![SF-1206S400-2 — Fuse, Surface Mount, 4 A, Slow Blow, 32 VDC, 1206 [3216 Metric], SF-1206S](/media/D/1/A/72D01843CFE80A1D.webp)
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SF-1206S400-2
Fuse, Surface Mount, 4 A, Slow Blow, 32 VDC, 1206 [3216 Metric], SF-1206S
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- Manufacturer: BOURNS
- Product type: SMD Fuses
- Fuse Current:4A; Product Range:-; Voltage Rating VAC:-; Voltage Rating V DC:24VDC; Blow Characteristic:Slow Blow; Fuse Case Style:1206; Breaking Capacity Current AC:-; Breaking Capacity C
- SVHC: No SVHC (04-Feb-2026)
- Fuse Current: 4A
- Product Range: SF-1206S
- Fuse Case Style: 1206 [3216 Metric]
- Voltage Rating VAC: -
- Voltage Rating VDC: 32VDC
- Blow Characteristic: Slow Blow
- Breaking Capacity Current AC: -
- Breaking Capacity Current DC: 50A
| Delivery and price | |
|---|---|
| Units per pack | 5000 |
| Price | 0.247 € |
| Current stock | 1000+ |
| Lead time | 30 days |
Datasheet
## **SinglFuse[™] SF-1206S Series Features**
## n Single blow fuse for overcurrent n Surface mount packaging for automated protection assembly n 3216 (EIA 1206) miniature footprint n Slow blow fuse n UL listed n RoHS compliant* and halogen free** n Thin film chip fuse POURNS ---T **SF-1206S Series - Slow Blow Surface Mount Fuses**
## ~~**Electrical Characteristics**~~
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|---|---|---|---|---|---|---|---|
|Rated Current|Resistance|Typical|
|Model|Fusing Time|Rated Voltage|Breaking Capacity|
|ee|(Amps)|(mΩ) Typ.***|I|[2]|t (A|[2]|s) ****|
|SF-1206S050|0.50|596|0.030|
|es|Cd|TT|
|SF-1206S080|0.80|165|0.068|
|ee|dd|sr|
|SF-1206S100|1.00|132|DC 63 V|0.098|
|ee|DC 63 V|st|
|SF-1206S125|1.25|90|50 A|0.155|
|ee|Td|TC|
|SF-1206S150|1.50|79|0.236|
|Open within 5 sec.|
|SF-1206S200|2.00|at 250 % rated|41|0.339|
|SF-1206S250|2.50|current|33|0.605|
|ee|||
|SF-1206S300|3.00|23|0.933|
|es|dd|DC 32 V|st|
|SF-1206S400|4.00|15.5|DC 32 V|1.537|
|es|-Td|50 A|ss|
|SF-1206S500|5.00|13|2.533|
|SF-1206S700|7.00|7|5.684|
|==[=aa|
|ee|eee|||||
|*** Resistance value was measured with less than 10 % of rated current. Resistance tolerance is ±25 %.|
|****Typical I|[2]|t value is measured at 10x rated current.|
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## ~~**Reliability Testing**~~
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||||
|---|---|---|
|Parameter|Requirement|Test Method|
|Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours|
|Fusing Time .............................................. Within 5 seconds ........................................250 % of its rated current|
|Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for|
|30 seconds again|
|Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm,|
|Bending: 3 mm,1time, 30 seconds|
|Resistance to Solder Heat ........................ ±20 % .........................................................260 °C ±5 °C,10 ±1 second|
|Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second|
|245 °C ±5 °C, 2 ±0.5 second (lead free)|
|Temperature Rise ..................................... <75 °C ........................................................100 % of its rated current, measure of surface|
|temperature|
|Resistance to Dry Heat............................. ±20 % .........................................................105 °C ±5 °C,1000 hours|
|Resistance to Solvent ............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds|
|coating and marking|
|Residual Resistance ................................. 10k ohms or more ......................................Measure DC resistance after fusing|
|Thermal Shock ......................................... DR < 10 % ..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles|
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## ~~**Environmental Characteristics**~~
Operating Temperature ..................................................................................-20 °C to +105 °C Storage Conditions Temperature ................................................................................................+5 °C to +35 °C Humidity...........................................................................................................40 % to 75 % Shelf Life........................................................................... 2 years from manufacturing date Moisture Sensitivity Level ........................................................................................................1 ESD Classification (HBM)..............................................................................................Class 6
## **Asia-Pacific:**
Tel: +886-2 2562-4117 Email: asiacus@bourns.com **Europe:** Tel: +36 88 520 390 Email: eurocus@bourns.com
## **The Americas:**
Tel: +1-951 781-5500 Email: americus@bourns.com **www.bourns.com**
- RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
** Bourns is using the definition that appears to be the prevalent definition used as the industry standard at this time. The Bourns definition of “halogen-free” is: Bromine (Br) content: ≤ 900 ppm; Chlorine (Cl) content: ≤ 900 ppm; Total Br + Cl content: ≤1500 ppm.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
## **SinglFuse[™] SF-1206S Series Applications**
n Portable memory
n LCD monitors
- n Disk drives
- n PDAs
- n Digital cameras
n Cell phones
- n Rechargeable battery packs
- n Battery chargers
- n Set top boxes
- n Industrial controllers
- n DVDs
## **SF-1206S Series - Slow Blow Surface Mount Fuses**
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Typical Part Marking How to Order<br>Represents total content. Layout may SF - 1206 S 050 - 2<br>vary.<br>SinglFuse™ Product Designator<br>j [ SMD Footprint _<br> 3216 (EIA 1206) size<br>Fuse Blow Type<br>F = Fast Acting FP = Fast Acting Precision<br>RATING CURRENT (A) S = Slow Blow SP = Time Lag<br>F = 0.50 T = 2.50<br>K = 0.80 3 = 3.00 Rated Current<br>L = 1.00 W = 4.00 050-700 (500 mA - 7.00 A)<br>M = 1.25 Y = 5.00<br>P = 1.50 Z = 7.00 Packaging Type<br>S = 2.00 - 2 = Tape & Reel (5,000 pcs./reel) ——S!<br>Solder Refow Recommendations Construction & Material Content<br>OVERCOAT<br>250 Peak: 250 +0/-5 °C<br>Sn PLATING<br>230 °C or higher<br>200<br>180 °C PRE-HEATING ZONE FUSE ELEMENT Cu / Ni PLATING<br>CERAMIC SUBSTRATE<br>150 150 °C<br>90 ± 30 Seconds<br>100<br>30 ± 10 Seconds<br>SOLDERING ZONE<br>50<br>HEATING TIME<br>PEAK: 250 +0/-5 °C, 5 seconds<br>PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds<br>SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds<br>TEMPERATURE (°C)<br>**----- End of picture text -----**<br>
## ~~**Product Dimensions**~~
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3.1 ± 0.1<br>(.122 ± .004)<br>0.6 ± 0.1<br>Oe —<br>(.0 2 4 ± .004)<br>1.55 ± 0.1<br>(.061 ± .004)<br>0.5 ± 0.2 0.5 ± 0.2<br>(.020 ± .008) (.020 ± .008)<br>: S e<br>0.5 ± 0.3 0.5 ± 0.3<br>-{— __[<br>(.020 ± .012) (.020 ± .012)<br>DIMENSIONS: 7 MM<br>(INCHES)<br>**----- End of picture text -----**<br>
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PACKAGING: 5,000 pcs./reel<br>**----- End of picture text -----**<br>
## ~~**Recommended Pad Layout**~~
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2.2 ± 0.2<br>(.087 ± .008)<br>-——- +<br>1.65 ± 0.15<br>(.065 ± .006) |<br>a (.185 ± .012)4.7 ± 0.3<br>**----- End of picture text -----**<br>
Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
## **SF-1206S Series - Slow Blow Surface Mount Fuses**
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Average Time Current Curves<br>1.50 A 2.00 A<br>1.25 A 2.50 A<br>1.00 A 3.00 A<br>0.80 A 4.00 A<br>0.50 A 5.00 A<br>7.00 A<br>100<br>10<br>1<br>0.1<br>0.01<br>0.001<br>0.1 1 10 100<br>CURRENT (A)<br>CLEARING TIME (S)<br>**----- End of picture text -----**<br>
## ~~**I2T Derating Curve by Repeater Rush Current**~~
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1<br>0.1<br>10 100 1000 10000 100000<br>RATIO OF I2T<br>**----- End of picture text -----**<br>
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Minimum I [2] T V Clear Time Curves<br>**----- End of picture text -----**<br>
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1000<br>7.00 A<br>5.00 A<br>4.00 A<br>100 3.00 A<br>2.50 A<br>2.00 A<br>1.50 A<br>1.25 A<br>10 1.00 A<br>0.80 A<br>0.50 A<br>1<br>0.1<br>0.01<br>0.001 0.01 0.1 1<br>CLEARING TIME (S)<br>MIN. I2T (A2 SEC)<br>**----- End of picture text -----**<br>
## ~~**Thermal Derating Curve**~~
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120<br>110<br>100<br>90<br>80<br>-20 0 20 40 60 80 100 120<br>AMBIENT TEMPERATURE (°C)<br>PERCENT OF RATING (%)<br>**----- End of picture text -----**<br>
RATIO OF I[2] T REPEAT NUMBERS TO BLOW
Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
REV. F 07/17
## **SF-1206S Series Tape and Reel Specifications**
|**SF-1206S Series**<br>**Tape Dimensions**<br>**per EIA 481-2**|**SF-1206S Series**<br>**Tape Dimensions**<br>**per EIA 481-2**|
|---|---|
|W|8.0±0.2<br>(.315 ± .008)|
|P0|4.0±0.1<br>(.157 ± .004)|
|P1|4.0±0.1<br>(.157 ± .004)|
|P2|2.0±0.05<br>(.079 ± .002)|
|A|2.0±0.15<br>(.079 ± .006)|
|B|3.6±0.2<br>(.142 ± .008)|
|F|3.5±0.05<br>(.138 ± .002)|
|E|1.75±0.1<br>(.069 ± .004)|
|D0|1.5+0.1/-0<br>(.059 + .004/-0)|
|T|0.84 ±0.1<br>(.033 ± .004)|
|**Reel Dimensions**||
|A|180+0/-3.0<br>(7.087 +0/-.118)|
|B Min.|60.0<br>(2.362)|
|C|13.0± 1.0<br>(.512 ± .039)|
|W|9.0± 1.0<br>(.354 ± .039)|
|T|11.4 ± 2.0<br>(.449 ± .079)|
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MM<br>DIMENSIONS:<br>T (INCHES)<br>W<br>A BOTTOM DO PO E<br>DIA. TAPE TOP<br>TAPE<br>C DIA.<br>B<br>B F<br>W<br>DIA.<br>RESISTOR<br>TAPE A P1 P2<br>PAPER T<br>TAPE<br>DIRECTION OF UNREELING<br>**----- End of picture text -----**<br>
Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
Updated at June 9, 2026
Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.
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