SBAV199LT1G

BAV199L, SBAV199L 

## Dual Series Switching Diode 

## **Features** 

- Low Leakage Current Applications 

- Medium Speed Switching Times 

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- S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **MAXIMUM RATINGS** 

**CASE 318 SOT−23 STYLE 11** 

**Rating Symbol Value Unit** Reverse Voltage VR 70 Vdc ANODE CATHODE 1 2 Forward Current IF 215 mAdc ~~— nan~~ 3 ~~a a~~ Peak Forward Surge Current IFM(surge) ~~es~~ 500 ~~ee~~ mAdc CATHODE/ANODE Repetitive Peak Reverse Voltage VRRM 70 Vdc ~~a~~ Average Rectified Forward Current IF(AV) 715 mAdc **MARKING DIAGRAM** (Note 1) (Averaged Over Any 20 ms Period) ~~eeee eee~~ Repetitive Peak Forward Current IFRM 450 mAdc JY M Non−Repetitive Peak Forward Current IFSM Adc t = 1.0 s 2.0 t = 1.0 ms 1.0 t = 1.0 s 0.5 ~~Ls~~ JY = Specific Device Code **THERMAL CHARACTERISTICS** M = Date Code* **Characteristic Symbol Max Unit** = Pb−Free Package ~~ee es es~~ ; Total Device Dissipation PD (Note: Microdot may be in either location) FR−5 Board (Note 1), TA = 25 ° C 225 mW *Date Code orientation and/or overbar may Derate above 25 ° C 1.8 mW/ ° C vary depending upon manufacturing location. ~~SE~~ Thermal Resistance, Junction−to−Ambient R JA 556 ° C/W ~~aee ee~~ Total Device Dissipation PD **ORDERING INFORMATION** Alumina Substrate (Note 2), TA = 25 ° C 300 mW Derate above 25 ° C 2.4 mW/ ° C **Device Package Shipping**[†] Thermal Resistance, Junction−to−Ambient R JA 417 ° C/W BAV199LT1G SOT−23 3,000 / ~~ee ee~~ (Pb−Free) Tape & Reel ~~ee~~ Junction and Storage Temperature TJ, T ~~es~~ stg −65 to +150 ° C SBAV199LT1G SOT−23 3,000 / Stresses exceeding those listed in the Maximum Ratings table may damage the (Pb−Free) Tape & Reel device. If any of these limits are exceeded, device functionality should not be SBAV199LT3G SOT−23 10,000 / assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 0.75 0.062 in. (Pb−Free) Tape & Reel ~~rT |~~ 2. Alumina = 0.4 0.3 0.024 in. 99.5% alumina. †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 1994 **October, 2016 − Rev. 10** 

**BAV199LT1/D** 

**BAV199L, SBAV199L** 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) (EACH DIODE) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise noted) (EAC|H DIODE)||||
|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Max**|**Unit**|
|**OFF CHARACTERISTICS**|||||
|Reverse Breakdown Voltage<br>(I(BR)= 100�Adc)|V(BR)|70|−|Vdc|
|Reverse Voltage Leakage Current<br>(VR= 70 Vdc)<br>(VR= 70 Vdc, TJ= 150°C)|IR|−<br>−|5.0<br>80|nAdc|
|Diode Capacitance<br>(VR= 0 V, f = 1.0 MHz)|CD|−|2.0|pF|
|Forward Voltage<br>(IF= 1.0 mAdc)<br>(IF= 10 mAdc)<br>(IF= 50 mAdc)<br>(IF= 150 mAdc)|VF|−<br>−<br>−<br>−|900<br>1000<br>1100<br>1250|mVdc|
|Reverse Recovery Time<br>(IF= IR= 10 mAdc) (Figure 1)|trr|−|3.0|�s|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

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820 �<br>IF<br>+10 V 2.0 k 0.1 �F tr t p t<br>100 �H IF 10% t rr t<br>0.1 �F<br>DUT 90%<br>50 � OUTPUT 50 � INPUT iR(REC) = 1.0 mA<br>IR<br>PULSE SAMPLING VR OUTPUT PULSE<br>GENERATOR OSCILLOSCOPE INPUT SIGNAL<br>(IF = IR = 10 mA; MEASURED<br>at iR(REC) = 1.0 mA)<br>**----- End of picture text -----**<br>


Notes: 1. A 2.0 k � variable resistor adjusted for a Forward Current (IF) of 10 mA. Notes: 2. Input pulse is adjusted so IR(peak) is equal to 10 mA. Notes: 3. tp » trr 

**Figure 1. Recovery Time Equivalent Test Circuit** 

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**2** 

**BAV199L, SBAV199L** 

## **TYPICAL CHARACTERISTICS** 

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1,000 100<br>TA = 150 ° C<br>100 10<br>150 ° C 25 ° C −55 ° C<br>10 1.0<br>25 ° C<br>1 0.1 −55 ° C<br>0.1 0.01<br>0 0.2 0.4 0.6 0.8 1.0 1.2 0 10 20 30 40 50 60 70 80<br>VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>, FORWARD CURRENT (mA)IF , REVERSE CURRENT (nA)IR<br>**----- End of picture text -----**<br>


**Figure 2. Forward Voltage** 

**Figure 4. Leakage Current** 

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1.2<br>TA = 25 ° C<br>1.0<br>0.8<br>0.6<br>0.4<br>0.2<br>0<br>0 10 20 30 40 50 60 70 80<br>VR, REVERSE VOLTAGE (V)<br>, TOTAL CAPACITANCE (pF)<br>T<br>C<br>**----- End of picture text -----**<br>


**Figure 3. Capacitance** 

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**3** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

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SOT−23 (TO−236)<br>CASE 318−08<br>ISSUE AS<br>2 DATE 30 JAN 2018<br>SCALE 4:1<br>D NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.<br>0.25 MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF<br>“a 3 t = THE BASE MATERIAL.<br>| E HE T 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,PROTRUSIONS, OR GATE BURRS.<br>1 2<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>L A 0.89 1.00 1.11 0.035 0.039 0.044<br>3X b L1 A1b 0.010.37 0.060.44 0.100.50 0.0000.015 0.0020.017 0.0040.020<br>e VIEW C c 0.08 0.14 0.20 0.003 0.006 0.008<br>TOP VIEW D 2.80 2.90 3.04 0.110 0.114 0.120<br>E 1.20 1.30 1.40 0.047 0.051 0.055<br>e 1.78 1.90 2.04 0.070 0.075 0.080<br>L 0.30 0.43 0.55 0.012 0.017 0.022<br>A L1 0.35 0.54 0.69 0.014 0.021 0.027<br>H E 2.10 2.40 2.64 0.083 0.094 0.104<br>= T 0 ° −−− 10 ° 0 ° −−− 10 °<br>a A1 SIDE VIEW SEE VIEW C c<br>GENERIC<br>END VIEW<br>MARKING DIAGRAM*<br>RECOMMENDED<br>SOLDERING FOOTPRINT XXXM<br>1<br>2.90 i 0.903X XXX = Specific Device Code oo<br>M = Date Code<br>= Pb−Free Package<br>LO | cr ,<br>*This information is generic. Please refer to<br>3X 0.80 a) LL 0.95 device data sheet for actual part marking.<br>PITCH Pb−Free indicator, “G” or microdot “ ”, |<br>DIMENSIONS: MILLIMETERS may or may not be present.<br>STYLE 1 THRU 5: STYLE 6: STYLE 7: STYLE 8:<br>CANCELLED PIN 1. BASE PIN 1. EMITTER PIN 1. ANODE<br>2. EMITTER 2. BASE 2. NO CONNECTION<br>3. COLLECTOR 3. COLLECTOR 3. CATHODE<br>STYLE 9: STYLE 10: STYLE 11: STYLE 12: STYLE 13: STYLE 14:<br>PIN 1. ANODE PIN 1. DRAIN PIN 1. ANODE PIN 1. CATHODE PIN 1. SOURCE PIN 1. CATHODE<br>2. ANODE 2. SOURCE 2. CATHODE 2. CATHODE 2. DRAIN 2. GATE<br>3. CATHODE 3. GATE 3. CATHODE−ANODE 3. ANODE 3. GATE 3. ANODE<br>STYLE 15: STYLE 16: STYLE 17: STYLE 18: STYLE 19: STYLE 20:<br>PIN 1. GATE PIN 1. ANODE PIN 1. NO CONNECTION PIN 1. NO CONNECTION PIN 1. CATHODE PIN 1. CATHODE<br>2. CATHODE 2. CATHODE 2. ANODE 2. CATHODE 2. ANODE 2. ANODE<br>3. ANODE 3. CATHODE 3. CATHODE 3. ANODE 3. CATHODE−ANODE 3. GATE<br>STYLE 21: STYLE 22: STYLE 23: STYLE 24: STYLE 25: STYLE 26:<br>PIN 1. GATE PIN 1. RETURN PIN 1. ANODE PIN 1. GATE PIN 1. ANODE PIN 1. CATHODE<br>2. SOURCE 2. OUTPUT 2. ANODE  2. DRAIN  2. CATHODE  2. ANODE<br>3. DRAIN 3. INPUT 3. CATHODE  3. SOURCE  3. GATE  3. NO CONNECTION<br>STYLE 27: STYLE 28:<br>PIN 1. CATHODE PIN 1. ANODE<br> 2. CATHODE  2. ANODE<br> 3. CATHODE  3. ANODE<br>Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98ASB42226B Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red.<br>DESCRIPTION: SOT−23 (TO−236) PAGE 1 OF 1<br>aes<br>ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.<br>ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding<br>the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically<br>disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the<br>rights of others.<br>**----- End of picture text -----**<br>


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