SETP0805-100-SE

**PolySwitch® Temperature Indicators** Surface Mount > setP™ Series 

~~[__}~~ ~~**RoHS** @ HF SAM~~ 

## ~~-~~ setP™ Temperature Indicators f ~~or USB Type C~~ 

## **Description** 

The Littelfuse setP™ temperature indicator helps protect USB Type-C plugs from overheating.  It has been designed to the unique specifications of USB Type-C and is capable of helping to protect even the highest levels of USB Power Delivery. 

## **Features** 

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Agency Approvals<br>Agency Agency File Number<br>ee<br>E74889<br>ee,<br>**----- End of picture text -----**<br>


- Compact footprint: • Easy part selection 0805 mils (2.0 x 1.2mm) 

- USB Power Delivery 

- • Sensitive and reliable compliant temperature indication 

- Protects systems with 

- • SMD compatible with 100W or higher power reflow soldering process 

- Lead-free, halogen-free, 

- • Zero IR loss contribution and RoHS compliant 

## **Applications** 

- USB Type-C Plugs 

- USB Type-C Plugs • Fast charging standards • Chargers with captive and protocols compliant Type-C Cables with USB-C and USB-PD 

|**Temperature Indication Characteristics**|**Temperature Indication Characteristics**|**Temperature Indication Characteristics**||||
|---|---|---|---|---|---|
|Part Number<br>SETP0805-100-SE<br>~~I~~|Marking Code<br>Indicating Temperature, Tind(°C)<br>Resistance (Ω)<br>Min<br>Typical1<br>Max<br>Max at 25°C2<br>Rind 3<br>T<br>90<br>100<br>110<br>12<br>35,000<br>~~_——————EEE~~|||||
|**Notes:**||||||



1.  Tind = Typical indicating temperature: Typical temperature when device switches to indicating resistance (Rind) 

2.  Maximum post reflow resistance measured at 25°C in still air 

3.  Rind = Indicating resistance when device reaches the indicating temperature (Tind) 

© 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/11/18 

**PolySwitch® Temperature Indicators** Surface Mount > setP™ Series 

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## **Electrical Characteristics** 

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Maximum<br>Part Number Ihold (A)1 I(A)trip 2 (Vdc)Vmax 3 Imax (A)4 Pd (W)5 typ.  Current Time-To-TripTime  Rmin Resistance6 R1max 7<br>(A) (Sec.) (Ω) (Ω)<br>SETP0805-100-SE 0.06 0.25 6 1 0.6 0.3 1 0.5 12<br>**----- End of picture text -----**<br>


**Notes:** 

1. Ihold = Hold current: maximum current device will pass without tripping in 20°C still air 

2. Itrip = Trip current: minimum current at which the device will trip in 20°C still air 

3. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 

4. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) 

5. Pd = Power dissipated from device when in the tripped state at 20°C still air 

6. Rmin = Minimum resistance of device in initial (un-soldered) state 

7. R1max = Maximum resistance of device at 20°C measured one hour after tripping or reflow Soldering of 260°C for 20 seconds _(Values specified were determined using PCBs with 0.115in x 1.0in ounce copper traces)_ 

**Caution:** Operation beyond the specified rating may result in damage and possible arcing and flame 

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Resistance Vs. Temperature Curve<br>SETP0805 -100 - SE<br>1.E+10<br>1.E+09<br>1.E+08<br>1.E+07<br>1.E+06<br>1.E+05<br>1.E+04<br>1.E+03<br>1.E+02<br>1.E+01<br>1.E+00<br>20 40 60 80 100 120 140<br>Temperature (ºC)<br>Resistance (Ω)<br>**----- End of picture text -----**<br>


## **Environmental Specifications** 

||**Operating Temperature**|-40°C to +85°C|
|---|---|---|
||**Passive Aging**|+70°C 1000 hours<br>≤ R1maxafter test|
||**Humidity Aging**<br>**Thermal Shock**<br>**Solvent Resistance**|+60°C, 90% R.H., 1000 hours<br>≤ R1maxafter test<br>MIL–STD–202, Method 215<br>No change<br>-40°C to +85°C, 10 Cycles<br>MIL–STD–202, Method 215<br>No change|
||**Vibration**|MIL–STD–883, Method 2007,<br>Condition A No change|
||**Moisture Sensitivity Level**|Level 2a, J–STD–020|



**Physical Specifications** Solder-Plated Copper **Terminal Material** (Solder Material: Matte Tin (Sn)) Meets EIA Specification RS186-9E, **Lead Solderability** ANSI/J-STD-002, Category 3. 

© 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/11/18 

**PolySwitch® Temperature Indicators** Surface Mount > setP™ Series 

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## **Soldering Parameters** 

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Profile Feature Pb-Free Assembly<br>t P<br>Average Ramp-Up Rate (TS(max) to  TP) 3°C/second max T P Ramp-up Critical Zonet L  to t P<br>Pre Heat: Temperature Min (TTemperature Max (Ts(min)s(max))) 150°C 200°C T S(max) T L t L<br>Time (Min to Max) (ts) 60 – 120 secs Ramp-down<br>Preheat<br>Time Maintained  Temperature (TL) 217°C  T S(min)<br>Above: Temperature (tL) 60 – 150 seconds t S<br>Peak / Classification Temperature (TP) 260 [+0/-5]  °C 25<br>Time within 5°C of actual peak  30 seconds max time to peak temperature Time<br>Temperature (tp)<br>Ramp-down Rate 2°C/second max --  All temperature refer to topside of the package, measured on the package body surface<br>Time 25°C to peak Temperature (TP) 8 minutes Max. --  If reflow temperature exceeds the recommended profile, devices may not meet the  performance requirements<br>--  Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead<br>--  Recommended maximum paste thickness is  0.25mm (0.010 inch)<br>--  Devices can be cleaned using standard industry methods and solvents<br>-- Devices can be reworked using the standard industry practices<br>Dimensions<br>A B Solder Pad Layout<br>C F G<br>D E E<br>Marking Code varies by device.<br>See Temperature Indication<br>Characteristics Table.<br>Device Dimension Solder Pad<br>A B C D E F G<br>Part Number<br>inch mm inch mm inch mm inch mm<br>inch mm inch mm inch mm<br>Min Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max<br>SETP0805-100-SE 0.079 0.087 2.00 2.20 0.017 0.025 0.43 0.60 0.051 0.079 1.30 2.00 0.010 0.030 0.25 0.75 0.039 1.00 0.047 1.20 0.059 1.50<br>Part Ordering Number System Packaging<br>SETP 0805 -100 -SE Minimum<br>Ordering Packaging<br>Part Number Order  Quantity<br>Number Option<br>Quantity<br>SERIES SETP0805-100-SE RF4795-000 20,000 Tape & Reel 4,000<br>SIZE<br>Temperature<br>**----- End of picture text -----**<br>


## **INDICATING TEMP** 

## **SINGLE-END CABLE** 

© 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/11/18 

**PolySwitch® Temperature Indicators** 

Surface Mount > setP™ Series 

## **Installation and Handling Guidelines** 

- Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire. 

- These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such conditions are expected to be repetitive or prolonged in duration. 

- Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices. 

   - Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device. 

   - Hand-soldering of PTC devices on boards is generally not recommended. Users shall define and verify this process if needed. 

   - Consult Littelfuse when the device is to be applied with thermal processes other than reflow process on the circuit board, such as molding, encapsulation. User should evaluate molding materials used in the charging cable applications to ensure there are no adverse effect on the PTC devices. 

- These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses. 

## **Tape and Reel Specifications** 

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SETP0805-100-SE<br>W 8.0 ± 0.30<br>P0 4.0 ± 0.10<br>P1 4.0 ± 0.10<br>P2 2.0 ± 0.05<br>A0 1.70 ± 0.10<br>B0 2.45 ± 0.10<br>B1 max. 4.35<br>D0 1.55 ± 0.05<br>F 3.50 ± 0.05<br>E1 1.75 ± 0.10<br>E2 min. 6.25<br>T max. 0.3<br>T1 max. 0.1<br>K0 0.86 ± 0.10<br>A max. 179<br>N min. 53.5<br>W1 9.5 ± 0.5<br>W2 max. 15<br>**----- End of picture text -----**<br>


**Standard Pack Quantity: 4,000 pcs Minimum Order Quantity: 20,000 pcs** 

Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. 

© 2018 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 09/11/18