RN52-I/RM116

**RN52** 

## **RN52 Bluetooth[®] Audio Module** 

## **Features:** 

- Fully qualified Bluetooth® version 3.0 module, 

- Fully compatible with Bluetooth version 2.1+EDR, 1.2, and 1.1 

- Embedded Bluetooth profiles: A2DP, AVRCP, HFP/HSP and SPP 

- Audio decoders: SBC, AAC, aptX 

- Enhanced hands free voice capability narrowband and wideband codecs with cVc DSP 

- Software configurable through commands over UART console interface 

- Stereo analog differential audio output and input for highest quality audio 

- External Audio CODECs Supported via S/PDIF and I2S Interface 

- Integrated Amplifier for Driving 16Ω Speakers 

- Dedicated GPIO pins enable MCUs to access control and status functions efficiently 

- SPP data connection interface over UART 

- Supports wireless iAP profile advertising which is discoverable by iOS devices (iAP protocol implementation on an external host microcontroller required) 

- Certifications: FCC, IC, CE, Bluetooth SIG 

- Postage Stamp sized form factor: 13.5 x 26.0 x 2.7 mm 

- Castellated SMT pads for easy and reliable PCB mounting 

- Environmentally Friendly, RoHS Compliant 

- Bluetooth SIG QDID 58578 

## **Applications:** 

- High-quality wireless stereo headsets 

- Automotive hands free audio kits 

- Wireless audio docking station for smartphones 

- High-quality wireless speakers 

- VoIP handsets 

- Remote control for media player 

## **RN52 Block Diagram:** 

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**----- Start of picture text -----**<br>
RN52<br>2 LEDs PCB Antenna Speaker<br>| A G<br>Bluetooth 3.0<br>MIC<br>RF Baseband<br>Speaker<br>= T L.<br>MIC Audio DSP UART<br>o = 16-Bit Stereo TT<br>CODEC<br>USB<br>||<br>11 GPIO<br>I [2] S 16-Bit RISC MCU<br>Pins<br>ee<br>S/PDIF 16-MBit Flash 1 AIO<br>a ee )| be<br>**----- End of picture text -----**<br>


- Medical data devices 

DS70005120A-page 1 

 2015 Microchip Technology Inc. 

**RN52** 

## **1.0 DEVICE OVERVIEW** 

Microchip’s RN52 Bluetooth audio module provides a highly integrated solution for delivering high-quality stereo audio in a small form factor. It combines a class 2 Bluetooth radio with an embedded DSP processor. The module is programmed and controlled with a simple ASCII command set. 

The RN52 module complies with Bluetooth specification version 3.0. It integrates an RF radio and a baseband controller making it a complete Bluetooth subsystem. The RN52 supports a variety of profiles including A2DP, AVRCP, HSP/HFP, SPP and iAP. It provides a UART interface, several user programmable I/O pins, stereo speaker outputs, microphone inputs, digital audio interface and a USB port. Standard RN52 and its variants support A2DP, AVRCP, HFP, SPP and 

iAP in the capacity of Bluetooth Slave role. RN52SRC supports A2DP, AVRCP, HFP in the capacity of Bluetooth Master role. 

RN52 supports wireless iAP profile advertising which is discoverable by iOS devices. An external host microcontroller is required to implement the iAP protocol and communicate with the authentication coprocessor while using the RN52 as a data pipe only to transfer the iAP protocol data over Bluetooth back and forth with the Apple device. A PIC[®] microcontroller can be used to implement the iAP protocol using the Microchip MFi Library. 

Table 1-1 provides the general specifications for the module. Table 1-2 and Table 1-3 provide the module’s weight, dimensions and electrical characteristics. 

## **TABLE 1-1: GENERAL SPECIFICATIONS** 

|**Specification**|**Description**|
|---|---|
|Standard|Bluetooth®3.0, class 2|
|FrequencyBand|2.4 ~ 2.48 GHz|
|Modulation Method|GFSK, PI/4-DQPSK, 8 DPSK|
|Maximum Data Rate|3 Mbps|
|RF Input Impedance|50 ohms|
|Interface|UART, GPIO, AIO, USB, I2S, S/PDIF, speaker, microphone|
|Operation Range|10 meters(33 feet)|
|Sensitivity|-85 dBm at 0.1 % BER|
|RF TX Power|4 dBm|



## **TABLE 1-2: WEIGHT AND DIMENSIONS** 

|**Specification**|**Description**|
|---|---|
|Dimensions|26.0 mm x 13.5 mm x 2.7 mm|
|Weight|1.2g|



## **TABLE 1-3: ELECTRICAL CHARACTERISTICS** 

|**Specification**|**Description**|
|---|---|
|SupplyVoltage|3.0-3.6V DC|
|Workingcurrent|Depends onprofiles, 30 mA typical|
|Standbycurrent(disconnected)|< 0.5 mA|
|Temperature|-40ºC to +85ºC|
|ESD|JESD22-A224 class 0product|
|Humidity|10% ~ 90% non-condensing|



Figure 1-1 shows the module’s dimensions and Figure 1-2 shows recommended landing pattern and layout. 

DS70005120A-page 2 

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**RN52** 

**==> picture [470 x 286] intentionally omitted <==**

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FIGURE 1-1: MODULE DIMENSIONS<br>(Top View) (Side View)<br>26.00 26.00<br>Dimensions are in millimeters<br>Tolerances:<br>21.20 21.40 21.40 PCB Outline: +/- 0.13 mm<br>20.00 PCB Thickness: +/- 0.100 mm<br>18.80<br>17.60<br>16.40<br>15.20<br>14.00<br>12.80<br>11.60<br>10.40<br>9.20<br>8.00<br>6.80<br>5.60<br>4.40<br>3.20<br>2.00<br>0.70<br>0.0 0.00<br>0.75 12.75<br>0.00 0.85 2.55 3.75 4.95 6.15 7.35 8.55 9.75 10.95 12.65 13.50 2.70 0.80 0.00<br>**----- End of picture text -----**<br>


## **FIGURE 1-2: RECOMMENDED PCB FOOTPRINT** 

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(Top View)<br>0.8mm<br>1.6mm<br>26.00<br>21.20 21.40 Host Ground Plane Edge<br>20.00 20.70 (See Mounting Details)<br>18.80<br>17.60<br>16.40<br>15.20 Ground Pads<br>14.00 0.8 x 1.0 mm<br>12.80<br>11.60<br>10.40 0.80mm<br>9.20<br>8.00<br>6.80<br>5.60<br>4.40<br>3.20<br>2.00<br>0.0<br>Dimensions are in millimeters<br>3.25 4.65 6.05 7.45 8.85 10.25<br>0.00 0.85 2.55 3.75 4.95 6.15 7.35 8.55 9.75 10.95 12.65 13.50<br>**----- End of picture text -----**<br>


Figure 1-3 shows the pinout and Table 1-4 describes the module’s pins. 

DS70005120A-page 3 

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**RN52** 

**FIGURE 1-3:** 

**PIN DIAGRAM** 

**TABLE 1-4: PIN DESCRIPTION[(1)] (SHEET 1 OF 3)** 

|**Pin**|**Symbol**|**I/O Type**|**Description**|**Directio**<br>**n**|**Defau**<br>**lt**|
|---|---|---|---|---|---|
|1|GND|Ground.|Ground.|||
|2|GPIO3|Digital|Driving this pin high during bootup will put the<br>module in Device Firmware Update (DFU)<br>mode. The device will enter DFU mode in 3<br>seconds. The pin should only be asserted high<br>before the device enters DFU mode and not<br>after. (USB device powers VBUS. PIO3 requires<br>47K to ground and 22K to USB VBUS if USB<br>VBUS is supplying power to the main board.)<br>During runtime, if the pin is driven high, the<br>device will reset and reboot.<br>Note: Device will reset within 500 ms after the IO<br>is driven high. A reset pulse of 100 ms is recom-<br>mended. If IO continues to be driven high after<br>reset, the device will naturally enter DFU mode.<br>The device will enter DFU mode in 3 seconds.|Input|Low|
|3|GPIO2|Digital|Reserved, event indicator pin. A microcontroller<br>can enter Command mode and poll the state<br>register usingtheQaction command|Output|High|
|4|AIO0|Bidirectional|Analogprogrammable input/output line|I/O||



DS70005120A-page 4 

 2015 Microchip Technology Inc. 

**RN52** 

## **TABLE 1-4: PIN DESCRIPTION[(1)] (SHEET 2 OF 3)** 

|**Pin**|**Symbol**|**I/O Type**|**Description**|**Directio**<br>**n**|**Defau**<br>**lt**|
|---|---|---|---|---|---|
|5|GPIO4|Digital|Factory Reset mode. To reset the module to the<br>factory defaults, GPIO4 should be high on<br>power-up and then toggle low, high, low, high<br>with a 1 second wait between the transitions.<br>During runtime, the module will enter voice com-<br>mand mode if this pin is driven low.<br>Reserved. Not available for reconfiguring as a<br>general purpose IO pin.|Input|Low|
|6|GPIO5|Bidirectional with program-<br>mable strength internal<br>pull-up/down|Programmable I/O|I/O|High|
|7|GPIO12|Bidirectional with program-<br>mable strength internal<br>pull-up/down|Programmable I/O|I/O|High|
|8|GPIO13|Bidirectional with program-<br>mable strength internal<br>pull-up/down|Programmable I/O|I/O|High|
|9|GPIO11|Bidirectional with program-<br>mable strength internal<br>pull-up/down|Programmable I/O|I/O|High|
|10|GPIO10|Bidirectional with program-<br>mable strength internal<br>pull-up/down|Programmable I/O|I/O|High|
|11|GPIO9|Digital|When you drive this signal low, the module’s<br>UART goes into Command mode. If this signal is<br>asserted high, the UART is in Data mode.<br>Reserved|Input|High|
|12|USBD-|Bidirectional|USB data minus|I/O||
|13|USBD+|Bidirectional|USB data plus with selectable internal 1.5 Kohm<br>pull-upresistor|I/O||
|14|UART_RTS|CMOS output, tri-state, with<br>weak internal pull-up|UART request to send active low|Output||
|15|UART_CTS|CMOS input with weak<br>internalpull-down|UART clear to send active low|Input||
|16|UART_TX|CMOS output, tri-state, with<br>weak internalpull-up|UART data output|Output||
|17|UART_RX|CMOS input with weak<br>internal pull-down|UART data input|Input||
|18|GND|Ground|Ground|||
|19|GPIO7|Bidirectional with program-<br>mable strength internal<br>pull-up/down|Driving this pin low sets the UART baud rate to<br>9,600. By default, the pin is high with a baud rate<br>of 115,200|I/O|High|
|20|GPIO6|Bidirectional with program-<br>mable strength internal<br>pull-up/down|Programmable I/O|I/O|High|
|21|PWREN|Analog|Pull high topower upRN52|Input|Low|
|22|VDD|3.3-V power input|3.3V power input|||
|23|PCM_IN|CMOS input, with weak<br>internalpull down|Synchronous data input, configurable for<br>SPDIF_IN or SD_IN(I2S)|Input||



DS70005120A-page 5 

 2015 Microchip Technology Inc. 

## **RN52** 

**TABLE 1-4: PIN DESCRIPTION[(1)] (SHEET 3 OF 3)** 

|**Pin**|**Symbol**|**I/O Type**|**Description**|**Directio**<br>**n**|**Defau**<br>**lt**|
|---|---|---|---|---|---|
|24|PCM_OUT|CMOS output, with weak<br>internal pull down|Synchronous data output, configurable for<br>SPDIF_OUT or SD_OUT(I2S)|Output||
|25|PCM_SYNC|Bidirectional with weak<br>internalpull down|Synchronous data sync; WS (I2S)|Output||
|26|PCM_CLK|CMOS input, with weak<br>internalpull down|Synchronous data clock; SCK (I2S)|Output||
|27|GND|Ground|Ground|||
|28|SPI_SS|CMOS input with weak<br>internalpull-up|Chip select for Synchronous Serial Interface<br>active low|Input||
|29|SPI_MISO|CMOS output, tri-state, with<br>weak internal pull-down|Serial Peripheral Interface (SPI) output|Output||
|30|SPI_CLK|Input with weak internal<br>pull-down|SPI clock|Input||
|31|SPI_MOSI|CMOS input, with weak<br>internalpull-down|SPI input|Input||
|32|LED1|Open drain output|Drives an LED. For the RN-52-EK Board, this<br>signal drives the red LED|Output||
|33|LED0|Open drain output|Drives an LED. For the RN-52-EK Board, this<br>signal drives the blue LED|Output||
|34|MIC_BIAS|Analog|Microphone bias|Output||
|35|MIC_L+|Analog|Microphone inputpositive, left|Input||
|36|MIC_R+|Analog|Microphone inputpositive, right|Input||
|37|MIC_L-|Analog|Microphone input negative, left|Input||
|38|MIC_R-|Analog|Microphone input negative, right|Input||
|39|AGND|Analog|Ground connection for audio|||
|40|SPK_R-|Analog|Speaker output negative(right side)|Output||
|41|SPK_L-|Analog|Speaker output negative(left side)|Output||
|42|SPK_R+|Analog|Speaker outputpositive(right side)|Output||
|43|SPK_L+|Analog|Speaker output positive(left side)|Output||
|44|GND|Ground|Ground|||
|45|GND|Ground|RFground|||
|46|GND|Ground|RFground|||
|47|GND|Ground|RFground|||
|48|GND|Ground|RFground|||
|49|GND|Ground|RFground|||
|50|GND|Ground|RFground|||



- **Note 1:** All GPIO pins default to input with weak pull-down. 

   - **2:** Refer to the “Bluetooth Audio Module Command Reference User’s Guide” (DS50002154) and the “RN52SRC Bluetooth Audio Module Command Reference User’s Guide” (DS50002343) for more information about the behavior of the pin and optional features that can be enabled. 

DS70005120A-page 6 

 2015 Microchip Technology Inc. 

**RN52** 

## **1.1 Audio Interface Circuit Description** 

The RN52 audio interface circuit consists of: 

- Analog audio interface with differential audio inputs and outputs 

- Digital audio interface with configurable S/PDIF and I[2] S interface (A2DP audio output only) 

The audio input circuitry has a dual audio input that can be configured as single-ended or fully differential and programmed for microphone or line input. It has an analog and digital programmable gain stage so that it can be optimized for different microphones. See Figure 1-5. 

## 1.1.1 DIGITAL AUDIO INTERFACE 

The stereo audio CODEC interface has a digital audio interface. It supports the I2S and S/PDIF interfaces. The RN52 I2S interface is I2S Master and provides the bit clock and phase sync clock. The I2S or S/PDIF interface can be configured through command console. The typical application interface can be seen in Figure 1-4. 

The audio resolution supported is 24-bit and the max channel size is 32-bit. The supported sample rates are 8KHz, 32KHz, 44.1KHz and 48KHz. The audio resolution and the sample rate can be configured using the UART console command. Refer the RN52 command specification for more information. 

**FIGURE 1-4:** 

## **I2S AND SPDIF CONNECTIONS** 

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RN52 DAC/ADC/CODEC/DSP<br>I2S MASTER I2S SLAVE<br>SDOx SDIx<br>SDIx SDOx<br>SCKx Serial Clock SCKx<br>SSx SSx<br>Frame Sync. Pulse<br>RN52 DAC/ADC/CODEC/DSP<br>S/PDIF S/PDIF<br>GND GND<br>S/PDIF OUT S/PDIF IN<br>S/PDIF IN S/PDIF OUT<br>VDD VDD IN<br>**----- End of picture text -----**<br>


## 1.1.2 ANALOG AUDIO INTERFACE 

The audio input circuitry has a dual audio input that can be configured as single-ended or fully differential and programmed for microphone or line input. It has an analog and digital programmable gain stage so that it can be optimized for different microphones. The microphone inputs MIC_L+, MIC_L-, MIC_R+ and MIC_Rare shown in Figure 1-6. 

The audio output circuitry consists of a differential speaker output preceded by a gain stage and a class AB amplifier. The speaker outputs SPK_L+, SPK_L-, SPK_R+ and SPK_R- are shown in Figure 1-6. 

The fully differential architecture in the analog signal path results in low noise sensitivity and good power supply rejection while effectively doubling the signal amplitude. It operates from a 1.5V single power supply and uses a minimum of external components. 

The typical application interface is shown in Figure 1-5. 

DS70005120A-page 7 

 2015 Microchip Technology Inc. 

## **RN52** 

**FIGURE 1-5: RN52 AUDIO INTERFACE BLOCK DIAGRAM** 

**==> picture [246 x 218] intentionally omitted <==**

**----- Start of picture text -----**<br>
RN52 System<br>Mainboard<br>SPK_L+<br>SPK_L- Audio<br>PA<br>SPK_R+<br>SPK_R-<br>S/PDIF & I [2] S<br>MIC_L+<br>MIC_L- MIC &<br>Bias<br>MIC_R+<br>MIC_R-<br>MIC_BIAS<br>**----- End of picture text -----**<br>


**FIGURE 1-6: STEREO CODEC AUDIO INPUT/OUTPUT STAGES** 

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**----- Start of picture text -----**<br>
Input<br>RN52<br>Amplifier<br>MIC_L+<br>ΣΔ-ADC<br>MIC_L-<br>Output<br>Amplifier<br>LP Filter<br>SPK_L+<br>DAC<br>SPK_L-<br>Input Digital<br>Amplifier Circuitry<br>MIC_R+<br>ΣΔ-ADC<br>MIC_R-<br>Output<br>Amplifier<br>LP Filter<br>SPK_R+<br>DAC<br>SPK_R-<br>**----- End of picture text -----**<br>


DS70005120A-page 8 

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**RN52** 

## 1.1.3 ANALOG-TO-DIGITAL CONVERTER (ADC) 

The ADC consists of two second-order sigma delta (SD) converters, resulting in two separate channels with identical functionality. Each ADC supports the following sample rates: 

The ADC analog amplifier is a two-stage amplifier. The first stage selects the correct gain for either microphone or line input. See Figure 1-7. 

- 8 kHz 

- 16 kHz 

- 32 kHz 

- 44.1 kHz 

- 48 kHz 

## **FIGURE 1-7:** 

## **ADC ANALOG AMPLIFIER BLOCK DIAGRAM** 

**==> picture [470 x 165] intentionally omitted <==**

**----- Start of picture text -----**<br>
Bypass or 24-dB Gain -3 to 18 dB Gain<br>P – – P<br>N + + N<br>Line Mode/Microphone Mode Gain 0:7<br>**----- End of picture text -----**<br>


## 1.1.4 DIGITAL-TO-ANALOG CONVERTER (DAC) 

The DAC consists of two third-order SD converters, resulting in two separate channels with identical functionality. Each DAC supports the following sample rates: 

- 8 kHz 

- 16 kHz 

- 32 kHz 

- 44.1 kHz 

- 48 kHz 

## 1.1.4.1 Speaker Output 

## 1.1.4.2 Microphone Input 

The RN52 audio input is intended for use from 1 μA at 94 dB SPL to about 10 μA at 94 dB SPL, which requires microphones with sensitivity between –40 and –60 dBV. The RN52 microphone mode input impedance is typically 6 kohm. The line mode input impedance is typically between 6 kohm and 30 kohm. The overall gain of the microphone input is approximately -3 dB to 42 dB in 1.5 dB steps. MIC_BIAS requires a minimum load to maintain regulation. MIC_BIAS maintains regulation within 0.199 and 1.229 mA. Therefore, if you use a microphone with specifications below these limits, the microphone output must be pre-loaded with a large value resistor to ground. 

The speaker output is capable of driving a speaker with an impedance of at least 8 ohms directly. The overall gain of the speaker output is approximately -21 dB to 0 dB in 1.5 dB steps. 

DS70005120A-page 9 

 2015 Microchip Technology Inc. 

## **RN52** 

## **TABLE 1-5: DIGITAL TO ANALOG CONVERTER** 

|**Parameter**|**Conditions**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Resolution|—||—|—|16|Bits|
|Ouput Sample Rate, Fsample|—||8|—|48|kHz|
|Signal to Noise Ratio, SNR|fin= 1 kHz<br>B/W = 20 Hz→20 kHz<br>A-Weighted<br>THD+N < 0.01%<br>0dBFS signal<br>Load = 100 kΩ|Fsample|—|95|—|dB|
|||8 kHz|—|95|—|dB|
|||16 kHz|—|95|—|dB|
|||32 kHz|—|95|—|dB|
|||44.1 kHz|—|95|—|dB|
|||48 kHz|—|95|—|dB|
|AnalogGain|AnalogGain Resolution = 3 dB||0|—|-21|dB|
|Output voltage full-scale swing (differential)|||—|750|—|mV rms|
|Allowed Load||Resistive|16(8)|—|O.C.|Ω|
|||Capacitive|—|—|500|pF|
|THD + N 100 kΩ load|||—|—|0.01|%|
|THD + N 16 kΩ load|||—|—|0.1|%|
|SNR(Load = 16Ω, 0 dBFS input relative to digital silence)|||—|95|—|dB|



## **TABLE 1-6: ANALOG TO DIGITAL CONVERTER** 

|**TABLE 1-6:**<br>**ANALOG**|**TO DIGITAL CONVERTER**|**TO DIGITAL CONVERTER**|||||
|---|---|---|---|---|---|---|
|**Parameter**|**Conditions**||**Min**|**Typ**|**Max**|**Unit**|
|Resolution|—||—|—|16|Bits|
|Input Sample Rate, Fsample|—||8|—|44.1|kHz|
|Signal to Noise Ratio, SNR|fin= 1 kHz<br>B/W = 20 Hz→20 kHz<br>A-Weighted<br>THD+N < 1%<br>150 mVpk-pkinput|Fsample|||||
|||8 kHz|—|79|—|dB|
|||16 kHz|—|76|—|dB|
|||32 kHz|—|75|—|dB|
|||44.1 kHz|—|75|—|dB|
|AnalogGain|AnalogGain Resolution = 3 dB||—|—|42|dB|
|Input full scale at maximumgain(differential)|||—|4|—|mV rms|
|Input full scale at minimumgain(differential)|||—|800|—|mV rms|
|3 dB Bandwidth|||—|20|—|kHz|
|Microphone mode input impedance|||—|6.0|—|kΩ|
|THD + N(microphone input) @30 mV rms input|||—|0.04|—|%|



DS70005120A-page 10 

 2015 Microchip Technology Inc. 

**RN52** 

## **1.2 General Purpose IO (GPIO) Ports** 

User programmable bidirectional GPIO ports are provided. The GPIO ports can be used as typical digital IO ports. The directionality of the GPIOs can be configured through console commands. The GPIOs can also be read or asserted using the console commands. The digital input and output voltage levels are provided in Table 1-7. 

## **TABLE 1-7: DIGITAL INPUT AND OUTPUT VOLTAGE LEVELS** 

|**Voltage Information**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|
|**Input Voltage Levels**|||||
|VILinput logic level low|-0.3|—|0.25 x VDD|V|
|VIHinput logic level high|0.625 x VDD|—|VDD+ 0.3|V|
|**Output Voltage Levels**|||||
|VOLoutput logic level low, Iol = 4.0 mA|0|—|0.125|V|
|VOHoutput logic level high, IOH = -4.0 mA|0.75 x VDD|—|VDD|V|



DS70005120A-page 11 

 2015 Microchip Technology Inc. 

**RN52** 

## **1.3 Power Consumption** 

The power consumption of the RN52 for various connection states are provided in Figure 1-8. 

## **TABLE 1-8: POWER CONSUMPTION** 

|**Role**|**Connection**|**Audio Packet**<br>**Type**|**Description**|**Current (mA)**|
|---|---|---|---|---|
|—|Stand-by|—|Active connection|0.07|
|—|Page Scan|—|Interval = 1280 ms|0.5|
|—|Inquiry and Page Scan|—|Inquiry scan = 1280 ms<br>Page scan = 1280 ms|0.88|
|RN52|A2DP|ACL|No Traffic|15|
|RN52|A2DP|ACL|Audio stream RX|21|
|RN52|A2DP|ACL|Sniff = 40 ms|1.7|
|RN52|A2DP|ACL|Sniff = 1280 ms|0.26|
|RN52|HFP|eSCO-EV3|—|26|
|RN52|HFP|eSCO-EV3|SettingS1|27|
|RN52|HFP|eSCO-2EV3|SettingS2|28|
|RN52|HFP|eSCO-2EV3|SettingS3|25|
|RN52|HFP|eSCO-EV5|—|22|
|RN52|HFP|SCO-HV1|—|42|
|RN52|HFP|SCO-HV3|—|28|
|RN52|HFP|SCO-HV3|Sniff = 30 ms|22|
|RN52SRC|A2DP|ACL|No traffic|4.4|
|RN52SRC|A2DP|ACL|Audio stream TX|9.2|
|RN52SRC|A2DP|ACL|Sniff = 40 ms|1.9|
|RN52SRC|A2DP|ACL|Sniff = 1280 ms|0.2|
|RN52SRC|HFP|eSCO-EV3|—|24|
|RN52SRC|HFP|eSCO-EV3|SettingS1|23|
|RN52SRC|HFP|eSCO-2EV3|SettingS2|22|
|RN52SRC|HFP|eSCO-2EV3|SettingS3|17|
|RN52SRC|HFP|eSCO-EV5|—|17|
|RN52SRC|HFP|SCO-HV1|—|42|
|RN52SRC|HFP|SCO-HV3|—|23|
|RN52SRC|HFP|SCO-HV3|Sniff = 30 ms|22|



DS70005120A-page 12 

 2015 Microchip Technology Inc. 

**RN52** 

## **2.0 APPLICATIONS** 

The following sections provide information on designing with the RN52 module, including restoring factory defaults, using the LED interface, minimizing radio interference, solder reflow profile, typical application, etc. 

## **2.1 Minimizing Radio Interference** 

When laying out the host PCB for the RN52 module, the areas under the antenna and shielding connections should not have surface traces, ground planes or exposed via (see Figure 2-1). For optimal radio performance, the RN52 module’s antenna end should protrude at least 31 mm beyond any metal enclosure. Figure 2-2 shows examples of good, bad, and acceptable positioning of the RN52 on the host PCB. 

**FIGURE 2-1: MINIMIZING RADIO INTERFERENCE** 

**==> picture [302 x 265] intentionally omitted <==**

**----- Start of picture text -----**<br>
(Top View)<br>Keep area around antenna<br>(approximately 31 mm) clear<br>of metallic structures for<br>31 mm<br>best performance<br>31 mm<br>Edge of Ground Plain 4.6 mm<br>21.4 mm<br>Dimensions are in millimeters<br>**----- End of picture text -----**<br>


## **FIGURE 2-2: PCB EXAMPLE LAYOUT** 

**==> picture [310 x 167] intentionally omitted <==**

**----- Start of picture text -----**<br>
RN52<br>Good<br>RN52<br>RN52<br>RN52<br>Acceptable<br>Bad Acceptable<br>**----- End of picture text -----**<br>


DS70005120A-page 13 

 2015 Microchip Technology Inc. 

**RN52** 

## **2.2 LED Interface** 

The RN52 includes two pads dedicated to driving the LED indicators. The firmware can control both terminals, and the battery charger can set LED0. The terminals are open-drain outputs; therefore, the LED must be connected from a positive supply rail to the pad in series with a current limiting resistor. You should operate the LED pad (LED0 or LED1 pins) with a pad voltage below 0.5V. In this case, the pad can be thought of as a resistor, RON. The resistance, together with the external series resistor, sets the current, ILED, in the LED. The current is also dependent on the external voltage, VDD, as shown in Figure 2-3. 

**FIGURE 2-3: LED INTERFACE** 

**==> picture [203 x 176] intentionally omitted <==**

**----- Start of picture text -----**<br>
VDD<br>LED Forward<br>Voltage, VF<br>|LED<br>LED0 or  RLED Resistor VoltageDrop, VR<br>LED1<br>Pad Voltage, VPAD<br>RON = 20 Ω<br>**----- End of picture text -----**<br>


The LEDs can be used to indicate the module’s connection status. Table 2-1 describes the LED functions. 

**TABLE 2-1: STATUS LED FUNCTIONS** 

|**Blue LED **|**Red LED**|**Description**|
|---|---|---|
|Flashing|Flashing|The RN52 module is<br>discoverable.|
|Off|Flashing|The module is connected.|
|Flashing|Off|The module is connectable.|



## **2.3 Device Firmware Updates** 

The module has a Device Firmware Update (DFU) mode in which you use the USB interface to update the firmware. Implementing the DFU feature is highly recommended because firmware updates offer new features and enhance the module’s functionality. Follow the reference design shown in Figure 2-7 to support this mode. 

## **FIGURE 2-4: USB DFU PORT AND GPIO3 SCHEMATIC** 

**==> picture [202 x 147] intentionally omitted <==**

**----- Start of picture text -----**<br>
VBUS<br>C4<br>D1 (3.3V)<br>10nF<br>GPIO3 R1 MBR120<br>22k J2<br>1<br>VBUS<br>USBD- 2<br>D-<br>USBD+ 3<br>D+ MTAB [6]<br>5<br>GND<br>R2<br>47k<br>USB Mini B Connector<br>(JAE DX2R005HN2E700)<br>**----- End of picture text -----**<br>


## **2.4 Restore Factory Defaults with GPIO4** 

The GPIO4 pin should be connected to a switch, jumper or resistor so it can be accessed. This pin is used to reset the module to its factory default settings, which is critical in situations where the module has been misconfigured. To reset the module to the factory defaults, GPIO4 should be high on power-up and then toggle low, high, low, high with a 1 second wait between the transitions. 

## **2.5 Power Control and Regulation** 

The VDD pin controls the power to the RN52 module. The VDD pin should be used to turn the RN52 module on and off, if the hardware power cycle feature is desired. 

The PWREN pin provides the power enable functionality. This pin is internally connected as an enable pin to the voltage regulator and can only be used to turn on the voltage regulator after VDD power is provided to the RN52 module. The PWREN pin cannot be used to turn the voltage regulator off. 

On later versions of the firmware, the RN52 also provides a module reset GPIO pin, which resets the RN52 module when asserted high, and also provides a console command which can be used to perform a module reset. 

**Note:** A 47 K pull-down resistor (R2 in Figure 2-4) is required on GPIO3 even if you do not use the USB for DFU. 

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**RN52** 

## **2.6 Solder Reflow Profile** 

The lead-free solder reflow temperature and times are: 

- **Temperature** – 230° C, 60 seconds maximum, peak 245° C maximum 

- **Preheat temperature** – 165° ± 15° C, 90 to 120 seconds 

To reflow solder the module onto a PCB, use an RoHScompliant solder paste equivalent to NIHON ALMIT paste or OMNIX OM-310 solder paste from Alpha metals. See Table 2-2. 

**Note:** Use no-clean flux and DO NOT water wash. 

- **Time** – Single pass, one time 

## **TABLE 2-2: PASTE SOLDER RECOMMENDATIONS** 

|**Manufacturer**|**Part Number**|**Metal Composition**|**Liquidus Temperature**|
|---|---|---|---|
|Alpha Metals<br>http://www.alphametals.com|OMNIX OM-310|SAC305 (96.5% Sn, 3%<br>Ag, 0.5% Cu)|~220°C|
|NIHON ALMIT Co. LTD<br>http://almit.co.jp|LFM-70W INP|88% Sn, 3.5% Ag, 0.5%<br>Bi, 8% In|~215°C|



Figure 2-5 and Figure 2-6 show the solder reflow temperature profiles. 

## **FIGURE 2-5:** 

## **SOLDER REFLOW TEMPERATURE PROFILE** 

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**RN52** 

**FIGURE 2-6:** 

**SOLDER REFLOW CURVE** 

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**RN52** 

## **2.7 Typical Application Schematic** 

Figure 2-7 shows a typical application circuit with LDO, stereo audio/microphone PA, USB/UART, AVRCP switches and LED0/LED1. 

## **FIGURE 2-7: TYPICAL APPLICATION CIRCUIT FOR A2DP AUDIO STREAMING AND AVRCP REMOTE CONTROL** 

**==> picture [302 x 513] intentionally omitted <==**

**----- Start of picture text -----**<br>
6<br>J91 2 5 3 4 Headphones MTAB<br>C20 100uF C23 100uF C17 100uF C19 100uF J1 1VBUS2D-3D+ 5GND USB Mini B / CSR UART<br>USBV<br>R14 47k C16 100nF 1Vo1 6SHUTDOWN 9Vo2 U4 TPA6112 R10 47k C3 100nF C1 100nF U1 FT232RQ 15USBDM 41USBDP 18RESET 27OSCI 82OSCO<br>USBV C15 10uF 2IN1- 3IN1+ 4BYPASS 7IN2+ 8IN2-<br>USBV<br>R15 22k R17 22k R16 47k R11 47k R13 22k R12 22k C2 100nF 30TXD2RXD32RTS8CTS31DTR6DSR7DCD3RI 22CBUS021CBUS110CBUS211CBUS39CBUS4 J4 1 2 3 4 5 6 SPI  MASTER<br>C21 1uF C13 1uF<br>C22 1uF C18 1uF C14 1uF k22 3.3V<br>- + - R70 UART_CTS UART_RTS .3V3 C7 1uF SPI _MI SO SPI _MOSI SPI _SCK SPI _SS<br>SPKR_L SPKR_L SPKR_R+ SPKR_R 1 2 3 4 5 6 7 8 9 10 11 12 J10<br>UART_RX ART_TXU U2 3Vout<br>MI C_L + MI C_R+ MI C_L - MI C_R- 3.3V Mic<br>MI C_BI AS PIO2 PIO4 BTN_VOLUP BTN_NEXT BTN_PLAY BTN_PREVI OUS BTN_VOLDOWN PIO7 PIO6 PWREN J54 3 5 2 1 TC1262- 3.3V 1Vin<br>C6 1uF<br>2 4 6 8 10 USBV<br>J11 1 2 Battery 1 3 5 7 9 J7 MI CL 1 2 J8 MI CR 1 2 J6<br>USBV - - + MI C_L MI C_R R7 2k2 MI C_L MI C_R UP DOWN AY OUS<br>SPKR_R SPKR_L SPKR_R+ SPKR_L R6 2k2 BTN_VOL BTN_VOL BTN_PL BTN_NEXT BTN_PREVI<br>C12 1uF<br>D1USBV MBR120 J2 1VBUS2D-36MTABD+ 5GND USB Mini B / RSVD USB USBV 2AI O04 6PCM_I N8PCM_OUT10PCM_SYNC12PCM_CLK14 3.3V16 MI C_BI AS C9C8 47nF47nF C10 C11 47nF 47nF Vol Down S2 Next S6<br>1 3 5 7 9 11 13 15 J3 EXT Connector - -<br>.3V3 MI C_L + MI C_R+ MI C_L  MI C_R Vol Up S4 Play / Pause S3 Prev S1<br>C4 10nF R1 22k USBD- USBD+ Device Firmware Update Wake S5 UART_TX UART_RX PIO9<br>R2 47k<br>PIO3 UART_RX UART_TX UART_CTS UART_RTS USBD+ USBD- PIO9 BTN_VOL DOWN BTN_PREVI OUS BTN_PLAY BTN_NEXT BTN_VOL UP PIO4 AI O0 PIO2 PIO3<br>M1 RN52 Module<br>D2 Red LED<br>.3V3 R9 470 PWREN PIO6 PIO7 17UART_RX 16UART_TX 15UART_CTS 14UART_RTS 13USBD+ 12USBD- 11GPIO9 10GPIO10 9GPIO11 8GPIO13 7GPIO12 6GPIO5 5GPIO4 4AIO0 3GPIO2 2GPIO3 1GND<br>D3<br>R8 47R Blue LED<br>.3V3<br>LED0 LED1<br>SPI _SS SPI_MISO SPI_SCK SPI_MOSI LED1 LED0 MIC_BIAS MIC_L+ MIC_R+ MIC_L- MIC_R- AGND SPKR_R- SPKR_L- SPKR_R+ SPKR_L + GND<br>28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44<br>PCM_IN PCM_OUT PCM_SYNC PCM_CLK<br>- - +<br>- - SPKR_R SPKR_L SPKR_R+ SPKR_L<br>SPI _SS SPI _MI SO SPI _SCK SPI _MOSI LED1 LED0 MI C_BIAS MI C_L + MI C_R+ MI C_L  MI C_R<br>10 V DD GNDPAD 115 16 3V 3OUT TEST 26<br>191 V CCIOV CC THPADAGNDGNDGNDGND 201733244<br>Tab 4<br>GND 2<br>18 GND<br>19 GPIO7<br>20 GPIO6 GND 50<br>21 PWREN GND 49<br>22 V DD GND 48<br>23 PCM_IN GND 47<br>24 PCM_OUT GND 46<br>25 PCM_SY NC GND 45<br>26 PCM_CLK<br>72GND<br>**----- End of picture text -----**<br>


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**RN52** 

## **3.0 BLUETOOTH SIG CERTIFICATION** 

The RN52 Bluetooth Audio Module has been certified by Bluetooth SIG and the Qualified Design ID is 58578 and the Declaration ID is D023391. The Qualified Design Listing certificate can be accessed on www.microchip.com/rn52 or at the Bluetooth SIG listings website. 

## **4.0 REGULATORY APPROVAL** 

This section outlines the regulatory information for the RN52 module for the following countries: 

- United States 

- Canada 

- Europe 

- Australia 

- New Zealand 

## **4.1 United States** 

The RN52 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the RN52 module into a finished product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. 

The finished product is required to comply with all applicable FCC equipment authorizations regulations, requirements and equipment functions not associated with the transmitter module portion. For example, compliance must be demonstrated to regulations for other transmitter components within the host product; to requirements for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate. 

## 4.1.1 LABELING AND USER INFORMATION REQUIREMENTS 

The RN52 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is 

installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: 

Contains Transmitter Module FCC ID: T9J-RN52 

or 

Contains FCC ID: T9J-RN52 

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation 

A user’s manual for the product should include the following statement: 

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: 

- Reorient or relocate the receiving antenna. 

- Increase the separation between the equipment and receiver. 

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 

- Consult the dealer or an experienced radio/TV technician for help. 

Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/ kdb/index.cfm. 

## 4.1.2 RF EXPOSURE 

All transmitters regulated by FCC must comply with RF exposure requirements. OET Bulletin 65, Evaluating Compliance with FCC Guidelines for Human Exposure to Radio Frequency Electromagnetic Fields, provides assistance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency 

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**RN52** 

(RF) fields adopted by the Federal Communications Commission (FCC). The bulletin offers guidelines and suggestions for evaluating compliance. 

If appropriate, compliance with exposure guidelines for mobile and unlicensed devices can be accomplished by the use of warning labels and by providing users with information concerning minimum separation distances from transmitting structures and proper installation of antennas. 

The following statement must be included as a CAUTION statement in manuals and OEM products to alert users of FCC RF exposure compliance: 

To satisfy FCC RF Exposure requirements for mobile and base station transmission devices, a separation distance of 20 cm or more should be maintained between the antenna of this device and persons during operation. To ensure compliance, operation at closer than this distance is not recommended. 

The antenna(s) used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. 

If the RN52 module is used in a portable application (i.e., the antenna is less than 20 cm from persons during operation), the integrator is responsible for performing Specific Absorption Rate (SAR) testing in accordance with FCC rules 2.1091. 

## 4.1.3 HELPFUL WEB SITES 

Federal Communications Commission (FCC): http://www.fcc.gov 

FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm 

## **4.2 Canada** 

The RN52 module has been certified for use in Canada under Industry Canada (IC) Radio Standards Specification (RSS) RSS-210 and RSSGen. Modular approval permits the installation of a module in a host device without the need to recertify the device. 

## 4.2.1 LABELING AND USER INFORMATION REQUIREMENTS 

Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The host device shall be properly labeled to identify the module within the host device. 

The Industry Canada certification label of a module shall be clearly visible at all times when installed in the host device, otherwise the host device must be labeled to display the Industry Canada certification number of 

the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or similar wording expressing the same meaning, as follows: 

Contains transmitter module IC: 6514A-RN52 

User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December 2010): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: 

This device complies with Industry Canada licenseexempt RSS standard(s). Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of the device. 

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement. 

Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals for transmitters shall display the following notice in a conspicuous location: 

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication. 

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. 

The above notice may be affixed to the device instead of displayed in the user manual. 

## 4.2.2 HELPFUL WEB SITES 

Industry Canada: http://www.ic.gc.ca/ 

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**RN52** 

## **4.3 Europe** 

The RN52 module is an R&TTE Directive assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. 

The RN52 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are summarized in Table 3-1: European Compliance Testing. A Notified Body Opinion has also been issued. All test reports are available on the RN52 product web page at http://www.microchip.com. 

The R&TTE Compliance Association provides guidance on modular devices in document Technical Guidance Note 01 available at http://www.rtteca.com/ html/download_area.htm. 

**Note:** To maintain conformance to the testing listed in Table 4-1, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. 

When integrating a radio module into a completed product the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements of the R&TTE Directive. 

## 4.3.1 LABELING AND USER INFORMATION REQUIREMENTS 

The label on the final product which contains the RN52 module must follow CE marking requirements. The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE marking. 

## 4.3.2 ANTENNA REQUIREMENTS 

From R&TTE Compliance Association document Technical Guidance Note 01: 

Provided the integrator installing an assessed radio module with an integral or specific antenna and installed in conformance with the radio module manufacturer’s installation instructions requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4] 

## 4.3.3 HELPFUL WEB SITES 

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/. 

Additional helpful web sites are: 

- Radio and Telecommunications Terminal Equipment (R&TTE): http://ec.europa.eu/enterprise/rtte/index_en.htm 

- European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org 

- European Telecommunications Standards Institute (ETSI): http://www.etsi.org 

- European Radio Communications Office (ERO): http://www.ero.dk 

- The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA): http://www.rtteca.com/ 

**TABLE 4-1: EUROPEAN COMPLIANCE TESTING** ~~a~~ **Certification Standards** ~~ee~~ **Article** ~~ee~~ **Laboratory Report Number Date** Safety EN 60950-1:2006+A11:2009+A1:2010 (3.1(a)) Worldwide W6M21301-13004-L 2/23/2013 Health EN 50371:2002-03 Testing W6M21301-13004-50371 5/31/2013 ~~| pOee ee~~ Services ~~ee~~ EMC EN 301 489-1 V1.8.1 (2008-04) (3.1(b)) W6M21301-13004-E-16 2/7/2013 (Taiwan) EN 301 489-17 V2.1.1 (2009-05) Co., Ltd. ~~ee~~ Radio EN 300 328 V1.7.1 (2006-10) (3.2) W6M21301-13004-T-45 5/31/2013 ~~es pO~~ Notified Eurofins U9M-1304-2756-C-V01 6/13/2013 Body — Product Opinion Service GmbH 

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**RN52** 

## **4.4 Australia** 

The Australia radio regulations do not provide a modular approval policy similar to the United States (FCC) and Canada (IC). However, RN52 module RF transmitter test reports can be used in part to demonstrate compliance in accordance with ACMA Radio communications “Short Range Devices” Standard 2004 (The Short Range Devices standard calls up the AS/NZS 4268:2008 industry standard). The RN52 module test reports can be used as part of the product certification and compliance folder. For more information on the RF transmitter test reports, contact Microchip Technology Australia sales office. 

To meet overall Australian final product compliance, the developer must construct a compliance folder containing all relevant compliance test reports, e.g. RF, EMC, electrical safety and DoC (Declaration of Conformity), etc. It is the responsibility of the integrator to know what is required in the compliance folder for ACMA compliance. All test reports are available on the RN52 product web page at http://www.microchip.com. For more information on Australia compliance, refer to the Australian Communications and Media Authority web site: http://www.acma.gov.au/. 

## 4.4.1 HELPFUL WEB SITES 

The Australian Communications and Media Authority: www.acma.gov.au/. 

## **4.5 New Zealand** 

The New Zealand radio regulations do not provide a modular approval policy similar to the United States (FCC) and Canada (IC). However, RN52 module RF transmitter test reports can be used in part to demonstrate compliance against the New Zealand “General User Radio License for Short Range Devices”. New Zealand Radio communications (Radio Standards) Notice 2010 calls up the AS / NZS 4268:2008 industry standard. The RN52 module test reports can be used as part of the product certification and compliance folder. All test reports are available on the RN52 product web page at http://www.microchip.com. For more information on the RF transmitter test reports, contact Microchip Technology sales office. 

Information on the New Zealand short range devices license can be found in the following web links: 

http://www.rsm.govt.nz/cms/licensees/types-oflicence/ general-user-licences/short-range-devices and 

http://www.rsm.govt.nz/cms/policy-and-planning/spectrum-policy-overview/legislation/gazette-notices/product-compliance/radiocommunications-radiostandardsnotice-2010. 

To meet overall New Zealand final product compliance, the developer must construct a compliance folder containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of Conformity) etc. It is the responsibility of the developer to know what is required in the compliance folder for New Zealand Radio communications. For more information on New Zealand compliance, refer to the web site: http://www.rsm.govt.nz/. 

## 4.5.1 HELPFUL WEB SITES 

Radio Spectrum Ministry of Economic Development: http://www.rsm.govt.nz/. 

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**RN52** 

## **5.0 ORDERING INFORMATION** 

Table 5-1 provides ordering information for the RN52 module. 

## **TABLE 5-1: ORDERING INFORMATION[(1)]** 

|**Part Number**|**Description**|
|---|---|
|RN52-I/RM|Standard application firmware(A2DP/AVRCP/SPP) (master).|



**Note 1:** For other configurations, contact Microchip directly. 

Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products. 

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**RN52** 

## **6.0 REVISION HISTORY** 

## **Revision A (September 2015)** 

- This replaces Roving Networks document “RN52 Bluetooth Audio Module Data Sheet”, version 1.1r 3/20/13. 

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**RN52** 

## **NOTES:** 

DS70005120A-page 24 

 2015 Microchip Technology Inc. 

**Note the following details of the code protection feature on Microchip devices:** 

- Microchip products meet the specification contained in their particular Microchip Data Sheet. 

- Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. 

- There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. 

- Microchip is willing to work with the customer who is concerned about the integrity of their code. 

- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” 

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. 

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE **.** Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 

## **Trademarks** 

The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC[32] logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A. 

Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. 

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. 

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. 

All other trademarks mentioned herein are property of their respective companies. 

© 2015, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. 

ISBN: 978-1-63277-794-2 

## **QUALITY MANAGEMENT  SYSTEM** 

## **CERTIFIED BY DNV** == **ISO/TS 16949** == 

_Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC[®] MCUs and dsPIC[®] DSCs, KEELOQ[®] code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified._ 

DS70005120A-page 25 

 2015 Microchip Technology Inc. 

## **Worldwide Sales and Service** 

## **AMERICAS** 

**Corporate Office** 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com 

**Atlanta** Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 

**Austin, TX** Tel: 512-257-3370 

**Boston** Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 

**Chicago** Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 

**Cleveland** Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 

**Dallas** Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 

**Detroit** Novi, MI Tel: 248-848-4000 

**Houston, TX** Tel: 281-894-5983 

**Indianapolis** Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 

**Los Angeles** Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 

**New York, NY** Tel: 631-435-6000 

**San Jose, CA** Tel: 408-735-9110 

**Canada - Toronto** Tel: 905-673-0699 Fax: 905-673-6509 

## **ASIA/PACIFIC** 

**Asia Pacific Office** 

Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon 

**Hong Kong** Tel: 852-2943-5100 Fax: 852-2401-3431 

**Australia - Sydney** Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 

**China - Beijing** Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 

**China - Chengdu** Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 

**China - Chongqing** Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 

**China - Dongguan** Tel: 86-769-8702-9880 

**China - Hangzhou** Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 

**China - Hong Kong SAR** Tel: 852-2943-5100 Fax: 852-2401-3431 

**China - Nanjing** Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 

**China - Qingdao** Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 

**China - Shanghai** Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 

**China - Shenyang** Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 

**China - Shenzhen** Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 

**China - Wuhan** Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 

**China - Xian** Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 

## **ASIA/PACIFIC** 

**China - Xiamen** Tel: 86-592-2388138 Fax: 86-592-2388130 

**China - Zhuhai** Tel: 86-756-3210040 Fax: 86-756-3210049 

**India - Bangalore** Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 

**India - New Delhi** Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 

**India - Pune** Tel: 91-20-3019-1500 

**Japan - Osaka** Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 

**Japan - Tokyo** Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 

**Korea - Daegu** Tel: 82-53-744-4301 Fax: 82-53-744-4302 

**Korea - Seoul** Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 

**Malaysia - Kuala Lumpur** Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 

**Malaysia - Penang** Tel: 60-4-227-8870 Fax: 60-4-227-4068 

**Philippines - Manila** Tel: 63-2-634-9065 Fax: 63-2-634-9069 

**Singapore** Tel: 65-6334-8870 Fax: 65-6334-8850 

**Taiwan - Hsin Chu** Tel: 886-3-5778-366 Fax: 886-3-5770-955 

**Taiwan - Kaohsiung** Tel: 886-7-213-7828 

**Taiwan - Taipei** Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 

**Thailand - Bangkok** Tel: 66-2-694-1351 

Fax: 66-2-694-1350 

## **EUROPE** 

**Austria - Wels** Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 

**Denmark - Copenhagen** Tel: 45-4450-2828 Fax: 45-4485-2829 

**France - Paris** Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 

**Germany - Dusseldorf** Tel: 49-2129-3766400 

**Germany - Karlsruhe** Tel: 49-721-625370 

**Germany - Munich** Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 

**Italy - Milan** Tel: 39-0331-742611 Fax: 39-0331-466781 

**Italy - Venice** Tel: 39-049-7625286 

**Netherlands - Drunen** Tel: 31-416-690399 Fax: 31-416-690340 

**Poland - Warsaw** Tel: 48-22-3325737 

**Spain - Madrid** Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 

**Sweden - Stockholm** Tel: 46-8-5090-4654 

**UK - Wokingham** Tel: 44-118-921-5800 Fax: 44-118-921-5820 

07/14/15 

DS70005120A-page 26 

 2015 Microchip Technology Inc.