PCS.26.A

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Low Profile 4G LTE SMD Dielectric Antenna 

**Part No: PCS.26.A** 

**Description** 

Low Profile 4G LTE SMD Dielectric Antenna 

**Features:** 

High Efficiency 4G LTE SMD antenna Covers 600-3000MHz Band 71 Ready 

Dimensions: 54.6*13*3mm RoHS & Reach Compliant 

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SPE-18-8-100-H 

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1. Introduction  2<br>2. Specification  3<br>3. Antenna Characteristics  5<br>4. Radiation Patterns  9<br>5. Mechanical Drawing  16<br>6. Packaging  17<br>7. Antenna Integration Guide  18<br>8. Solder Reflow Profile  26<br>9. Application Note  27<br>Changelog  29<br>**----- End of picture text -----**<br>


Taoglas makes no warranties based on the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice. Taoglas reserves all rights to this document and the information contained herein. Reproduction, use or disclosure to third parties without express permission is strictly prohibited. 

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The PCS.26.A is a low-profile SMD 4G/LTE embedded antenna designed for direct SMD mount on a device PCB. It provides high efficiency in a very small form factor, at 54.6*13*3mm. Its rectangular shape and very small size make it very easy to integrate. Packaged in tape and reel, it can be mounted via pick and place to reflow solder directly on the edge of the PCB board. 

The antenna is a great match for lower cost cellular applications, particularly in the telematics and automotive sector, but also for IoT applications as it exhibits outstanding performance on variable ground plane lengths – meaning it can be used in small devices. 

- Typical Applications Include: 

- IoT Sensors and devices 

- Connected Health 

- Wearables 

This antenna is recommended for use with longer ground-plane lengths of 100mm or more for maximum efficiency. Some tuning can be performed on this antenna to help optimize to the device environment. Contact your regional Taoglas customer support team for further information. 

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|**LTE Electrical**|**LTE Electrical**|**LTE Electrical**|**LTE Electrical**|**LTE Electrical**|**LTE Electrical**|**LTE Electrical**|**LTE Electrical**|**LTE Electrical**|
|---|---|---|---|---|---|---|---|---|
|**Band**|Frequency<br>(MHz)|Efficiency (%)|Average Gain<br>(dB)|Peak Gain (dBi)|Peak Gain (dBi)<br>Impedance|Polarization|Radiation<br>Pattern|Max. input<br>power|
|**5GNR/4G**<br>Band71|617-698|67.8|-1.69|2.36|50 Ω|Linear|Omni|2W|
|**4G/3G**<br>Band 12,13,14,17,28,29|698-806|75.2|-1.24|3.66|||||
|**4G/3G/NB-IoT/Cat M**<br>Band 5,8,18,19,20,26,27|824-960|76.0|-1.19|3.99|||||
|**5GNR/4G**<br>Band 21,32,74,75,76|1427-1518|25.8|-5.88|0.84|||||
|**4G/3G**<br>Band<br>1,2,3,4,9,23,25,35,39,66|1710-2200|73.2|-1.36|6.44|||||
|**4G/3G**<br>Band 7,30,38,40,41|2300-2690|68.2|-1.66|4.85|||||



## **Mechanical** 

||**Mechanical**||
|---|---|---|
|Antenna Dimensions||54.6mm x 13mm x 3mm|
|Material||FR4|
|Soldering Type||SMD through Reflow|
||||
||**Environmental**|**Environmental**|
|Operation Temperature||-40°C ~ +85°C|
|Storage Temperature||-40°C ~ +85°C|
|Moisture Sensitivity Level (MSL)||3 (168 Hours)|



* All measurements were SMD on 178*55.6mm EVB board 

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||**5G/4G Bands**|**5G/4G Bands**|**5G/4G Bands**|
|---|---|---|---|
|**Band Number**|**5GNR/ FR1/ LTE**|**/ LTE-Advanced/ WCDMA/ HSPA/ HSPA+/ TD-SCDMA**||
||**Uplink**|**Downlink**|**Covered**|
|**B1**|1920 to 1980|2110 to 2170|✓|
|**B2**|1850 to 1910|1930 to 1990|✓|
|**B3**|1710 to 1785|1805 to 1880|✓|
|**B4**|1710 to 1755|2110 to 2155|✓|
|**B5**|824 to 849|869 to 894|✓|
|**B7**|2500 to 2570|2620 to 2690|✓|
|**B8**|880 to 915|925 to 960|✓|
|**B9***|1749.9 to 1784.9|1844.9 to 1879.9|✓|
|**B11**|1427.9 to 1447.9|1475.9 to 1495.9||
|**B12**|699 to 716|729 to 746|✓|
|**B13**|777 to 787|746 to 756|✓|
|**B14**|788 to 798|758 to 768|✓|
|**B17**|704 to 716|734 to 746|✓|
|**B18**|815 to 830|860 to 875|✓|
|**B19**|830 to 845|875 to 890|✓|
|**B20**|832 to 862|791 to 821|✓|
|**B21**|1447.9 to 1462.9|1495.9 to 1510.9|✓|
|**B22***|3410 to 3490|3510 to 3590||
|**B23***|2000 to 2020|2180 to 2200|✓|
|**B24**|1626.5 to 1660.5|1525 to 1559|✓|
|**B25**|1850 to 1915|1930 to 1995|✓|
|**B26**|814 to 849|859 to 894|✓|
|**B27***|807 to 824|852 to 869|✓|
|**B28**|703 to 748|758 to 803|✓|
|**B29**|717 t|o 728|✓|
|**B30**|2305 to 2315|2350 to 2360|✓|
|**B31**|452.5 to 457.5|462.5 to 467.5||
|**B32**|1452 t|o 1496|✓|
|**B34**|2010 t|o 2025|✓|
|**B35**|1850 t|o 1910|✓|
|**B36**|1930 t|o 1990|✓|
|**B37**|1910 t|o 1930|✓|
|**B38**|2570 t|o 2620|✓|
|**B39**|1880 t|o 1920|✓|
|**B40**|2300 t|o 2400|✓|
|**B41**|2496 t|o 2690|✓|
|**B42**|3400 t|o 3600||
|**B43**|3600 t|o 3800||
|**B45**|1447 t|o 1467|✓|
|**B46**|5150 t|o 5925||
|**B47**|5855 t|o 5925||
|**B48**|3550 t|o 3700||
|**B49**|3550 t|o 3700||
|**B50**|1432 t|o 1517|✓|
|**B51**|1427 t|o 1432||
|**B52**|3300 t|o 3400||
|**B53**|2483.5|to 2495|✓|
|**B65**|1920 to 2010|2110 to 2200|✓|
|**B66**|1710 to 1780|2110 to 2200|✓|
|**B68**|698 to 728|753 to 783|✓|
|**B69**|2570 t|o 2620|✓|
|**B70**|1695 to 1710|1995 to 2020|✓|
|**B71**|663 to 698|617 to 652|✓|
|**B72**|451 to 456|461 to 466||
|**B73**|450 to 455|460 to 465||
|**B74**|1427 to 1470|1475 to 1518|✓|
|**B75**|1432 t|o 1517|✓|
|**B76**|1427 t|o 1432||
|**B77**|3300 t|o 4200||
|**B78**|3300 t|o 3800||
|**B79**|4400 t|o 5000||
|**B85**|698 to 716|728 to 746|✓|
|**B87**|410 to 415|420 to 425||
|**B88**|412 to 417|422 to 427||



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## Test Setup 

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## Return Loss 

## VSWR 

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## Efficiency 

## Average Gain 

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## Peak Gain 

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## Test Setup 

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## PCS.26.A - Patterns at 700 MHz 

## XZ Plane 

## YZ Plane 

## XY Plane 

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## PCS.26.A - Patterns at 780 MHz 

## XZ Plane 

## YZ Plane 

## XY Plane 

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## PCS.26.A - Patterns at 810 MHz 

## XZ Plane 

## YZ Plane 

## XY Plane 

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## PCS.26.A - Patterns at 1710 MHz 

## XZ Plane 

## YZ Plane 

## XY Plane 

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## PCS.26.A - Patterns at 1880 MHz 

## XZ Plane 

## YZ Plane 

## XY Plane 

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## PCS.26.A - Patterns at 2170 MHz 

## XZ Plane 

## YZ Plane 

## XY Plane 

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## **7.1** Schematic and Symbol Definition eas 

The circuit symbol for the antenna is shown below. The antenna has 4 pins with only two pins (Pin 1 and Pin 2) as functional. Pins 3 and 4 are for mechanical strength. 

|**Pin**<br>~~LT~~|**Description**<br>~~LT~~|
|---|---|
|1|RF Feed|
|2|Ground|
|3, 4|Mechanical, Not Connected|



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TAOGLAS PCS.26.A<br>ANTI —<br>OO oO<br>Z ZL<br>Ys? k<br>OF =<br>“=! nN om] +<br>**----- End of picture text -----**<br>


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## Antenna Integration 

For any given PCB size, the antenna should ideally be placed on the PCB’s shortest side, to take advantage of the ground plane. Optimized matching components can be placed as shown. 

With Solder Mask Without Solder Mask 

## PCB Layout 

The footprint and clearance on the PCB must meet the layout drawing in section (Footprint Drawing). Note the placement of the optimized components. L1 is placed as close as possible to the RF feed (pad 1) within the copper keep out area. C1 is then placed tightly in series after that. C2 is an optional component but the footprint is recommended in case it is needed. 

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ANT1<br>**----- End of picture text -----**<br>


Without Antenna 

With Antenna 

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SPE-18-8-100-H 

## PCB Keep out 

Below shows the antenna footprint and clearance through ALL layers on the PCB. Only the antenna pads and connections to feed and GND are present within this clearance area (marked RED). The clearance area extends to 5mm from the antenna mechanical pads to the ground area. This clearance area includes the bottom side and ALL internal layers on the PCB. 

Topside 

Bottom side 

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## Evaluation Board 

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Topside  Bottom Side<br>**----- End of picture text -----**<br>


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## Evaluation Board Ground Plane Length 

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## Matching Circuit 

Matching components with the PCS.26.A are required for the antenna to have optimal performance on the evaluation board, located outside of the ground plane in the space specified in the above images. Additional matching components may be necessary for your device, so we recommend incorporating extra component footprints, forming a “pi” network, between the cellular module and the edge of the ground plane. 

|**Designator**|**Type**|**Value**|**Manufacturer**|**Manufacturer**<br>**Part Number**|
|---|---|---|---|---|
|L1|Inductor|6.8nH|TDK Corporation|MLK1005S6N8JT000|
|C1|Capacitor|8.2pF|Murata<br>Electronics|GRM1555C1H8R2DA01D|
|C2|Capacitor|Not Fitted|-|-|



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## Footprint 

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The PCS.26.A can be assembled by following the recommended soldering temperatures are as follows: 

Smaller components are typically mounted on the first pass, however, we do advise mounting the PCS.06.A when placing larger components on the board during subsequent reflows. 

Note: Soldering flux classified ROL0 under IPC J-STD-004 is recommended. 

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This application note shows how changing the ground plane length effects the antenna performance. 

## Return Loss 

## Efficiency 

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Average Gain<br>**----- End of picture text -----**<br>


## Peak Gain 

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Changelog for the datasheet<br>SPE-18-8-100 – PCS.26.A<br>Revision: H (Current Version)<br>Date: 2023-09-11<br>Changes: Updated Solder Reflow information<br>Changes Made by: Cesar Sousa<br>Previous Revisions<br>Revision: G  Revision: B<br>Date: 2023-06-30  Date: 2018-11-19<br>Changes: Full datasheet update  Changes: Amended EVB size<br>Changes Made by: Gary West  Changes Made by: Jack Conroy<br>Revision: F Revision: A (First Release)<br>Date: 2022-08-12  Date: 2018-09-11<br>Changes: Updated antenna footprint drawing  Changes: First Release<br>Changes Made by: Gary West  Changes Made by: AW<br>Revision: E<br>Date: 2022-04-26<br>Changes: Updated 3D Radiation Patterns<br>Changes Made by: Gary West<br>Revision: D<br>Date: 2021-10-07<br>Changes: Updated datasheet template, addition of<br>intergration guide, addition of application note &<br>added MSL to spec table<br>Changes Made by: Gary West<br>Revision: C<br>Date:<br>Changes:<br>Changes Made by: AW<br>**----- End of picture text -----**<br>


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