SF-1206SP600M-2

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F<br>&<br>*RoHS COMPLIANT<br>**HALOGEN FREE<br>**----- End of picture text -----**<br>


## **SinglFuse[™] SF-1206SPxxxM Series Features** 

n Single blow fuse for overcurrent protection n 3216 (EIA 1206) footprint n Time Lag fuse n UL 248-14 listed 

n RoHS compliant* and halogen free** 

n Multilayer SMD design n Surface mount packaging for automated assembly 

## **SF-1206SPxxxM Series - Time Lag Multilayer Surface Mount Fuses** -i--i 

## ~~**Electrical Characteristics**~~ 

|**Model**<br>~~ee~~<br>~~ee~~|**Rated Current**<br>**(Amps)**|**Fusing Time**<br>~~|~~|**Resistance**<br>**(Ω) Typ.*****<br>~~|~~|**Rated**<br>**Voltage**|**Interrupting**<br>**Rating**|**Typical**<br>**I2t (A2s)******<br>~~|~~|
|---|---|---|---|---|---|---|
|SF-1206SP100M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.00<br>~~ee~~|Open within 120<br>sec. at 200 %<br>rated current<br>~~|~~<br>~~ee~~<br>~~|~~<br>~~ee~~<br>~~|~~<br>~~|~~<br>~~|~~<br>~~**|**~~<br>~~ee~~<br>~~|~~<br>~~ee~~<br>~~|~~<br>~~|~~<br>~~|~~<br>~~|~~<br>~~|~~|0.360<br>~~|~~<br>~~|~~<br>~~sd~~|DC 63 V<br>~~sd~~<br>~~sd~~|DC 63 V<br>50 A|0.11<br>~~|sid~~<br>~~|~~|
|SF-1206SP125M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.25<br>~~ee~~<br>~~ee~~||0.200<br>~~|~~<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~sd~~|||0.22<br>~~|sid~~<br>~~|t—isi—sidC~~<br>~~|~~|
|SF-1206SP150M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|1.50<br>~~ee~~<br>~~ee~~||0.150<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~sid~~|||0.23<br>~~sid~~<br>~~|t—isi—sidC~~<br>~~|—s—‘izdC~~<br>~~|~~<br>~~t—(siz~~|
|SF-1206SP200M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|2.00<br>~~ee~~||0.088<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~sid~~<br>~~|~~<br>~~sd~~|||0.63<br>~~t—isi—sidC~~<br>~~|—s—‘izdC~~<br>~~|~~<br>~~t—(siz~~<br>~~|~~<br>~~tisCisdC~~|
|SF-1206SP250M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~<br>~~ee~~|2.50||0.065<br>~~|~~<br>~~sid~~<br>~~|~~<br>~~sd~~<br>~~**|**~~<br>~~sd~~|DC 32V<br>~~sd~~<br>~~sd~~|DC 32 V<br>50 A|0.90<br>~~—s—‘izdC~~<br>~~|~~<br>~~t—(siz~~<br>~~|~~<br>~~tisCisdC~~<br>~~**|**~~<br>~~tCsid~~|
|SF-1206SP300M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~|3.00||0.034<br>~~|~~<br>~~sid~~<br>~~|~~<br>~~sd~~<br>~~**|**~~<br>~~sd~~|||1.20<br>~~|~~<br>~~t—(siz~~<br>~~|~~<br>~~tisCisdC~~<br>~~**|**~~<br>~~tCsid~~|
|SF-1206SP350M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~|3.50<br>~~ee~~||0.028<br>~~|~~<br>~~sd~~<br>~~**|**~~<br>~~sd~~<br>~~|~~<br>~~sd~~|||1.60<br>~~|~~<br>~~ti sCisdC~~<br>~~**|**~~<br>~~tCsid~~<br>~~sid~~<br>~~|~~|
|SF-1206SP400M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~|4.00<br>~~ee~~<br>~~ee~~||0.024<br>~~**|**~~<br>~~sd~~<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~sd~~|||2.20<br>~~**|**~~<br>~~tC sid~~<br>~~sid~~<br>~~|t—isi—sidC~~<br>~~|~~|
|SF-1206SP450M-2<br>~~ee~~<br>~~ee~~<br>~~ee~~|4.50<br>~~ee~~<br>~~ee~~||0.020<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~sid~~|||3.60<br>~~sid~~<br>~~|t—isi—sidC~~<br>~~|—s—‘izdC~~<br>~~|~~<br>~~t—(siz~~|
|SF-1206SP500M-2<br>~~ee~~<br>~~ee~~|5.00<br>~~ee~~||0.018<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~sid~~|||5.30<br>~~t—isi—sidC~~<br>~~|—s—‘izdC~~<br>~~|~~<br>~~t—(siz~~|
|SF-1206SP550M-2<br>~~ee~~<br>~~|~~<br>~~|~~|5.50<br>~~|~~||0.014<br>~~|~~<br>~~sid~~<br>~~|~~<br>~~sd~~|DC 24V|DC24 V50A|6.40<br>~~—s—‘izdC~~<br>~~|~~<br>~~t—( siz~~<br>~~|~~<br>~~tCs—CidC~~|
|SF-1206SP600M-2<br>~~|~~<br>~~|~~~~**e**e~~|6.00<br>~~|~~||0.011<br>~~|~~<br>~~sd~~<br>~~|~~||DV 24 V<br>60 A<br>~~i~~|8.50<br>~~|~~<br>~~tCs—CidC~~<br>~~i~~|
|SF-1206SP700M-2<br>~~|~~<br>~~|~~~~**e**e~~<br>~~s~~|7.00<br>~~|~~||0.010<br>~~|~~<br>~~sd~~<br>~~|~~<br>~~|~~|||10.0<br>~~|~~<br>~~tC s—CidC~~<br>~~i~~<br>~~|~~<br>~~tCs—sidC~~|
|SF-1206SP800M-2<br>~~**e**e~~<br>~~s~~|8.00||0.009<br>~~|~~<br>~~|~~|||16.9<br>~~i~~<br>~~|~~<br>~~tCs—sidC~~|



- *** Resistance value measured with ≤10 % rated current at 25 °C ambient. 

**** Melting I[2] t calculated at 0.001 second pre-arcing time. 

## ~~**Reliability Testing**~~ 

|**No.**|**Test**|**Requirement**|**Test Condition**|**Test Reference**|
|---|---|---|---|---|
|1|Soldering heat<br>resistance|DCR change ≤ ±10 %<br>No mechanical damage|One dip at 260 °C for 60 seconds|MIL-STD-202<br>Method 210|
|2|Solderability|Minimum 95 % coverage|One dip at 245 °C for 5 seconds|MIL-STD-202<br>Method 208|
|3|Thermal shock|DCR change ≤ ±10 %<br>No mechanical damage|100 cycles between -65 °C and +125 °C|MIL-STD-202<br>Method 107|
|4|Moisture resistance|DCR change ≤ ±15 %<br>No excessive corrosion|10 cycles|MIL-STD-202<br>Method 106|
|5|Salt spray|DCR change ≤ ±10 %<br>No excessive corrosion|48 hour exposure, 5 % salt solution|MIL-STD-202<br>Method 101|
|6|Mechanical vibration|DCR change ≤ ±10 %<br>No mechanical damage|0.4 inch D.A. or 30 G between<br>5-3000 Hz|MIL-STD-202<br>Method 204|
|7|Mechanical shock|DCR change ≤ ±10 %<br>No mechanical damage|1500 G, 0.5 ms, half-sine shocks|MIL-STD-202<br>Method 213|
|8|Life|No electrical “opens” during testing<br>Voltage drop change shall be less<br>than ±20 % of initial value|80 % rated current (75 % for < 1 A fuses)<br>for 2000 hours at ambient temperature<br>between +20 °C and +30 °C|Refer to STP<br>document|



## ~~**Agency Recognition**~~ 

UL File Number .................................................... E198545 

http://www.ul.com/  Follow link to Online Certificates Directory, then enter UL File No. E198545, or click here 

**Asia-Pacific:** Tel: +886-2 2562-4117 • Email: asiacus@bourns.com **EMEA:** Tel: +36 88 520 390 • Email: eurocus@bourns.com **The Americas:** Tel: +1-951 781-5500 • Email: americus@bourns.com **www.bourns.com** 

- RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. 

- ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. 

“SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SinglFuse[™] SF-1206SPxxxM Series Applications** 

n Portable memory n Cell phones n LCD monitors n Rechargeable battery packs n Disk drives n Battery chargers n PDAs n Set-top boxes n Digital cameras n Industrial controllers n MP3 players n Battery Management Systems (BMS) 

n LED lighting 

- n Power tools 

## **SF-1206SPxxxM Series - Time Lag Multilayer Surface Mount Fuses** 

## ~~**Environmental Characteristics**~~ 

Operating Temperature ................................................................................................................................................................-55 °C to +150 °C Storage Conditions Temperature ..............................................................................................................................................................................+5 °C to +35 °C Humidity.........................................................................................................................................................................................40 % to 75 % Shelf Life..........................................................................................................................................................2 years from manufacturing date Moisture Sensitivity Level ...................................................................................................................................................................................... 1 ESD Classification (HBM)............................................................................................................................................................................ Class 6 

## ~~**How to Order**~~ 

## ~~**Construction**~~ 

## ~~**Typical Part Marking**~~ 

Represents total content. Layout may **SF - 1206 SP 100 M - 2** MASKING LAYER vary. MARKING FUSE ELEMENT SinglFuse™ CERAMIC Product Designator BODY **R** SMD Footprint 1206 = 3216 (EIA 1206) size TERMINATION Fuse Blow Type RATED CURRENT (A) SP = Time Lag MARKING E = 1.00 M = 4.00 Rated Current MASKING LAYER F = 1.25G = 1.50 T = 4.50N = 5.00 100 ~ 800 (1.00 A ~ 8.00 A) I = 2.00 U = 5.50 Structure Type J = 2.50 O = 6.00 M = Multilayer ~~**Packaging Quantity**~~ K = 3.00 P = 7.00 L = 3.50 R = 8.00 Packaging Type 3,000 pieces per 7-inch reel - 2 = Tape & Reel 

3,000 pieces per 7-inch reel 

## ~~**Product Dimensions**~~ 

## ~~**Recommended Pad Layout**~~ 

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3.20 ± 0.20<br>(.126 ± .008) 1.50<br>(.059)<br>1.60 ± 0.20<br>(.063 ± .008)<br>1.80<br>1.60 ± 0.20<br>(.071)<br>(.063 ± .008) 0.97 ± 0.20<br>(.038 ± .008)<br>4.40<br>0.51 ± 0.25<br>(.020 ± .010) DIMENSIONS: MM (.173)<br>(INCHES)<br>Current Rating Thermal Derating Curve<br>110<br>105<br>100<br>95<br>90<br>85<br>80<br>75<br>70<br>65<br>60<br>55<br>50<br>-55 -35 -15 5 25 45 65 85 105 125 145 165<br>MAXIMUM OPERATING TEMPERATURE (°C)<br>DERATING (%)<br>**----- End of picture text -----**<br>


## ~~**Current Rating Thermal Derating Curve**~~ 

Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SF-1206SPxxxM Series - Time Lag Multilayer Surface Mount Fuses** 

## ~~**Solder Refow Recommendations**~~ 

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Tp<br>Tc -5 °C<br>MAX. RAMP UP RATE = 3 °C/s tp<br>MAX. RAMP DOWN RATE = 6 °C/s<br>TL<br>Tsmax PREHEAT AREA tL<br>Tsmin<br>ts<br>25<br>TIME 25 °C TO PEAK<br>TIME<br>TEMPERATURE (°C)<br>**----- End of picture text -----**<br>


|**Profle Feature**|**Pb-Free Assembly**|
|---|---|
|Preheat / Soak:<br>Temperature Min. (Tsmin)<br>Temperature Max. (Tsmax)<br>Time (ts) from (Tsminto Tsmax)|150 °C<br>200 °C<br>60~120 seconds|
|Ramp Up Rate (TLto Tp)|3 °C / second max.|
|Liquidous Temperature (TL)<br>Time (tL) maintained above TL|217 °C<br>60~150 seconds|
|Peak Package Body<br>Temperature (Tp)|260 °C|
|Time (tp)* within 5 °C of the<br>specifed classifcation temperature<br>(Tc)|30 seconds*|
|Ramp Down Rate (Tpto TL)|6 °C / second max.|
|Time 25 °C to Peak Temperature|8 minutes max.|



* Tolerance for peak profile temperature (Tp ) is defined as a supplier minimum and a user maximum. 

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Recommended Temperature Profle for Wave Soldering<br>260 10 sec. max. Wave soldering is suitable for 1206 size models.<br>150<br>PREHEATING<br>120 seconds TIME<br>TEMPERATURE (°C)<br>**----- End of picture text -----**<br>


Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SF-1206SPxxxM Series - Time Lag Multilayer Surface Mount Fuses3312 - 2 mm SMD Trimming Potentiometer** 

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Average Pre-Arcing Time vs. Current Curves Average I [2] t vs. t Curves<br>3.50 A 4.00 A<br>3.00 A 4.50 A<br>2.50 A 5.00 A<br>2.00 A 5.50 A<br>1.50 A 6.00 A<br>1.25 A 7.00 A<br>1.00 A 8.00 A<br>100 100000<br>8.00 A<br>7.00 A<br>6.00 A<br>5.50 A<br>10000 5.00 A<br>4.50 A<br>10 4.00 A<br>3.50 A<br>3.00 A<br>1000 2.50 A<br>2.00 A<br>1.50 A<br>1.25 A<br>1.00 A<br>1<br>100<br>10<br>0.1<br>1<br>0.01<br>0.1<br>0.001 0.01<br>1 10 100 1000 0.001 0.01 0.1 1 10 100<br>CURRENT (A) TIME (SECONDS)<br>s)<br>2<br>t (A<br>2I<br>PRE-ARCING TIME (SECONDS)<br>**----- End of picture text -----**<br>


REV. B 03/18 

Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SF-1206SPxxxM Series Tape and Reel Packaging Specifications3312 - 2 mm SMD Trimming Potentiometer** 

|**SF-1206SPxxxM Series**<br>**Tape Dimensions**<br>**per EIA 481-2**|**SF-1206SPxxxM Series**<br>**Tape Dimensions**<br>**per EIA 481-2**|
|---|---|
|W|8.00±0.10<br>(.315 ± .004)|
|P0|4.0±0.10<br>(.157 ± .004)|
|P1|4.0±0.10<br>(.157 ± .004)|
|P2|2.0±0.05<br>(.079 ± .002)|
|A0|1.80±0.10<br>(.071 ± .004)|
|B0|3.50±0.10<br>(.138 ± .004)|
|F|3.50±0.05<br>(.138 ± .002)|
|E1|1.75±0.10<br>(.069 ± .004)|
|D0|1.50+0.10<br>(.059 + .004)|
|K0|1.10±0.10<br>(.043 ± .004)|
|T|0.23±0.02<br>(.009 ± .001)|



PACKAGING:  Plastic tape, 3,000 pcs. per reel 

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13.40 ± 0.50<br>(.539 ± .020)<br>0.8<br>0.60.4 178.00 ± 1.00 60.20 ± 0.50<br>0.2 (7.008 ± .039)DIA. (2.370 ± .020)DIA.<br>2.20 ± 0.30<br>(.087 ± .012)<br>13.20 +0.3/-0.2<br>(.520 +.012/-.008)<br>DIA.<br>1.40 ± 0.20<br>1.20 ± 0.20 (.055 ± .008)<br>(.047 ± .008)<br>E1 D0 P0 P2 T<br>F W<br>B0<br>P1 AO KO DIMENSIONS: MM<br>(INCHES)<br>DIRECTION OF UNREELING<br>0.2<br>0.4<br>0.6<br>0.8<br>**----- End of picture text -----**<br>


Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.