SDM10K45-7-F

**SDM10K45** [ **SURFACE MOUNT SCHOTTKY BARRIER DIODE** 

## **Features** 

- Fast Switching Speed 

- Ultra-Small Surface Mount Package 

- For General Purpose Switching Applications 

- High Conductance 

- **Lead, Halogen and Antimony Free, RoHS Compliant "Green" Device (Notes 3 and 4)** 

- **Qualified to AEC-Q101 Standards for High Reliability** 

## **Mechanical Data** 

- Case: SOD-323 

- Case Material:  Molded Plastic.  UL Flammability  Classification Rating 94V-0 

- Moisture Sensitivity: Level 1 per J-STD-020 

- Terminals: Matte Tin Finish annealed over Alloy 42 leadframe (Lead Free Plating).Solderable per MIL-STD-202, Method 208 

- Polarity: Cathode Band 

- Marking Information: See Page 2 

- Ordering Information: See Page 2 

- Weight: 0.006 grams (approximate) 

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## **Maximum Ratings** @TA = 25°C unless otherwise specified 

|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|**Maximum Ratingsgss** @TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|
|---|---|---|---|
|||||
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|45|V|
|RMS Reverse Voltage|VR(RMS)|40|V|
|Forward Continuous Current(Note 1)|IFM|100|mA|
|Forward Surge Current<br> @t < 8.3ms|IFSM|1.0|A|



## **Thermal Characteristics** 

|**Thermal Characteristics**||||
|---|---|---|---|
|**Characteristic**|**Symbol **|**Value**|**Unit**|
|Power Dissipation(Note 1)|PD|200|mW|
|Thermal Resistance Junction to Ambient Air(Note 1)|RθJA|500|°C/W|
|Operatingand Storage Temperature Range(Note 5)|TJ,TSTG|-40 to +150|°C|



## **Electrical Characteristics** @TA = 25°C unless otherwise specified 

|**Electrical Characteristics**@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|@TA = 25°C unless otherwise specifiedA = 25°C unless otherwise specified= 25°C unless otherwise specified|||||
|---|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max **|**Unit**|**Test Condition **|
|Reverse Breakdown Voltage(Note 2)|V(BR)R|45|⎯|⎯|⎯|IR= 100μA|
|Forward Voltage|VF|⎯|370|450|mV|IF= 10mA|
|Reverse Leakage Current(Note 2)|IR|⎯|0.07|1.0|μA|VR= 10V|
|Total Capacitance|CT|⎯|6.0|⎯|pF|VR= 10V,f = 1.0MHz|



- Notes: 1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf 

   2. Short duration pulse test used to minimize self-heating effect. 

   3. No purposefully added lead. Halogen and Antimony Free. 

   4. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants. 

   5. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/RθJA 

1 of 4 **www.diodes.com** 

SDM10K45 Document number: DS30256 Rev. 15 - 2 

June 2010 © Diodes Incorporated 

**SDM10K45** 

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100 100<br>A 7 A es es |<br>TA = 125ºC FALL<br>80<br>TA = 75ºC<br>10<br>60 P| NE M E=eey ee =ts TA E  = 25ºC<br>[ |  eyfy |f | tT tTes7 7<br>40<br>TA = -25ºC<br>1.0 u g<br>20 TT  TN | Se eSS S<br>A ==<br>TJ = 150°C<br>0 LN 0.1 |TPEA TTP Ty tT tTEEEyt<br>0 25 50 75 100 125 150 0 200 400 600 800 1.0<br>TA,  AMBIENT TEMPERATURE (°C) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Fig. 1  Forward Current Derating Curve Fig. 2  Typical Forward Characteristics<br>100<br>z 1000 _— e n<br>— a P o ee J<br>a7 100 4050 a w pooft T ia<br>a a _<br>8 _—— F eSSsSs t csSs isSs P| | | | | | lf<br>3 10 _ | | |] | C T<br>Ww a es eee ee ee ee ee 10 e T<br>®3 © 1.0  LoeweSS | || | | Ne S  e e eeree e e<br>FA a | INE | | hE ht<br>0.1<br>fe SS SSS|  SSS | =<br>Pee F 0.01 se 1.0 OT PS|<br>0 10 20 30 40 0 5.0 10 15 20 25 30 35 40<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>Fig. 3  Typical Reverse Characteristics<br>Fig. 4  Total Capacitance vs. Reverse Voltage<br> AVERAGE RECTIFIED CURRENT (mA)<br>IO,<br>, INSTANTANEOUS FORWARD CURRENT (mA)<br>IF<br>, TOTAL CAPACITANCE (pF)<br>T<br>C<br>**----- End of picture text -----**<br>


## **Ordering Information** (Note 6) 

|**Ordering Informationg Information Information** (Note 6)|||
|---|---|---|
|**Part Number**|**Case**|**Packaging**|
|SDM10K45-7-F|SOD-323|3000/Tape &Reel|



Notes: 6. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf. 

## **Marking Information** 

LG LG = Product Type Marking Code Cathode band denotes polarity 

2 of 4 **www.diodes.com** 

SDM10K45 Document number: DS30256 Rev. 15 - 2 

June 2010 © Diodes Incorporated 

**SDM10K45** 

## **Package Outline Dimensions** 

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C<br>H<br>SOD-323<br>== Dim  Min  Max<br>A  0.25 0.35<br>B A<br>B  1.20 1.40<br>C 2.30 2.70<br>H  1.60 1.80<br>Phe J  0.00  0.10<br>K  1.0  1.1<br>L  0.20 0.40<br>M M  0.10 0.15<br>K<br>J α 0°  8°<br>L<br>All Dimensions in mm<br>+ yD,<br>**----- End of picture text -----**<br>


## **Suggested Pad Layout** 

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C<br>—<br>X<br>fF<br>Y G<br>Z<br>ann<br>**----- End of picture text -----**<br>


|**Dimensions**|**Value (in mm)**|
|---|---|
|**Z**|3.75|
|**G**|1.05|
|**X**|0.65|
|**Y**|1.35|
|**C**|2.40|



3 of 4 **www.diodes.com** 

SDM10K45 Document number: DS30256 Rev. 15 - 2 

June 2010 © Diodes Incorporated 

**SDM10K45** 

## **IMPORTANT NOTICE** 

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). 

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others.  Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. 

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. 

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## **LIFE SUPPORT** 

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: 

- A.   Life support devices or systems are devices or systems which: 

   1. are intended to implant into the body, or 

   2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. 

B.   A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. 

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Copyright © 2010, Diodes Incorporated 

**www.diodes.com** 

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SDM10K45 Document number: DS30256 Rev. 15 - 2 

June 2010 © Diodes Incorporated