SF-2410HI0375T-2

## **SinglFuse[™] SF-2410HI-T Series Features** 

n Single blow fuse for overcurrent protection n EIA 2410 (6125 metric) footprint n Ceramic tube design for high inrush fusing speed applications | & nn UL 248-14 compliant Surface mount packaging for automated assembly n RoHS compliant* and halogen free** BOURNS ~~Ei~~ **SF-2410HI-T Series – High Inrush SMD Fuses** ~~**Clearing Time Characteristics for Series Additional Information**~~ Click these links for more information: **Clearing Time at 25 °C % of Current Rating Min. Max.** 100 % 4 hours — PRODUCT TECHNICAL INVENTORY SAMPLES CONTACT 200 % 1 second 60 seconds SELECTOR LIBRARY 300 % 0.2 seconds 3 seconds 800 % 0.02 seconds 0.1 seconds ~~———~~ ~~**Electrical Characteristics**~~ **Certifications Rated Current Resistance Rated Interrupting Typical Model (A) (Ω) Typ.*** Voltage Rating I[2] t (A[2] s) **** cUL: E198545** ~~ee~~ SF-2410HI0375T-2 0.375 0.6208 ~~ee~~ 0.4147 ~~es~~ 3 ~~es =~~ SF-2410HI050T-2 0.50 0.3462 0.495 3 ~~ee ee a~~ SF-2410HI075T-2 0.75 0.1666 1.2632 3 ~~ee ee es~~ SF-2410HI100T-2 1.00 0.1079 1.9933 3 ~~ee ee es~~ SF-2410HI150T-2 1.50 0.057 2.82 3 ~~ee ee es~~ SF-2410HI200T-2 2.00 0.0509 50 A @ 125 VAC 7.488 3 125 VAC 50 A @ 125 VDC ~~ee ee es~~ SF-2410HI250T-2 2.50 0.0317 300 A @ 32 VDC 16.771 3 ~~ee ee es~~ SF-2410HI300T-2 3.00 0.0228 24.99 3 ~~ee ee es~~ SF-2410HI350T-2 3.50 0.0196 24.908 3 ~~ee ee es~~ SF-2410HI400T-2 4.00 0.015 27.056 3 ~~ee ee es~~ SF-2410HI500T-2 5.00 0.0112 50.308 3 ~~ee ee es~~ SF-2410HI700T-2 7.00 0.0083 100.06 3 ~~es ee ee es~~ 

- *** Resistance value measured with ≤10 % rated current at 25 °C ambient. Tolerance ± 30 %. 

- **** Melting I[2] t calculated at 10 times rated current. 

## **WARNING  Cancer and Reproductive Harm** 

## www.P65Warnings.ca.gov 

- RoHS Directive 2015/863, Mar 31, 2015 and Annex. 

- ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. 

> “SinglFuse” is a trademark of Bourns, Inc. 

> Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. 

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

## **SinglFuse[™] SF-2410HI-T Series Applications** 

n Notebooks n PC Servers n LCD Monitors n Power Supplies n LCD Backlight Inverters n Battery Protection n POE, POE+ n White Goods 

## **SF-2410HI-T Series – High Inrush SMD Fuses** 

## ~~**Environmental Characteristics**~~ 

## Storage Conditions 

## ~~**Average Pre-Arcing Time vs. Current Curves**~~ 

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Average I [2] t vs. t Curves<br>**----- End of picture text -----**<br>


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2 A 2.5 A<br>1.5 A 3 A<br>1 A 3.5 A<br>750 mA 4 A<br>500 mA 5 A<br>375 mA 7 A<br>100000 1000000<br>7 A<br>PASS Eo Sent eset Se Smet ewan OSD? aR 5 A<br>10000 100000 4 A<br>3.5 A<br>3 A<br>2.5 A<br>PI Perr CTCC T AeA 2 A<br>1000 10000 1.5 A<br>1 A<br>750 mA<br>Pn AVON Cs SSBC A a cA 500 mA<br>100 1000 375 mA<br>oe | Pernt Ca ae ae CC<br>10 100<br>ee oe eas ieee tea ea<br>1 10<br>PT TANNER RT pe ey 20 VV<br>0.1 1<br>NESE etree<br>0.01 0.1<br>PEETT a * AST Pe PE TUTI VTIIT TTI CSU OUT EET<br>0.1 1 10 100 0.01 0.1 1 10 100 1000 10000 100000<br>CURRENT (A) TIME (SECONDS)<br>s)<br>2<br>t (A<br>2I<br>PRE-ARCING TIME (SECONDS)<br>**----- End of picture text -----**<br>


Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

## **SF-2410HI-T Series – High Inrush SMD Fuses** 

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How to Order Packaging<br>SF - 2410 HI 0375 T - 2<br>Reel Dimension 7-inch Tape and Reel<br>SinglFuse™   Specification EIA 481-2<br>T Product Designator<br>2.5A SMD Footprint  Quantity 1,000 pieces<br>2410 = EIA 2410<br>(6125 metric) Packaging Code -2<br>Fuse Blow Type<br>Part Marking HI = High inrush<br>375 mA Rated Current<br>500 mA 0375 ~ 700 (375 mA ~ 7 A)<br>750 mA Structure Type<br>T = Ceramic Tube<br>1 A Packaging Type<br>1.5 A - 2 = Tape & Reel<br>2 A<br>2.5 A<br>3 A<br>3.5 A<br>4 A<br>5 A<br>7 A<br>Recommended Pad Layout<br>2.95<br>6.10 ± 0.20 2.60 ± 0.10<br>(.116)<br>(.240 ± .008) (.102 ± .004)<br>T<br>3.15<br>2.5A (.124)<br>2.15 ± 0.10<br>1.45 ± 0.10 (.085 ± .004) 2.60 ± 0.10<br>(.057 ± .004) (.102 ± .004) 1.96<br>(.077)<br>MM MM<br>DIMENSIONS: DIMENSIONS:<br>(INCHES) (INCHES)<br>**----- End of picture text -----**<br>


## ~~**Typical Part Marking**~~ 

Represents total content. Layout may vary. 

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Rated Current Part Marking<br>**----- End of picture text -----**<br>


|**Rated Current**|**Part Marking**|
|---|---|
|||
|375 mA|375 mA|
|500 mA|500 mA|
|750 mA|750 mA|
|1 A|1 A|
|1.5 A|1.5 A|
|2 A|2 A|
|2.5 A|2.5 A|
|3 A|3 A|
|3.5 A|3.5 A|
|4 A|4 A|
|5 A|5 A|
|7 A|7 A|



## ~~**Product Dimensions**~~ 

Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

## **SF-2410HI-T Series – High Inrush SMD Fuses** 

## ~~**Solder Reflow Recommendations**~~ 

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tp<br>TP<br>RAMP-UP CRITICAL ZONE<br>TL TO TP<br>TL<br>t L<br>TS MAX.<br>RAMP-DOWN<br>TS MIN.<br>ts<br>PREHEAT<br>25 °C<br>t  25 °C TO PEAK<br>Time<br>Temperature<br>**----- End of picture text -----**<br>


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Profile Feature Pb-Free Assembly<br>**----- End of picture text -----**<br>


|**Profile Feature**|**Pb-Free Assembly**|
|---|---|
|||
|Preheat / Soak:<br>Temperature Min. (Tsmin)<br>Temperature Max. (Tsmax)<br>Time (ts) from (Tsminto Tsmax)|150 °C<br>200 °C<br>60~180 seconds|
|Ramp Up Rate (TLto Tp)|3 °C / second max.|
|Ramp Up Rate (Tsmaxto TL)|5 °C / second max.|
|Liquidous Temperature (TL)<br>Time (tL) maintained above TL|217 °C<br>60~150 seconds|
|Peak Package Body<br>Temperature (Tp)|235 °C ± 5 °C<br>(for <1 A rating)<br>260 °C +0/-5 °C<br>(for ≥1 A rating)|
|Time within 5 °C of actual peak<br>temperature (Tp)|20~30 seconds*|
|Ramp Down Rate (Tpto TL)|6 °C / second max.|
|Time 25 °C to Peak Temperature|8 minutes max.|



- Tolerance for peak profile temperature (Tp ) is defined as a supplier minimum and a user maximum. 

## ~~**Solder Wave Recommendations**~~ 

## **Peak Temperature (Dwell Time)** 

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300<br>280<br>260<br>240<br>220<br>200<br>180<br>160<br>140<br>120<br>100<br>80<br>60<br>40<br>20<br>0<br>20 40 60 80 100 120 140 160 180 200 220 240<br>PREHEAT TIME COOLING TIME<br>Time (Sec.)<br>Temperature (°C)<br>**----- End of picture text -----**<br>


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Profile Feature Pb-Free Assembly<br>**----- End of picture text -----**<br>


|**Profile Feature**|**Pb-Free Assembly**|
|---|---|
|||
|Preheat:<br>Temperature Max. (Tsmax)<br>Time (Min. to Max.)|150 °C<br>60~90 seconds|
|Solder Pot Temperature|260 °C max.|
|Solder Dwell Time|2~3 seconds|



Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

## **SF-2410HI-T Series – High Inrush SMD Fuses** 

## ~~**Current Rating Thermal Derating Curve**~~ 

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120<br>100<br>80<br>60<br>40<br>25 °C<br>20<br>0<br>-60 -40 -20 0 20 40 60 80 100 120 140<br>AMBIENT TEMPERATURE (°C)<br>RATED CURRENT PERCENTAGE (%)<br>**----- End of picture text -----**<br>


## ~~**Reliability Testing**~~ 

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No. Test Test Condition Requirement Test Reference<br>**----- End of picture text -----**<br>


|**No.**|**Test**|**Test Condition**|**Requirement**|**Test Reference**|
|---|---|---|---|---|
||||||
|1|Solderability|Temperature setup: 235 ±5 °C<br>Time setup: 10 ±1 sec.|After test terminal electrode wetting<br>area must begreater than 95 %|IEC 60068-2-58|
|2|Resistance to<br>solderingheat|Temperature setup: 235 ±5 °C<br>Time setup: 30 ± 5 sec.|DCR change ≤ ±15 %|IEC 60068-2-58|
|3|Thermal shock|Temperature setup:<br>25 °C ~ -65 °C ~ 25 °C ~ 125 °C<br>Time setup: -65 °C (30 min)<br>~ 25 °C (5 min) ~ 125 °C (30 min)<br>~ 25 °C (5 min), 5 cycles|DCR change ≤ ±15 %<br>No mechanical damage|MIL-STD-202G<br>Method 107G<br>Test Condition B|
|4|Humidity unload|Heat (85 ±0.5 °C)<br>High Humidity (85 ±1 % RH)<br>240 hours|DCR change ≤ ±15 %<br>No mechanical damage|MIL-STD-202G<br>Method 103B<br>Test Condition A|
|5|Salt spray|Salt spray concentration: 5 ±1 %<br>Test liquid temperature: 35 ±0.5 °C<br>96 hours|DCR change ≤ ±15 %<br>No mechanical damage|MIL-STD-202G<br>Method 101E<br>Test Condition A|
|6|Bending|The board shall be bent by 1 mm<br>at a rate of 1 mm/sec.|DCR change ≤ ±15 %|IEC 60127-4|
|7|Vibration|Frequency setup: 10 ~ 55 ~ 10 Hz<br>Time setup: 1 Minute/cycle<br>(X-Y-Z, 120 cycles, 6 hours)|DCR change ≤ ±15 %<br>No mechanical damage|MIL-STD-202G<br>Method 201A|



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REV. 07/24 

Specifications are subject to change without notice. Users should verify actual device performance in their specific applications. 

The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf. 

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C1753 12/14/23R