SF-0603F500-2

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*RoHS COMPLIANT<br>**----- End of picture text -----**<br>


## **SinglFuse[™] SF-0603F Series Features** 

   - n Surface mount packaging for automated assembly 

- n Single blow fuse for overcurrent 

- protection 

n 1608 (EIA 0603) miniature footprint 

- n Fast-acting fuse 

- n UL listed 

- n RoHS compliant* and halogen free** n Thin film chip fuse 

## -i-- **SF-0603F Series - Fast Acting Surface Mount Fuses** i 

## ~~**Electrical Characteristics**~~ 

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|||||||
|---|---|---|---|---|---|
|Resistance|
|Rated Current|Typical|
|Model|Fusing Time|Tolerance ±25 %|Rated Voltage Breaking Capacity|
|(Amps)|I|[2]|t (A|[2]|s) ****|
|(m|Ω|) ***|
|SF-0603F040|0.40|496|DC 50 V|0.004|
|ee|sr|DC 50 V|CS|
|SF-0603F050|0.50|290|50 A|0.005|
|SF-0603F063|0.63|205|0.007|
|ee|CCS~S|
|SF-0603F080|0.80|132|0.014|
|ee|Sd|
|SF-0603F100|1.00|84|0.016|
|ee|sd|
|SF-0603F125|1.25|63|0.027|
|ee|Sd|
|SF-0603F150|1.50|Open within 1 min.|50.5|0.037|
|ee|at 200 % rated|-|
|SF-0603F160|1.60|45|DC 32 V|0.041|
|ee|current|DC 32 V|
|SF-0603F200|2.00|34|50 A|0.044|
|ee|-|
|SF-0603F250|2.50|24.5|0.055|
|ee|-|
|SF-0603F300|3.00|20|0.082|
|ee|TT|
|SF-0603F315|3.15|19|0.089|
|ee|—|tT|
|SF-0603F400|4.00|13|0.239|
|ee|tT|
|SF-0603F500|5.00|11|0.433|
|ee|ee||S|||

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- ***  Resistance value was measured with less than 10 % of rated current. 

****Typical I[2] t value is measured at 10x rated current. 

## ~~**Reliability Testing**~~ 

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|---|---|---|
|Parameter|Requirement|Test Method|
|Carrying Capacity ..................................... No fusing ....................................................Rated current, 4 hours|
|Fusing Time .............................................. Within 1 minute ..........................................200 % of its rated current|
|Interrupting Ability ..................................... No mechanical damages ...........................After the fuse is interrupted, rated voltage applied for|
|30 seconds again|
|Bending Test ............................................. No mechanical damages ...........................Distance between holding points: 90 mm,|
|Bending: 3 mm,1time, 30 seconds|
|Resistance to Solder Heat ........................ ±20 % .........................................................260 °C ±5 °C,10 seconds ±1 second|
|Solderability .............................................. 95 % coverage minimum ...........................235 °C ±5 °C, 2 ±0.5 second|
|245 °C ±5 °C, 2 ±0.5 second (lead free)|
|Temperature Rise ..................................... <75 ° ..........................................................100 % of its rated current, measure of surface|
|temperature|
|Resistance to Dry Heat............................. ±20 % .........................................................105 °C ±5 °C,1000 hours|
|Resistance to Solvent ............................... No evident damage on protective ..............23 °C ±5 °C of isopropyl alcohol, 90 seconds|
|coating and marking|
|Residual Resistance ................................. 10k ohms or more ......................................Measure DC resistance after fusing|
|Thermal Shock ......................................... DR < 10 % ..................................................-20 °C / +25 °C /+125 °C /+25 °C, 10 cycles|

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## ~~**Environmental Characteristics**~~ 

Operating Temperature ..................................................................................-20 °C to +105 °C Storage Conditions Temperature ................................................................................................+5 °C to +35 °C Humidity...........................................................................................................40 % to 75 % Shelf Life........................................................................... 2 years from manufacturing date Moisture Sensitivity Level ........................................................................................................1 ESD Classification (HBM)..............................................................................................Class 6 

- RoHS Directive 2002/95/EC Jan 27 2003 including Annex. 

**Asia-Pacific:** Tel: +886-2 2562-4117 Email: asiacus@bourns.com 

**Europe:** 

Tel: +36 88 520 390 Email: eurocus@bourns.com 

**The Americas:** Tel: +1-951 781-5500 Email: americus@bourns.com **www.bourns.com** 

- **Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; 

(b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. “SinglFuse” is a trademark of Bourns, Inc. Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SinglFuse[™] SF-0603F Series Applications** 

- n Portable memory n Cell phones n LCD monitors n Rechargeable battery packs n Disk drives n Battery chargers n PDAs n Set top boxes n Digital cameras n Industrial controllers 

- n Digital cameras 

- n DVDs 

## **SF-0603F Series - Fast Acting Surface Mount Fuses** 

## ~~**Solder Refow Recommendations**~~ 

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250 Peak: 250 +0/-5 °C<br>230 °C or higher<br>200<br>PRE-HEATING ZONE<br>180 °C<br>PEAK:  250 +0/-5 °C, 5 seconds<br>150 150 °C PRE-HEATING ZONE: 150 to 180 °C, 90 ± 30 seconds<br>90 ± 30 Seconds SOLDERING ZONE: 230 °C or higher, 30 ± 10 seconds<br>100<br>30 ± 10 Seconds<br>SOLDERING ZONE<br>50<br>HEATING TIME<br>TEMPERATURE (°C)<br>**----- End of picture text -----**<br>


## ~~**Product Dimensions**~~ 

## ~~**Recommended Pad Layout**~~ 

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1.6 ± 0.1<br>(.063 ± .004)<br>— — 0.45 ± 0.1<br>(.018 ± .004)<br>0.8 ± 0.1<br>(.031 ± .004)<br>0.35 ± 0.2 0.35 ± 0.2<br>i - — (.014 ± .008) (.014 ± .008)<br>: 1 ee<br>0.3 ± 0.2 0.3 ± 0.2<br>| (.012 ± .008) (.012 ± .008) —1<br>MM<br>DIMENSIONS:<br>(INCHES)<br>PACKAGING:  5,000 pcs./reel<br>**----- End of picture text -----**<br>


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1.02<br>(.040)<br>— 0.45 ± 0.1 | qo 7<br>(.018 ± .004)<br>1.09<br>(.043)<br>a<br>|<br>2.54<br>— (.010) —<br>**----- End of picture text -----**<br>


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Thermal Derating Curve<br>120<br>110<br>100<br>90<br>80<br>-20 0 20 40 60 80 100 120<br>AMBIENT TEMPERATURE (°C)<br>PERCENT OF RATING (%)<br>**----- End of picture text -----**<br>


## ~~**Construction & Material Content**~~ 

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OVERCOAT<br>Sn PLATING<br>FUSE ELEMENT Cu / Ni PLATING<br>CERAMIC SUBSTRATE<br>**----- End of picture text -----**<br>


Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SF-0603F Series - Fast Acting Surface Mount Fuses** 

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Average Time Current Curves Minimum I [2] T V Clear Time Curves<br>1.50 A 1.60 A<br>1.25 A 2.00 A 5.00 A<br>1.00 A 2.50 A 100 4.00 A<br>0.80 A 3.00 A<br>0.63 A 3.15 A 3.15 A3.00 A<br>0.50 A 4.00 A 2.50 A<br>0.40 A 5.00 A 2.00 A<br>1.60 A<br>100 1.50 A<br>10 1.25 A<br>1.00 A<br>0.80 A<br>0.63 A<br>10 0.50 A<br>1 0.40 A<br>1<br>0.1<br>0.1<br>0.01<br>0.01<br>0.001<br>0.001 0.01 0.1 1<br>CLEARING TIME (S)<br>0.001<br>0.1 1 10 100 How to Order<br>CURRENT (A)<br>SF - 0603  F  040  -  2<br>SinglFuse™<br>Typical Part Marking Product Designator<br>Represents total content. Layout may vary. SMD Footprint<br>     1608 (EIA 0603) size<br>Fuse Blow Type<br>F = Fast acting<br>S = Slow blow<br>Rated Current<br>040-500 (400 mA - 5.00 A)<br>RATING CURRENT (A)<br>E = 0.40 S = 2.00 Packaging Type<br>F = 0.50 T = 2.50 - 2 = Tape & Reel (5,000 pcs./reel)<br>I = 0.63 3 = 3.00<br>K = 0.80 U = 3.15<br>L = 1.00 W = 4.00<br>M = 1.25 Y = 5.00<br>P = 1.50 6 = 6.00<br>N = 1.60<br>MIN. I2T (A2 SEC)<br>CLEARING TIME (S)<br>**----- End of picture text -----**<br>


## **SF - 0603  F  040  -  2** 

REV. G 07/17 

Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 

## **SF-0603F Series Tape and Reel Specifications** 

|**SF-0603F Series**<br>**Tape Dimensions**<br>**per EIA 481-2**|**SF-0603F Series**<br>**Tape Dimensions**<br>**per EIA 481-2**|
|---|---|
|W|8.0±0.2<br>(.315 ± .008)|
|P0|4.0±0.1<br>(.157 ± .004)|
|P1|4.0±0.1<br>(.157 ± .004)|
|P2|2.0±0.05<br>(.079 ± .002)|
|A|1.1 ±0.1<br>(.043 ± .004)|
|B|1.9±0.1<br>(.075 ± .004)|
|F|3.5±0.05<br>(.138 ± .002)|
|E|1.75±0.1<br>(.069 ± .004)|
|D0|1.5+0.1/-0<br>(.059 + .004/-0)|
|T|0.64 ±0.1<br>(.025 ± .004)|
|**Reel Dimensions**||
|A|180+0/-3.0<br>(7.087 +0/-.118)|
|B Min.|60.0<br>(2.362)|
|C|13.0± 1.0<br>(.512 ± .039)|
|W|9.0± 1.0<br>(.354 ± .039)|
|T|11.4 ± 2.0<br>(.449 ± .079)|



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MM<br>DIMENSIONS:<br>T (INCHES)<br>W<br>A BOTTOM DO PO E<br>DIA. TAPE TOP<br>TAPE<br>C DIA.<br>B<br>B F<br>W<br>DIA.<br>RESISTOR<br>TAPE A P1 P2<br>PAPER T<br>TAPE<br>DIRECTION OF UNREELING<br>**----- End of picture text -----**<br>


Specifications are subject to change without notice. 

The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications.