SBRB1545CTT4G

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## Switch-mode Power Rectifier 

## D[2] PAK Surface Mount Power Package 

## **SCHOTTKY BARRIER RECTIFIER 15 AMPERES 45 VOLTS** 

## MBRB1545CTG, SBRB1545CTG 

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D [2] PAK<br>CASE 418B<br>STYLE 3<br>1<br>4<br>3<br>a<br>MARKING DIAGRAM<br>AY    WW<br>B1545G<br> AKA<br>**----- End of picture text -----**<br>


The D[2] PAK Power Rectifier employs the Schottky Barrier principle **CASE 418B** with a platinum barrier metal. These state-of-the-art devices have the **STYLE 3** following features: 

**Features** 1  Center−Tap Configuration 4 3 

- Guardring for Stress Protection 

- Low Forward Voltage 

- 175  C Operating Junction Temperature 

- Epoxy Meets UL 94, V−0 @ 0.125 in 

- Short Heatsink Tab Manufactured − Not Sheared 

- Similar in Size to the Industry Standard TO220 Package 

- SBRB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free and are RoHS Compliant* 

## **Mechanical Characteristics** 

- Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 

- Weight: 1.7 grams (approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260  C Max. for 10 Seconds 

- Device Meets MSL1 Requirements 

- ESD Ratings: 

   - Machine Model = C (> 400 V) 

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B1545 = Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>G  = Pb−Free Package<br>AKA = Diode Polarity<br>**----- End of picture text -----**<br>


## **ORDERING INFORMATION** 

See detailed ordering and shipping information on page 3 of this data sheet. 

NOTE: Some of the devices on this data sheet have been **DISCONTINUED** . Please refer to the table on page 3. 

- Human Body Model = 3B (> 8000 V) 

> *For additional information on our Pb-Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBRB1545CT/D** 

**1** 

 Semiconductor Components Industries, LLC, 2012 **November, 2024 − Rev. 14** 

**MBRB1545CTG, SBRB1545CTG** 

## **MAXIMUM RATINGS** (Per Leg) 

|**Symbol**|**Rating**|**Value**|**Unit**|
|---|---|---|---|
|VRRM<br>VRWM<br>VR|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|45|V|
|IF(AV)|Average Rectified Forward Current<br>(Rated VR, TC= 167C) Total Device|7.5<br>15|A|
|IFRM|Peak Repetitive Forward Current<br>(Rated VR, Square Wave, 20 kHz, TC= 166C)|15|A|
|IFSM|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|150|A|
|IRRM<br>~~a~~|Peak Repetitive Reverse Surge Current (2.0 s, 1.0 kHz)|1.0|A|
|Tstg|Storage Temperature Range|−65 to +175|C|
|TJ|Operating Junction Temperature (Note 1)|−65 to +175|C|
|dv/dt<br>~~a~~|Voltage Rate of Change (Rated VR)|10,000|V/ s|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R 8 JA. 

## **THERMAL CHARACTERISTICS** (Per Leg) 

|**Symbol**|**Characteristic**|**Value**|**Unit**|
|---|---|---|---|
|R JC<br>R JA<br>8<br>8|Thermal Resistance<br>Junction to Case<br>Junction to Ambient (Note 2)|2.0<br>50|C/W|



2. When mounted using minimum recommended pad size on FR−4 board. 

## **ELECTRICAL CHARACTERISTICS** (Per Leg) 

|**ELECTRICAL CHARACTERISTICS**|**ELECTRICAL CHARACTERISTICS**(Per Leg)|||
|---|---|---|---|
|**Symbol**|**Characteristic**|**Value**|**Unit**|
|VF|Maximum Instantaneous Forward Voltage (Note 3)<br>(iF= 7.5 Amps, TJ= 125C)<br>(iF= 15 Amps, TJ= 125C)<br>(iF= 15 Amps, TJ= 25C)|0.57<br>0.72<br>0.84|V|
|iR|Maximum Instantaneous Reverse Current (Note 3)<br>(Rated dc Voltage, TJ= 125C)<br>(Rated dc Voltage, TJ= 25C)|15<br>0.1|mA|



3. Pulse Test: Pulse Width = 300 s, Duty Cycle u  2.0%. 

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**MBRB1545CTG, SBRB1545CTG** 

## **TYPICAL CHARACTERISTICS** 

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50<br>SSS SSSS S SSS<br>3020 OEE 10 a a a a a<br>10 125  C<br>aes eee 1 ee<br>3 85  C<br>2 Se ee Se —— eee<br>1 DO 0.1<br>0.5 125  C 85  C 25  C 0.01 25  C<br>i oo oo eee eeE e<br>-—__{ | __+__{___}___}__}__ J e e<br>Ps es ss 0.001 | +r | [| {| { { { { {|<br>0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 10 20 30 40 50<br>vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 1. Typical Forward Voltage, Per Leg Figure 2. Typical Reverse Current, Per Leg<br>14<br>16<br>TJ = 125  C IPK = DC<br>14 Pe I AV 12<br>IPK<br>12 pf  | IPK = 10 IAV = 5 i 10 e e<br>10 IPK I AV SQUARE<br>= = 20 oA 8 V N<br>IAV<br>8 + p68<br>DC 6<br>6<br>| Spe 4 f o<br>| SQUARE S<br>4<br>WAVE<br>2<br>2 OB B AP eeee\<br>0 Ae FF] hE 0 dTUN<br>0 2 4 6 8 10 12 14 16 155 160 165 170 175<br>IF(AV), AVERAGE FORWARD CURRENT (AMPS) TC, CASE TEMPERATURE (C)<br>, REVERSE LEAKAGE CURRENT (mA)<br>IR<br>iF, INSTANTANEOUS FORWARD CURRENT (AMPS)<br>, AVERAGE FORWARD CURRENT (A)<br>, AVERAGE FORWARD POWER DISSIPATION (WATTS)PF(AV) IF(AV)<br>**----- End of picture text -----**<br>


**Figure 3. Typical Forward Power Dissipation** 

**Figure 4. Current Derating, Case, Per Leg** 

## **ORDERING INFORMATION** 

|**ORDERING INFORMATION**|||
|---|---|---|
|**Device**|**Package**|**Shipping**†|
|MBRB1545CTT4G|D2PAK<br>(Pb−Free)|800 / Tape & Reel|
|SBRB1545CTT4G|D2PAK<br>(Pb−Free)|800 / Tape & Reel|



## **DISCONTINUED** (Note 4) 

|**DISCONTINUED**(Note 4)|||
|---|---|---|
|MBRB1545CTG|D2PAK<br>(Pb−Free)|50 Units / Rail|
|SBRB1545CTG|D2PAK<br>(Pb−Free)|50 Units / Rail|



†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

4. **DISCONTINUED:** These devices are not recommended for new design. Please contact your **onsemi** representative for information. The most current information on these devices may be available on www.onsemi.com. 

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MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**D[2] PAK 3** CASE 418B−04 ISSUE L 

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DATE 17 FEB 2015 

**SCALE 1:1** 

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NOTES:<br>C 1. DIMENSIONING AND TOLERANCING<br>PER ANSI Y14.5M, 1982.<br>E 2. CONTROLLING DIMENSION: INCH.<br>−B− V 3. 418B−01 THRU 418B−03 OBSOLETE,NEW STANDARD 418B−04.<br>W<br>4 INCHES MILLIMETERS<br>DIM MIN MAX MIN MAX<br>A 0.340 0.380 8.64 9.65<br>B 0.380 0.405 9.65 10.29<br>A C 0.160 0.190 4.06 4.83<br>S D 0.020 0.035 0.51 0.89<br>1 2 3 E 0.045 0.055 1.14 1.40<br>F 0.310 0.350 7.87 8.89<br>G 0.100 BSC 2.54 BSC<br>−T− H 0.080 0.110 2.03 2.79<br>K J 0.018 0.025 0.46 0.64<br>SEATINGPLANE G J W KL 0.0900.052 0.0720.110 2.291.32 2.791.83<br>M 0.280 0.320 7.11 8.13<br>H N 0.197 REF 5.00 REF<br>D 3 PL P 0.079 REF 2.00 REF<br>R 0.039 REF 0.99 REF<br>0.13 (0.005) M T B M S 0.575 0.625 14.60 15.88<br>V 0.045 0.055 1.14 1.40<br>VARIABLE<br>CONFIGURATION<br>ZONE N P<br>R<br>U<br>L L L<br>M M M<br>F F F<br>VIEW W−W VIEW W−W VIEW W−W<br>1 2 3<br>STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: STYLE 6:<br>PIN 1. BASE PIN 1. GATE PIN 1. ANODE PIN 1. GATE PIN 1. CATHODE PIN 1. NO CONNECT<br>2. COLLECTOR 2. DRAIN 2. CATHODE 2. COLLECTOR 2. ANODE 2. CATHODE<br>3. EMITTER 3. SOURCE 3. ANODE 3. EMITTER 3. CATHODE 3. ANODE<br>4. COLLECTOR 4. DRAIN 4. CATHODE 4. COLLECTOR 4. ANODE 4. CATHODE<br>**----- End of picture text -----**<br>


## **MARKING INFORMATION AND FOOTPRINT ON PAGE 2** 

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Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98ASB42761B Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION:  D [2] PAK 3 PAGE 1 OF 2<br>**----- End of picture text -----**<br>


**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2019 

DATE 17 FEB 2015 

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D [2] PAK 3<br>CASE 418B−04<br>ISSUE L<br>**----- End of picture text -----**<br>


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GENERIC<br>MARKING DIAGRAM*<br>xx AYWW<br>xxxxxxxxG<br>xxxxxxxxx xxxxxxxxG<br>AYWW<br>AWLYWWG  AKA<br>IC Standard Rectifier<br>xx = Specific Device Code<br>A = Assembly Location<br>WL = Wafer Lot<br>Y = Year<br>WW = Work Week<br>G = Pb−Free Package<br>AKA = Polarity Indicator<br>**----- End of picture text -----**<br>


*This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

## **SOLDERING FOOTPRINT*** 

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10.49<br>8.38<br>16.155<br>2X<br>3.504<br>2X<br>1.016<br>5.080<br>PITCH<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Electronic versions are uncontrolled except when accessed directly from the Document Repository. **DOCUMENT NUMBER: 98ASB42761B** Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **DESCRIPTION: D[2] PAK 3 PAGE 2 OF 2** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

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