RN4678-V/RM100

## **RN4678** 

## **Bluetooth[®] Dual Mode Module** 

## **Features** 

- Bluetooth[®] Classic (BR/EDR) and Low Energy (LE) 

- Certified to FCC, ISED, MIC, KCC, NCC and SRRC Radio Regulations 

- European Radio Equipment Directive (RED) Assessed Radio Module 

- Qualified for Bluetooth SIG v5.0 Core Specification 

- Transparent UART mode for Seamless Serial Data over Bluetooth Classic using Serial Port Profile (SPP) and Bluetooth Low Energy (BLE) using Generic Attribute (GATT) Profile 

- Easily Programmable through ASCII Commands and Easily Configurable with Available PIC[®] MCU Driver Library 

- Firmware can be Upgraded in the Field over UART (Flash version) 

- Integral Chip Antenna (RN4678) 

- Integrated Crystal, Internal Voltage Regulator and Matching Circuitry 

- Available Configurable I/O Pins for Control or Status Indication 

- Supports Apple[®] iPod[®] Accessory Protocol (iAP2) ( _only_ RN4678APL) 

- Supports Bluetooth LE Secure Connections 

- Bluetooth LE Data Packet Length Extension 

- Small and Compact Surface Mount Module 

- Castellated SMT Pads for Easy and Reliable PCB Mounting 

- Ideal for Portable Battery-Operated Devices 

## **RF/Analog** 

- Frequency: 2.402 GHz to 2.480 GHz 

- RX Sensitivity: -90 dBm (BR/EDR), -92 dBm (LE) 

- Class 2 Output Power (+1.5 dBm typical) 

## **Data Throughput** 

Data Throughput at 1 Mbps UART Baud Rate: 

- BR/EDR: up to 32 Kbytes/s 

- LE: up to 7 Kbytes/s 

Data Throughput at 115200 bps UART Baud Rate 

- BR/EDR: up to 10 Kbytes/s 

- LE: up to 6 Kbytes/s 

## **Operating Conditions** 

- Operating Voltage Range: 3.3V to 4.2V 

• Operating Temperature Range: -20°C to +70°C 

## **MAC/Baseband/Higher Layer Features** 

- Secure AES128 Encryption 

- Bluetooth Classic: GAP, SPP, SDP, RFCOMM and L2CAP 

- Bluetooth Low Energy: GAP, GATT, ATT, SMP and L2CAP 

## **Applications** 

- Internet of Things (IoT) 

- Secure Payment 

- Home and Security 

- Health and Fitness 

- Industrial and Data Logger 

- LED Lighting (16 configurations) 

## **Description** 

The RN4678 module is a fully certified, Bluetooth v5.0 compliant (BR/EDR/LE) Dual mode module, available for customers to easily add Dual mode Bluetooth wireless capability to their products. The RN4678 is built around Microchip’s IS1678 Bluetooth Dual mode chip. Refer to **Section 8.0 “Ordering Information”** . 

The RN4678 provides a convenient method for cable replacement for smartphones or tablets for data transfer and control based on the Bluetooth protocols. Data transfer is achieved through the Bluetooth link by sending or receiving data through SPP in Bluetooth (BT) Classic mode and through Transparent UART in the BLE mode. The ASCII interface provides an easy way to learn the operation and to integrate the module with any microprocessor or microcontroller (MCU) with 

a UART interface. 

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**RN4678** 

## **Table of Contents** 

1.0 Device Overview .............................................................................................................................................................................. 3 2.0 Application Information..................................................................................................................................................................... 7 3.0 Electrical Characteristics................................................................................................................................................................ 15 4.0 Radio Characteristics..................................................................................................................................................................... 19 5.0 Physical Dimensions...................................................................................................................................................................... 20 6.0 Reflow Profile................................................................................................................................................................................. 23 7.0 Module Placement ......................................................................................................................................................................... 24 8.0 Ordering Information ...................................................................................................................................................................... 27 9.0 Regulatory Approval....................................................................................................................................................................... 28 Appendix A: Revision History............................................................................................................................................................... 33 The Microchip Website ........................................................................................................................................................................ 34 Customer Change Notification Service ............................................................................................................................................... 34 Customer Support ............................................................................................................................................................................... 34 Product Identification System ............................................................................................................................................................. 35 

## **TO OUR VALUED CUSTOMERS** 

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If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at **docerrors@microchip.com** . We welcome your feedback. 

## **Most Current Data Sheet** 

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at: 

## **http://www.microchip.com** 

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). 

## **Errata** 

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. 

To determine if an errata sheet exists for a particular device, please check with one of the following: 

- Microchip’s Worldwide Website; **http://www.microchip.com** 

- Your local Microchip sales office (see last page) 

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. 

## **Customer Notification System** 

Register on our website at **www.microchip.com** to receive the most current information on all of our products. 

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**RN4678** 

## **1.0 DEVICE OVERVIEW** 

The RN4678 module is a fully certified, embedded Bluetooth (BR/EDR/LE) wireless module. The module includes an on-board Bluetooth stack, power management subsystem, a 2.4 GHz transceiver and RF power amplifier. Customers can embed Bluetooth functionality into any application using the RN4678 module. 

The RN4678 enables rapid product development and faster time to market, and it is designed to provide integrators with the following features: 

- Simple integration and programming 

- Reduced development time 

- Superior wireless module with low-cost system 

The RN4678 is a complete and fully regulatory certified module with an integral ceramic chip antenna and RF shield. 

The RN4678 is a small, compact and surface-mounted module with castellated pads for easy and reliable host PCB mounting. The module is compatible with standard pick-and-place equipment and can independently maintain a low-power wireless connection. Low-power usage and flexible power management maximize the lifetime of the RN4678 module in battery-operated devices. A wide operating temperature range enables its applications in indoor and outdoor environments. 

Figure 1-1 illustrates the internal block diagram of the RN4678 module. 

- Interoperability with Bluetooth host 

- Wide range of applications 

**FIGURE 1-1: RN4678 INTERNAL BLOCK DIAGRAM** 

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**----- Start of picture text -----**<br>
RN4678 BT Dual Mode Module<br>PMU Antenna<br>BAT_ IN BAT_ DET<br>SW_ BTN Matching<br>SW_ BTN<br>LDO33_O Bluetooth<br>LDO3V3_OUT Baseband<br>LDO18_O IS1678 S/SM & RF 16 MHz<br>LDO1V8_OUT CRYSTAL<br>VDD_IO VDDIO<br>RST_N Core<br>RST_N<br>320 KB ROM<br>28 KB SRAM<br>WAKEUP<br>WAKEUP<br>MCU GPIO<br>LED DRIVER<br>LED 4 Mb Flash<br>TXD<br>(Only IS1678SM) HOST<br>RXD MCU<br>UART<br>RTS<br>CTS<br>EEPROM<br>**----- End of picture text -----**<br>


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**RN4678** 

Table 1-1 provides the description of the various pins of the RN4678 module. 

**TABLE 1-1: PIN DESCRIPTION** 

|**RN4678**|**Pin Name**|**Pin Name**|**Type**|**Description**|
|---|---|---|---|---|
|1|GND||Power|Ground reference.|
|2|GND||Power|Ground reference.|
|3|GND||Power|Ground reference.|
|4|BAT_IN||Power|Battery Input (3.3V to 4.2V),<br>Main positive supply input,<br>Connect to 10µF(X5R/X7R)capacitor.|
|5|SW_BTN||DI|• Software Button:<br>- H: Power On<br>- L: Power Off<br>• By default, this functionality is disabled. Refer to_“RN4678 Command_<br>_Reference User Guide”_ (DS50002506)to enable the feature|
|6|LDO33_O||Power|Internal 3.3V LDO output; can source no more than 50 mA.|
|7|VDD_IO||Power|I/O positive supply input._For internal use only_; do_not_connect to other<br>devices.|
|8|LDO18_O||Power|Internal 1.8V LDO output._For internal use only_; do_not_connect to other<br>devices.|
|9|WAKEUP||DI|Wake-up from Sleep mode(active-low) (internal pull-up).|
|10|PMULDO_O||Power|Power management unit output._For internal use only_; do_not_connect<br>to other devices.|
|11|P0_4||DO|Status indication pin. Indicates the current status of BLE data<br>transmission.<br>High: Data currently transmitting<br>Low: No current data transmission|
|12|P1_5||DO|Status indication pin. Indicates the current connection status.<br>High: Powered on and not connected<br>Low: Connected to peer device|
|13|P1_2||DO|GPIOpin. Internally pulled upbydefault.|
|14|P1_3||DIO|GPIOpin. Internally pulled upbydefault.|
|15|P1_7/CTS||DIO|Configurable control or indication pin or UART CTS(input).|
|16|P0_5||DIO|Configurable control or indicationpin.|
|17|P0_0/RTS||DIO|Configurable control or indicationpin or UART RTS(output).|
|18||P2_0|DI|System configuration pin. Along with the P2_4 and EAN pins, used to<br>set the module in any of the following three modes: Application mode<br>(for normal operation), Test mode (to change EEPROM values) and<br>Write Flash mode (to enter the new firmware into the module); refer to<br>Table 2-1.|
|19||P2_4|DI|System configuration pin. Along with the P2_0 and EAN pins, used to<br>set the module in any of the following three modes: Application mode<br>(for normal operation), Test mode (to change EEPROM values) and<br>Write Flash mode (to enter new firmware into the module); refer to<br>Table 2-1.|
|20||EAN|DI|External address bus negative pin. System configuration pin along with<br>the P2_0 and P2_4 pins, used to set the module in any of the following<br>three modes: Application mode (for normal operation), Test mode (to<br>change EEPROM values) and Write Flash mode (to enter new<br>firmware into the module); refer toTable 2-1.|
|21||RST_N|DI|Module Reset(internal pull-up). Applya pulse of at least 63 ns.|



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**RN4678** 

## **TABLE 1-1: PIN DESCRIPTION (CONTINUED)** 

|**RN4678**|**Pin Name**|**Type**|**Description**|
|---|---|---|---|
|22|RXD|DI|UART data input.|
|23|TXD|DO|UART data output.|
|24|P3_1|DIO|Configurable control or indication pin (Internally pulled up if configured<br>as an input).|
|25|P3_2|DIO|Configurable control or indication pin (Internally pulled up if configured<br>as an input).|
|26|P3_3|DIO|Configurable control or indication pin (Internally pulled up if configured<br>as an input).|
|27|P3_4|DIO|Configurable control or indication pin (Internally pulled up if configured<br>as an input).|
|28|P3_6|DIO|Do_not_connect.|
|29|P3_7|DIO|Configurable control or indication pin (Internally pulled up if configured<br>as an input).|
|30|LED|DO|Status LED, connect to LDO33_0.|
|31|GND|Power|Ground reference.|
|—|BT_RF|AIO|External antenna connection(50 Ohms).|
|32|GND|Power|Ground reference.|
|33|GND|Power|Ground reference.|



**Legend:** A = Analog D = Digital I = Input O = Output 

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**RN4678** 

Figure 1-2 illustrates the pin diagram of the RN4678 module. 

**FIGURE 1-2: RN4678 PIN DIAGRAM** 

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**----- Start of picture text -----**<br>
GND 1 33 GND<br>GND 2 32 GND<br>GND 3<br>BAT_IN 4<br>SW_BTN 5 31 GND<br>LDO33_O 6 30 LED<br>VDD_IO 7 29 P3_7<br>LDO18_O 8 28 P3_6<br>WAKEUP 9 27 P3_4<br>PMULDO_O 10 26 P3_3<br>P0_4 11 25 P3_2<br>P1_5 12 24 P3_1<br>P1_2 13 23 TXD<br>P1_3 14 22 RXD<br>P1_7/CTS 15 P0_5 16 P0_0/RTS 17 P2_0 18 P2_4 19 EAN 20 RST_N 21<br>**----- End of picture text -----**<br>


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**RN4678** 

## **2.0 APPLICATION INFORMATION** 

## **2.1 Module Configuration** 

For the I/O pins, P2_0, P2_4 and EAN, place the RN4678 into Operating mode. Each of these pins has internal pull-up, and allows configuration settings and firmware to be updated from UART. Table 2-1 provides system configuration details. 

## **2.2 Flow Control** 

from the RN4678, the CTS pin (RN4678 input pin) must be pulled high. The RN4678 pulls the RTS pin (output pin) low to indicate that it can accept data. 

## **2.3 Control and Indication I/O Pins** 

The GPIO pins of the RN4678 module can be configured to different functions using the ASCII command interface. Table 2-1 shows the various pins in the RN4678 module that are available for configuration and their default configuration settings. Table 2-2 provides details on each of the functions available. 

Flow control is enabled by default on the RN4678 module. With the flow control enabled, the RTS and CTS lines need to be connected to the corresponding lines for the module to operate. To pause data flow 

## **TABLE 2-1: SYSTEM CONFIGURATION SETTINGS** 

|**P2_0**|**P2_4**|**EAN**|**Operational Mode**|
|---|---|---|---|
|Low|Low|High|Write FLASH|
|Low|High|Low|Write EEPROM and Test mode|
|High|High|Low|Normal Operational/Application mode|



## **TABLE 2-2: CONTROL AND INDICATION I/O PIN ASSIGNMENTS** 

|**Pin Symbol**|**Default Configuration**|
|---|---|
|P0_0|UART_RTS**(1,2)**|
|P0_5|N/C|
|P1_7|UART_CTS**(1,2)**|
|P3_1|INQUIRY CONTROL|
|P3_2|LINK_DROP_CONTROL(DISCONNECT)|
|P3_3|UART_RX_IND|
|P3_4|PAIRING_KEY|
|P3_7|LOW_BATTERY_IND|



**Note 1:** The RTS pin can only be assigned to P0_0 and the CTS pin can only be assigned to P1_7. 

- **2:** The RTS and CTS pins can be configured as GPIOs if flow control is disabled. 

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**RN4678** 

## **TABLE 2-3: CONFIGURABLE FUNCTIONS AND DESCRIPTIONS** 

|**Function Name**|**Description**|
|---|---|
|Low Battery Indication|Pin output goes low when the battery level is below a specified level. Default<br>batterylow indication voltage level is 3.4V.|
|RSSI Indication|Use this pin to indicate the quality of the link based on the RSSI level. If the<br>RSSI level is lower than the specified values, then the RSSI indication pin<br>goes low.|
|Link Drop Control|Use this pin to force the module to drop the current BLE link with a peer<br>device. Pulling the Link Drop pin low forces a disconnect. The pin must be<br>pulled low for at least 10 ms.|
|UART RX Indication|Use this pin to enable communication with the UART when the module is in<br>Low-Power mode. When_not_in Low-Power mode, the module runs on a<br>16 MHz clock. If Low-Power mode is enabled on the module by using<br>command,SO,1, the module runs on a 32 kHz clock, thus reducing power<br>consumption. However, in Low-Power mode, the host MCU_cannot_<br>communicate with the module via the UART since the UART is_not_<br>operational. If the user intends to provide data or commands via UART in<br>the Low-Power mode, then the UART_RX_IND pin must be pulled low and<br>the user needs to wait for at least five milliseconds before sending the data.<br>Pulling the UART_RX_IND pin low allows the module to operate the<br>16 MHz clock and to enable UART.|
|Pairing Key|Use this pin to force the module to enter Standby mode. The pin must be<br>pulled down for at least 160 ms.|
|Inquiry Control|This pin forces the module to enter Inquiry mode (BT Classic). The pin must<br>bepulled low for at least 240 ms for the device to enter Inquirymode.|
|Profile_IND|This pin is used to indicate whether the current connection is in BR/EDR<br>(BT Classic) or in Bluetooth®Low Energy (BLE). If the Profile_IND pin is<br>high, then the current connection is a BR/EDR connection. If low, then the<br>current connection is a BLE connection. This pin is valid only for the Link<br>state.|



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**RN4678** 

## **2.4 Power Tree** 

Figure 2-1 illustrates the power tree diagram of the RN4678. 

## **FIGURE 2-1: POWER TREE DIAGRAM** 

**==> picture [413 x 235] intentionally omitted <==**

**----- Start of picture text -----**<br>
BAT_IN<br>3.3v˜4.2v<br>PMULDO<br>o<br>VCC_RF<br>PMU Logic LDO18_EN LDO18 1v8 AVDD_SAR<br>SW_BTN VDD_XO<br>LDO33_EN<br>VDD_IO<br>3v3<br>LDO33 LED<br>EEPROM<br>**----- End of picture text -----**<br>


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**RN4678** 

## **2.5 Software Button (SW_BTN)** 

The Software Button (SW_BT) pin powers the main sections of the module into operation. If the SW_BTN pin is low, the module is turned off. After turning the module on via the SW_BTN, the host MCU must wait for a specific time before sending the first command. The timing diagrams for the SW_BTN, other related pins and the time delay are required before the host MCU sends the first command. 

Figure 2-2 through Figure 2-4 show the timing diagrams for the RN4678 with regard to the SW_BTN and the other relevant pins in different states of the module. 

**Note:** By default, the SW_BTN functionality is disabled and it can be enabled using the host MCU commands. Refer to the “ _RN4678 Command Reference User’s Guide”_ (DS50002506) for more details. 

## **FIGURE 2-2:** 

## **SW_BTN TIME (HIGH) AT APP MODE[(][1][,][2][)]** 

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**----- Start of picture text -----**<br>
BAT_IN<br>Power on<br>MCU State Idle Power on<br>/Initial<br>SW_BTN<br>LDO18_O 10 ms<br>40 ms<br>RST_N<br>4 ms<br>P1_5<br>P0_4<br>UART<br>MCU send UART command<br>command<br>(BT UART RX)<br>475 ms<br>Note 1: Time duration (475 ms) is for reference purposes only. Use the Status Indication pins to verify the exact<br>time when the host MCU can start sending the commands.<br>2: Reset pin is  not  connected.<br>**----- End of picture text -----**<br>


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**RN4678** 

## **FIGURE 2-3: SW_BTN TIME (LOW) AT ACCESS STATES[(][1][)]** 

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**----- Start of picture text -----**<br>
BAT_IN<br>SW_BTN<br>12 ms<br>RST_N<br>LDO33_O<br>140 ms<br>Note 1: Reset pin is  not  connected.<br>**----- End of picture text -----**<br>


## **FIGURE 2-4: SW_BTN TIME (LOW) AT LINK STATES[(][1][,][2][)]** 

**==> picture [341 x 160] intentionally omitted <==**

**----- Start of picture text -----**<br>
BAT_IN<br>SW_BTN<br>RST_N<br>LDO33_O<br>830 ms 140 ms<br>**----- End of picture text -----**<br>


- **Note 1:** 830 ms time duration is a typical value measured on iPhone[®] 6 and this time duration can vary from one smartphone to another. 

   - **2:** Reset pin is _not_ connected. 

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**RN4678** 

## **2.6 Wake-up** 

The WAKEUP input pin wakes the RN4678 module from Deep Sleep mode. The WAKEUP pin is active-low and puts the module in Standby mode. Figure 2-5 illustrates the timing diagram of the RN4678 in the Wake-up mode. 

**FIGURE 2-5: WAKE-UP TIME[(][1][)]** 

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**----- Start of picture text -----**<br>
WAKE UP<br>P0_4<br>P1_5<br>85ms<br>Note 1: The 85 ms is for reference time. Use the Status Indication pins to verify the exact results.<br>**----- End of picture text -----**<br>


## **2.7 External Reset** 

The RN4678 provides an External Reset pin which resets the module. The Reset pin, RST_N, is activelow. Figure 2-6 shows the timing diagram for the RST_N pin of the RN4678 module. 

**FIGURE 2-6: TIMING WAVEFORMS ON RESET[(][1][,][2][)]** 

**==> picture [425 x 216] intentionally omitted <==**

**----- Start of picture text -----**<br>
RST_N<br>RST_N state<br>RST_N<br>System RESET<br>trigger<br>P0_4<br>P1_5<br>4 ms 350 ms<br>Note 1: The RST_N state trigger must be greater than 63 ns.<br>2: Time duration (350 ms) is for reference purpose only. Use the Status Indication pins to verify the exact results.<br>**----- End of picture text -----**<br>


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**RN4678** 

## **2.8 LED Driver** 

The RN4678 has a dedicated LED driver and the LED can be connected directly to this pin, as shown in Figure 2-7. 

The maximum current sourcing for the LED is 5 mA. The brightness of this LED can be configured via an ASCII command. 

The following are the LED status indications. Each indication is a configurable flashing sequence: 

- Standby 

- Link Back 

- Low Battery 

- Inquiry 

- Link 

**FIGURE 2-7:** 

## **LED DRIVER** 

**==> picture [67 x 57] intentionally omitted <==**

**----- Start of picture text -----**<br>
LDO33_O<br>Module<br>LED1<br>**----- End of picture text -----**<br>


## **2.9 Host MCU Interface Over UART** 

Figure 2-8 illustrates an example of the UART interface with host MCU and a power scheme using 3.3V to the VDD. From the LDO33_O pin, voltage can be routed to the VDD_IO pin and the external circuitry, including the MCU. This power scheme ensures that the RN4678 and the MCU I/O voltages are compatible. 

**Note:** The internal 3.3V LDO current source must _not_ exceed 50 mA (maximum). ~~TT~~ 

**FIGURE 2-8:** 

## **POWER AND MCU INTERFACE EXAMPLE FOR RN4678** 

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**----- Start of picture text -----**<br>
3.3V<br>(3.3V to 4.2V) P1_5/STATUS_IND_1 I/O VDD<br>BAT_IN<br>P0_4/UART_TX_IND/STATUS_IND_2 I/O<br>10uF<br>Lt SW_BTN —_ I/O<br>LDO33_O RN4678  WAKE_UP I/O<br>MODULE RST_N I/O<br>LDO18_O P3_7 I/O HOST<br>P3_4 I/O MCU<br>Note:2 P3_3 I/O<br>P3_2 I/O<br>VDD_IO  P3_1 I/O<br>(Note:1) | P0_5 _ , I/O<br>P0_0/RTS CTS<br>—<br>P1_7/CTS RTS<br>LED<br>t TXD   en RX<br>RXD TX<br>| __d<br>LY<br>System Configuration<br>P2_0 P2_4 EAN<br>**----- End of picture text -----**<br>


**Note 1:** Ensure that VDD_IO and MCU VDD voltages are compatible. **2:** The control and indication ports are configurable. 

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## **2.10 Reference Circuit** 

Figure 2-9 illustrates the reference schematic of the power supply design implemented for the RN4678. 

## **FIGURE 2-9: RN4678 REFERENCE CIRCUIT** 

**==> picture [595 x 383] intentionally omitted <==**

**----- Start of picture text -----**<br>
BAT_IN LDO33_O U1<br>RN4678<br>4<br>BAT_IN<br>6<br>LDO33_O<br>C3 C4 R4 107 VDD_IO<br>100R PMULDO_O<br>10 μF 1 μF D1 8<br>LDO18_O<br>BLUE<br>30<br>LED<br>GND GND SW_BTN [5] SW_BTN<br>P0_4 11 W-UP W-UP<br>P0_4 WAKEUP [9]<br>MCU P1_5 12 RST RST<br>P1_5 RST [21]<br>Status indication<br>RXD 22 UART_RX P0_5 [16] P0_5 SW2 SW3<br>TXD 23 UART_TX P3_1 [24] P3_1 RESET WAKEUP<br>P1_7 15 P1_7/CTS P3_2 [25] P3_2<br>P0_0 17 P0_0/RTS P3_3 [26] P3_3<br>UART P3_4 [27] P3_4<br>P1_2 13 P1_2 P3_6 [28] P3_6<br>P1_3 14 P1_3 P3_7 [29] P3_7<br>Functional GPIO<br>GND GND<br>RESET, W-UP, SW-BTN<br>SW_BTN<br>LDO33_O<br>System<br>Configuration<br>SW1<br>R1<br>SW_BTN<br>20k<br>GND<br>GND<br>B<br>GND GND GND GND GND GND P2_0 P2_4 EAN<br>1 2 3 31 32 33 18 19 20<br>JP1 JP2 JP3<br>3 2 1<br>6 5 4<br>**----- End of picture text -----**<br>


**RN4678** 

## **3.0 ELECTRICAL CHARACTERISTICS** 

This section provides an overview of the electrical characteristics of the RN4678 module. Additional information is provided in future revisions of this document as it becomes available. 

Absolute maximum ratings for the RN4678 devices are listed below. Exposure to these maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at these or any other conditions, above the parameters indicated in the operation listings of this specification, is _not_ implied. 

## **Absolute Maximum Ratings** 

Ambient temperature under bias...............................................................................................................-20°C to +70°C Storage temperature .............................................................................................................................. -40°C to +125°C Voltage on VDD with respect to VSS .........................................................................................................  -0.3V to +3.6V Maximum output current sunk by any I/O pin..........................................................................................................12 mA Maximum output current sourced by any I/O pin.....................................................................................................12 mA 

**Note:** Stresses above those listed under **“Absolute Maximum Ratings”** may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions, above those indicated in the operation listings of this specification, is _not_ implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 

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**RN4678** 

Table 3-1 through Table 3-7 provide the recommended operating conditions and the electrical specifications of the module. 

## **TABLE 3-1: RECOMMENDED OPERATING CONDITIONS** 

|**Rating**||**Min.**|**Typical**|**Max.**|
|---|---|---|---|---|
|Ambient OperatingTemperature Range||-20ºC|+25ºC|+70ºC|
|Relative Humidity (Operating)||10%|—|90%|
|Relative Humidity (Storage)||10%|—|90%|
|ESD|HBM|—|±2 KV|—|
||MM|—|±200V|—|
|HTOL**(1)**||—|1000 hrs|—|
|SupplyVoltage: BAT_IN||3.3V|—|4.2V|
|SupplyVoltage: 1V8, VCC_RF, VDD_XO, AVDD_SAR||1.8V|1.9V|2.1V|
|SW_BTN||3.3V|—|4.2V|
|LED1||—|—|3.6V|
|Reset VTH,resThreshold Voltage||—|1.6V|—|
|VILInput Logic Level Low||-0.3V|—|0.8V|
|VIHInput Logic Level High||2.0V|—|3.6V|
|VOLOutput Logic Level Low(IOl= 12 mA)||—|—|0.4V|
|VOHOutput Logic Level High(IOh= 12 mA)||2.4V|—|—|
|RF Continuous TX Mode||—|—|43 mA|
|RF Continuous RX Mode||—|—|37 mA|



**Note 1:** HTOL life test condition: +125ºC, BAT_IN = 4.2V, LDO33_O = 3.3V, LDO18_O = 1.9V. 

## **TABLE 3-2: 3.3V LDO ELECTRICAL PARAMETERS[(][1][,][2][)]** 

|**TABLE 3-2:**<br>**3.3V LDO ELECTRICAL PARAMETER**|**S(1,2)**||||
|---|---|---|---|---|
|**Parameter**|**Min.**|**Typical**|**Max.**|**Unit**|
|OperatingTemperature|-20|—|+70|ºC|
|Output Current(VIN= 3.6V/Load Regulation with 100 mV Drop)|—|100|—|mA|
|Quiescent Current(VIN= 3.6V)|—|150|—|µA|



**Note 1:** With 10 µF capacitor at LDO33_O as the condition for IP verification. 

**2:** Output voltage can be calibrated using the MP tool. 

## **TABLE 3-3: PMU LDO[(][1][,][2][)]** 

|**TABLE 3-3:**<br>**PMU LDO(1,2)**|||||
|---|---|---|---|---|
|**Parameter**|**Min.**|**Typical**|**Max.**|**Unit**|
|OperatingTemperature|-20|—|+70|ºC|
|Output Current(VIN= 3.6V/Load Regulation with 0.3 mV Drop)|—|100|—|µA|
|Quiescent Current(VIN= 3.6V)|—|120|—|µA|



**Note 1:** With 1 µF capacitor at PMULDO_O as the condition for IP verification. 

**2:** Output voltage can be calibrated by using the MP tool. 

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**RN4678** 

## **TABLE 3-4: SAR-ADC AND BATTERY VOLTAGE DETECTOR** 

|**Parameter**|**Min.**|**Typical**|**Max.**|**Unit**|
|---|---|---|---|---|
|OperatingTemperature|-20|—|+70|ºC|
|AVDD_SAR Power Supply|—|1.8|—|V|
|SAR_BAT Detection**(1)**|3.3|—|4.2|V|
|Resolution|—|10|—|bit|
|OperatingCurrent(includingbandgap)|—|—|1|mA|
|DeepSleepCurrent|—|—|1|µA|



**Note 1:** SAR_BAT is connected with BAT_IN internally for battery voltage detection. 

**TABLE 3-5: INTENSITY CONTROLLABLE LED DRIVER** 

|**Parameter**|**Min.**|**Typical**|**Max.**|**Unit**|
|---|---|---|---|---|
|OperatingTemperature|-20|—|+70|ºC|
|Open-Drain Voltage|—|—|3.6|V|
|Current Step|—|0.3|—|mA|
|Programmable Current Range|0|—|5|mA|
|IntensityControl|—|16|—|step|
|Power-Down Open-Drain Current|—|—|1|µA|
|DeepSleepCurrent|—|—|1|µA|



## **TABLE 3-6: POWER CONSUMPTION-CLASSIC[(][1][)]** 

|**Test Condition**|**Current Consumption (avg.) (mA)**|**Remarks**|
|---|---|---|
|StandbyMode|2.543|—|
|DeepSleepMode|0.281|—|
|Connected+Sniff, Master (no data)|0.710|No data were transmitted,<br>Sniff interval = 500 ms|
|Connected+Sniff, Slave (no data)|0.70|No data were transmitted,<br>Sniff interval = 500 ms|
|Data, Master|14.08|Data transmitted at 115200 bps,<br>Block size = 500|
|Data, Slave|19.06|Data transmitted at 115200 bps,<br>Block size = 500|



**Note 1:** Classic BR/EDR and RX_IND functions are enabled. 

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**RN4678** 

**TABLE 3-7: POWER CONSUMPTION-LOW ENERGY[(][1][,][2][)]** 

|**Test Condition**|**Current Consumption**<br>**(avg.) (mA)**|**Remarks**|
|---|---|---|
|Deep Sleep mode|0.28|—|
|LE Fast Advertising|2.09|LE fast advertisinginterval = 100 ms|
||1.51|LE fast advertisinginterval = 160 ms|
||0.63|LE fast advertisinginterval = 500 ms|
||2.75|LE fast advertisinginterval = 100 ms + Beacon 100 ms|
||0.83|LE fast advertisinginterval = 500 ms + Beacon 500 ms|
|Reduced Power Advertising|0.62|LE reduced power advertisinginterval = 961 ms|
||1.65|LE reduced power advertising<br>interval = 961 ms + Beacon 100 ms|
||0.84|LE reduced power advertising<br>interval = 961 ms + Beacon 500 ms|
|Connected (no data)|0.57|Connection interval = 1500 ms|
||0.61|Connection interval = 600 ms|
|Connected (iPhone®6 to module)|0.45|Connection interval = 500 ms|
||0.60|Connection interval = 200 ms|
|Connected (module to iPhone 6)|6.6|Connection interval = 500 ms|
||7.0|Connection interval = 200 ms|



**Note 1:** Low energy RX_IND function is enabled. 

- **2:** Only low energy. 

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**RN4678** 

## **4.0 RADIO CHARACTERISTICS** 

Table 4-1 provides the transmitter performance characteristics of the RN678/RN4678U module. 

## **TABLE 4-1: TRANSMITTER PERFORMANCE[(][1][,][2][)]** 

||**Min.**|**Typical**|**Max.**|**Bluetooth®**<br>**Specification**|**Unit**|
|---|---|---|---|---|---|
|BDR Power|—|1.5|—|-6 ~ +4|dBm|
|EDR(2M/3M)Power|—|-1|—|-6 ~ +4||
|LE Power|—|0.5|—|-20 ~ +10||



**Note 1:** The RF transmit power can be calibrated during production by using the MP Tool software and the MT8852 Bluetooth Test equipment. 

**2:** Test condition: VCC RF = 1.80V, temperature = +25ºC. 

Table 4-2 provides the receiver performance characteristics of the RN678/RN4678U module. 

**TABLE 4-2: RECEIVER PERFORMANCE[(][1][)]** 

||**Min.**|**Typical**|**Max.**|**Bluetooth®**<br>**Specification**|**Unit**|
|---|---|---|---|---|---|
|BDR Sensitivity|—|-90|—|≤-70|dBm|
|EDR 2M Sensitivity|—|-90|—|||
|EDR 3M Sensitivity|—|-82|—|||
|LE Sensitivity|—|-92|—|||



**Note 1:** Test condition: VCC RF = 1.80V, temperature = +25ºC. 

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**RN4678** 

## **5.0 PHYSICAL DIMENSIONS** 

Figure 5-1 illustrates the physical dimensions of the RN4678 module. 

## **FIGURE 5-1: RN4678 MODULE DIMENSIONS** 

**==> picture [459 x 321] intentionally omitted <==**

**----- Start of picture text -----**<br>
(Top View) (Side View) (Bottom View)<br>22.0 22.0<br>21.2 1 33 21.5 21.2<br>20.1 19.9 20.1<br>18.95<br>18.0 18.0<br>17.3 16.95<br>shield mounting hole<br>14.90<br>13.9 1.0mm 13.9<br>12.8 12.8<br>11.7 0.7mm 11.7<br>10.6 10.6<br>9.5 9.5<br>8.4 8.4<br>7.3 (Bottom View) 7.3<br>1.1mm<br>6.2 6.2<br>5.1 5.1<br>4.0 4.0<br>2.9 2.9<br>1.8 1.8<br>0.7<br>0.0 shield 0.0<br>mounting<br>hole<br>Dimentions are in millimeters<br>Tolerances:<br>PCB Thickness: +/- 0.06 mm<br>1.0mm<br>Pad Detail<br>0.8 2.0 11.2 10.2 2.0<br>0.0 0.8 2.7 3.8 4.9 6.0 7.1 8.2 9.3 11.2 12.0 2.4 0.6 0.0 12.0 9.3 8.2 7.1 6.0 4.9 3.8 2.7 0.0<br>0.5mm 0.7mm<br>**----- End of picture text -----**<br>


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**RN4678** 

Figure 5-2 illustrates the recommended host PCB footprint. 

## **FIGURE 5-2: RN4678 RECOMMENDED PCB FOOTPRINT** 

**==> picture [317 x 446] intentionally omitted <==**

**----- Start of picture text -----**<br>
(Top View)<br>22.0 Top Copper<br>21.2 Keep Out Area<br>20.1<br>18.0 18.0<br>16.0<br>13.9 0.5mm<br>1.5mm<br>12.8<br>11.7<br>10.6<br>9.5<br>8.4 Silkscreen 0.7mm<br>7.3 area<br>6.2<br>5.1<br>1.1mm<br>4.0<br>2.9<br>1.8<br>0.0<br>2.0 9.2 11.2<br>0.0 2.7 3.8 4.9 6.0 7.1 8.2 9.3 12.0<br>**----- End of picture text -----**<br>


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**RN4678** 

Figure 5-3 illustrates the recommendations for mounting the RN4678 on the host PCB, and also shows the minimum ground plane area to the left and right of the module for the best antenna performance. 

Avoid the top copper layer near the test pin area. When designing the host PCB, the areas under the antenna must _not_ contain any top, inner or bottom copper layer. 

A low-impedance ground plane ensures best radio performance (best range and lowest noise). The ground plane can be extended beyond the minimum recommended as required for the host PCB EMC noise reduction. For best range performance, keep all external metal at least 31 mm away from the ceramic chip antenna. 

**FIGURE 5-3: RN4678 HOST PCB MOUNTING SUGGESTION** 

This area needs to have top metal copper that is connected to Ground for optimal functioning of the chip antenna. 

This purple hashed area must not have any top metal layer copper. It can have bottom copper layer. 

This area (purple with dots) needs to have both top and bottom copper layers connected to Ground for optimal operation of the antenna. 

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**RN4678** 

## **6.0 REFLOW PROFILE** 

It is highly recommended that the RN678/RN4678U be assembled using a standard lead-free reflow profile, IPC/JEDEC J-STD-020. The RN678/RN4678U can be soldered to the host PCB by using the standard leaded and lead-free solder reflow profile. 

To avoid damage to the module, follow these recommendations: 

- Follow solder reflow recommendations provided in Microchip Technology Application Note, _AN233 “Solder Reflow Recommendation”_ (DS00233). 

- Refer to the solder paste data sheet for specific reflow profile recommendations. 

- Do _not_ exceed the Peak Temperature (TP) of +250ºC. 

- Use no-clean flux solder paste. 

   - Standard: IPC/JEDEC J-STD-020 

   - Condition: Preheat: 150~200ºC for 60 ~ 120 seconds. 

   - Average ramp-up rate (217ºC to peak): 3ºC/sec max. 

   - Temperature maintained above 217ºC: 60 ~ 150 seconds. 

   - Time within 5ºC of peak temperature: 30 ~ 40 seconds. 

   - Peak temperature: 260ºC +5/-0. 

   - Ramp-down rate (peak to 217ºC): 6ºC/sec. max. 

   - Time 25ºC to peak temperature: 8 minutes max. 

   - Cycle interval: 5 minutes. 

- Do _not_ wash as moisture can be trapped under the shield. 

- Use only one flow. If the PCB requires multiple flows, apply the module on the final flow. 

## **FIGURE 6-1: REFLOW PROFILE** 

**==> picture [361 x 211] intentionally omitted <==**

**----- Start of picture text -----**<br>
Ramp-up Rate:<br>3ºC/sec max.<br>Peak: 260ºC +5/-0<br>(217ºC to Peak)<br>255ºC<br>Ramp-Down Rate:<br>6ºC/sec max.<br>(Peak to 217ºC)<br>217ºC<br>200ºC<br>150ºC<br>30 ~ 40 sec.<br>60 ~ 120 sec. 60 ~ 150 sec.<br>Time (sec)<br>**----- End of picture text -----**<br>


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**RN4678** 

## **7.0 MODULE PLACEMENT** 

For a Bluetooth wireless product, the antenna placement affects the performance of the whole system. The antenna requires free space to radiate the RF signal and it _cannot_ be surrounded by the ground plane. Microchip recommends that the areas underneath the antenna on the host PCB must _not_ contain copper on 

the top, inner or bottom layer. Figure 7-1 illustrates an example of good and poor antenna placement on a host PCB with ground plane. 

The ground plane can be extended beyond the minimum recommended, as required for the main PCB EMC noise reduction. For the best range performance, keep all external metal away from the ceramic chip antenna, that is, a minimum of 15 mm away. 

## **FIGURE 7-1: MODULE PLACEMENT EXAMPLES** 

**TABLE 7-1: RECOMMENDED ANTENNA Description Manufacturer Part Number Manufacturer** ~~——————~~ ANT ANT3216A063R2400A, PIFA, 2.4 GHz, L3.2W1.6 ANT3216A063R2400A Yageo Corp. 

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**RN4678** 

Figure 7-2 illustrates the RN4678 module mounted on the RN4678 Evaluation Board (EVB). It also shows the recommended keep out area for the antenna. 

## **FIGURE 7-2: KEEP OUT AREA RECOMMENDED FOR ANTENNA** 

**Note:** For additional information on free space for antenna placement design, refer to the design rule document of the antenna manufacturer. 

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**RN4678** 

## **7.1 RN4678 Ceramic Chip Antenna** 

The RN4678 contains an integral ceramic chip antenna. Figure 7-3 illustrates the antenna radiation pattern of the ceramic chip antenna on the RN4678. 

## **FIGURE 7-3: RN4678 ANTENNA RADIATION PATTERN** 

|**Parameter**|**Values**|
|---|---|
|Frequency|2450 MHz|
|Peak Gain|1.63 dBi|
|Efficiency|71.55%|



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## **8.0 ORDERING INFORMATION** 

Table 8-1 provides ordering information for the RN678/RN4678U module. 

## **TABLE 8-1: ORDERING INFORMATION** 

|**Device**|**Microchip IC**|**Antenna**|**Description**|**Shield**|**Regulatory Certification**|**Ordering Number**|
|---|---|---|---|---|---|---|
|RN4678-V/RM100|IS1678SM|On-Board|BT Dual Mode, Class 2|Yes|FCC, ISED, RED, MIC,<br>KCC, NCC, SRRC|RN4678-V/RM100|
|RN4678APL-V/RM100|IS1678SM|On-Board|BT Dual Mode, Class 2, Use with<br>Apple®MFI|Yes|FCC, ISED, RED, MIC,<br>KCC, NCC, SRRC|RN4678APL-V/RM100|
|RN4678-V/RM113|IS1678SM|On-Board|BT Dual Mode, Class 2|Yes|FCC, ISED, RED, MIC,<br>KCC, NCC, SRRC|RN4678-V/RM113|
|RN4678APL-V/RM113|IS1678SM|On-Board|BT Dual Mode, Class 2|Yes|FCC, ISED, RED, MIC,<br>KCC, NCC, SRRC|RN4678APL-V/RM113|



Go to http://www.microchip.com for current pricing and a list of distributors carrying Microchip products. 

**RN4678** 

## **9.0 REGULATORY APPROVAL** 

This section outlines the regulatory information for the RN4678 module for the following countries: 

- United States 

- Canada 

- Europe 

- Japan 

- Korea 

- Taiwan 

- Other Regulatory Jurisdictions 

## **9.1 United States** 

The RN4678 module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single modular approval in accordance with Part 15.212 Modular Transmitter approval. Single modular transmitter approval is defined as a complete RF transmission subassembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a Modular Grant can be installed in different end-use products (referred to as a host, host product or host device) by the Grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. 

The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. 

A host product itself is required to comply with all other applicable FCC equipment authorization regulations, requirements and equipment functions that are not associated with the transmitter module portion. For example, compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Verification or Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi[®] transmitter modules may also contain digital logic functions). 

## 9.1.1 LABELING AND USER INFORMATION REQUIREMENTS 

The RN4678 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording as follows: 

Contains Transmitter Module FCC ID: A8TBM78ABCDEFGH _or_ Contains FCC ID: A8TBM78ABCDEFGH 

**This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.** 

A user’s manual for the product should include the following statement: 

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: 

- Reorient or relocate the receiving antenna. 

- Increase the separation between the equipment and receiver. 

- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. 

- Consult the dealer or an experienced radio/TV technician for help. 

Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm. 

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**RN4678** 

## 9.1.2 RF EXPOSURE 

All transmitters regulated by FCC must comply with RF exposure requirements. KDB Publication 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). 

Output power listed is conducted. This grant is valid only when the module is sold to OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with FCC multitransmitter product procedures. This module is approved for installation into mobile or/and portable host platforms. 

## 9.1.3 APPROVED ANTENNAS 

To maintain modular approval in the United States, only the antenna types that have been tested shall be used. It is permissible to use a different antenna, provided it is the same antenna type, antenna gain (equal to or less than), with similar in-band and out-of-band characteristics (refer to specification sheet for cutoff frequencies). 

For RN4678, the approval is received using an integral chip antenna. 

## 9.1.4 HELPFUL WEBSITES 

Federal Communications Commission (FCC): http://www.fcc.gov 

FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB): http://apps.fcc.gov/oetcf/kdb/index.cfm 

## **9.2 Canada** 

The RN4678 module has been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada), Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. 

## 9.2.1 LABELING AND USER INFORMATION REQUIREMENTS 

Labeling Requirements (from RSP-100, Issue 12, Section 5): The host product shall be properly labeled to identify the module within the host device. 

The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host product; otherwise, the host device must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word, “Contains”, or similar wording expressing the same meaning, as follows: 

Contains transmitter module IC: 12246A-BM78SPPS5M2 

User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 5, March 2019): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual, or alternatively on the device or both: 

This device contains license-exempt transmitter(s)/ receiver(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions: 

1. This device may not cause interference; 

2. This device must accept any interference, including interference that may cause undesired operation of the device. 

L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 

1. L’appareil ne doit pas produire de brouillage; 

2. L’appareil   doit   accepter   tout   brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. 

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**RN4678** 

Transmitter Antenna (from Section 6.8 RSS-GEN, Issue 5, March 2019): User manuals for transmitters shall display the following notice in a conspicuous location: 

This radio transmitter [IC: 12246A-BM78SPPS5M2] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le présent émetteur radio 

[IC: 12246A-BM78SPPS5M2] a été approuvé par Innovation, Sciences et Développement économique Canadapour fonctionner avec les types d'antenne énumérés cidessous et ayant un gain admissible maximal Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'émetteur. 

Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each. 

## 9.2.2 RF EXPOSURE 

All transmitters regulated by the Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands). 

This transmitter is restricted for use with a specific antenna tested in this application for certification and must not be co-located or operating in conjunction with any other antenna or transmitters, except in accordance with Innovation, Science and Economic Development Canada multitransmitter guidelines. 

The device operates at an output power level which is within the ISED SAR test exemption limits at any user distance. 

## 9.2.3 APPROVED ANTENNAS 

For RN4678, the approval is received using an integral chip antenna. 

## 9.2.4 HELPFUL WEBSITES 

Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/. 

## **9.3 Europe** 

The RN4678 module is Radio Equipment Directive (RED) assessed, CE marked, and has been manufactured and tested with the intention of being integrated into a final product. 

The RN4678 module has been tested to RED 2014/53/ EU Essential Requirements mentioned in the following European Compliance table. 

## **TABLE 9-1: EUROPEAN COMPLIANCE** 

|**Certification**|**Standards**|**Article**|
|---|---|---|
|Safety|EN 62368|3.1a|
|Health|EN 62311||
|Electromagnetic<br>Compatibility (EMC)|EN 301 489-1|3.1b|
||EN 301 489-17||
|Radio|EN300 328|3.2|



The ETSI provides guidance on modular devices in “ _Guide to the application of harmonised standards covering Article 3.1b and Article 3.2 of the Directive 2014/ 53/EU RED to multi-radio and combined radio and non-radio equipment_ ” document available at: http://www.etsi.org/deliver/etsi_eg/203300_203399/ 203367/01.01.01_60/eg_203367v010101p.pdf . 

**Note:** To maintain conformance to the standards listed in the preceding European Compliance table, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED. 

## 9.3.1 LABELING AND USER INFORMATION REQUIREMENTS 

The label on the final product which contains the RN4678 module must follow CE marking requirements. 

## 9.3.2 CONFORMITY ASSESSMENT 

From ETSI Guidance Note EG 203367, Section 6.1, non-radio products are combined with a radio product: 

If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e., host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against Article 3.2 of the RED is required. 

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**RN4678** 

## 9.3.2.1 Simplified EU Declaration of Conformity 

Hereby, Microchip Technology Inc. declares that the radio equipment type RN4678 is in compliance with Directive 2014/53/EU. 

The full text of the EU declaration of conformity for this product is available at: 

https://www.microchip.com/wwwproducts/en/RN4678 (available under _Documents > Certifications_ ). 

## 9.3.3 APPROVED ANTENNAS 

For RN4678, the approval is received using an integral chip antenna. 

## 9.4.1 LABELING AND USER INFORMATION REQUIREMENTS 

The label on the final product which contains the RN4678 module must follow Japan marking requirements. The integrator of the module must refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. 

The RN4678 module is labeled with its own technical conformity mark and certification number. The final product in which this module is being used must have a label referring to the type certified module inside: 

## 9.3.4 HELPFUL WEBSITES 

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Radio Communications Committee (ECC) at: http://www.ecodocdb.dk/. 

Additional helpful websites are: 

- Radio Equipment Directive (2014/53/EU): https://ec.europa.eu/growth/single-market/ european-standards/harmonised-standards/red_en 

- European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org 

- European Telecommunications Standards Institute (ETSI): http://www.etsi.org 

- The Radio Equipment Directive Compliance Association (REDCA): http://www.redca.eu/ 

## **9.4 Japan** 

The RN4678 module has received type certification, and is labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. 

Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: 

## 9.4.2 HELPFUL WEBSITES 

Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm 

Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/ 

## **9.5 Korea** 

The RN4678 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 

## 9.5.1 LABELING AND USER INFORMATION REQUIREMENTS 

The label on the final product which contains the RN4678 module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. 

The RN4678 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of the module: 

- If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator must contact their conformance laboratory to determine if this testing is required. 

- There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCII: http://www.vcci.jp/vcci_e/index.html. 

DS50002519F-page  31 

 2016-2021 Microchip Technology Inc. 

**RN4678** 

## 9.5.2 HELPFUL WEBSITES 

Korea Communications Commission (KCC): http://www.kcc.go.kr 

National Radio Research Agency (RRA): http://rra.go.kr 

## **9.6 Taiwan** 

The RN4678 module has received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product must contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. 

Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 

## 9.6.1 LABELING AND USER INFORMATION REQUIREMENTS 

For the RN4678 module, due to limited module size, the NCC mark and ID are displayed in the data sheet and/or packaging, and cannot be displayed on the module label: 

## 9.6.2 HELPFUL WEBSITES 

National Communications Commission (NCC): http://www.ncc.gov.tw 

## **9.7 China** 

The RN4678 module has received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 

For expiry date, refer to SRRC certificate available at: https://www.microchip.com/wwwproducts/en/RN4678 

## 9.7.1 LABELING AND USER INFORMATION REQUIREMENTS 

The RN4678 module is labeled with its own CMIIT ID as follows: 

## CMIIT ID: 2016DJ5735 

When the host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement, “This device contains SRRC approved Radio module CMIIT ID: 2016DJ5735”. 

Refer to the SRRC certificate available in the RN4678 product page for expiry date. 

The user’s manual must contain below warning (for RF device) in traditional Chinese: 

注意 ! 

依據 低功率電波輻射性電機管理辦法 

第十二條 經型式認證合格之低功率射頻電機，非經許 可， 

公司、商號或使用者均不得擅自變更頻率、加大功率或 變更原設計 

之特性及功能。 

## **9.8 Other Regulatory Information** 

- For information about other countries’ jurisdictions not covered here, refer to: www.microchip.com/RN4678 

- (available under _Documents>Certifications_ ). 

- Should other regulatory jurisdiction certification be required by the customer, or the customer needs to recertify the module for other reasons, contact Microchip for the required utilities and documentation. 

第十四條 低功率射頻電機之使用不得影響飛航安全及 干擾合法通信； 

經發現有干擾現象時，應立即停用，並改善至無干擾時 方得繼續使用。 

前項合法通信，指依電信規定作業之無線電信。 

低功率射頻電機須忍受合法通信或工業、科學及醫療用 電波輻射性 

電機設備之干擾。 

DS50002519F-page  32 

 2016-2021 Microchip Technology Inc. 

**RN4678** 

## **APPENDIX A: REVISION HISTORY** 

## **Revision F (February 2021)** 

- Updated Table 1-1. 

## **Revision C (March 2019)** 

This revision includes the following changes and minor updates to text and formatting, which were incorporated throughout the document. 

- Updated **Section 9.2.1 “Labeling and User Information Requirements”** . 

- Added **Section 9.1.3 “Approved Antennas”** . 

- Added **Section 9.2.3 “Approved Antennas”** . 

- Updated **Section 9.3 “Europe”** . 

- Updated **Section 9.7 “China”** . 

## **Revision E (February 2020)** 

Updated Figure 2-9. 

## **Revision D (May 2019)** 

Updated China labeling ID in **Section 9.7.1 “Labeling and User Information Requirements”** . 

## **TABLE A-1: MAJOR SECTION UPDATES** 

|**Section**|**Description**|
|---|---|
|**“Features”**|Updated certification information|
|**“Data Throughput”**|Updated Kbytes/s|
|**Section 1.0 “Device Overview”**|UpdatedFigure 1-1andTable 1-1|
|**Section 2.0 “Application Information”**|• UpdatedTable 2-3<br>• Added SW_BTN note in**Section 2.5 “Software Button**<br>**(SW_BTN)”**|
|**Section 3.0 “Electrical Characteristics”**|• Updated storage temperature<br>• Updated current consumption values inTable 3-6andTable 3-7|
|**Section 5.0 “Physical Dimensions”**|UpdatedFigure 5-1andFigure 5-2|
|**Section 8.0 “Ordering Information”**|UpdatedTable 8-1with certification information|
|**Section 9.0 “Regulatory Approval”**|• Updated IC to ISED in**Section 9.2 “Canada”**<br>• Updated RED certification information in**Section 9.3 “Europe”**<br>• Updated**Section 9.6 “Taiwan”**<br>• Added**Section 9.7 “China”**|



## **Revision B (January 2018)** 

- Updated Figure 1-1, Figure 1-2, and Figure 5-3. 

- Updated Table 1-1. 

- Added **Section 2.2 “Flow Control”** . 

- Updated **Section 8.0 “Ordering Information”** 

- Updated **Section  “Product Identification System”** 

- Removed Figure 1-3, Figure 2-9, Figure 5-4, Figure 5-5, and Figure 5-6. 

## **Revision A (June 2016)** 

This is the initial released version of the document. 

DS50002519F-page  33 

 2016-2021 Microchip Technology Inc. 

**RN4678** 

## **THE MICROCHIP WEBSITE** 

Microchip provides online support via our WWW site at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: 

- **Product Support** – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software 

- **General Technical Support** – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing 

## **CUSTOMER SUPPORT** 

Users of Microchip products can receive assistance through several channels: 

- Distributor or Representative 

- Local Sales Office 

- Field Application Engineer (FAE) 

- Technical Support 

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. 

**Technical support is available through the website at: http://microchip.com/support** 

- **Business of Microchip** – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives 

## **CUSTOMER CHANGE NOTIFICATION SERVICE** 

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. 

To register, access the Microchip website at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. 

DS50002519F-page  34 

 2016-2021 Microchip Technology Inc. 

**RN4678** 

## **PRODUCT IDENTIFICATION SYSTEM** 

To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office. 

||**PART NO.**||**V**||**RM**|**XXX**||**Example:**|
|---|---|---|---|---|---|---|---|---|
||**Device**|**Temperature**|||**Package**|**Firmware**||RN4678-V/RM100: Various temperature|
||||**Range**|||**Revision**|||
|||||||**Number**|||
||**Device:**|RN4678:||Ceramic|Chip Antenna||||
||**Temperature**|V|=|-20C to|+70C (Various)||||
||**Range:**||||||||
||**Package:**|RM|=|Radio Module|||||
||||||||||



DS50002519F-page  35 

 2016-2021 Microchip Technology Inc. 

- **Note the following details of the code protection feature on Microchip devices:** 

- Microchip products meet the specifications contained in their particular Microchip Data Sheet. 

- Microchip believes that its family of products is secure when used in the intended manner and under normal conditions. 

- There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods  require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip's intellectual property rights. 

- Microchip is willing to work with any customer who is concerned about the integrity of its code. 

- Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. 

Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. 

THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. 

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. 

## **Trademarks** 

The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. 

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. 

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. 

The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. 

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. 

All other trademarks mentioned herein are property of their respective companies. 

- © 2016-2021, Microchip Technology Incorporated, All Rights Reserved. 

_For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality._ 

ISBN: 978-1-5224-7728-0 

DS50002519F-page 36 

 2016-2021 Microchip Technology Inc. 

## **Worldwide Sales and Service** 

## **AMERICAS** 

**Corporate Office** 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com 

**Atlanta** Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 

**Austin, TX** Tel: 512-257-3370 

**Boston** Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 

**Chicago** Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 

**Dallas** Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 

**Detroit** Novi, MI Tel: 248-848-4000 

**Houston, TX** Tel: 281-894-5983 

**Indianapolis** Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 

**Los Angeles** Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 

**Raleigh, NC** Tel: 919-844-7510 

**New York, NY** Tel: 631-435-6000 

**San Jose, CA** Tel: 408-735-9110 Tel: 408-436-4270 

**Canada - Toronto** Tel: 905-695-1980 Fax: 905-695-2078 

## **ASIA/PACIFIC** 

**Australia - Sydney** Tel: 61-2-9868-6733 **China - Beijing** Tel: 86-10-8569-7000 

**China - Chengdu** Tel: 86-28-8665-5511 **China - Chongqing** Tel: 86-23-8980-9588 **China - Dongguan** Tel: 86-769-8702-9880 

**China - Guangzhou** Tel: 86-20-8755-8029 

**China - Hangzhou** Tel: 86-571-8792-8115 

**China - Hong Kong SAR** Tel: 852-2943-5100 

**China - Nanjing** Tel: 86-25-8473-2460 

**China - Qingdao** Tel: 86-532-8502-7355 

**China - Shanghai** Tel: 86-21-3326-8000 

**China - Shenyang** Tel: 86-24-2334-2829 

**China - Shenzhen** Tel: 86-755-8864-2200 

**China - Suzhou** Tel: 86-186-6233-1526 

**China - Wuhan** Tel: 86-27-5980-5300 

**China - Xian** Tel: 86-29-8833-7252 

**China - Xiamen** Tel: 86-592-2388138 

**China - Zhuhai** Tel: 86-756-3210040 

## **ASIA/PACIFIC** 

**India - Bangalore** Tel: 91-80-3090-4444 **India - New Delhi** Tel: 91-11-4160-8631 

**India - Pune** Tel: 91-20-4121-0141 **Japan - Osaka** Tel: 81-6-6152-7160 

**Japan - Tokyo** Tel: 81-3-6880- 3770 

**Korea - Daegu** Tel: 82-53-744-4301 

**Korea - Seoul** Tel: 82-2-554-7200 

**Malaysia - Kuala Lumpur** Tel: 60-3-7651-7906 

**Malaysia - Penang** Tel: 60-4-227-8870 **Philippines - Manila** Tel: 63-2-634-9065 

**Singapore** Tel: 65-6334-8870 

**Taiwan - Hsin Chu** Tel: 886-3-577-8366 

**Taiwan - Kaohsiung** Tel: 886-7-213-7830 

**Taiwan - Taipei** Tel: 886-2-2508-8600 

**Thailand - Bangkok** Tel: 66-2-694-1351 

**Vietnam - Ho Chi Minh** Tel: 84-28-5448-2100 

## **EUROPE** 

**Austria - Wels** Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 

**Denmark - Copenhagen** Tel: 45-4485-5910 Fax: 45-4485-2829 

**Finland - Espoo** Tel: 358-9-4520-820 

**France - Paris** Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 

**Germany - Garching** Tel: 49-8931-9700 

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**Germany - Heilbronn** Tel: 49-7131-72400 

**Germany - Karlsruhe** Tel: 49-721-625370 

**Germany - Munich** Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 **Germany - Rosenheim** Tel: 49-8031-354-560 

**Israel - Ra’anana** Tel: 972-9-744-7705 

**Italy - Milan** Tel: 39-0331-742611 Fax: 39-0331-466781 

**Italy - Padova** Tel: 39-049-7625286 

**Netherlands - Drunen** Tel: 31-416-690399 Fax: 31-416-690340 

**Norway - Trondheim** Tel: 47-7288-4388 

**Poland - Warsaw** Tel: 48-22-3325737 

**Romania - Bucharest** Tel: 40-21-407-87-50 

**Spain - Madrid** Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 

**Sweden - Gothenberg** Tel: 46-31-704-60-40 

**Sweden - Stockholm** Tel: 46-8-5090-4654 

**UK - Wokingham** Tel: 44-118-921-5800 

Fax: 44-118-921-5820 

DS50002519F-page 37 

 2016-2021 Microchip Technology Inc. 02/28/20