfree requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). SINOPOWER reserves the right to m ake changes to im prove reliability or m anufacturability without notice, and advise custom ers to obtain the latest version of relevant inform ation to verify before placing orders. _ww w.sinopowersem i.com_ 1 Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 **®** sinopower MA **SM1A0 0NSG** **Absolute Maxim um Ratings** (TA = 25 ° C Unless Otherwise Noted) |**Symbol**<br>~~a~~|**Parameter**<br>|**Parameter**<br>|**Rating**<br>|**Unit**<br>| |---|---|---|---|---| |**Common Ratings**<br><br>~~ae~~<br>~~a~~||||| |VDSS<br>~~es~~<br>~~a~~|Drain-Source Voltage<br>~~es~~<br>||100<br>~~es~~<br>~~ae~~<br>|V<br>~~es~~<br>~~ae~~<br>| |VGSS<br>~~es~~<br>~~a~~|Gate-Source Voltage<br>~~es~~<br>||±25<br>~~es~~<br>~~ae~~<br>|| |TJ<br>~~aee~~|Maximum Junction Temperature<br>~~ee~~||150<br>~~ae~~<br>~~ee~~|°C<br>~~ae~~<br>~~ee~~| |TSTG<br>~~ee~~<br>~~a~~|Storage Temperature Range<br>~~ee~~<br>~~ee~~||-55 to 150<br>~~ee~~<br>~~ee~~|| |IS<br>~~a~~|Diode Continuous Forward Current<br>~~ee~~|TC=25°C<br>~~ee~~|80<br>~~ee~~|A| |ID<br>~~[Ee~~|Continuous Drain Current<br>~~[Ee~~|TC=25°C<br>~~[Ee~~|180<br>a<br>~~[Ee~~|| |||TC=100°C<br>~~[Ee~~<br>~~a~~|115<br>~~[Ee~~<br>~~a~~|| |IDM<br>b<br>~~a~~|Pulsed Drain Current|TC=25°C|400|| |PD<br>~~a~~|Maximum Power Dissipation|TC=25°C<br>~~**a**~~|312<br>~~**a**e~~|W<br>~~e~~| |||TC=100°C<br>~~**a**~~|125<br>~~**a**e~~|| |RθJC<br>~~a~~|Thermal Resistance-Junction to Case<br>~~ee~~|Steady State<br>~~ee~~|0.4<br>~~ee~~|°C/W<br>~~ee~~| |ID<br>~~a~~|Continuous Drain Current<br>~~a~~|TA=25°C<br>~~ee~~|14.5<br>~~ee~~|A<br>~~ee~~| |||TA=70°C<br>~~ee~~<br>~~a~~|11.5<br>~~ee~~<br>~~a~~|| |PD<br>~~[ee~~<br>~~a~~|Maximum Power Dissipation<br>~~[ee~~<br>~~ee~~|TA=25°C<br>~~[ee~~<br>~~ee~~|2<br>~~[ee~~<br>~~eee~~|W<br>~~[ee~~<br>~~eee~~| |||TA=70°C<br>~~[ee~~<br>~~ee~~|1.25<br>~~[ee~~<br>~~eee~~|| |RθJA<br>~~a~~|Thermal Resistance-Junction to Ambient<br>~~ee~~|Steady State<br>~~ee ~~|62.5<br> ~~eee~~|°C/W<br>~~eee~~| |IAS<br>c<br>~~a~~|Avalanche Current, Single pulse<br>~~ee~~|L=0.5mH<br>~~ee~~|57<br>~~ee~~|A<br>~~ee~~| |EAS<br>c<br>~~a~~|Avalanche Energy, Single pulse|L=0.5mH|812|mJ| Note a:Calculated continuous current based on maximum allowable junction temperature. Bonding wire limitation current is 120A. Note b:Pulse width limited by max. junction temperature. Note c:UIS tested and pulse width limited by maximum junction temperature 150[o] C (initial temperature Tj=25[o] C). _ww w.sinopowersem i.com_ 2 Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 **®** sinopower MA **SM1A0 0NSG** ## **Electrical Characteristics** (TA = 25 ° C Unless Otherwise Noted) |~~PR~~|||||||| |---|---|---|---|---|---|---|---| |**Symbol**<br>~~PR~~|**Parameter**|**Test Conditions**||**Min.**|**Typ.**|**Max.**|**Unit**| |**Static Characteristics**<br>~~PR~~<br>~~PR~~|||||||| |BVDSS<br>~~PR~~|Drain-Source Breakdown Voltage<br>|VGS=0V, IDS=250µA<br><br>~~ee~~||100<br><br>~~ee~~|-<br><br>|-<br><br>|V<br>| |IDSS<br>~~PRee~~<br>~~HR~~|Zero Gate Voltage Drain Current<br>~~ee~~|VDS=80V, VGS=0V<br>TJ=85°C<br>~~ee~~<br>~~eepT~~||-<br>~~ee~~<br>~~ee~~|-<br>~~ee~~<br>|1<br>~~ee~~<br>|µA<br>~~ee~~| ||||TJ=85°C<br>~~ee~~<br>~~eepT~~|-<br>~~ee~~<br>~~eepT~~|-<br>~~ee~~<br>~~pT~~|30<br>~~ee~~<br>~~pT~~|| |VGS(th)<br>~~HR~~<br>~~PR~~|Gate Threshold Voltage|VDS=VGS, IDS=250µA<br>~~eepT~~||2<br>~~eepT~~|3<br>~~pT~~|4<br>~~pT~~|V| |IGSS<br>~~HR~~<br>~~PR~~<br>~~PR~~|Gate Leakage Current<br>|VGS=±25V, VDS=0V<br>~~eepT~~<br>||-<br>~~eepT~~<br>|-<br>~~pT~~<br>|±100<br>~~pT~~<br>|nA<br>| |RDS(ON)<br>d <br>~~PR~~<br>~~PR~~|Drain-Source On-state Resistance<br>|VGS=10V, IDS=40A<br>||-<br>|3.3<br>|4.0<br>|mΩ<br>| |**Diode Characteristics**<br>~~PR~~|||||||| |VSD<br>d<br>~~a~~<br>~~a~~|Diode Forward Voltage<br>|ISD=20A, VGS=0V<br><br>~~a~~||-<br><br>~~oe~~|0.8<br><br>~~oe~~|1.3<br><br>~~el~~|V<br><br>~~el~~| |trr<br>~~es~~<br>~~a~~|Reverse Recovery Time<br>~~es~~|ISD=40A, dlSD/dt=100A/µs<br>~~es~~<br>~~a~~<br>~~|~~||-<br>~~es~~<br>~~oe~~<br>~~|~~<br>~~|~~|56<br>~~es~~<br>~~oe~~<br>~~|~~|-<br>~~es~~<br>~~el~~|ns<br>~~es~~<br>~~el~~| |Qrr<br>~~es~~<br>~~a~~|Reverse Recovery Charge<br>~~es~~|||-<br>~~es~~<br>~~oe~~<br>~~|~~<br>~~|~~|136<br>~~es~~<br>~~oe~~<br>~~|~~|-<br>~~es~~<br>~~el~~|nC<br>~~es~~<br>~~el~~| |**Dynamic Characteristics**<br>e<br>~~a~~<br>~~oe el~~<br>~~a~~<br>~~|~~<br>~~|~~<br>~~|~~<br>~~ee~~|||||||| |RG<br>~~a~~<br>~~ee~~|Gate Resistance<br>~~ee~~|VGS=0V,VDS=0V,f=1MHz<br>~~|~~||-<br>~~|~~<br>~~|~~|1<br>~~|~~|-<br>~~|~~|Ω| |Ciss<br>~~ee~~<br>~~ee~~|Input Capacitance<br>~~ee~~|VGS=0V,<br>VDS=30V,<br>Frequency=1.0MHz<br>~~|~~<br>~~|~~<br>~~ee~~||-<br>~~|~~<br>~~|~~<br>~~Ff~~|9550<br>~~|~~<br>~~Ff~~|12400<br>~~|~~<br>~~Ff~~|pF| |Coss<br>~~ee~~<br>~~ee~~<br>~~ee~~|Output Capacitance<br>~~ee~~|||-<br>~~|~~<br>~~|~~<br>~~Ff~~<br>~~|~~|980<br>~~|~~<br>~~Ff~~<br>|-<br>~~|~~<br>~~Ff~~<br>|| |Crss<br>~~ee~~<br>~~ee~~<br>~~es~~<br>~~ee~~|Reverse Transfer Capacitance<br>~~ee~~|||-<br>~~Ff~~<br>~~||~~<br>~~pf~~|595<br>~~Ff~~<br>~~|~~<br>~~pf~~|-<br>~~Ff~~<br>~~|~~<br>~~pf~~|| |td(ON)<br>~~ee~~<br>~~es~~<br>~~ee~~|Turn-on Delay Time<br>~~ee~~|VDD=30V, RL=30Ω,<br>IDS=1A, VGEN=10V,<br>RG=6Ω<br>~~|~~<br>~~ee~~<br>~~|~~||-<br>~~||~~<br>~~pf~~|47<br>~~|~~<br>~~pf~~|85<br>~~|~~<br>~~pf~~|ns| |tr<br>~~es~~<br>~~ee~~<br>~~ee~~|Turn-on Rise Time<br>~~ee~~|||-<br>~~|~~<br>~~pf~~<br>~~Ff~~<br>~~|~~|33<br>~~|~~<br>~~pf~~<br>~~Ff~~<br>|60<br>~~|~~<br>~~pf~~<br>~~Ff~~<br>|| |td(OFF)<br>~~ee~~<br>~~ee~~<br>~~ee~~|Turn-off Delay Time<br>~~ee~~<br>~~ee~~|||-<br>~~pf~~<br>~~Ff~~<br>~~|~~~~**|**~~<br>~~|~~|160<br>~~pf~~<br>~~Ff~~<br>~~**|**~~|290<br>~~pf~~<br>~~Ff~~<br>~~**|**~~|| |tf<br>~~ee~~<br>~~ee~~|Turn-off Fall Time<br>~~ee~~|||-<br>~~Ff~~<br>~~|~~~~**|**~~<br>~~|~~|100<br>~~Ff~~<br>~~**|**~~|180<br>~~Ff~~<br>~~**|**~~|| |**Gate Charge Characteristics**<br>e<br>~~**|**~~<br>~~ee~~<br>~~ee~~<br>~~|~~<br>~~a~~<br>~~ee~~<br>~~Ft~~|||||||| |Qg<br>~~a~~<br>~~ee ee~~|Total Gate Charge<br>~~ee~~<br>~~ee~~|VDS=50V, VGS=10V,<br>IDS=40A<br>~~ee~~<br>~~|~~<br>~~|~~||-<br>~~Ft~~<br>~~|~~|215<br>~~Ft~~<br>|300<br>~~Ft~~<br>|nC| |Qgs<br>~~a~~<br>~~ee ee~~<br>~~a~~|Gate-Source Charge<br>~~ee~~<br>~~ee~~|||-<br>~~Ft~~<br>~~|tT~~<br>~~|~~|61<br>~~Ft~~<br>~~tT~~<br>|-<br>~~Ft~~<br>~~tT~~<br>|| |Qgd<br>~~ee ee~~<br>~~a~~|Gate-Drain Charge<br>~~ee~~|||-<br>~~|~~<br>~~|tt~~|62<br><br>~~tt~~|-<br><br>~~tt~~|| _ww w.sinopowersem i.com_ 3 Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 ## **SM1A0 0NSG** **==> picture [4 x 4] intentionally omitted <==** **----- Start of picture text -----**<br> ®<br>**----- End of picture text -----**<br> ## **Typical Operating Characteristics** **Power Dissipation** **Drain Current** **==> picture [439 x 511] intentionally omitted <==** **----- Start of picture text -----**<br> 350 140<br>300 120<br>250 100<br>200 80<br>150 60<br>100 40<br>50 20<br>TC=25 o C TC=25 o C,VG=10V<br>0 0<br>0 20 40 60 80 100 120 140 160 0 20 40 60 80 100 120 140 160<br>Tj - Junction Temperature (°C) Tj - Junction Temperature<br>Safe Operation Area Thermal Transient Impedance<br>800 2<br>1 Duty = 0.5<br>100 µ s<br>0.2<br>100 0.1<br>0.1<br>0.05<br>1ms 0.02<br>10 0.01<br>0.01<br>10ms<br>1<br>1E-3<br>DC<br>TC=25oC Single Pulse R θ JC :0.4oC/W<br>0.1 A 1E-4<br>0.01 0.1 1 10 100 500 1E-6 1E-5 1E-4 1E-3 0.01 0.1 0.5<br>VDS - Drain - Source Voltage (V) Square Wave Pulse Duration (sec)<br>Rds(on) Limit<br>- Power (W)<br>tot<br>P - Drain Current (A)<br>ID<br>- Drain Current (A)<br>ID<br>Normalized Transient Thermal Resistance<br>**----- End of picture text -----**<br> Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 _ww w.sinopowersem i.com_ 4 ## **SM1A0 0NSG** **==> picture [4 x 4] intentionally omitted <==** **----- Start of picture text -----**<br> ®<br>**----- End of picture text -----**<br> ## **Typical Operating Characteristics ( Cont.)** **Output Characteristics** **Drain-Source On Resistance** **==> picture [439 x 513] intentionally omitted <==** **----- Start of picture text -----**<br> 240 4.2<br>VGS=6,7,8,9,10V<br>5.5V<br>200 3.9<br>160 3.6<br>V =10V<br>GS<br>120 3.3<br>80 5V 3.0<br>40 2.7<br>4.5V<br>0 2.4<br>0 1 2 3 4 5 0 40 80 120 160 200<br>VDS - Drain - Source Voltage (V) ID - Drain Current (A)<br>Gate-Source On Resistance Gate Threshold Voltage<br>18 1.6<br>IDS=40A [a] I DS =250 µ A<br>1.4<br>15<br>1.2<br>12<br>1.0<br>9<br>0.8<br>6<br>0.6<br>3<br>0.4<br>0 0.2 _<br>3 4 5 6 7 8 9 10 -50 -25 0 25 50 75 100 125 150<br>VGS - Gate - Source Voltage (V) Tj - Junction Temperature (°C)<br>)<br>Ω<br> - Drain Current (A) - On - Resistance (m<br>ID<br>DS(ON)<br>R<br>)<br>Ω<br>- On - Resistance (m<br>DS(ON)<br>R Normalized Threshold Voltage<br>**----- End of picture text -----**<br> Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 _ww w.sinopowersem i.com_ 5 **SM1A0 0NSG** **==> picture [4 x 4] intentionally omitted <==** **----- Start of picture text -----**<br> ®<br>**----- End of picture text -----**<br> ## **Typical Operating Characteristics ( Cont.)** ## **Source-Drain Diode Forward** **==> picture [439 x 530] intentionally omitted <==** **----- Start of picture text -----**<br> Drain-Source On Resistance Source-Drain Diode Forward<br>3.0 200<br>V = 10V<br>GS<br>100<br> I = 40A<br>DS<br>2.5<br>2.0 o<br>T =150 C<br>10 j<br>1.5 T =25oC<br>j<br>1.0<br>1<br>0.5<br>RON@Tj=25oC: 3.3m Ω<br>0.0 a 0.1<br>-50 -25 0 25 50 75 100 125 150 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br> Tj - Junction Temperature (°C) VSD - Source - Drain Voltage (V)<br>Capacitance Gate Charge<br>16000 10<br>Frequency=1MHz 9 V DS = 50V<br>14000 I DS = 40A<br>8<br>12000<br>7<br>10000 Ciss 6<br>8000 5<br>4<br>6000<br>3<br>4000<br>2<br>2000 Coss<br>1<br>Crss<br>0 0<br>0 8 16 24 32 40 0 40 80 120 160 200 240<br>VDS - Drain-Source Voltage (V) QG - Gate Charge (nC)<br> - Source Current (A)<br>IS<br>Normalized On Resistance<br>C - Capacitance (pF)<br> - Gate-source Voltage (V)<br>GS<br>V<br>**----- End of picture text -----**<br> Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 _ww w.sinopowersem i.com_ 6 **®** sinopower MA **SM1A0 0NSG** ## **Avalanche Test Circuit and W aveform s** **==> picture [167 x 104] intentionally omitted <==** **----- Start of picture text -----**<br> VDS<br>L<br>DUT<br>RG<br>VDD<br>tp IL<br>0.01 Ω<br>**----- End of picture text -----**<br> **==> picture [160 x 118] intentionally omitted <==** **----- Start of picture text -----**<br> VDSX(SUS)<br>tp<br>VDS<br>IAS<br>VDD<br>EAS<br>tAV<br>**----- End of picture text -----**<br> ## **Sw it ching Tim e Test Circuit and W aveform s** **==> picture [166 x 95] intentionally omitted <==** **----- Start of picture text -----**<br> VDS<br>RD<br>DUT<br>VGS<br>RG<br>VDD<br>ef<br>tp<br>**----- End of picture text -----**<br> **==> picture [146 x 92] intentionally omitted <==** **----- Start of picture text -----**<br> VDS<br>90%<br>10%<br>VGS<br>td(on) tr td(off) tf<br>**----- End of picture text -----**<br> _ww w.sinopowersem i.com_ Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 7 **®** sinopower WN **SM1A0 0NSG** ## **Package I nform at ion** ## **TO-263-3** **==> picture [431 x 511] intentionally omitted <==** **----- Start of picture text -----**<br> A<br>E E1<br>c2<br>b<br>ml b2 e c :<br>SEE VIEW A<br>GAUGE PLANE SEATING PLANE<br>L<br>aH eR<br>VIEW A<br>SYM TO-263-3 RECOMMENDED LAND PATTERN<br>MILLIMETERS INCHES<br>B<br>OL MIN. MAX. MIN. MAX. 8.5 MIN.<br>A 4.06 4.83 0.160 0.190<br>———<br>A1 0.00 0.25 0.000 0.010<br>b 0.51 0.99 0.020 0.039<br>b2 1.14 1.78 0.045 0.070<br>9.0 MIN.<br>c 0.38 0.74 0.015 0.029<br>Se 7<br>c2 1.14 1.65 0.045 0.065<br>——— D 8.38 9.65 0.330 0.380 ee<br>10.5<br>D1 6.00 9.00 0.236 0.354 1.6 MIN.<br>E 9.65 11.43 0.380 0.450<br>E1 6.22 9.00 0.245 0.354<br>4.0 MIN.<br>e 2.54 BSC 0.100 BSC<br>H 14.61 15.88 0.575 0.625<br>L 1.78 2.79 0.070 0.110<br>L1 - 1.68 - 0.066 5.08<br>ca L2 - 1.78 - 0.070 al<br>θ 0o 8 o 0 o 8o<br>UNIT: mm<br>Note : Follow JEDEC TO-263 AB.<br>L1<br>D1<br>D<br>H<br>L2<br>A1<br>25<br>0.<br>0<br>**----- End of picture text -----**<br> Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 _ww w.sinopowersem i.com_ 8 > **SM1A0 0NSG** K **®** ## **Carrier Tape & Reel Dim ensions** **==> picture [315 x 330] intentionally omitted <==** **----- Start of picture text -----**<br> OD0 P0 P2 P1 A<br>©<br>“|<br>a<br>K0 B A0 OD1 B A<br>SECTION A-A<br>SECTION B-B<br>d<br>I VY<br>T1<br>E1<br>F<br>W<br>B0<br>T<br>H A<br>**----- End of picture text -----**<br> |**Application**|**A**|**H**|**T1**<br>**C**|**d**|**D**|**W**|**E1**|**F**| |---|---|---|---|---|---|---|---|---| |**TO-263-3**|330.0±2.00|2.00<br>50 MIN.|24.4+2.00<br>-0.00<br>13.0+0.50<br>-0.20|13.0+0.50<br>-0.20 1.5 MIN.|20.2 MIN.|20.2 MIN. 24.0±0.30|1.75±0.10|11.5±0.10| ||**P0**|**P1**|**P2**<br>**D0**|**D0**<br>**D1**|**T**|**A0**|**B0**|**K0**| ||4.0±0.10|16.0±0.10|2.0±0.10<br>1.5+0.10<br>-0.00|1.5+0.10<br>-0.00<br>1.5 MIN.|0.6+0.00<br>-0.40|0.6+0.00<br>-0.40<br>10.8±0.20|16.1±0.20|5.2±0.20| (mm) _ww w.sinopowersem i.com_ 9 Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 sinopower **®** YX **SM1A0 0NSG** ## **Taping Direction I nform at ion** **TO-263-3** USER DIRECTION OF FEED ## **Classificat ion Profile** Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 **==> picture [11 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> 10<br>**----- End of picture text -----**<br> _ww w.sinopowersem i.com_ **®** sinopower MA **SM1A0 0NSG** ## **Disclaim er** Sinopower Semiconductor, Inc. (hereinafter “Sinopower”) has been making great efforts to development high quality and better performance products to satisfy all customers’ needs. However, a product may fail to meet customer’s expectation or malfunction for various situations. All information which is shown in the datasheet is based on Sinopower’s research and development result, therefore, Sinopower shall reserve the right to adjust the content and monitor the production. In order to unify the quality and performance, Sinopower has been following JEDEC while defines assembly rule. Notwithstanding all the suppliers basically follow the rule for each product, different processes may cause slightly different results. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. Sinopower does not grant customers explicitly or implicitly, any license to use or exercise intellectual property or other rights held by Sinopower and other parties. Sinopower shall bear no responsible whatsoever for any dispute arising from the use of such technical information. The products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability, such as the failure or malfunction of which any may result in a direct threat to human life or a risk of human injury. Sinopower shall bear no responsibility in any way for use of any of the products for the above special purposes. If a product is intended to use for any such special purpose, such as vehicle, military, or medical controller relevant applications, please contact Sinopower sales representative before purchasing. _ww w.sinopowersem i.com_ 11 Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014 **SM1A0 0NSG** **®** ## **Classification Reflow Profiles** |**Profile Feature**|**Sn-Pb Eutectic Assembly**|**Pb-Free Assembly**| |---|---|---| |**Preheat & Soak**<br>Temperature min (Tsmin)<br>Temperature max (Tsmax)<br>Time (Tsminto Tsmax) (ts)|100°C<br>150°C<br>60-120 seconds|150°C<br>200°C<br>60-120 seconds| |Average ramp-up rate<br>(Tsmaxto TP)|3°C/second max.|3°C/second max.| |Liquidous temperature (TL)<br>Time at liquidous (tL)|183°C<br>60-150 seconds|217°C<br>60-150 seconds| |Peak package body Temperature<br>(Tp)*|See Classification Temp in table 1|See Classification Temp in table 2| |p<br>Time (tP)** within 5°C of the specified<br>classification temperature (Tc)|20** seconds|30** seconds| |Average ramp-down rate (Tpto Tsmax)|6°C/second max.|6°C/second max.| |Time 25°C to peak temperature|6 minutes max.|8 minutes max.| |* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum.<br>**Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.||| Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) **Package Volume mm[3 ] Volume mm[3 ] Thickness <350** ≥ **350** <2.5 mm 235 ° C 220 ° C ≥ 2.5 mm 220 ° C 220 ° C ~~SS~~ Table 2. Pb-free Process – Classification Temperatures (Tc) **Package Volume mm[3] Volume mm[3] Volume mm[3] Thickness <350 350-2000 >2000** <1.6 mm 260 ° C 260 ° C 260 ° C 1.6 mm – 2.5 mm 260 ° C 250 ° C 245 ° C ≥ 2.5 mm 250 ° C 245 ° C 245 ° C ~~———————~~ **Reliabilit y Test Prog ram Test item Method Description** SOLDERABILITY JESD-22, B102 5 Sec, 245 ° C HTRB JESD-22, A108 1000 Hrs, 80% of VDS max @ Tjmax HTGB JESD-22, A108 1000 Hrs, 100% of VGS max @ Tjmax PCT JESD-22, A102 168 Hrs, 100 % RH, 2atm, 121 ° C ~~————~~ TCT JESD-22, A104 500 Cycles, -65 ° C~150 ° C **Custom er Service** ## **Sinopower Semiconductor, Inc.** 5F, No. 6, Dusing 1St Rd., Hsinchu Science Park, Hsinchu, 30078, Taiwan TEL: 886-3-5635818 Fax: 886-3-5642050 _ww w.sinopowersem i.com_ 12 Copyright Sinopow er Sem iconductor, Inc. Rev. A.1 - Novem ber, 2014
Updated at February 12, 2024
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