PLA192

**PLA192 600V, 150mA Single-Pole Normally Open Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameters**|**Ratings**|**Units**|
|---|---|---|
|Blocking Voltage|600|VP|
|Load Current|150|mArms/ mADC|
|On-Resistance (max)|22||
|LED Current to Operate|5|mA|



## **Features** 

- PLA192E is 100% Tested for Partial Discharge: DIN EN 60747-5-5 

- 5000Vrms Input/Output Isolation 

- Low Drive Power Requirements 

- Greater Reliability than Electromechanical Relays 

- No EMI/RFI Generation 

- Small 6-Pin Package 

- Flammability Rating UL 94 V-0 

## **Applications** 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

## **Description** 

IXYS Integrated Circuits' PLA192 is a single-pole, normally open (1-Form-A) solid state relay that provides 5000Vrms of input to output isolation. 

In addition to all the features and benefits of the PLA192, the PLA192E uses double-molded vertical construction to meet the partial discharge demands of DIN EN 60747-5-5 (previously VDE 0884). 

All versions of the PLA192 can be used to replace mechanical relays, while offering the superior reliability associated with semiconductor devices. Employing the patented OptoMOS architecture, the highly efficient infrared LED controls the optically coupled outputs. Because they have no moving parts, they offer bounce-free switching in more compact surface mount or thru-hole packages. 

## **Approvals** 

   - UL Recognized Component: File E76270 

   - TUV EN 62368-1: Certificate # B 082667 0008 

   - DIN EN 60747-5-5 Certified ("E" Suffix Only) 

   - VDE Certificate 40036603 

- I/O Subsystems 

- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment: Patient/Equipment Isolation 

- Industrial Controls 

## **Pin Configuration** 

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AC/DC Configuration<br>1 6<br>+ Control Load<br>2 5<br>- Control Do Not Use<br>3 4<br>Do Not Use Load<br>**----- End of picture text -----**<br>


## DC Only Configuration 

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1 6<br>+ Control + Load<br>2 5<br>- Control - Load<br>3 4<br>Do Not Use<br>**----- End of picture text -----**<br>


## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|PLA192E|6-Pin DIP (50/Tube)|
|PLA192ES|6-Pin Surface Mount (50/Tube)|
|PLA192ESTR|6-Pin Surface Mount (1000/Reel)|
|PLA192|6-Pin DIP (50/Tube)|
|PLA192S|6-Pin Surface Mount (50/Tube)|
|PLA192STR|6-Pin Surface Mount (1000/Reel)|



## **Switching Characteristics of Normally Open Devices** 

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Form-A<br>I<br>F<br>90%<br>10%<br>I<br>LOAD<br>t t<br>on off<br>**----- End of picture text -----**<br>


**1** 

DS-PLA192-R10 

**www.ixysic.com** 

**PLA192** 

INTEGRATED CIRCUITS DIVISION 

**Absolute Maximum Ratings @ 25ºC (Unless Otherwise Noted)** 

|**Parameter**<br>**Rating**<br>**Units**<br>BlockingVoltage<br>600<br>VP<br>Reverse Input Voltage<br>5<br>V<br>Input Control Current<br>50<br>mA<br>Peak(10ms)<br>1<br>A<br>Input Power Dissipation1<br>150<br>mW<br>Total Package Dissipation2<br>800<br>mW<br>Isolation Voltage, Input to Output<br>(60 Seconds)<br>5000<br>Vrms<br>ESD Rating, Human Body Model<br>4<br>kV<br>Operational Temperature, Ambient<br>-40 to +85<br>ºC<br>Storage Temperature<br>-40 to +125<br>ºC<br>~~=~~|**Parameter**<br>**Rating**<br>**Units**<br>BlockingVoltage<br>600<br>VP<br>Reverse Input Voltage<br>5<br>V<br>Input Control Current<br>50<br>mA<br>Peak(10ms)<br>1<br>A<br>Input Power Dissipation1<br>150<br>mW<br>Total Package Dissipation2<br>800<br>mW<br>Isolation Voltage, Input to Output<br>(60 Seconds)<br>5000<br>Vrms<br>ESD Rating, Human Body Model<br>4<br>kV<br>Operational Temperature, Ambient<br>-40 to +85<br>ºC<br>Storage Temperature<br>-40 to +125<br>ºC<br>~~=~~|**Parameter**<br>**Rating**<br>**Units**<br>BlockingVoltage<br>600<br>VP<br>Reverse Input Voltage<br>5<br>V<br>Input Control Current<br>50<br>mA<br>Peak(10ms)<br>1<br>A<br>Input Power Dissipation1<br>150<br>mW<br>Total Package Dissipation2<br>800<br>mW<br>Isolation Voltage, Input to Output<br>(60 Seconds)<br>5000<br>Vrms<br>ESD Rating, Human Body Model<br>4<br>kV<br>Operational Temperature, Ambient<br>-40 to +85<br>ºC<br>Storage Temperature<br>-40 to +125<br>ºC<br>~~=~~|_Absolute Maximum Ratings are stress ratings. Stresses in_<br>_excess of these ratings can cause permanent damage to the_<br>_device. Functional operation of the device at conditions beyond_<br>_those indicated in the operational sections of this data sheet is_<br>_not implied._<br>_Typical values are characteristic of the device at +25°C, and_<br>_are the result of engineering evaluations. They are provided for_<br>_information purposes only, and are not part of the manufacturing_<br>_testing requirements._|
|---|---|---|---|
|1Derate linearly 1.33 mW / ºC||||
|2Derate output power linearly 6.67 mW / ºC||||
|**Electrical Characteristics @ 25ºC (Unless Otherwise Noted)**|**Electrical Characteristics @ 25ºC (Unless Otherwise Noted)**||**Electrical Characteristics @ 25ºC (Unless Otherwise Noted)**|



_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

|**Parameters**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Blocking Voltage|IL=1A|VDRM|600|-|-|VP|
|Load Current<br>Continuous, AC/DC Configuration<br>Continuous, DC-Only Configuration<br>Peak|-|IL|-|-|150|mArms/ mADC|
||||-|-|220|mADC|
||t=10ms|ILPK|-|-|±400|mAP|
|On-Resistance1<br>AC/DC Configuration<br>DC-OnlyConfiguration|IL=150mA|RON|-|13.3|22||
||IL=220mA||-|4.15|8||
|Off-State Leakage Current|VL=600V|ILEAK|-|-|1|A|
|Switching Speeds<br>Turn-On<br>Turn-Off|IF=5mA, VL=10V|ton|-|-|5|ms|
|||toff|-|-|5||
|Output Capacitance|IF=0mA, VL=50V, f=1MHz|COUT|-|10|-|pF|
|**Input Characteristics**|||||||
|Input Control Current to Activate|IL=100mA|IF|-|0.22|5|mA|
|Input Control Current to Deactivate|-|IF|0.1|0.21|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.36|1.5|V|
|Reverse Input Current<br>~~pe~~|VR=5V<br>~~pe~~|IR<br>~~pe~~|-<br>~~pe~~|-<br>~~pe~~|10<br>~~pe~~|A<br>~~pe~~|
|**Common Characteristics**<br>~~pe~~|||||||
|Input to Output Capacitance<br>~~pe~~|VIO=0V, f=1MHz<br>~~pe~~|CIO<br>~~pe~~|-<br>~~pe~~|3<br>~~pe~~|-<br>~~pe~~|pF<br>~~pe~~|



## **PLA192E Safety and Insulation Ratings** 

|**Parameters**|**Conditions**|**Symbol**|**Min**|**Max**|**Units**|
|---|---|---|---|---|---|
|Pollution Degree 2 accordingto DIN VDE 0109|-|-|-|-|-|
|Highest Allowable Over-Voltage|Transient Voltage|VIOTM|7071|-|VP|
|Maximum WorkingInsulation Voltage|RecurringVoltage|VIORM|1000|-|VP|
|Partial Discharge Test Voltage|DIN EN 60747-5-5Method B|VPR|-|1875|VP|
|Isolation Test Voltage|-|VISO|-|5000|Vrms|
|Creepage Distance|-|-|7.6|-|mm|
|Clearance Distance|-|-|7.6|-|mm|



R10 

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call INTEGRATED CIRCUITS DIVISION **PLA192** ~~a~~ 

## **PERFORMANCE DATA*** 

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Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA) (N=50, IF=5mA, IL=100mADC ) (N=50, IF=5mA, IL=100mADC )<br>3025 3530 Fo UT hf CUT TT 3530 Fo UT CUT CUT<br>20 2 25 25 TT<br>20 20<br>15 ; | iaa a7! me 7| ie<br>15 15<br>10<br>Tit 10 -Hieoo 10 op io<br>5 | aia 5 5 = ||<br>0 “=i 0 cet 0 cefiicc<br>1.364 1.366 1.368 1.370 1.372 1.6 1.7 1.8 1.9 2.0 2.1 0.23 0.26 0.29 0.32 0.35 0.38<br>LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Typical IF for Switch Operation Typical On-Resistance Distribution DC-Only On-Resistance Distribution<br>(N=50, IL=100mA) (N=50, IF=5mA, IL=150mA) (N=50, IF=5mA, IL=220mA)<br>30 40 30<br>25 F DOLELLELLI 35 foe 25<br>30<br>20 | fo =—— ee 20<br>25<br>15 20 15<br>10 oS Ssee m 15 =s === 10<br>10<br>5 Lae = =e 5<br>5<br>0 fi. 0  ——z-— 0<br>0.20 0.21 0.22 0.23 0.24 0.25 0.26 13.1 13.2 13.3 13.4 13.5 13.6 4.05 4.10 4.15 4.20 4.25 4.30<br>LED Current (mA)  On-Resistance ( ) On-Resistance ( )<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


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Typical Blocking Voltage Distribution<br>(N=50)<br>3025201510 T==|.oL||ig<br>5 | pee<br>0 a_i io i<br>700 710 720 730 740 750<br>Blocking Voltage (VP)<br>Device Count (N)<br>**----- End of picture text -----**<br>


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Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>vs. Temperature (IL=100mA) (IL=100mA)<br>1.8 4500 361<br>1.7 E | | UT CUT CT 4000 ee ee ee ee 360 F<br>1.6 3500<br>1.5 Set+ IIFF=10mA=5mA ee 30002500 ee 359 OTT<br>1.4 I F =2mA 2000 358<br>1.3 ASS Oe<br>pf FSS 9 ° 1500  SESSAS ee 357 Eberpo4ew<br>1.2 1000<br>1.1 SSeqtas 500 CUES 356 | |<br>1.0 Ft. tt 0 PbES 355 0SCO eee eee eee eee<br>-50 -25 0 25 50 75 100 0 10 20 30 40 50 0 10 20 30 40 50<br>Temperature (ºC) LED Current (mA) Forward Current (mA)<br>s) s)<br>Turn-On Time ( Turn-Off Time (<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

**www.ixysic.com** 

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= INTEGRATED CIRCUITS DIVISION **PLA192** ~~eee~~ 

## **PERFORMANCE DATA*** 

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Typical IF for Switch Operation Typical Turn-On Time Typical Turn-Off Time<br>vs. Temperature vs. Temperature vs. Temperature<br>(IL=100mA) (IL=100mA) (IL=100mA)<br>0.30 4500 500<br>0.280.26 EEE. 40003500 EERE IF=2mA 450400 IIIFFF=10mA=5mA=2mA Oe<br>0.24 Sa 3000<br>0.22 Fo | | PA“a 25002000 Peer= > IF=5mA 350 PTINES<br>300<br>0.20<br>0.18 pPerr{| pet { rr)ft 15001000 iae6eeea IF=10mA 250 DINOs—LLELL-<br>0.16 el ott tT  tt 500 e n ae 200 PtE tTEU TB NL<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical AC/DC On-Resistance Typical DC-Only On-Resistance Maximum Load Current<br>vs. Temperature vs. Temperature vs. Temperature<br>18 (IF=5mA, IL=150mA) 7 (IF=5mA, IL=220mA) 250 (IF=5mA)<br>DC-Only Configuration<br>16 6 Pt | tT | ye<br>200<br>‘ ef 5 | | | |<br>14 AC/DC Configuration<br>4 P| |Prt]| 150<br>12<br>3 ptt<br>100<br>10 2 -T | | tT| | I<br>8 1 Pett TL Tt 50<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical Load Current vs. Load Voltage Typical Load Current vs. Load Voltage<br>AC/DC Configuration DC-Only Configuration Typical Blocking Voltage<br>0.15 (IF=5mA) 0.25 (IF=5mA) 770 ee vs. Temperature<br>0.10 0.20 760<br>0.05 750 eof | tl | ce<br>0.15<br>740 eof | | Ce<br>0.00<br>0.10 730 Poff | re<br>-0.05 720 Ftc<br>-0.10 0.05 710 ra | t | | | | ft |<br>-0.15 0.00 700 PCT<br>-3 -2 -1 0 1 2 3 0.0 0.2 0.4 0.6 0.8 1.0 1.2 -40 -20 0 20 40 60 80 100<br>Voltage (V) Voltage (V) Temperature (ºC)<br>Typical Leakage vs. Temperature Output Capacitance<br>Measured across Pins 4&6 vs. Load Voltage Energy Rating Curve<br>0.06 (VL=600V) 180 (IF=0mA, f=1MHz) 1.2 (IF=5mA)<br>160<br>0.05 Ft | | ht dT hr 140 Sa a 1.0 NaA<br>0.04 120 0.8<br>Se SS se enee<br>100<br>0.03 0.6<br>0.02 YA 8060 eS| 0.4 A<br>pt tT | TA TO COTM Nn CoC aN a a<br>40<br>0.01 A 20 aa 0.2 Se<br>0 c ee el ee 0 CECE 0 FUL IUTATMC YC Ti<br>-40 -20 0 20 40 60 80 100 0.1 1 10 100 1000 10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Temperature º(C) Load Voltage (V) Time<br>s) s)<br>Turn-On Time ( Turn-Off Time (<br>LED Current to Operate (mA)<br>) )<br>On-Resistance ( On-Resistance ( Load Current (mA)<br>)P<br>Current (A) Current (A)<br>Blocking Voltage (V<br>A)<br>Leakage (<br>Load Current (A)<br>Output Capacitance (pF)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R10 

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**PLA192** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of %) the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

|**Device**<br>~~—————————~~|**Moisture Sensitivity Level (MSL) Classifi cation**<br>~~—————————~~|
|---|---|
|PLA192S / PLA192ES<br>~~—————————~~|MSL 1<br>~~—————————~~|



## **ESD Sensitivity** 

This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. 

**Device Classifi cation Temperature (Tc) Dwell Time (tP) Max Refl ow Cycles** PLA192S / PLA192ES 250ºC 30 seconds 3 ~~—~~ For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. 

|**Device**<br>~~——————~~|**Maximum Pin Temperature**<br>~~——————~~|**Maximum Body Temperature**<br>~~——————~~|**Maximum Dwell Time**<br>~~——————~~|**Wave Cycles**<br>~~——————~~|
|---|---|---|---|---|
|PLA192 / PLA192E<br>~~——————~~|260ºC<br>~~——————~~|250ºC<br>~~——————~~|10 seconds*<br>~~——————~~|1<br>~~——————~~|



*Total cumulative duration of all waves. 

## **Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 

**www.ixysic.com** 

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**PLA192** 

INTEGRATED CIRCUITS DIVISION 

## **MECHANICAL DIMENSIONS** 

## **PLA192 & PLA192E** 

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8.382±0.381 7.239 TYP PCB Hole Pattern<br>(0.330±0.015) 2.54±0.127 (0.285 TYP)<br>(0.100±0.005)<br>[o ath 6 - 0.800 DIA.<br>(6 - 0.031 DIA.) 2.540±0.127<br>9.144±0.508 (0.100±0.005)<br>6.350±0.127<br>(0.360±0.020)<br>(0.250±0.005)<br>7.620±0.127<br>(0.300±0.005)<br>1.524 TYP<br>Pin 1 1.651±0.254(0.060 TYP) (0.300±0.010)7.620±0.254 0.254±0.0127<br>a i  a (0.065±0.010) (0.010±0.0005) 1 nLeb 5.080±0.127 ie4<br>(0.200±0.005)<br>Controlling dimension: inches<br>3.302±0.051 4.064 TYP<br>(0.130±0.002) iin (0.160 TYP) Dimensions _<br>0.457±0.076 mm<br>(0.018±0.003) (inches)<br>**----- End of picture text -----**<br>


## **PLA192S & PLA192ES** 

0.635±0.127 8.382±0.381 (0.025±0.005) (0.330±0.015) 2.54±0.127 (0.100±0.005) 9.524±0.508 ~~ae~~ 6.350±0.127 ; (0.375±0.020) (0.250±0.005) 7.620±0.254 0.254±0.0127 Pin 1 (0.018±0.003)0.457±0.076 (0.300±0.010) (0.010±0.0005) 1.651±0.254 ~~=~~ (0.065±0.010) L ~~i~~ 3.302±0.051 (0.130±0.002) 4.445±0.254 (0.175±0.010) 1.524 TYP (0.060 TYP) 1.651±0.254 ~~im~~ (0.065±0.010) 

**PCB Land Pattern** 2.54 (0.10) f ~~om~~ 8.90 1.65 (0.3503) (0.0649) ~~c~~ k ~~=~~ 0.65 (0.0255) Controlling dimension: inches Dimensions mm - (inches) 

R10 

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**PLA192** 

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INTEGRATED CIRCUITS DIVISION<br>**----- End of picture text -----**<br>


## **PLA192STR & PLA192ESTR** 

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330.2 Dia P1 = 12.00<br>(13.00 Dia) (0.472)<br>Top Cover W=16.00<br>Tape Thickness (0.63)<br>0.102 Max<br>(0.004 Max) B0 = 10.10<br>(0.398)<br>K0 = 4.90 A0(0.398) = 10.10<br>       (0.19)<br>K1 = 3.80 [B][e] Dimensions<br>       (0.15) User Direction of Feed mm<br>EmbossedCarrier (inches)<br>an [:] NOTES: [7] fake=<br>1. All dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>**----- End of picture text -----**<br>


## **For additional information please visit our website at: https://www.ixysic.com** 

**Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** 

Specification:  DS-PLA192-R10 ©Copyright 2021, Littelfuse, Inc. All rights reserved.  Printed in USA. 12/7/2021 

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