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PCMF2HDMI2SZ
EMI Filter, 2 Channels, WLCSP-10
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- Manufacturer: NEXPERIA
- Product type: Integrated Passive Filters
- EMI Filter Type:Common Mode Filter with ESD Protection; No. of Data Lines:4 Data Lines; Filter Circuit:Common-Mode; Filter Case Style:WLCSP; No. of Pins:10Pins; Product Range:PCMFX
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 10Pins
- Product Range: PCMFxHDMI2S Series
- Filter Circuit: Common-Mode
- EMI Filter Type: Common Mode Filter with ESD Protection
- No. of Data Lines: 4 Data Lines
- Filter Case / Package: WLCSP
| Delivery and price | |
|---|---|
| Units per pack | 500 |
| Price | 0.405 € |
| Current stock | 10+ |
| Lead time | 30 days |
Datasheet
## **PCMFXHDMI2S series** **Common-mode EMI filter for differential channels with integrated ESD protection** **Rev. 2 — 19 April 2016** **Product data sheet** ## **1. Product profile** ## **1.1 General description** Common-mode ElectroMagnetic Interference (EMI) filters with integrated ElectroStatic Discharge (ESD) protection for one, two and three differential channels. The devices are designed to provide low insertion loss for differential high-speed signals on each channel while unwanted common-mode signals are attenuated. Each differential channel incorporates two signal lines that are coupled by integrated coils. Diodes provide protection to downstream components from ESD voltages up to 15 kV on each signal line. ## **Table 1. Product overview** |**Type number**|**Number of channels**|**Package Name**| |---|---|---| |PCMF1HDMI2S|1|WLCSP5| |PCMF2HDMI2S|2|WLCSP10| |PCMF3HDMI2S|3|WLCSP15| ## **1.2 Features and benefits** - One, two and three differential channels common-mode EMI filters with integrated ESD protection - ESD protection up to 15 kV contact discharge according to IEC 61000-4-2 - Superior common-mode suppression over a wide frequency range - Superior RF performance compared to other integrated filters or discrete filters with external ESD protection - Extremely high symmetry between line pairs - Industry-standard Wafer Level Chip Scale Packages: WLCSP5, 10 and 15 for smaller footprint ## **1.3 Applications** - Smartphone, cellular and cordless phone - Tablet PC and Mobile Internet Device (MID) - HDMI 2.0, HDMI 1.4 - MIPI M-PHY and D-PHY as used in Camera Serial Interface (CSI) and Display Serial Interface (DSI) - General-purpose EMI and Radio-Frequency Interference (RFI) filter and downstream ESD protection **==> picture [172 x 101] intentionally omitted <==** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **2. Pinning information** ## **Table 2. Pinning** |**Pin**|**Symbol**|**Description**|**Simplified outline**|**Graphic symbol**| |---|---|---|---|---| |**PCMF1HDMI2S (WLCSP5_2-1-2)**||||| |A1|CH1_IN+|channel 1+, external|**WLCSP5_2-1-2**<br>A<br>B<br>C<br>B1<br>1<br>2<br>Transparent top view|A1<br>A2<br>C1<br>C2<br>_aaa-019784_<br>B1| |A2|CH1_IN|channel 1, external||| |B1|GND_CH1|ground channel 1||| |C1|CH1_OUT+|channel 1+, internal||| |C2|CH1_OUT|channel 1, internal||| |**PCMF2HDMI2S (WLCSP10_4-2-4)**||||| |A1|CH1_IN+|channel 1+, external|**WLCSP10_4-2-4**<br>A<br>B<br>C<br>B1<br>B2<br>1<br>2<br>3<br>4<br>Transparent top view|A1, 3<br>A2, 4<br>C1, 3<br>C2, 4<br>_aaa-019785_<br>B1, B2 - no internal connection| |A2|CH1_IN|channel 1, external||| |A3|CH2_IN+|channel 2+, external||| |A4|CH2_IN|channel 2, external||| |B1|GND_CH1|ground channel 1||| |B2|GND_CH2|ground channel 2||| |C1|CH1_OUT+|channel 1+, internal||| |C2|CH1_OUT|channel 1, internal||| |C3|CH2_OUT+|channel 2+, internal||| |C4|CH2_OUT|channel 2, internal||| |**PCMF3HDMI2S (WLCSP15_6-3-6)**||||| |A1|CH1_IN+|channel 1+, external|**WLCSP15_6-3-6**<br>B2<br>B3<br>B1<br>1<br>2<br>3<br>4<br>5<br>6<br>A<br>B<br>C<br>Transparent top view|A1, 3, 5<br>A2, 4, 6<br>C1, 3, 5<br>C2, 4, 6<br>_aaa-019786_<br>B1, B2, B3 - no internal connection| |A2|CH1_IN|channel 1, external||| |A3|CH2_IN+|channel 2+, external||| |A4|CH2_IN|channel 2, external||| |A5|CH3_IN+|channel 3+, external||| |A6|CH3_IN|channel 3, external||| |B1|GND_CH1|ground channel 1||| |B2|GND_CH2|ground channel 2||| |B3|GND_CH3|ground channel 3||| |C1|CH1_OUT+|channel 1+, internal||| |C2|CH1_OUT|channel 1, internal||| |C3|CH2_OUT+|channel 2+, internal||| |C4|CH2_OUT|channel 2, internal||| |C5|CH3_OUT+|channel 3+, internal||| |C6|CH3_OUT|channel 3, internal||| © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **2 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **3. Ordering information** **Table 3. Ordering information** |**Type number**|**Package**|**Package**|**Package**| |---|---|---|---| ||**Name**|**Description**|**Version**| |PCMF1HDMI2S|WLCSP5|wafer level chip-size package; 5 bumps (2-1-2)|PCMF1HDMI2S| |PCMF2HDMI2S|WLCSP10|wafer level chip-size package;<br>10 bumps (4-2-4)|PCMF2HDMI2S| |PCMF3HDMI2S|WLCSP15|wafer level chip-size package;<br>15 bumps (6-3-6)|PCMF3HDMI2S| ## **4. Marking** **Table 4. Marking codes** |**Type number**|**Marking code**| |---|---| |PCMF1HDMI2S|PF1S| |PCMF2HDMI2S|PF2S| |PCMF3HDMI2S|PF3S| ## **5. Limiting values** ## **Table 5. Limiting values** _In accordance with the Absolute Maximum Rating System (IEC 60134)._ |**Symbol**|**Parameter**|**Conditions**|**Min**|**Max**|**Unit**| |---|---|---|---|---|---| |VI|input voltage||0.5|5|V| |VESD|electrostatic discharge<br>voltage|IEC 61000-4-2, level 4;<br>all input pins to ground|||| |||contact discharge|15|15|kV| |||air discharge|15|15|kV| |||IEC 61000-4-2, level 4;<br>all output pins to ground|||| |||contact discharge|2|2|kV| |||air discharge|2|2|kV| |IPPM|rated peak pulse<br>current|tp= 8/20s|7|7|A| |Tstg|storage temperature||40|+125|C| |Tamb|ambient temperature||40|+85|C| © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **Product data sheet** **3 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **6. Characteristics** ## **6.1 Channel characteristics** **Table 6. Channel characteristics** _Tamb = 25_ _C unless otherwise specified._ |**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Rs(ch)|channel series resistance|single line; input to output|-|3|-|| |Cd|diode capacitance|f = 1 MHz; VI= 2.5 V<br>[1]|-|0.25|-|pF| |IRM|reverse leakage current|per line; VI= 5 V|-|-|100|nA| |VBR|breakdown voltage|IR= 1 mA|6|9|-|V| |VF|forward voltage|IF= 10 mA|-|0.8|-|V| |VCL|clamping voltage|TLP<br>[2]||||| |||IPP=16 A|-|3.7|-|V| |||IPP=8 A|-|2.5|-|V| |||IPP= 8 A|-|2.8|-|V| |||IPP= 16 A|-|4|-|V| |Rdyn|dynamic resistance|TLP<br>[2]||||| |||positive transient|-|0.16|-|| |||negative transient|-|0.16|-|| |||surge<br>[3]||||| |||positive transient|-|0.22|-|| |||negative transient|-|0.22|-|| - [1] This parameter is guaranteed by design. - [2] 100 ns Transmission Line Pulse (TLP); 50 ; pulser at 70 ns to 90 ns. - [3] According to IEC 61000-4-5 (8/20 s). ## **6.2 Frequency characteristics** ## **Table 7. Frequency characteristics** |**Symbol**|**Parameter**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |**Common mode: S21cc**||||||| |il|insertion loss|[1]||||| |||f = 800 MHz|-|12|-|dB| |||f = 1.7 GHz|-|21.5|-|dB| |||f = 3 GHz|-|31.5|-|dB| |**Differential mode: S21dd**||||||| |il|insertion loss|f = 1 MHz<br>[1]|-|0.3|-|dB| |f3dB|cut-off frequency|[1]|-|6|-|GHz| - [1] Normalized to attenuation at 1 MHz. © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **4 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** ## **Common-mode EMI filter for differential channels with ESD protection** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> aaa-019777 aaa-019778<br>0 0<br>Sdd21 S(dB)cc21<br>(dB)<br>-10<br>-2<br>-20<br>S21dd pin 1 - 2 S21cc pin 1 - 2<br>-4<br>S21dd pin 5 - 6 S21cc pin 5 - 6<br>-30<br>-6<br>-40<br>-8 -50<br>10 [7] 10 [8] 10 [9] 10 [10] 10 [7] 10 [8] 10 [9] 10 [10]<br>f (Hz) f (Hz)<br>**----- End of picture text -----**<br> **Fig 1. Differential-mode insertion loss; typical values Fig 2. Common-mode insertion loss; typical values** **==> picture [481 x 189] intentionally omitted <==** **----- Start of picture text -----**<br> aaa-021982 aaa-019779<br>0 115<br>Sdd21<br>(db) Zdif<br>(Ω)<br>-20<br>Mag S21dd A3 - A4 > C1 - C2<br>105<br>Mag S21dd A5 - A6 > C1 - C2 Z reference<br>-40<br>Z DUT<br>95<br>-60<br>-80 85<br>10 [7] 10 [8] 10 [9] 10 [10] 10 [11] 40.4 40.6 40.8 41.0 41.2<br>f (Hz) t (ns)<br>**----- End of picture text -----**<br> **Fig 3. Differential crosstalk; typical values** tr = 200 ps **Fig 4. Differential Time Domain Reflectometer (TDR) plot; typical values** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 2 — 19 April 2016** **5 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## Test frequency: 148.5 MHz Differential swing voltage: 861 mV Horizontal scale: 34 ps/div **Fig 5. HDMI 2.0 eye diagram TP1, test board with PCMF2HDMI2S; typical values** Test frequency: 148.5 MHz Differential swing voltage: 917 mV Horizontal scale: 34 ps/div **Fig 6. HDMI 2.0 eye diagram TP1, test board without device; typical values** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 2 — 19 April 2016** **6 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** Test frequency: 148.5 MHz Differential swing voltage: 849 mV Horizontal scale: 34 ps/div **Remark:** Measured at Test Point 2 (TP2) worst cable emulator, reference cable equalizer and worst case positive skew. **Fig 7. HDMI 2.0 eye diagram TP2, test board with PCMF2HDMI2S; typical values** Test frequency: 148.5 MHz Differential swing voltage: 909 mV Horizontal scale: 34 ps/div **Remark:** Measured at Test Point 2 (TP2) worst cable emulator, reference cable equalizer and worst case positive skew. **Fig 8. HDMI 2.0 eye diagram TP2, test board without device; typical values** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 2 — 19 April 2016** **7 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** Vertical scale: 145 mV/div Horizontal scale: 15.6 ns/div **Fig 9. MIPI M-PHY PWM-TX transmitter eye opening at 140 mV, test board with PCMF2HDMI2S; typical values** Vertical scale: 146 mV/div Horizontal scale: 15.6 ns/div **Fig 10. MIPI M-PHY PWM-TX transmitter eye opening at 140 mV, test board without device; typical values** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 2 — 19 April 2016** **8 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** Vertical scale: 145 mV/div Horizontal scale: 15.6 ns/div **Fig 11. MIPI M-PHY PWM-TX transmitter eye opening at 140 mV, test board with PCMF2HDMI2S; typical values** Vertical scale: 146 mV/div Horizontal scale: 15.6 ns/div **Fig 12. MIPI M-PHY PWM-TX transmitter eye opening at 140 mV, test board without device; typical values** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 2 — 19 April 2016** **9 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** ## **Common-mode EMI filter for differential channels with ESD protection** **==> picture [482 x 249] intentionally omitted <==** **----- Start of picture text -----**<br> aaa-019781 aaa-019782<br>25 0<br>I I<br>(A) (A)<br>20 -5<br>15 -10<br>10 -15<br>5 -20<br>0 -25<br>0 5 10 15 20 25 -25 -20 -15 -10 -5 0<br>VCL (V) VCL (V)<br>Transmission Line Pulse (TLP) = 100 ns; Transmission Line Pulse (TLP) = 100 ns;<br>tr = 1 ns tr = 1 ns<br>Fig 13. Dynamic resistance with positive clamping; Fig 14. Dynamic resistance with negative clamping;<br>typical values typical values<br>**----- End of picture text -----**<br> **==> picture [482 x 247] intentionally omitted <==** **----- Start of picture text -----**<br> aaa-021984 aaa-021983<br>25 0<br>I I<br>(A) (A)<br>20 -5<br>15 -10<br>10 -15<br>5 -20<br>0 -25<br>0 5 10 15 20 25 -25 -20 -15 -10 -5 0<br>VCL (V) VCL (V)<br>Very-Fast Transmission Line Pulse (VF-TLP) = 5 ns; Very-Fast Transmission Line Pulse (VF-TLP) = 5 ns;<br>tr = 600 ps tr = 600 ps<br>Fig 15. Dynamic resistance with positive clamping; Fig 16. Dynamic resistance with negative clamping;<br>typical values typical values<br>**----- End of picture text -----**<br> The device uses an advanced clamping structure showing a negative dynamic resistance. This snapback behavior strongly reduces the clamping voltage to the system behind the ESD protection during an ESD event. Do not connect unlimited DC current sources to the data lines to avoid keeping the ESD protection device in snapback state after exceeding breakdown voltage (due to an ESD pulse for instance). All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** **Rev. 2 — 19 April 2016** **10 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** **==> picture [497 x 253] intentionally omitted <==** **----- Start of picture text -----**<br> aaa-022150 aaa-022151<br>10 0<br>I I<br>(A) (A)<br>8 -2<br>6 -4<br>4 -6<br>2 -8<br>0 -10<br>0 2 4 6 8 10 -10 -8 -6 -4 -2 0<br>VCL (V) VCL (V)<br>According to IEC 61000-4-5 (8/20 s) According to IEC 61000-4-5 (8/20 s)<br>Fig 17. Dynamic resistance with positive clamping; Fig 18. Dynamic resistance with negative clamping;<br>typical values typical values<br>**----- End of picture text -----**<br> ## **7. Application information** The device is designed to provide high-level ESD protection and common-mode filtering for differential high-speed data line pairs such as: - HDMI 2.0 - Transition-Minimized Differential Signaling (TMDS) - DisplayPort - external Serial Advanced Technology Attachment (eSATA) - Low Voltage Differential Signaling (LVDS) When designing the PCB, give careful consideration to impedance matching and signal coupling. Do not connect the protected signal lines to unlimited current sources like, for example, a battery. © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **Product data sheet** **11 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **8. Package outline** **WLCSP5: wafer level chip-size package; 5 bumps (2-1-2)** ## **PCMF1HDMI2S** **==> picture [481 x 493] intentionally omitted <==** **----- Start of picture text -----**<br> D<br>bump A1<br>index area A1<br>E A<br>detail X<br>e<br>1/2 e<br>b<br>C<br>e1<br>B1<br>B e2<br>A<br>bump A1 1 2<br>index area<br>X<br>0 1 mm<br>scale<br>Dimensions (mm are the original dimensions)<br>Unit A A1 b D E e e1 e2<br>max 0.60 0.38 0.31 0.82 1.22<br>mm nom 0.57 0.37 0.26 0.77 1.17 0.40 0.40 0.80<br>min 0.54 0.36 0.21 0.72 1.12<br>pcmf1hdmi2s_po<br>Outline References European Issue date<br>version IEC JEDEC JEITA projection<br>15-10-14<br>PCMF1HDMI2S<br>15-10-22<br>**----- End of picture text -----**<br> **Fig 19. Package outline WLCSP5** All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** **Rev. 2 — 19 April 2016** **12 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** **WLCSP10: wafer level chip-size package; 10 bumps (4-2-4)** **==> picture [58 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> PCMF2HDMI2S<br>**----- End of picture text -----**<br> **==> picture [481 x 565] intentionally omitted <==** **----- Start of picture text -----**<br> D<br>bump A1index area A1<br>E A<br>detail X<br>e b<br>C<br>e1<br>B1 B2<br>B e2<br>A<br>bump A1 1 2 3 4<br>index area e3 X<br>1/2 e<br>0 1 mm<br>scale<br>Dimensions (mm are the original dimensions)<br>Unit A A1 b D E e e1 e2 e3<br>max 0.60 0.38 0.31 1.62 1.22<br>mm nom 0.57 0.37 0.26 1.57 1.17 0.40 0.40 0.80 0.80<br>min 0.54 0.36 0.21 1.52 1.12<br>pcmf2hdmi2s_po<br>Outline References European Issue date<br>version IEC JEDEC JEITA projection<br>15-10-14<br>PCMF2HDMI2S<br>15-10-22<br>**----- End of picture text -----**<br> **Fig 20. Package outline WLCSP10** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **13 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **WLCSP15: wafer level chip-size package; 15 bumps (6-3-6)** **==> picture [60 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> PCMF3HDMI2S<br>**----- End of picture text -----**<br> **==> picture [481 x 565] intentionally omitted <==** **----- Start of picture text -----**<br> D<br>bump A1<br>index area A1<br>E A<br>detail X<br>e 1/2 e b<br>C<br>e1<br>B B1 B2 B3 e2<br>A<br>bump A1 1 2 3 4 5 6<br>index area e3 X<br>0 1 mm<br>scale<br>Dimensions (mm are the original dimensions)<br>Unit A A1 b D E e e1 e2 e3<br>max 0.60 0.38 0.31 2.42 1.22<br>mm nom 0.57 0.37 0.26 2.37 1.17 0.40 0.40 0.80 0.80<br>min 0.54 0.36 0.21 2.32 1.12<br>pcmf3hdmi2s_po<br>Outline References European Issue date<br>version IEC JEDEC JEITA projection<br>15-10-14<br>PCMF3HDMI2S<br>15-10-22<br>**----- End of picture text -----**<br> **Fig 21. Package outline WLCSP15** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **14 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **9. Soldering** **WLCSP5: Solder footprint and stencil aperture** ## **PCMF1HDMI2S** **==> picture [481 x 257] intentionally omitted <==** **----- Start of picture text -----**<br> Hx<br>P<br>see<br>detail X<br>P<br>solder land (SL)<br>Hy<br>solder paste deposit (SP)<br>solder land plus solder paste<br>SL = SP<br>solder resist opening (SR)<br>SR<br>occupied area<br>detail X<br>Dimensions in mm<br>recommend stencil thickness: 0.1 mm<br>P SL SP SR Hx Hy<br>0.40 0.25 0.25 0.325 1.00 1.40 15-10-14<br>15-10-22 pcmf1hdmi2s_fr<br>**----- End of picture text -----**<br> **Fig 22. Soldering footprint WLCSP5 (PCMF1HDMI2S)** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **15 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** **==> picture [481 x 266] intentionally omitted <==** **----- Start of picture text -----**<br> WLCSP10: Solder footprint and stencil aperture PCMF2HDMI2S<br>Hx<br>P<br>see<br>detail X<br>P<br>solder land (SL)<br>Hy<br>solder paste deposit (SP)<br>solder land plus solder paste<br>SL = SP<br>solder resist opening (SR)<br>SR<br>occupied area<br>P1 detail X<br>Dimensions in mm<br>recommend stencil thickness: 0.1 mm<br>P P1 SL SP SR Hx Hy<br>0.40 0.80 0.25 0.25 0.325 1.80 1.40 15-10-14<br>15-10-22 pcmf2hdmi2s_fr<br>**----- End of picture text -----**<br> **Fig 23. Soldering footprint WLCSP10 (PCMF2HDMI2S)** **WLCSP15: Solder footprint and stencil aperture** **==> picture [58 x 8] intentionally omitted <==** **----- Start of picture text -----**<br> PCMF3HDMI2S<br>**----- End of picture text -----**<br> **==> picture [481 x 257] intentionally omitted <==** **----- Start of picture text -----**<br> Hx<br>P<br>see<br>detail X<br>P<br>solder land (SL)<br>Hy<br>solder paste deposit (SP)<br>solder land plus solder paste<br>SL = SP<br>solder resist opening (SR)<br>SR<br>occupied area<br>P1 detail X<br>Dimensions in mm<br>recommend stencil thickness: 0.1 mm<br>P P1 SL SP SR Hx Hy<br>0.40 0.80 0.25 0.25 0.325 2.60 1.40 15-10-14<br>15-10-22 pcmf3hdmi2s_fr<br>**----- End of picture text -----**<br> **Fig 24. Soldering footprint WLCSP15 (PCMF3HDMI2S)** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **16 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **10. Revision history** **Table 8. Revision history** |**Document ID**|**Release date**|**Data sheet status**|**Change notice**|**Supersedes**| |---|---|---|---|---| |PCMFXHDMI2S_SER v.2|20160419|Product data sheet|-|PCMFXHDMI2S_SER v.1| |Modifications:|**•** Section 1“<br>Product profile<br>”<br>:updated<br>**•** Section 6.1<br>:clamping voltage VCLadded; dynamic resistance Rdynupdated<br>**•** Section 6.2<br>:insertion lossilupdated<br>**•** Figure 3<br>:added<br>**•** Figure 5<br> to Figure 8<br>: updated<br>**•** Figure 9<br> to Figure 12<br> and Figure 15<br> to Figure 18<br>:added<br>**•** Section 7“<br>Application information<br>”<br>:added|||| |PCMFXHDMI2S_SER v.1|20151126|Preliminary data sheet|-|-| © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 2 — 19 April 2016** **17 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **11. Legal information** ## **11.1 Data sheet status** |**Document status[1]**<br>**[2]**|**Product statu**~~**s**~~**[3]**|**Definition**| |---|---|---| |Objective [short] data sheet|Development|This document contains data from the objective specification for product development.| |Preliminary [short] data sheet|Qualification|This document contains data from the preliminary specification.| |Product [short] data sheet|Production|This document contains the product specification.| [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. ## **11.2 Definitions** **Suitability for use —** NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. **Draft —** The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. **Short data sheet —** A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. **Applications —** Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. **Product specification —** The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. ## **11.3 Disclaimers** **Limited warranty and liability —** Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. **Limiting values —** Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. **Terms and conditions of commercial sale —** NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the _Terms and conditions of commercial sale_ of NXP Semiconductors. **Right to make changes —** NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. **No offer to sell or license —** Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 2 — 19 April 2016** **18 of 20** ## **NXP Semiconductors** ## **PCMFXHDMI2S series** ## **Common-mode EMI filter for differential channels with ESD protection** **Export control —** This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. **Quick reference data —** The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. **Non-automotive qualified products —** Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. **Translations —** A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. ## **11.4 Trademarks** Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. ## **12. Contact information** For more information, please visit: **http://www.nxp.com** For sales office addresses, please send an email to: **salesaddresses@nxp.com** © NXP Semiconductors N.V. 2016. All rights reserved. PCMFXHDMI2S_SER All information provided in this document is subject to legal disclaimers. **Product data sheet** **Rev. 2 — 19 April 2016** **19 of 20** **PCMFXHDMI2S series** **NXP Semiconductors** **Common-mode EMI filter for differential channels with ESD protection** ## **13. Contents** |**1**|**Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1**| |---|---| |1.1|General description . . . . . . . . . . . . . . . . . . . . . 1| |1.2|Features and benefits. . . . . . . . . . . . . . . . . . . . 1| |1.3|Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1| |**2**|**Pinning information. . . . . . . . . . . . . . . . . . . . . . 2**| |**3**|**Ordering information. . . . . . . . . . . . . . . . . . . . . 3**| |**4**|**Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3**| |**5**|**Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3**| |**6**|**Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4**| |6.1|Channel characteristics . . . . . . . . . . . . . . . . . . 4| |6.2|Frequency characteristics. . . . . . . . . . . . . . . . . 4| |**7**|**Application information. . . . . . . . . . . . . . . . . . 11**| |**8**|**Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12**| |**9**|**Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15**| |**10**|**Revision history. . . . . . . . . . . . . . . . . . . . . . . . 17**| |**11**|**Legal information. . . . . . . . . . . . . . . . . . . . . . . 18**| |11.1|Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18| |11.2|Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18| |11.3|Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18| |11.4|Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19| |**12**|**Contact information. . . . . . . . . . . . . . . . . . . . . 19**| |**13**|**Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20**| Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. **© NXP Semiconductors N.V. 2016.** **All rights reserved.** For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com **Date of release: 19 April 2016 Document identifier: PCMFXHDMI2S_SER**
Updated at March 17, 2026
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