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SFUI016GJ1AB1TO-I-QT-211-STD
Flash Memory Card, 16 GB
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: SWISSBIT
- Product type: Flash Memory Cards
- Memory Capacity: 16GB
| Delivery and price | |
|---|---|
| Units per pack | 1 |
| Price | 105.24 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
Product Data Sheet **Industrial USB Flash Drive Module U-400 Series USB2.0 high speed, SLC**
## **U-400 Series (USB2.0, high speed, SLC) Industrial USB Flash Drive Module (** e **USB) – 1 to 16GByte**
## **Main Features**
- USB2.0 solid state flash drive for internal 9(10)-pin USB connector terminal
- Fully compliant with USB specification 2.0/3.0 (High-Speed, 480Mb/s burst)
- Fully backward compliant with USB 1.1 systems (Full speed, 12Mb/s burst)
- Dimension of 26.65 x 36.8mm
- 2.54mm or 2.00mm connector with keyed pin9 (optional different key pins and pinouts)
- Screw hole not connected (optional grounded)
- Fix drive (optional removable)
- LED for operation indication
- Write protect switch (optional)
- FAT32 preformatted
- Diagnostic features with Life Time Monitoring tool support
- Firmware update in field possible
- High performance 2.0 specification
- Up to 40 IOPS write and 1700 IOPS read (4KByte transfers)
- Up to 34MBytes/s sequential write and 36MBytes/s read speed
- Power Supply: (Low-power CMOS technology)
- 3.1 to 5.5V operating voltage
- Optimized FW algorithms especially for high read access and long data retention applications `o` Patented power-off reliability technology
- Near Miss ECC technology
Minimize the risk of uncorrectable bit failure over the product life time. Each read command analyzes the ECC margin level and refresh data if necessary.
- Read Disturb Management
- The read commands are monitored and the content is refreshed when critical levels have occurred.
- `o` Wear Leveling technology
Equal wear leveling of static and dynamic data. The wear leveling assures that dynamic data as well as static data is balanced evenly across the memory. With that the maximum write endurance of the device is guaranteed.
- Data Care Management
The interruptible background process maintain the user data for Read Disturb effects or Retention degradation due to high temperature effects.
- UBER <10[-17]
- High reliability
- SLC NAND Flash with highest program erase cycles per block
- Designed with sophisticated firmware architecture for industrial and netcom market especially 24/7 application like networking, base stations, infrastrucuture systems, POS/POI, medical and general boot medium use case.
- The product is optimized for highest reliability and power fail safety.
- Commercial and Industrial Temperature range, 0° up to 70°C and -40° up to 85°C
- Controlled BOM & PCN process
- RoHS, China-RoHS, REACH compatible, WEEE, CE, FCC compliant
- Customized options like registers, removable device, connector options, write protect switch, grounded mounting hole, conformal coating, densities, uploads, label, security controller, …
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## **1 Table of Content**
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|||||
|---|---|---|---|
|MAIN FEATURES|............................................................................................................................................................. 2|
|1 TABLE OF CONTENT|...................................................................................................................................................... 3|
|2 ORDER INFORMATION|................................................................................................................................................. 4|
|2.1|STANDARD PRODUCTS WITH 2.54MM (J) CONNECTOR ..................................................................................................... 4|
|2.2|LOW PROFILE PRODUCTS WITH 2.00MM (K) CONNECTOR ................................................................................................ 4|
|2.3|OFFERED OPTIONS FOR CUSTOM PRODUCTS ................................................................................................................... 4|
|3 NAND FLASH TECHNOLOGIES|....................................................................................................................................... 4|
|4 CAPACITY SPECIFICATION|............................................................................................................................................. 5|
|5 SYSTEM PERFORMANCE|............................................................................................................................................... 5|
|6 INTERFACE / PIN OUT|.................................................................................................................................................. 5|
|7 ELECTRICAL SPECIFICATION|.......................................................................................................................................... 6|
|8 ENVIRONMENTAL SPECIFICATION AND RELIABILITY|.................................................................................................... 7|
|8.1|RECOMMENDED OPERATING CONDITIONS ..................................................................................................................... 7|
|8.2|RELIABILITY .......................................................................................................................................................... 7|
|8.3|ENVIRONMENTAL -|SHOCK,|VIBRATION, AND HUMIDITY ................................................................................................ 7|
|9 COMPATIBILITY & COMPLIANCE|.................................................................................................................................. 7|
|10 APPLICATIONS|............................................................................................................................................................ 8|
|11 STANDARD FORM FACTORS AND HARDWARE|............................................................................................................. 8|
|12 BEST PRACTICES|....................................................................................................................................................... 11|
|12.1|DEVICE REMOVAL|&|POWER FAILURE ...................................................................................................................... 11|
|12.2|LIFETIME END HANDLING ...................................................................................................................................... 11|
|13 PART NUMBER DECODER|......................................................................................................................................... 12|
|14 LABEL|....................................................................................................................................................................... 13|
|15 REVISION HISTORY|................................................................................................................................................... 14|
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## **2 Order Information**
|Density|Part Number|Connector|Temp. Range|Flash Technology|
|---|---|---|---|---|
|1GB|SFUI1024cgAB1TO-t-MS-2xx-STD|c = J 2.54mm pitch<br>c = K 2.00mm pitch|t = C -0°C to 70°C<br>t = I -40°C to 85°C|SLC NAND Flash|
|2GB|SFUI2048cgAB2TO-t-MS-2xx-STD||||
|4GB|SFUI4096cgAB1TO-t-MS-2xx-STD||||
|8GB|SFUI8192cgAB2TO-t-MS-2xx-STD||||
|16GB|SFUI016GcgAB1TO-t-QT-2xx-STD||||
g = generation; x = options, firmware and custom configuration
_**2.1 Standard products with 2.54mm (J) connector**_
Density Part Number 1GB `SFUI1024J1AB1TO-t-MS-211-STD` 2GB `SFUI2048J1AB2TO-t-MS-211-STD` 4GB `SFUI4096J1AB1TO-t-MS-211-STD` 8GB `SFUI8192J1AB2TO-t-MS-211-STD` ~~———~~ 16GB `SFUI016GJ1AB1TO-t-QT-211-STD` _**2.2 Low profile products with 2.00mm (K) connector**_ Density Part Number 1GB `SFUI1024K1AB1TO-t-MS-211-STD` 2GB `SFUI2048K1AB2TO-t-MS-211-STD` 4GB `SFUI4096K1AB1TO-t-MS-211-STD` 8GB `SFUI8192K1AB2TO-t-MS-211-STD` ~~——_~~ 16GB `SFUI016GK1AB1TO-t-QT-211-STD`
t = temperature grade (C=0°C to 70°C and I=-40°C to +85°C)
## _**2.3 Offered options for custom products**_
- Removable or fixed drive (standard fix)
- Customer specified strings and IDs
- FAT16, FAT32 format or customer file system, default FAT32
- Preload service
- Temperature range
Please ask our sales for more details and additional features.
## **3 NAND Flash technologies**
## SLC, pSLC and MLC flash
`o` Single-level-cell (SLC) flash, 1 bit (1 level) is stored in each memory cell `o` Pseudo Single-level-cell (pSLC) 1 bit (1 level) is stored in an MLC memory cell by special sequences `o` Multi-level-cell (MLC) flash, 2 bit (3 level) are stored in each memory cell
## Differences
|Series<br>U-400<br>U-46<br>U-45<br>SLC<br>pSLC<br>MLC<br>comment<br>Endurance<br>up to 100,000<br>up to 20,000<br>up to 3,000<br>Physical write/erase cycles<br>Write Performance<br>Superior<br>Superior<br>High<br>pSLC and SLC have improved write<br>performance due to single bit write<br>Read Performance<br>Increased<br>Increased<br>High<br>pSLC and SLC have improved read<br>performance due to single bit read<br>Reliability<br>highest<br>high<br>normal<br>Degradation of information has higher<br>impact with 4 reference levels<br>Cost<br>high<br>medium<br>low<br>MLC can store twice the bits per square<br>mm silicon<br>~~soe~~|Series<br>U-400<br>U-46<br>U-45<br>SLC<br>pSLC<br>MLC<br>comment<br>Endurance<br>up to 100,000<br>up to 20,000<br>up to 3,000<br>Physical write/erase cycles<br>Write Performance<br>Superior<br>Superior<br>High<br>pSLC and SLC have improved write<br>performance due to single bit write<br>Read Performance<br>Increased<br>Increased<br>High<br>pSLC and SLC have improved read<br>performance due to single bit read<br>Reliability<br>highest<br>high<br>normal<br>Degradation of information has higher<br>impact with 4 reference levels<br>Cost<br>high<br>medium<br>low<br>MLC can store twice the bits per square<br>mm silicon<br>~~soe~~|Series<br>U-400<br>U-46<br>U-45<br>SLC<br>pSLC<br>MLC<br>comment<br>Endurance<br>up to 100,000<br>up to 20,000<br>up to 3,000<br>Physical write/erase cycles<br>Write Performance<br>Superior<br>Superior<br>High<br>pSLC and SLC have improved write<br>performance due to single bit write<br>Read Performance<br>Increased<br>Increased<br>High<br>pSLC and SLC have improved read<br>performance due to single bit read<br>Reliability<br>highest<br>high<br>normal<br>Degradation of information has higher<br>impact with 4 reference levels<br>Cost<br>high<br>medium<br>low<br>MLC can store twice the bits per square<br>mm silicon<br>~~soe~~|Series<br>U-400<br>U-46<br>U-45<br>SLC<br>pSLC<br>MLC<br>comment<br>Endurance<br>up to 100,000<br>up to 20,000<br>up to 3,000<br>Physical write/erase cycles<br>Write Performance<br>Superior<br>Superior<br>High<br>pSLC and SLC have improved write<br>performance due to single bit write<br>Read Performance<br>Increased<br>Increased<br>High<br>pSLC and SLC have improved read<br>performance due to single bit read<br>Reliability<br>highest<br>high<br>normal<br>Degradation of information has higher<br>impact with 4 reference levels<br>Cost<br>high<br>medium<br>low<br>MLC can store twice the bits per square<br>mm silicon<br>~~soe~~|
|---|---|---|---|
|Swissbit AG|||Revision: 1.02|
|Industriestrasse 4||||
|CH-9552 Bronschhofen||www.swissbit.com|U-400_data_sheet_Rev102.docx|
|Switzerland||industrial@swissbit.com|Page4 of 14|
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U-400_data_sheet_Rev102.docx Page 4 of 14
## **4 Capacity specification**
|Capacity|Sectors|Total addressable capacity (Byte)|
|---|---|---|
|1GB|1,960,704|1,003,880,448|
|2GB|3,921,664|2,007,891,968|
|4GB|7,843,328|4,015,783,936|
|8GB|15,663,104|8,019,509,248|
|16GB|31,719,424|16,240,345,088|
|32GB|62,533,296|32,017,047,552|
**5 System performance**
High Speed mode Full Speed mode unit Speed (sequential, typ) (sequential, typ) Burst 480 12 Mbit/s Read 28[(1)] 1.0 MByte/s ~~Se~~ Write 19/27[(1)] 0.9 1) Effective speed varies with controller, number and type of flash, host, file size, file system and operating system System Performance High Speed mode typ max Unit Burst Data transfer Rate (480Mbit/s) 60 1…2GB 28[(1)(2)] 34[(1)] Sustained Sequential Read 4GB 28[(1)(2)] 36[(1)] 8…16GB 25[(1)(2)] 32[(1)] MB/s 1…2GB 28[(1)(2)] 34[(1)] Sustained Sequential Write 4GB 26[(1)(2)] 31[(1)] 8…16GB 23[(1)(2)] 28[(1)] 1…2GB 1200[(1)(2)] 1400[(1)] Random Read 4k 4GB 1500[(1)(2)] 1700[(1)] 8…16GB 1500[(1)(2)] 1700[(1)] IOPS 1…2GB 33[(1)(2)] 40[(1)] Random Write 4k 4GB 16[(1)(2)] 22[(1)] ~~=o————~~ 8…16GB 18[(1)(2)] 25[(1)] 1) Effective speed varies with controller, number and type of flash, host, file size, file system and operating system ~~ee~~ 2) performance measured with Crystal Disk Mark performance test **6 Interface / Pin out**
- USB-connector 10pin (2mm or 2.54mm pitch)
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USB 2.0 high speed interface, USB1.1 full speed compatible<br> STD variation<br>Pin Signal Standard type Optional on request<br>1 V_Bus Operating voltage<br>2 NC Not Connected V_Bus<br>3 D- Data signal pair<br>4 NC Not Connected<br>5 D+ Data signal pair<br>6 NC Not Connected<br>7 GND Ground<br>8 NC Not Connected GND<br>9 NC Keyed at connector not keyed NC or V_Bus<br>=== 10 Shield Ground (shield) NC, LED out, Reset in<br>See also chapter (Standard form factors and hardware)<br>Swissbit AG<br>Industriestrasse 4<br>CH-9552 Bronschhofen www.swissbit.com<br>Switzerland<br>**----- End of picture text -----**<br>
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## **7 Electrical Specification**
## Absolute Maximum Ratings
|**7 Electrical Specification**<br>Absolute Maximum Ratingsbsolute Maximum Ratings|**Electrical Specification**||||
|---|---|---|---|---|
|Parameter|Symbol|Min|Max|Unit|
|Power Supply Voltage|V_Bus|-0.5|6.0|V|
|Voltage on D+and D-|V_Data|-0.5|3.6||
|Commercial Operating Temperature|T_A|0|70|°C|
|Industrial Operating Temperature||-40|85||
|DC characteristics for High-Speed operation (T=25°C, V_Bus=5V or 3.3V)<br>Parameter<br>Symbol<br>Test condition<br>Min<br>Typ<br>Max<br>Unit<br>Supply Voltage (Standard)<br>V_Bus<br>3.1(1)<br>3.3 or<br>5.00<br>5.25<br>V<br>~~eG~~<br>~~GC~~<br>~~A~~|
|---|
|Write current<br>I_WR<br>V_Bus=5.0V<br>100<br>120<br>mA<br>Read current<br>I_RD<br>70<br>100<br>Idle current<br>I_IDL<br>45<br>60<br>Suspend current<br>I_CCS<br>0.8<br>2.5<br>High Speed Idle Level<br>V_HSOI<br>V_Bus=5.0V<br>-10<br>10<br>~~ee~~<br>~~————~~|
|High Speed Data Signaling<br>LOW<br>V_HSOL<br>V_Bus=5.0V<br>-10<br>10<br>~~a~~|
|mV<br>High Speed Data Signaling<br>HIGH<br>V_HSOH<br>V_Bus=5.0V<br>360<br>440<br>Chirp J Level (differential)<br>V_CHIRPJ<br>V_Bus=5.0V<br>360<br>440<br>Chirp K Level (differential)<br>V_CHIRPK<br>V_Bus=5.0V<br>-440<br>-360<br>1)<br>The U-400 devices can be supplied with 5V or with 3.3V.<br>~~a~~<br>~~_——~~|
|DC characteristics for Full-Speed operation (T=25°C, V_Bus=5V or 3.3V)|
|Parameter<br>Symbol<br>Test condition<br>Min<br>Typ<br>Max<br>Unit<br>~~GC~~|
|Supply Voltage (5V Type)<br>V_Bus<br>3.1(1)<br>3.3 or<br>5.00<br>5.25<br>V<br>Write current<br>I_WR<br>V_Bus=5.0V<br>80<br>100<br>mA<br>Read current<br>I_RD<br>60<br>80<br>Idle current<br>I_IDL<br>45<br>60<br>Suspend current<br>I_CCS<br>0.8<br>2.5<br>Input LOW Voltage<br>V_IL<br>0.8<br>V<br>Input HIGH Voltage<br>V_IH<br>2<br>Output LOW Voltage<br>V_OL<br>RLof 1.5kΩ to 3.6V<br>0.3<br>Output HIGH Voltage<br>V_OH<br>RLof 15kΩ to GND<br>2.8<br>3.6<br>Output Signal Crossover<br>Voltage<br>V_CRS<br>1.3<br>2.0<br>~~a~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee eee~~<br>~~——re~~<br>~~A~~|
|1)<br>The U-400 devices can be supplied with 5V or with 3.3V.|
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## **8 Environmental Specification and Reliability**
## _**8.1 Recommended operating conditions**_
|Parameter|Symbol|Min|Typ|Max|Unit|
|---|---|---|---|---|---|
|Commercial Operating Temperature|T_A|0|25|70|°C|
|Industrial Operating Temperature||-40||85||
|Storage Temperature|T_S|-40||100(1)||
- 1) Data loss (Retention) is accelerated by high temperature (5 days@100°C is equivalent to 10 years@40°C, i.e. retention acceleration factor is 700)
## _**8.2 Reliability**_
|**_8.2 Reliability_**||
|---|---|
|Parameter|Value|
|Endurance (SLC NAND Flash)|Up to 100,000 erases per flash block (JESD 218)|
|Data reliability (UBER)|<10-17 bitsread|
|Error correction code (ECC)|correct up to 40-bit errors per 1kB|
|MTBF / MTTF|>3,000,000 hours|
|Data retention@40°C (JESD 218)|10 years @ 10% life time / 1 years @ life end|
|Durability|>1,500 insertions / removals|
## _**8.3 Environmental - Shock, Vibration, and Humidity**_
|Parameter|Value|
|---|---|
|Shock|1,500G Peak, 0.5m pulse duration, 6 axes<br>(JESD22-B110 / B104)|
|Vibration|50G Peak, 20-2,000Hz, 0.75mm, 4 cycles per direction (X, Y and Z)<br>(MIL-STD-883H M2007.3)|
|Humidity|85°C, 85% RH, Vmax<br>(JESD22-A101)|
|Free fall / Drop test|1.5m<br>(IEC 60068-2-32)|
|Temperature Cycles|-40°C/+125°C 1000 cycles<br>(JESD22-A104)|
|Hazardous gases|SO2/H2S 10 days<br>(IEC 60068-42/43)|
## **9 Compatibility & Compliance**
- Configurable as boot-drive
- Standard fix Configuration (mounted as local drive, not as removable drive)
- Operating Systems:
- Windows CE
- Windows Server 2003 and 2008
- Windows 10, 8, 7, Vista, XP, 2000, ME
- Mac 9.0 and newer
- Mac 8.6 (with driver) and newer
- Linux 2.4 and newer
- All USB mass-storage host systems (guarantee on all USB-IF certified systems)
- CE – EN 55022/55024
- FCC class B for information technology
- USB-IF high speed certified
- RoHS
- UL60950 compliant PCB
- WEEE
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## **10 Applications**
- Gaming
- Industrial PCs
- Point-Of-Sale (POS)
- Industrial Automation
- Networking Equipment
- Medical Equipment
- Data Recorders
## **11 Standard form factors and hardware**
- Standard form factor of PCBs 36.8mm x 26.65mm
- Hole for mechanical fixture (optional grounded)
- Shield (connector Pin 10) grounded (optional NC)
- 2 additional holes
- LED for operation indication (optional no LED)
- 2 connector types
- 2.54mm pitch, 7.5mm long standard
- 2.00mm pitch, 3.6mm long low profile
- Component heights max. 1.6mm on connector side max. 1.2mm on flash side
Figure 1: Mechanical Dimensions for 2.54mm connector (standard)
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Figure 2: Mechanical Dimensions for 2.00mm connector (low profile)
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D38.0mm Ring<br>Connector tolerance<br>0.25mm<br>**----- End of picture text -----**<br>
## Variations
|Variations||||||
|---|---|---|---|---|---|
|Part number|Connector|Pin 9|Pin 10|Hole|LED|
|SFUIxxxxJgABxxx-t-xx-xfx-STD|2.54 mm|Key pin|Shield<br>(NC on<br>request)|NC<br>(grounded<br>on request)|For operational<br>indication<br>(no LED on request)|
|SFUIxxxxKgAB2xx-t-xx-xfx-STD|2.00 mm|Key pin||||
g = hardware generation
t = temperature grade (C=0°C to 70°C and I=-40°C to +85°C)
f = firmware generation per product type
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Figure 3: Component region on connector side (general tolerance ±0.5mm)
Figure 4: Component region on flash side (symmetric to center line, general tolerance ±0.5mm)
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## **12 Best Practices**
There are a number of best practices to reach the maximum life time.
## _**12.1 Device Removal**_ **&** _**Power Failure**_
User data can be lost or corrupted if power is interrupted while the UFD is writing data. To avoid data loss, it is necessary to avoid power interruption while the device is busy. This can be made sure by always using the host (e.g. Windows) shutdown mechanisms or by detaching the device in the operating system before unplugging it. Swissbit also offers an Application Note “Design-In Guide” that describes techniques to reduce data loss on power failure, if power failure absolutely can’t be avoided.
## _**12.2 Lifetime end handling**_
If the flash reaches its end of life, the number of bad blocks will increase (bad flash blocks will be replaced with spare blocks). There exist different side effects with negative data influence by degraded flash cells. Sometimes bit errors can occur because of effects that are not immediately detected by the flash, e.g. effects like program disturb or read disturb, which means that the bad block recognition does not always prevent data loss. When the number of bit errors in a sector exceeds the ECC correcting capabilities, invalid (uncorrected) data cannot be read from the host. Because of these effects it is strongly recommended to replace devices that are nearing their end of life. One good indicator would be the current spare blocks should not be reducing below 5. It is in the responsibility of the system integrator to account for the flash usage. Swissbit offers support for calculating expected life time if the exact use case is provided (e.g. by providing low level [USB interface] write statistics).
For notes on reducing flash stress, Swissbit offers an Application Note called “Design-In Guide”.
Please contact your sales channel for more information or send a mail to sales@swissbit.com.
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## **13 Part Number Decoder**
S F UI 016G J 1 A B 1 TO - I - Q T - 211 - STD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Manuf. Option Memory Type. Configuration Product Type Manuf. Code: Flash Mode Density Manuf. Code: Flash Package Platform Temp. Option Product Generation Flash vendor Code Memory Organization Number of flash chips/channels ~~mn"~~ Technology 1. Manufacturer
2. Memory Type
3. Product Type
4. Density
5. Platform
6. Product Generation
7. Memory Organization
8. Technology
9. Number of Flash chips
10. Flash Code
11. Temp. Option
12. DIE Classification
13. PIN Mode
||Flash|F|
|---|---|---|
|U-xxx USB Flash Drive Module (Internal)<br>UI<br>1 GB<br>1024<br>2 GB<br>2048<br>4 GB<br>4096<br>8 GB<br>8192<br>16 GB<br>016G<br>U-xxx–2.54mm plug<br>J<br>U-xxx–2.00mm plug<br>K<br>~~_~~|||
||x8|A|
||||
||U-4xx technology|B|
||||
||1 Flash|1|
||2 Flash|2|
||||
||Toshiba|TO|
||||
||Industrial Temp. Range-40°C to 85°C|I|
||Standard Temp. Range 0°C to 70°C|C|
||||
||SLC MONO<br>(single die package)|M|
||SLC DDP<br>(dual die package)|D|
||SLC QDP<br>(quad die package)|Q|
||||
||Normal nCE & R/nB|S|
||Dual nCE & Dual R/nB|T|
Swissbit S
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|14. UFD XYZ||||||
|---|---|---|---|---|---|
||XSetting<br>Removable Drive<br>Fix Drive<br>~~[_~~|||1<br>2||
||YFirmware revision per product generation<br>Block Based Revision 1, 2, 3, …<br>1,2,3…<br>durabitRevision 1, 2, 3, …<br>A,B,C…<br>~~[-_+~~<br>~~—_~~|||||
||ZOptional setting|||||
|||default<br>1<br>pSLC(pseudoSLC)<br>P<br>~~ee~~||||
|15. Option|Swissbit / Standard 5V supply<br>Customized version<br>~~[_~~|||STD<br>XXX||
## **14 Label**
**SFUIxxxxxxABxTO -x-xx-xxx-xxx 60xxxxxx 6xxxxx** ce |[Swissbit] FCa SFUIxxxxxxABxxx Part Number -x-xx-xxx-xxx 60xxxxxx Lot Code 6xxxxx Type No.
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U-400_data_sheet_Rev102.docx Page 13 of 14
industrial@swissbit.com
## **15 Revision History**
## Document Revision History
|Document Revision History|Document Revision History|||
|---|---|---|---|
|Date|Revision Descri|Revision Description|Revision Detail|
|05-October-2015|1.00|Initial release|Doc. req. no. 0792|
|15-February-2016|1.01|2.00mm connector position tolerance added|Doc. req. no. 0963|
|27-February-2017|1.02|Added capacity specification and NAND flash technologies<br>Update performance values, interface illustration, wording<br>adjustment and removed RoHS, ACPEIP and WEEE decl.|Doc. req. no. 1568|
## Disclaimer:
No part of this document may be copied or reproduced in any form or by any means, or transferred to any third party, without the prior written consent of an authorized representative of Swissbit AG (“SWISSBIT”). The information in this document is subject to change without notice. SWISSBIT assumes no responsibility for any errors or omissions that may appear in this document, and disclaims responsibility for any consequences resulting from the use of the information set forth herein. SWISSBIT makes no commitments to update or to keep current information contained in this document. The products listed in this document are not suitable for use in applications such as, but not limited to, aircraft control systems, aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. Moreover, SWISSBIT does not recommend or approve the use of any of its products in life support devices or systems or in any application where failure could result in injury or death. If a customer wishes to use SWISSBIT products in applications not intended by SWISSBIT, said customer must contact an authorized SWISSBIT representative to determine SWISSBIT willingness to support a given application. The information set forth in this document does not convey any license under the copyrights, patent rights, trademarks or other intellectual property rights claimed and owned by SWISSBIT. The information set forth in this document is considered to be “Proprietary” and “Confidential” property owned by SWISSBIT.
ALL PRODUCTS SOLD BY SWISSBIT ARE COVERED BY THE PROVISIONS APPEARING IN SWISSBIT,S TERMS AND CONDITIONS OF SALE ONLY, INCLUDING THE LIMITATIONS OF LIABILITY, WARRANTY AND INFRINGEMENT PROVISIONS. SWISSBIT MAKES NO WARRANTIES OF ANY KIND, EXPRESS, STATUTORY, IMPLIED OR OTHERWISE, REGARDING INFORMATION SET FORTH HEREIN OR REGARDING THE FREEDOM OF THE DESCRIBED PRODUCTS FROM INTELLECTUAL PROPERTY INFRINGEMENT, AND EXPRESSLY DISCLAIMS ANY SUCH WARRANTIES INCLUDING WITHOUT LIMITATION ANY EXPRESS, STATUTORY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
©2017 SWISSBIT AG All rights reserved.
Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland
Revision: 1.02
www.swissbit.com industrial@swissbit.com
U-400_data_sheet_Rev102.docx Page 14 of 14
Updated at February 9, 2023
Swissbit is a premier independent European manufacturer specializing in industrial-grade storage and embedded IoT solutions. Founded in 2001, the company is globally recognized for engineering highly reliable products designed to meet the rigorous demands of the industrial, automotive, telecommunications, and medical sectors. With manufacturing operations rooted in Germany, Swissbit delivers exceptional quality, long-term component availability, and custom optimization for mission-critical applications. The core of the company's offering centers on advanced semiconductor memory solutions, with a strong emphasis on high-performance flash memory cards. These robust storage options, which include industrial SD cards, microSD memory cards, and CompactFlash, are specifically engineered to provide secure, reliable data retention in extreme operating environments. Swissbit's flash memory products integrate sophisticated wear-leveling and error-correction technologies to guarantee maximum endurance and data integrity over extended product lifecycles. Beyond portable flash memory cards, Swissbit's comprehensive storage ecosystem encompasses managed NAND BGAs, USB flash drives, and a wide array of solid-state drives across multiple interfaces. By combining cutting-edge packaging expertise with hardware-based security features, Swissbit empowers design engineers to reliably store and protect sensitive data across the entire spectrum of modern connected devices.
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