SF-1206S250W-2
Fuse, Surface Mount, Wire Core, 2.5 A, Slow Blow, 65 VDC, 1206 [3216 Metric]
- Manufacturer: BOURNS
- Product type: SMD Fuses
- Fuse Current:2.5A; Product Range:SinglFuse SF-1206SxxxW Series; Voltage Rating VAC:-; Voltage Rating V DC:65V; Blow Characteristic:Slow Blow; Fuse C; Available until stocks are exhausted
- SVHC: No SVHC (27-Jun-2024)
- Fuse Current: 2.5A
- Product Range: SinglFuse SF-1206SxxxW
- Fuse Case Style: 1206 [3216 Metric]
- Voltage Rating VAC: -
- Voltage Rating VDC: 65VDC
- Blow Characteristic: Slow Blow
- Breaking Capacity Current AC: -
- Breaking Capacity Current DC: 50A
| Delivery and price | |
|---|---|
| Units per pack | 50 |
| Price | 0.61 € |
| Current stock | 50+ |
| Lead time | 30 days |
## **SinglFuse[™] SF-1206SxxxW Series Features** **==> picture [504 x 646] intentionally omitted <==** **----- Start of picture text -----**<br> |||||||||| |---|---|---|---|---|---|---|---|---| |n|Single blow fuse for overcurrent protection| |n|3216 (EIA 1206) footprint| |n|Slow blow fuse| |n|UL 248-14 listed| |n|RoHS compliant* and halogen free**| |‘|n|Wire core SMD design| |n|Surface mount packaging for automated assembly| |POURNS|SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses| |Electrical Characteristics| |Rated Current|Resistance|Rated|Interrupting|Typical| |Model|Fusing Time|***|****| |(Amps)|(Ω) Typ.|Voltage|Rating|I|[2]|t (A|[2]|s)| |Pa|SF-1206S150W-2|1.50|0.050|0.37| |SF-1206S160W-2|1.60|0.043|0.52| |ee|SF-1206S200W-2|2.00|Po|0.032|J|0.88| |SF-1206S250W-2|2.50|0.028|DC 65 V|1.10| |ee|Pp|DC 65 V||| |ee|SF-1206S300W-2|3.00|Pp|0.022|50 A|J|1.90| |ee|SF-1206S315W-2|3.15|Pp|0.020|J|2.20| |SF-1206S350W-2|3.50|Open within 5|0.018|2.60| |ee||p||| |ee|SF-1206S400W-2|4.00|sec. at 250 %|PF|0.016|||3.30| |ee|SF-1206S500W-2|5.00|rated current|Po|0.013|||5.40| |ee|SF-1206S630W-2|6.30|Pp|0.010|||8.90| |SF-1206S700W-2|7.00|0.0092|10.40| |ee|Pp|DC 32 V|J| |SF-1206S800W-2|8.00|0.0084|DC 32 V|13.50| |ee|Pp|50 A|J| |SF-1206S1000W-2|10.00|0.0050|11.20| |ee|SF-1206S1200W-2|12.00|Pp|0.0041|||15.00| |ee|SF-1206S1500W-2|15.00|||0.0035|Po|24.50| |*** Resistance value measured with ≤10 % rated current at 25 °C ambient.| |**** Melting I|[2]|t calculated at 0.001 second pre-arcing time.| |Reliability Testing| |a|No.|Test|Requirement|Test Condition|Test Reference| |1|DCR change ≤ 20 % (≤ 10 % for ≤1 A)|3 reflows at 245 °C followed by a|Refer to STP| |a|Reflow and bend|No mechanical damage|2 mm bend|document| |MIL-STD-202| |2|Solderability|Minimum 90 % coverage|One dip at 245 °C for 5 seconds| |Method 208| |a| |Soldering heat|DCR change ≤ 20 % (≤ 10 % for ≤1 A)|MIL-STD-202| |3|One dip at 260 °C for 10 seconds| |a|resistance|New solder coverage ≤ 75 %|Method 210| |DCR change ≤ ±15 %|MIL-STD-202| |4|Moisture resistance|10 cycles| |No excessive corrosion|Method 106| |a| |DCR change ≤ ±10 %|MIL-STD-202| |5|Salt spray|48 hour exposure, 5 % salt solution| |No excessive corrosion|Method 101| |a| |DCR change ≤ ±10 %|0.4 inch D.A. or 30 G between|MIL-STD-202| |6|Mechanical vibration| |a|No mechanical damage|5-3000 Hz|Method 204| |DCR change ≤ ±10 %|MIL-STD-202| |7|Mechanical shock|1500 G, 0.5 ms, half-sine shocks| |a|No mechanical damage|Method 213| |8|Thermal Shock|DCR change ≤ ±10 %|100 cycles between -65 °C and +125 °C|[MIL-STD-202 ]| |No mechanical damage|Method 107| |No electrical “opens” during testing|80 % rated current (75 % for < 1 A fuses)| |Refer to STP| |9|Life|Voltage drop change shall be less|for 2000 hours at ambient temperature| |document| |than ±20 % of initial value|+25 °C| |es|a| **----- End of picture text -----**<br> ## ~~**Agency Recognition**~~ - RoHS Directive 2015/863, Mar 31, 2015 and Annex.. ** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. UL File Number .................................................... E198545 http://www.ul.com/ Follow link to Online Certificates Directory, then enter UL File No. E198545, or click here “SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **SinglFuse[™] SF-1206SxxxW Series Applications** n LCD monitors n Backlight drivers n Low voltage lighting power n Industrial controllers n Set top boxes - n DC/DC converters n Notebooks / ultrabooks ## **SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses** ## ~~**Environmental Characteristics**~~ Operating Temperature ................................................................................................................................................................-55 °C to +125 °C Storage Conditions Temperature ..............................................................................................................................................................................+5 °C to +35 °C Humidity.........................................................................................................................................................................................40 % to 75 % Shelf Life..........................................................................................................................................................2 years from manufacturing date Moisture Sensitivity Level ...................................................................................................................................................................................... 1 ESD Classification (HBM)............................................................................................................................................................................ Class 6 **==> picture [517 x 470] intentionally omitted <==** **----- Start of picture text -----**<br> Typical Part Marking How to Order Construction<br>Represents total content. Layout may SF - 1206 S 150 W - 2 FR4 PCB<br>vary. SinglFuse™ Cu/Ni/SnTERMINATION<br>Product Designator<br>SMD Footprint<br>G 1206 = 3216 (EIA1206) size<br>Fuse Blow Type<br>S = Slow Blow<br>RATED CURRENT (A) Rated Current FUSE ELEMENT<br>G = 1.50T = 1.60 N = 5.00O = 6.30 150 ~ 1500 (1.50 A ~ 15.00 A) (Cu or Cu alloy)<br>I = 2.00 P = 7.00 Structure Type<br>J = 2.50 R = 8.00 W = Wire Core Packaging Quantity<br>K = 3.00 Q = 10.00<br>V = 3.15L = 3.50 X = 12.00Y = 15.00 Packaging Type - 2 = Tape & Reel 3,500 pieces per 7-inch reel<br>M = 4.00<br>Product Dimensions Recommended Pad Layout<br>3.20 ± 0.20 MM<br>(.126 ± .008) DIMENSIONS:<br>(INCHES) 1.08 ± 0.15 1.50<br>(.059)<br>(. 042 ± .006)<br>1.80<br>1.60 + 0.30 / - 0.20<br>(.071)<br>(.063 + .012 / - .004)<br>4.40<br>(.173)<br>0.85 ± 0.30 0.85 ± 0.30 0.85 ± 0.30 0.85 ± 0.30<br>(.033 ± .012) (.033 ± .012) (.033 ± .012) (.033 ± .012)<br>Current Rating Thermal Derating Curve<br>105<br>100<br>95<br>90<br>85<br>80<br>75<br>70<br>65<br>60<br>55<br>50<br>-55 -35 -15 5 25 45 65 85 105 125<br>MAXIMUM OPERATING TEMPERATURE (°C)<br>DERATING (%)<br>**----- End of picture text -----**<br> Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **SF-1206SxxxW Series - Slow Blow Wire Core Surface Mount Fuses** ## ~~**Solder Refow Recommendations**~~ **==> picture [247 x 157] intentionally omitted <==** **----- Start of picture text -----**<br> Tp<br>Tc -5 °C<br>MAX. RAMP UP RATE = 3 °C/s tp<br>MAX. RAMP DOWN RATE = 6 °C/s<br>TL<br>Tsmax PREHEAT AREA tL<br>Tsmin<br>ts<br>25<br>TIME 25 °C TO PEAK<br>TIME<br>TEMPERATURE (°C)<br>**----- End of picture text -----**<br> |**Profle Feature**|**Pb-Free Assembly**| |---|---| |Preheat / Soak:<br>Temperature Min. (Tsmin)<br>Temperature Max. (Tsmax)<br>Time (ts) from (Tsminto Tsmax)|150 °C<br>200 °C<br>60~120 seconds| |Ramp Up Rate (TLto Tp)|3 °C / second max.| |Liquidous Temperature (TL)<br>Time (tL) maintained above TL|217 °C<br>60~150 seconds| |Peak Package Body<br>Temperature (Tp)|260 °C| |Time (tp)* within 5 °C of the<br>specifed classifcation temperature<br>(Tc)|30 seconds*| |Ramp Down Rate (Tpto TL)|6 °C / second max.| |Time 25 °C to Peak Temperature|8 minutes max.| * Tolerance for peak profile temperature (Tp ) is defined as a supplier minimum and a user maximum. **==> picture [516 x 163] intentionally omitted <==** **----- Start of picture text -----**<br> Recommended Temperature Profle for Wave Soldering<br>260 10 sec. max. Wave soldering is suitable for 1206 size models.<br>150<br>PREHEATING<br>120 seconds TIME<br>TEMPERATURE (°C)<br>**----- End of picture text -----**<br> Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **SF-1206SxxxW Series - Slow Blow W re Core Surface Mount Fuses3312 - 2 mm SMD Trimming Potentiometer** **==> picture [510 x 343] intentionally omitted <==** **----- Start of picture text -----**<br> Average Pre-Arcing Time vs. Current Curves Average I [2] t vs. t Curves<br>4.00 A<br>3.50 A 5.00 A<br>3.15 A 6.30 A<br>3.00 A 7.00 A<br>2.50 A 8.00 A<br>2.00 A 10.00 A<br>1.60 A 12.00 A<br>1.50 A 15.00 A<br>10 10000<br>15.00 A<br>12.00 A<br>10.00 A<br>8.00 A<br>7.00 A<br>6.30 A<br>1 1000 5.00 A4.00 A<br>3.50 A<br>3.15 A<br>3.00 A<br>2.50 A<br>2.00 A<br>1.60 A<br>0.1 100 1.50 A<br>0.01 10<br>0.001 1<br>0.0001 0.1<br>1 10 100 1000 0.0001 0.001 0.01 0.1 1 10<br>CURRENT (A) TIME (SECONDS)<br>s)<br>2<br>t (A<br>2I<br>PRE-ARCING TIME (SECONDS)<br>**----- End of picture text -----**<br> Tel: +886-2 2562-4117 • Email: asiacus@bourns.com **Asia-Pacific: EMEA:** Tel: +36 88 520 390 • Email: eurocus@bourns.com **The Americas:** Tel: +1-951 781-5500 • Email: americus@bourns.com **www.bourns.com** REV. A 03/18 Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. ## **SF-1206SxxxW Series Tape and Reel Packaging Specifications3312 - 2 mm SMD Trimming Potentiometer** |**SF-1206SxxxW Series**<br>**Tape Dimensions**<br>**per EIA 481-2**|**SF-1206SxxxW Series**<br>**Tape Dimensions**<br>**per EIA 481-2**| |---|---| |W|8.10±0.20<br>(.319 ± .008)| |P0|4.0±0.10<br>(.157 ± .004)| |P1|4.0±0.10<br>(.157 ± .004)| |P2|2.0±0.05<br>(.079 ± .002)| |A0|2.05±0.10<br>(.081 ± .004)| |B0|3.50±0.10<br>(.138 ± .004)| |F|3.50±0.05<br>(.138 ± .002)| |E1|1.75±0.10<br>(.069 ± .004)| |D0|1.50+0.10<br>(.059 + .004)| |K0|1.30±0.10<br>(.051 ± .004)| |T|0.22 ±0.05<br>(.009 ± .002)| **==> picture [490 x 280] intentionally omitted <==** **----- Start of picture text -----**<br> PACKAGING: Plastic tape, 3,500 pcs. per reel 13.40 ± 0.50<br>(.539 ± .020)<br>0.8<br>0.60.4 178.00 ± 1.00 60.20 ± 0.50<br>0.2 (7.008 ± .039)DIA. (2.370 ± .020)DIA.<br>2.20 ± 0.30<br>(.087 ± .012)<br>13.20 +0.3/-0.2<br>(.520 +.012/-.008)<br>DIA.<br>1.40 ± 0.20<br>1.20 ± 0.20 (.055 ± .008)<br>(.047 ± .008)<br>E1 D0 P0 P2 T<br>F W<br>B0<br>P1 AO KO DIMENSIONS: (INCHES)MM<br>DIRECTION OF UNREELING<br>0.2<br>0.4<br>0.6<br>0.8<br>**----- End of picture text -----**<br> Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.
Updated at June 9, 2026
Bourns, Inc. is a globally recognized manufacturer of high-reliability electronic components, headquartered in Riverside, California. Renowned for its engineering excellence, the company delivers critical solutions across a diverse range of demanding markets, including automotive, industrial, consumer electronics, telecommunications, and medical equipment. The Bourns product portfolio is anchored by an industry-leading selection of passive components and circuit protection devices. The brand is particularly dominant in magnetic components, offering thousands of high-performance power inductors, alongside specialized RF and toroidal inductors engineered for optimized power management and signal integrity. Equally prominent is their comprehensive suite of circuit protection solutions. This robust lineup features a vast array of standard and resettable fuses, transient voltage suppressors (including TVS varistors and diodes), and gas discharge tubes (GDTs) designed to rigorously safeguard sensitive electronics against overvoltage and overcurrent faults. Beyond its core passives and protection technologies, Bourns manufactures highly effective EMC and RFI suppression components, such as common mode chokes and power line filters. The company's offering also extends into discrete semiconductors and power management, including Schottky diodes, fast recovery rectifiers, bridge rectifiers, and board-level transformers. This expansive breadth of quality components provides design engineers with a trusted foundation for developing resilient, efficient, and long-lasting electronic systems.
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