SBRB2545CTT4G

## MBRB2545CTG, SBRB2545CTG 

## SWITCHMODE Power Rectifier 

## **D[2] PAK Surface Mount Power Package** 

## **http://onsemi.com** 

The D[2] PAK Power Rectifier is a state−of−the−art device that employs the Schottky Barrier principle with a platinum barrier metal. 

## **Features** 

- Center−Tap Configuration 

## **SCHOTTKY BARRIER RECTIFIER 30 AMPERES, 45 VOLTS** 

- Guardring for Stress Protection 

- Low Forward Voltage 

- 175°C Operating Junction Temperature 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Short Heat Sink Tab Manufactured − Not Sheared 

- Similar in Size to the Industry Standard TO−220 Package 

- AEC−Q101 Qualified and PPAP Capable 

- SBRB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

- All Packages are Pb−Free* 

## **Mechanical Characteristics** 

- Case: Epoxy, Molded, Epoxy Meets UL 94 V−0 

- Weight: 1.7 Grams (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

- Device Meets MSL1 Requirements 

- ESD Ratings: 

   - ♦ Machine Model = C (> 400 V) 

   - ♦ Human Body Model = 3B (> 8000 V) 

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D [2] PAK<br>CASE 418B<br>STYLE 3<br>1<br>4<br>3 ae,<br>MARKING DIAGRAM<br>AY   WW<br>B2545G<br>AKA<br>=<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>B2545 = Device Code<br>G = Pb−Free Package<br>AKA = Diode Polarity<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBRB2545CT/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **November, 2013 − Rev. 12** 

**MBRB2545CTG, SBRB2545CTG** 

## **MAXIMUM RATINGS** (Per Leg) 

|**MAXIMUM RATINGS**(Per Leg)||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|45|V|
|Average Rectified Forward Current<br>(Rated VR, TC= 164°C) Total Device|IF(AV)|15<br>30|A|
|Peak Repetitive Forward Current<br>(Rated VR, Square Wave, 20 kHz, TC= 160°C)|IFRM|30|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|150|A|
|Peak Repetitive Reverse Surge Current (2.0�s, 1.0 kHz)|IRRM|1.0|A|
|Storage Temperature Range|Tstg|−65 to +175|°C|
|Operating Junction Temperature (Note 1)|TJ|−65 to +175|°C|
|Voltage Rate of Change(Rated VR)|dv/dt|10,000|V/�s|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 

## **THERMAL CHARACTERISTICS** (Per Leg) 

|**THERMAL CHARACTERISTICS**(Per Leg)||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance,<br>Junction−to−Case<br>Junction−to−Ambient (Note 2)|R�JC<br>R�JA|1.5<br>50|°C/W|



2. When mounted using minimum recommended pad size on FR−4 board. 

## **ELECTRICAL CHARACTERISTICS** (Per Diode) 

|**Symbol**|**Characteristic**|**Condition**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|VF|Instantaneous Forward Voltage<br>(Note 3)|IF= 15 Amp, TJ= 25°C<br>IF= 15 Amp, TJ= 125°C<br>IF= 30 Amp, TJ= 25°C<br>IF= 30 Amp, TJ= 125°C|−<br>−<br>−<br>−|−<br>0.50<br>−<br>0.65|0.62<br>0.57<br>0.82<br>0.72|V|
|IR|Instantaneous Reverse Current<br>(Note 3)|VR= 45 Volts, TJ= 25°C<br>VR= 45 Volts, TJ= 125°C|−<br>−|−<br>9.0|0.2<br>25|mA|



3. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|MBRB2545CTG|D2PAK<br>(Pb−Free)|50 Units / Rail|
|SBRB2545CTG|D2PAK<br>(Pb−Free)|50 Units / Rail|
|MBRB2545CTT4G|D2PAK<br>(Pb−Free)|800 Units / Tape & Reel|
|SBRB2545CTT4G|D2PAK<br>(Pb−Free)|800 Units / Tape & Reel|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

**http://onsemi.com** 

**2** 

**MBRB2545CTG, SBRB2545CTG** 

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1000 200<br>100<br>4020 T J  = 150 ° C<br>100 10<br>4.0 125 ° C<br>TJ = 125 ° C 2.0<br>1.0<br>10 100 ° C<br>0.4<br>0.2<br>150 ° C 0.1 75 ° C<br>1.0 0.04<br>25 ° C 0.020.01 25 ° C<br>0.004<br>0.1 0.002<br>0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 10 20 30 40 50<br>VF�, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 1. Typical Forward Voltage, Per Leg Figure 2. Typical Reverse Current, Per Leg<br>32 26<br>SQUARE WAVE 24 DC<br>28 T J  = 125°C 22<br>IPK 20<br>24 (RESISTIVE LOAD) I AV = � 18<br>DC SQUARE<br>20 16<br>5<br>(CAPACITIVE 14<br>16 LOADS) 10 12<br>12 10<br>IPK = 20 8<br>8 IAV 6<br>4<br>4<br>2<br>0 0<br>0 4 8 12 16 20 24 28 32 36 40 145 150 155 160 165 170 175<br>IF, AVERAGE FORWARD CURRENT (AMPS) TC, CASE TEMPERATURE ( ° C)<br>, REVERSE CURRENT (mA)<br>IR<br>IF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>, AVERAGE FORWARD CURRENT (A)<br>, AVERAGE FORWARD POWER DISSIPATION (WATTS)<br>IF(AV)<br>PF(AV)<br>**----- End of picture text -----**<br>


**Figure 3. Typical Forward Power Dissipation** 

**Figure 4. Current Derating, Case per Leg** 

**http://onsemi.com** 

**3** 

**MBRB2545CTG, SBRB2545CTG** 

## **PACKAGE DIMENSIONS** 

**D[2] PAK 3** CASE 418B−04 ISSUE K 

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NOTES:<br>C 1. DIMENSIONING AND TOLERANCING<br>PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>−B− V 3. 418B−01 THRU 418B−03 OBSOLETE,NEW STANDARD 418B−04.<br>W<br>4 INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>A 0.340 0.380 8.64 9.65<br>B 0.380 0.405 9.65 10.29<br>A C 0.160 0.190 4.06 4.83<br>S D 0.020 0.035 0.51 0.89<br>1 2 3 E 0.045 0.055 1.14 1.40<br>F 0.310 0.350 7.87 8.89<br>G 0.100 BSC 2.54 BSC<br>−T− H 0.080 0.110 2.03 2.79<br>K J 0.018 0.025 0.46 0.64<br>SEATINGPLANE G J W KL 0.0520.090 0.0720.110 1.322.29 1.832.79<br>M 0.280 0.320 7.11 8.13<br>H N 0.197 REF 5.00 REF<br>D 3 PL P 0.079 REF 2.00 REF<br>R 0.039 REF 0.99 REF<br>0.13 (0.005) M T B M S 0.575 0.625 14.60 15.88<br>V 0.045 0.055 1.14 1.40<br>VARIABLE STYLE 3:<br>CONFIGURATION PIN 1. ANODE<br>ZONE N P 2. CATHODE<br>R 3. ANODE<br>U 4. CATHODE<br>L L L<br>M M M<br>F F F<br>VIEW W−W VIEW W−W VIEW W−W<br>1 2 3<br>SOLDERING FOOTPRINT*<br>10.49<br>8.38<br>16.155<br>2X<br>3.504<br>2X<br>1.016<br>5.080<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**http://onsemi.com** 

**4** 

**MBRB2545CTG, SBRB2545CTG** 

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**MBRB2545CT/D** 

**5**