PLA170STR

**PLA170 800V, 180mA Single-Pole Normally Open Relay** 

INTEGRATED CIRCUITS DIVISION 

|**Parameter**|**Rating**|**Units**|
|---|---|---|
|BlockingVoltage|800|VP|
|Load Current, Continuous<br>AC/DC Configuration<br>DC Configuration|100|mArms/ mADC|
||180|mADC|
|On-Resistance (max)<br>AC/DC Configuration<br>DC Configuration|50||
||14||



## **Features** 

- 800VP Blocking Voltage 

- 3750Vrms Input/Output Isolation 

- 100% Solid State 

## **Description** 

PLA170 is a single-pole, normally open (1-Form-A) Solid State Relay that uses optically coupled MOSFET technology to provide an en hanced input-to-output isolation of 3750V . rms 

Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient infrared LED. 

Designed to replace electromechanical relays, the PLA170 offers the superior reliability associated with solid state devices, and provides bounce-free switching in a more compact surface mount or thru-hole package. 

- Low Drive Power Requirements 

- No EMI/RFI Generation 

- Small 6-Pin Package 

- Flammability Rating UL 94 V-0 

## **Approvals** 

- UL Recognized Component: File E76270 

- TUV EN 62368-1: Certificate # B 082667 0008 

## **Applications** 

- Instrumentation 

- Multiplexers 

- Data Acquisition 

- Electronic Switching 

- I/O Subsystems 

## **Ordering Information** 

|**Part #**|**Description**|
|---|---|
|PLA170|6-Pin DIP(50/tube)|
|PLA170S|6-Pin Surface Mount(50/tube)|
|PLA170STR|6-Pin Surface Mount(1000/Reel)|



- Meters (Watt-Hour, Water, Gas) 

- Medical Equipment—Patient/Equipment Isolation 

- Security 

- Industrial Controls 

## **Pin Configuration** 

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AC/DC Configuration<br>1  6<br>+ Control  Load<br>2  5<br>– Control  Do Not Use<br>3  4<br>NC  Load<br>DC Only Configuration<br>1  6<br>+ Control  + Load<br>2  5<br>– Control  – Load<br>3  4<br>NC<br>**----- End of picture text -----**<br>


## **Switching Characteristics of Normally Open Devices** 

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Form-A<br>IF<br>90%<br>10%<br>ILOAD<br>ton toff<br>**----- End of picture text -----**<br>


**1** 

DS-PLA170-R06 

**www.ixysic.com** 

**PLA170** 

INTEGRATED CIRCUITS DIVISION 

## **Absolute Maximum Ratings @ 25ºC** 

|**Parameter**|**Ratings**|**Units**|
|---|---|---|
|BlockingVoltage|800|VP|
|Reverse Input Voltage|5|V|
|Input Control Current<br>Peak(10ms)|50|mA|
||1|A|
|Input Power Dissipation1|150|mW|
|Total Power Dissipation2|800|mW|
|Isolation Voltage, Input to Output|3750|Vrms|
|Operational Temperature, Ambient|-40 to +85|°C|
|Storage Temperature|-40 to +125|°C|



_Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied._ 

_Typical values are characteristic of the device at +25°C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements._ 

1  Derate linearly 1.33 mW / ºC 

2  Derate output power linearly 6.67 mW / ºC 

## **Electrical Characteristcs @ 25ºC** 

|**Parameter**|**Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Units**|
|---|---|---|---|---|---|---|
|**Output Characteristics**|||||||
|Blocking Voltage<br>~~er~~|IL=1A<br>~~er~~|VDRM<br>~~er~~|800<br>~~er~~|-<br>~~er~~|-<br>~~er~~|VP<br>~~er~~|
|Load Current<br>Continuous, AC/DC Configuration1<br>Continuous, DC Configuration<br>Peak<br>~~er~~<br>~~eee~~|-<br>~~er~~|IL<br>~~er~~|-<br>~~er~~|-<br>~~er~~|100<br>~~er~~|mArms/ mADC<br>~~er~~|
||||||180<br>~~er~~|mADC<br>~~er~~|
||t=10ms<br>~~er~~<br>~~eee~~|ILPK<br>~~er~~<br>~~eee~~|-<br>~~er~~<br>~~eee~~|-<br>~~er~~<br>~~eee~~|±350<br>~~er~~<br>~~eee~~|mAP<br>~~er~~<br>~~eee~~|
|On-Resistance2<br>AC/DC Configuration<br>DC Configuration<br>~~er~~<br>~~eee~~|IL=100mA<br>~~er~~<br>~~eee~~|RON<br>~~er~~<br>~~eee~~|-<br>~~er~~<br>~~eee~~|-<br>~~er~~<br>~~eee~~|50<br>~~er~~<br>~~eee~~|<br>~~er~~<br>~~eee~~|
||IL=180mA<br>~~eee~~||-<br>~~eee~~|-<br>~~eee~~|14<br>~~eee~~||
|Off-State Leakage Current<br>~~eee~~<br>~~ee~~|VL=800V<br>~~eee ~~<br>~~ee~~|ILEAK<br> ~~eee~~<br>~~ee~~|-<br>~~eee~~<br>~~ee~~|-<br>~~eee~~<br>~~ee~~|1<br>~~eee~~<br>~~ee~~|µA<br>~~eee~~<br>~~ee~~|
|Switching Speeds<br>Turn-On<br>Turn-Off<br>~~ee~~|IF=5mA, VL=10V<br>~~ee~~|ton<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|5<br>~~ee~~|ms<br>~~ee~~|
|||toff<br>~~ee~~|-<br>~~ee~~|-<br>~~ee~~|5<br>~~ee~~||
|Output Capacitance<br>~~ee~~|IF=0mA, VL=50V, f=1MHz<br>~~ee~~|COUT<br>~~ee~~|-<br>~~ee~~|50<br>~~ee~~|-<br>~~ee~~|pF<br>~~ee~~|
|**Input Characteristics**|||||||
|Input Control Current to Activate3|IL=100mA|IF|-|-|5|mA|
|Input Control Current to Deactivate|-|IF|0.3|0.7|-|mA|
|Input Voltage Drop|IF=5mA|VF|0.9|1.36|1.5|V|
|Reverse Input Current|VR=5V|IR|-|-|10|µA|
|**Common Characteristics**|||||||
|Input to Output Capacitance|VIO=0V, f=1MHz|CIO|-|3|-|pF|



1  AC/DC confi guration load current derates linearly from 100mA @ 25oC to 90mA @85oC with IF=5mA. 

2  Measurement taken within 1 second of on-time. 

3  For applications requiring high temperature operation (greater than 60oC) a minimum LED drive current of 10mA is recommended. 

R06 

**www.ixysic.com** 

**2** 

**PLA170** 

INTEGRATED CIRCUITS DIVISION 

## **PERFORMANCE DATA*** 

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**----- Start of picture text -----**<br>
Typical LED Forward Voltage Drop Typical Turn-On Time Typical Turn-Off Time<br>(N=50, IF=5mA)F=5mA)=5mA) (N=50, IF=5mA, IL=100mADC) (N=50, IF=5mA, IL=100mADC)<br>30 25 35<br>25 eeeeeeeee 20 30<br>25<br>20<br>| ie 15 FT Tel IT 20<br>15<br>15<br>10<br>10 rTrT 10<br>50 rT i| T ni aia aia 50 —||| Eee 2 | 50<br>1.364 1.366 1.368 1.370 1.372 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.070 0.075 0.080 0.085 0.090<br>LED Forward Voltage Drop (V) Turn-On Time (ms) Turn-Off Time (ms)<br>Typical IF for Switch Operation Typical IF for Switch Dropout Typical On-Resistance Distribution<br>(N=50, IL=100mADC) (N=50, IL=100mADC) (N=50, IL=100mADC)<br>25 25 35<br>20 FET ETT E hh 20 UEETTT 30<br>25<br>15 PCR) 15 OO TE TT C 20 E<br>10 2|0 Ge 10 e 15<br>10<br>5 22 5 | ee te<br>|) | Pee |) 5 eee<br>0 | Eee 0 | Eee 0 Eee| le<br>0.39 0.65 0.91 1.17 1.43 1.69 1.95 0.39 0.65 0.91 1.17 1.43 1.69 1.95 39 40 41 42 43 44 45<br>LED Current (mA) LED Current (mA) On-Resistance ( )<br>Device Count (N) Device Count (N) Device Count (N)<br>Device Count (N) Device Count (N) Device Count (N)<br>**----- End of picture text -----**<br>


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Typical LED Forward Voltage Drop<br>(N=50, IF=5mA)F=5mA)=5mA)<br>30<br>25 eeeeeeeee<br>20<br>| ie<br>15<br>10 rTrT | aia aia<br>050 i| T ni<br>1.364 1.366 1.368 1.370 1.372<br>LED Forward Voltage Drop (V)<br>Device Count (N)<br>**----- End of picture text -----**<br>


**Typical Blocking Voltage Distribution (N=50)** 

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353025 PSOC OLL er<br>20 OOP Pelrer<br>1510 2.==| oo<br>50 hCrite<br>875 880 885 890 895 900 905<br>Blocking Voltage (VP)<br>Typical Turn-On Time Typical Turn-Off Time<br>Typical LED Forward Voltage Drop vs. LED Forward Current vs. LED Forward Current<br>vs. Temperature (IL=100mADC) (IL=100mADC)<br>1.8 2.0 0.35<br>1.7 1.8 0.30<br>E | | | ht CT 1.6 Po fie fe fa dd FT. TE [TELL]<br>1.61.5 IIFF=10mA=5mA 1.41.2 0.250.20<br>1.41.3 S S,e I F =2mA 1.00.8 S EEEEE E EEEER 0.15 | EreEEE EHHT LE<br>0.6 0.10<br>1.2<br>0.4<br>1.1 BRS 0.2 AES 0.05 ete<br>1.0 Seti 0 0 [ESSSSSS6] 0 fd<br>-50 -25 0 25 50 75 100 0 5 10 15 20 25 30 35 40 45 50 0 5 10 15 20 25 30 35 40 45 50<br>Temperature (ºC) LED Forward Current (mA) LED Forward Current (mA)<br>Device Count (N)<br>Turn-On Time (ms) Turn-Off Time (ms)<br>LED Forward Voltage Drop (V)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R06 

**www.ixysic.com** 

**3** 

**PLA170** 

INTEGRATED CIRCUITS DIVISION ~~**e** e~~ 

## **PERFORMANCE DATA*** 

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**----- Start of picture text -----**<br>
Typical Turn-On Time Typical Turn-Off Time Typical On-Resistance<br>vs. Temperature vs. Temperature vs. Temperature<br>(IL=70mADC) (IF=5mA, IL=70mADC) (IF=5mA, IL=50mADC)<br>2.0 0.20 60<br>1.8 0.18<br>1.6 a 0.16 a 50 FELL LET<br>1.4 a 0.14 Se 40<br>1.21.00.8 aaa a IF=5mA 0.120.100.08 aPESOs 30 P~~eay| | | ld CU<br>0.6 a 0.06 S S O 20 TT tld<br>0.40.2 Ae IF=10mA a 0.040.02 DS 10 Fett<br>0 S SSea eeeTr 0 SESes a EE 0 Pt Ut  EL Tt<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Typical IF for Switch Operation  Typical IF for Switch Dropout<br>vs. Temperature vs. Temperature Typical Load Current vs. Load Voltage<br>(IL=70mADC) (IL=70mADC) (IF=5mA)<br>3.0 3.0 150<br>2.5 2.5 100<br>PTET TTY) Ee<br>2.0 2.0 50<br>pt tt ttt Pt | | dT LAL<br>1.5 7a 1.5 Pt tT | dT UY 0<br>1.0 Pt TE | Yt 1.0 Pt TE | YT -50<br>0.50.0 P|FEPeet | tt 0.50.0 P|eT]pet tt -100-150<br>-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100 -6 -4 -2 0 2 4 6<br>Temperature (ºC) Temperature (ºC) Load Voltage (V)<br>Maximum Load Current Typical Blocking Voltage  Typical Leakage vs. Temperature<br>vs. Temperature vs. Temperature Measured across Pins 4&6<br>220 1050 0.040<br>200180160140 Saseee DC Configuration e acone IIFF=10mA=5mA 1000950900 eet tT ct TT== 0.0350.0300.025 pfF.1df |fet<br>eS 0.020<br>120 850<br>100 a AC/DC Configuration 2 0.015<br>80 IF=5mA 800 0.010<br>60 SSS 750 eee 0.005 EEE<br>40 s e ee 700 P ott TE tT tt 0 2eee<br>-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100<br>Temperature (ºC) Temperature (ºC) Temperature (ºC)<br>Turn-On Time (ms) Turn-Off Time (ms) On-Resistance ()<br>LED Current (mA) LED Current (mA) Load Current (mA)<br>)P<br>A)<br>Leakage (<br>Load Current (mA) Blocking Voltage (V<br>**----- End of picture text -----**<br>


## **Energy Rating Curve** 

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1.0<br>0.9 SNC A000 0 00<br>0.8 2200000000000<br>0.7 2201) 000000<br>0.6 TMI TT Fn CTT<br>0.5 22010000500<br>0.4 2801000080<br>0.3 200100000000SU<br>0.2 200100000000<br>0.1 2201000000000 [0] SE<br>0 2010000000<br>10 s 100 s 1ms 10ms 100ms 1s 10s 100s<br>Time<br>Load Current (A)<br>**----- End of picture text -----**<br>


*Unless otherwise noted, data presented in these graphs is typical of device operation at 25ºC. 

R06 

**www.ixysic.com** 

**4** 

**PLA170** 

INTEGRATED CIRCUITS DIVISION 

## **Manufacturing Information** 

## **Moisture Sensitivity** 

All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of %) the joint industry standard, **IPC/JEDEC J-STD-020** , in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. 

Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. 

This product carries a **Moisture Sensitivity Level (MSL)** classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard **IPC/JEDEC J-STD-033** . 

**Device Moisture Sensitivity Level (MSL) Classifi cation** PLA170S MSL 1 ~~————————E~~ 

## **ESD Sensitivity** 

This product is ESD Sensitive, and should be handled according to the industry standard **JESD-625** . 

## **Soldering Profile** 

Provided in the table below is the **IPC/JEDEC J-STD-020** Classification Temperature (TC) and the maximum total dwell time (tP) in all reflow processes that the body temperature of these surface mount devices may be (TC - 5)°C or greater. The device’s body temperature must not exceed the Classification Temperature at any time during reflow soldering processes. 

|**Device**<br>~~SS~~|**Classifi cation Temperature (Tc)**<br>~~SS~~|**Dwell Time (tP)**<br>~~SS~~|**Max Refl ow Cycles**<br>~~SS~~|
|---|---|---|---|
|PLA170S<br>~~SS~~|250ºC<br>~~SS~~|30 seconds<br>~~SS~~|3<br>~~SS~~|



For through-hole devices, the maximum pin temperature and maximum dwell time through all solder waves is provided in the table below. Dwell time is the interval beginning when the pins are initially immersed into the solder wave until they exit the solder wave. For multiple waves, the dwell time is from entering the first wave until exiting the last wave. During this time, pin temperatures must not exceed the maximum temperature given in the table below. Body temperature of the device must not exceed the limit shown in the table below at any time during the soldering process. 

|**Device**<br>~~SE————————~~|**Maximum Pin Temperature**<br>~~SE————————~~|**Maximum Body Temperature**<br>~~SE————————~~|**Maximum Dwell Time**<br>~~SE————————~~|**Wave Cycles**<br>~~SE————————~~|
|---|---|---|---|---|
|PLA170<br>~~SE————————~~|260ºC<br>~~SE————————~~|250ºC<br>~~SE————————~~|10 seconds*<br>~~SE————————~~|1<br>~~SE————————~~|



*Total cumulative duration of all waves. 

## **Board Wash** 

IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to halide flux or solvents. 

R06 

**www.ixysic.com** 

**5** 

**PLA170** 

INTEGRATED CIRCUITS DIVISION 

## **Mechanical Dimensions** 

## **PLA170** 

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**----- Start of picture text -----**<br>
8.382±0.381 7.239 TYP PCB Hole Pattern<br>(0.330±0.015) 2.54±0.127 (0.285 TYP)<br>(0.100±0.005)<br>L at 6 - 0.800 DIA.<br>(6 - 0.031 DIA.) 2.540±0.127<br>9.144±0.508 (0.100±0.005)<br>6.350±0.127<br>(0.360±0.020)<br>(0.250±0.005)<br>7.620±0.127<br>(0.300±0.005)<br>1.524 TYP<br>Pin 1 1.651±0.254(0.060 TYP) (0.300±0.010)7.620±0.254 0.254±0.0127<br>S a (0.065±0.010) le m (0.010±0.0005) 7 yLed 5.080±0.127 e4<br>(0.200±0.005)<br>Controlling dimension: inches<br>3.302±0.051 4.064 TYP<br>(0.130±0.002) iia (0.160 TYP) _ Dimensions<br>0.457±0.076 mm<br>(0.018±0.003) (inches)<br>**----- End of picture text -----**<br>


## **PLA170S** 

> 0.635±0.127 **PCB Land Pattern** 8.382±0.381 (0.025±0.005) (0.330±0.015) 2.54±0.127 (0.100±0.005) 2.54 (0.10) 9.524±0.508 ~~oe~~ 6.350±0.127 , 0 ~~“~~ (0.375±0.020) (0.250±0.005) 8.90 1.65 (0.3503) Pin 1 (0.018±0.003)0.457±0.076 (0.300±0.010)7.620±0.254 (0.010±0.0005)0.254±0.0127 (0.0649) 1.651±0.254 ~~=~~ (0.065±0.010) H ~~i W~~ e ~~=~~ 0.65 3.302±0.051 (0.130±0.002) (0.0255) 4.445±0.254 (0.175±0.010) Controlling dimension: inches 1.524 TYP (0.060 TYP) Dimensions 1.651±0.254 mm ~~=~~ 7 (0.065±0.010) (inches) 

R06 

**www.ixysic.com** 

**6** 

**PLA170** 

INTEGRATED CIRCUITS DIVISION 

## **PLA170STR Tape & Reel** 

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**----- Start of picture text -----**<br>
330.2 Dia P1 = 12.00<br>(13.00 Dia) (0.472)<br>Top Cover W=16.00<br>Tape Thickness (0.63)<br>0.102 Max<br>(0.004 Max) B0 = 10.10<br>(0.398)<br>K0 = 4.90 A0(0.398) = 10.10<br>       (0.19)<br>K1 = 3.80 [W][e] Dimensions<br>       (0.15) User Direction of Feed mm<br>EmbossedCarrier (inches)<br>an [:] NOTES: [|] maoI<br>1. All dimensions carry tolerances of EIA Standard 481-2<br>Embossment 2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2<br>**----- End of picture text -----**<br>


## **For additional information please visit our website at: https://www.ixysic.com** 

**Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at https://www.littelfuse.com/disclaimer-electronics.** 

Specification:  DS-PLA170-R06 ©Copyright 2021, Littelfuse, Inc. OptoMOS® is a registered trademark of IXYS Integrated Circuits All rights reserved.  Printed in USA. 

**7** 

11/5/2021