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PCA6408APW,118
I/O Expander, 8bit, 400 kHz, I2C, SMBus, 1.65 V, 5.5 V, TSSOP
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- Manufacturer: NXP
- Product type: I/O Expanders
| Delivery and price | |
|---|---|
| Units per pack | 2500 |
| Price | 0.504 € |
| Current stock | 1000+ |
| Lead time | 7 days |
Datasheet
**Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander with interrupt output, reset, and configuration registers Rev. 1 — 27 September 2012** ## **PCA6408A** **Product data sheet** ## **1. General description** The PCA6408A is an 8-bit general purpose I/O expander that provides remote I/O expansion for most microcontroller families via the I[2] C-bus interface. NXP I/O expanders provide a simple solution when additional I/Os are needed while keeping interconnections to a minimum, for example, in battery-powered mobile applications for interfacing to sensors, push buttons, keypad, etc. In addition to providing a flexible set of GPIOs, it simplifies interconnection of a processor running at one voltage level to I/O devices operating at a different (usually higher) voltage level. The PCA6408A has built-in level shifting feature that makes these devices extremely flexible in mixed signal environments where communication between incompatible I/O voltages is required. Its wide VDD range of 1.65 V to 5.5 V on the dual power rail allows seamless communications with next-generation low voltage microprocessors and microcontrollers on the interface side (SDA/SCL) and peripherals at a higher voltage on the port side. There are two supply voltages for PCA6408A: VDD(I2C-bus) and VDD(P). VDD(I2C-bus) provides the supply voltage for the interface at the master side (for example, a microcontroller) and the VDD(P) provides the supply for core circuits and Port P. The bidirectional voltage level translation in the PCA6408A is provided through VDD(I2C-bus). VDD(I2C-bus) should be connected to the VDD of the external SCL/SDA lines. This indicates the VDD level of the I[2] C-bus to the PCA6408A. The voltage level on Port P of the PCA6408A is determined by the VDD(P). The PCA6408A consists of one 8-bit Configuration (input or output selection), Input, Output, and Polarity Inversion (active HIGH) register. At power-on, the I/Os are configured as inputs. However, the system master can enable the I/Os as either inputs or outputs by writing to the I/O configuration bits. The data for each input or output is kept in the corresponding Input or Output register. The polarity of the Input port register can be inverted with the Polarity Inversion register, saving interrupts. The system master can reset the PCA6408A in the event of a time-out or other improper operation by asserting a LOW in the RESET input. The power-on reset puts the registers in their default state and initializes the I[2] C-bus/SMBus state machine. The RESET pin causes the same reset/initialization to occur without de-powering the part. The PCA6408A open-drain interrupt (INT) output is activated when any input state differs from its corresponding Input port register state and is used to indicate to the system master that an input state has changed. INT can be connected to the interrupt input of a microcontroller. By sending an interrupt signal on this line, the remote I/O can inform the microcontroller if there is incoming data on its ports without having to communicate via the I[2] C-bus. Thus, the PCA6408A can remain a simple slave device. **==> picture [172 x 101] intentionally omitted <==** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** The device Port P outputs have 25 mA sink capabilities for directly driving LEDs while consuming low device current. One hardware pin (ADDR) can be used to program and vary the fixed I[2] C-bus address and allow up to two devices to share the same I[2] C-bus or SMBus. ## **2. Features and benefits** - I[2] C-bus to parallel port expander - Operating power supply voltage range of 1.65 V to 5.5 V - Allows bidirectional voltage-level translation and GPIO expansion between: - 1.8 V SCL/SDA and 1.8 V, 2.5 V, 3.3 V or 5 V Port P - 2.5 V SCL/SDA and 1.8 V, 2.5 V, 3.3 V or 5 V Port P - 3.3 V SCL/SDA and 1.8 V, 2.5 V, 3.3 V or 5 V Port P - 5 V SCL/SDA and 1.8 V, 2.5 V, 3.3 V or 5 V Port P - Low standby current consumption of 1 A - Schmitt-trigger action allows slow input transition and better switching noise immunity at the SCL and SDA inputs - Vhys = 0.18 V (typical) at 1.8 V - Vhys = 0.25 V (typical) at 2.5 V - Vhys = 0.33 V (typical) at 3.3 V - Vhys = 0.5 V (typical) at 5 V - 5 V tolerant I/O ports - Active LOW reset input (RESET) - Open-drain active LOW interrupt output (INT) - 400 kHz Fast-mode I[2] C-bus - Input/Output Configuration register - Polarity Inversion register - Internal power-on reset - Power-up with all channels configured as inputs - No glitch on power-up - Noise filter on SCL/SDA inputs - Latched outputs with 25 mA drive maximum capability for directly driving LEDs - Latch-up performance exceeds 100 mA per JESD 78, Class II - ESD protection exceeds JESD 22 - 2000 V Human-Body Model (A114-A) - 1000 V Charged-Device Model (C101) - Packages offered: HVQFN16, TSSOP16, XQFN16 © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **2 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **3. Ordering information** ## **Table 1. Ordering information** |**Type number**|**Topside**<br>**mark**|**Package**|**Package**|**Package**| |---|---|---|---|---| |||**Name**|**Description**|**Version**| |PCA6408ABS<br>P8A||HVQFN16<br>plastic thermal enhanced very thin quad flat package;<br>no leads; 16 terminals; body 330.85 mm<br>SOT758-1||| |PCA6408APW<br>PA6408A||TSSOP16<br>plastic thin shrink small outline package; 16 leads;<br>body width 4.4 mm<br>SOT403-1||| |PCA6408AHK<br>P8||XQFN16<br>plastic, extremely thin quad flat package; no leads;<br>16 terminals; body 1.802.600.50 mm<br>SOT1161-1||| ## **3.1 Ordering options** ## **Table 2. Ordering options** |**Type number**|**Orderable**|**Package**|**Packing method**|**Minimum**|**Temperature**| |---|---|---|---|---|---| ||**part number**|||**order quantity**|| |PCA6408ABS|PCA6408ABSHP|HVQFN16|Reel pack, SMD,|6000|Tamb=40C to +85C| ||||13-inch, Turned||| |PCA6408APW|PCA6408APW,118|TSSOP16|Reel pack, SMD,|2500|Tamb=40C to +85C| ||||13-inch||| |PCA6408AHK|PCA6408AHKX|XQFN16|Reel pack, SMD|4000|Tamb=40C to +85C| ## **4. Block diagram** **==> picture [376 x 239] intentionally omitted <==** **----- Start of picture text -----**<br> PCA6408A<br>INTERRUPT<br>INT LP FILTER<br>LOGIC<br>ADDR<br>P0 to P7<br>SCL INPUT I [2] C-BUS SHIFT I/O<br>FILTER CONTROL REGISTER 8 BITS PORT<br>SDA<br>VDD(I2C-bus) write pulse<br>VDD(P) POWER-ON read pulse<br>RESET<br>RESET<br>VSS<br>002aaf823<br>All I/Os are set to inputs at reset.<br>Fig 1. Block diagram (positive logic)<br>**----- End of picture text -----**<br> © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **3 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **5. Pinning information** ## **5.1 Pinning** **==> picture [397 x 462] intentionally omitted <==** **----- Start of picture text -----**<br> terminal 1<br>index area<br>RESET 1 12 SCL<br>VDD(I2C-bus) 1 16 VDD(P)<br>ADDR 2 15 SDA P0 2 11 INT<br>PCA6408ABS<br>RESET 3 14 SCL P1 3 10 P7<br>P0 4 13 INT<br>PCA6408APW P2 4 9 P6<br>P1 5 12 P7<br>P2 6 11 P6<br>P3 7 10 P5<br>VSS 8 9 P4 002aaf830<br>002aaf821 Transparent top view<br>The exposed center pad, if used, must be<br>connected only as a secondary VSS or<br>must be left electrically open.<br>Fig 2. Pin configuration for TSSOP16 Fig 3. Pin configuration for HVQFN16<br>terminal 1<br>index area<br>RESET 1 12 SCL<br>P0 2 11 INT<br>PCA6408AHK<br>P1 3 10 P7<br>P2 4 9 P6<br>002aaf822<br>Transparent top view<br>ADDR VDD(I2C-bus) VDD(P) SDA<br>16 15 14 13<br>5 6 7 8<br>P3 SS P4 P5<br>V<br>DD(I2C-bus) DD(P)<br>ADDR V V SDA<br>16 15 14 13<br>5 6 7 8<br>P3 SS P4 P5<br>V<br>**----- End of picture text -----**<br> **Fig 4. Pin configuration for XQFN16** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **4 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **5.2 Pin description** **Table 3. Pin description** |**Symbol**|**Pin**|**Pin**|**Pin**|**Description**| |---|---|---|---|---| ||**TSSOP16**|**HVQFN16**|**XQFN16**|| |VDD(I2C-bus)|1<br>15<br>15<br>Supply voltage of I2C-bus. Connect directly to<br>the VDDof the external I2C master. Provides<br>voltage-level translation.|||| |ADDR|2<br>16<br>16<br>Address input. Connect directly to VDD(P)or<br>ground.|||| |RESET|3<br>1<br>1<br>Active LOW reset input. Connect to VDD(I2C-bus)<br>through a pull-up resistor if no active connection<br>is used.|||| |P~~0~~[1]|4<br>2<br>2<br>Port P input/output 0.|||| |P~~1~~[1]|5<br>3<br>3<br>Port P input/output 1.|||| |P~~2~~[1]|6<br>4<br>4<br>Port P input/output 2.|||| |P~~3~~[1]|7<br>5<br>5<br>Port P input/output 3.|||| |VSS|8<br>6<br>6<br>Ground.|||| |P~~4~~[1]|9<br>7<br>7<br>Port P input/output 4.|||| |P~~5~~[1]|10<br>8<br>8<br>Port P input/output 5.|||| |P~~6~~[1]|11<br>9<br>9<br>Port P input/output 6.|||| |P~~7~~[1]|12<br>10<br>10<br>Port P input/output 7.|||| |INT|13<br>11<br>11<br>Interrupt output. Connect to VDD(I2C-bus)through<br>a pull-up resistor.|||| |SCL|14<br>12<br>12<br>Serial clock bus. Connect to VDD(I2C-bus)through<br>a pull-up resistor.|||| |SDA|15<br>13<br>13<br>Serial data bus. Connect to VDD(I2C-bus)through<br>a pull-up resistor.|||| |VDD(P)|16<br>14<br>14<br>Supply voltage of PCA6408A for Port P.|||| [1] All I/O are configured as input at power-on. © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **5 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **6. Voltage translation** Table 4 shows how to set up VDD levels for the necessary voltage translation between the I[2] C-bus and the PCA6408A. |**Table 4.**|**Voltage translation**|| |---|---|---| |**VDD(I2C-bus)**|**(SDA and SCL of I2C master)**|**VDD(P) (Port P)**| |1.8 V||1.8 V| |1.8 V||2.5 V| |1.8 V||3.3 V| |1.8 V||5 V| |2.5 V||1.8 V| |2.5 V||2.5 V| |2.5 V||3.3 V| |2.5 V||5 V| |3.3 V||1.8 V| |3.3 V||2.5 V| |3.3 V||3.3 V| |3.3 V||5 V| |5 V||1.8 V| |5 V||2.5 V| |5 V||3.3 V| |5 V||5 V| ## **7. Functional description** “ ” Refer to Figure 1 Block diagram (positive logic) . ## **7.1 Device address** The address of the PCA6408A is shown in Figure 5. **==> picture [155 x 63] intentionally omitted <==** **----- Start of picture text -----**<br> slave address<br>AD<br>0 1 0 0 0 0 R/W<br>DR<br>fixed<br>programmable<br>002aaf539<br>**----- End of picture text -----**<br> ## **Fig 5. PCA6408A address** ADDR is the hardware address package pin and is held to either HIGH (logic 1) or LOW (logic 0) to assign one of the two possible slave addresses. The last bit of the slave address defines the operation (read or write) to be performed. A HIGH (logic 1) selects a read operation, while a LOW (logic 0) selects a write operation. All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. PCA6408A **Rev. 1 — 27 September 2012** **Product data sheet** **6 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **7.2 Interface definition** **Table 5. Interface definition** |**Byte**|**Bit**|**Bit**|**Bit**|**Bit**|**Bit**|**Bit**|**Bit**|**Bit**| |---|---|---|---|---|---|---|---|---| ||**7 (MSB)**|**6**|**5**|**4**|**3**|**2**|**1**|**0 (LSB)**| |I2C-bus slave address|L<br>H<br>L<br>L<br>L<br>L<br>ADDR<br>R/W|||||||| |I/O data bus|P7<br>P6<br>P5<br>P4<br>P3<br>P2<br>P1<br>P0|||||||| ## **7.3 Pointer register and command byte** Following the successful acknowledgement of the address byte, the bus master sends a command byte, which is stored in the Pointer register in the PCA6408A. Two bits of this data byte state the operation (read or write) and the internal registers (Input, Output, Polarity Inversion, or Configuration) that will be affected. This register is write only. **==> picture [139 x 27] intentionally omitted <==** **----- Start of picture text -----**<br> B7 B6 B5 B4 B3 B2 B1 B0<br>002aaf540<br>**----- End of picture text -----**<br> ## **Fig 6. Pointer register bits** ## **Table 6. Command byte** |**Pointer register bits**|**Pointer register bits**|**Pointer register bits**|**Pointer register bits**|**Pointer register bits**|**Pointer register bits**|**Pointer register bits**|**Pointer register bits**|**Command byte**<br>**(hexadecimal)**|**Register**|**Protocol**|**Power-up**<br>**default**| |---|---|---|---|---|---|---|---|---|---|---|---| |**B7**|**B6**|**B5**|**B4**|**B3**|**B2**|**B1**|**B0**||||| |0<br>0<br>0<br>0<br>0<br>0<br>0<br>0<br>00h<br>Input port<br>read byte<br>xxxx xxx~~x~~[1]|||||||||||| |0<br>0<br>0<br>0<br>0<br>0<br>0<br>1<br>01h<br>Output port<br>read/write byte<br>1111 1111|||||||||||| |0<br>0<br>0<br>0<br>0<br>0<br>1<br>0<br>02h<br>Polarity Inversion<br>read/write byte<br>0000 0000|||||||||||| |0<br>0<br>0<br>0<br>0<br>0<br>1<br>1<br>03h<br>Configuration<br>read/write byte<br>1111 1111|||||||||||| [1] Undefined. © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **7 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **7.4 Register descriptions** ## **7.4.1 Input port register (00h)** The Input port register (register 0) reflects the incoming logic levels of the pins, regardless of whether the pin is defined as an input or an output by the Configuration register. The Input port register is read only; writes to this register have no effect. The default value ‘X’ is determined by the externally applied logic level. An Input port register read operation is “ ” performed as described in Section 8.2 Read commands . **Table 7. Input port register (address 00h)** |**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**| |---|---|---|---|---|---|---|---|---| |**Symbol**|I7|I6|I5|I4|I3|I2|I1|I0| |**Default**|X<br>X<br>X<br>X<br>X<br>X<br>X<br>X|||||||| ## **7.4.2 Output port register (01h)** The Output port register (register 1) shows the outgoing logic levels of the pins defined as outputs by the Configuration register. Bit values in these registers have no effect on pins defined as inputs. In turn, reads from this register reflect the value that was written to this register, **not** the actual pin value. **Table 8. Output port register (address 01h)** |**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**| |---|---|---|---|---|---|---|---|---| |**Symbol**|O7|O6|O5|O4|O3|O2|O1|O0| |**Default**|1<br>1<br>1<br>1<br>1<br>1<br>1<br>1|||||||| ## **7.4.3 Polarity inversion register (02h)** The Polarity inversion register (register 2) allows polarity inversion of pins defined as inputs by the Configuration register. If a bit in this register is set (written with ‘1’), the corresponding port pin’s polarity is inverted. If a bit in this register is cleared (written with a ‘0’), the corresponding port pin’s original polarity is retained. **Table 9. Register 2: Polarity inversion register (address 02h)** |**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**| |---|---|---|---|---|---|---|---|---| |**Symbol**|N7|N6|N5|N4|N3|N2|N1|N0| |**Default**|0<br>0<br>0<br>0<br>0<br>0<br>0<br>0|||||||| ## **7.4.4 Configuration register (03h)** The Configuration register (register 3) configures the direction of the I/O pins. If a bit in this register is set to 1, the corresponding port pin is enabled as a high-impedance input. If a bit in this register is cleared to 0, the corresponding port pin is enabled as an output. **Table 10. Register 3: Configuration register (address 03h)** |**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**|**Bit**<br>**7**<br>**6**<br>**5**<br>**4**<br>**3**<br>**2**<br>**1**<br>**0**| |---|---|---|---|---|---|---|---|---| |**Symbol**|C7|C6|C5|C4|C3|C2|C1|C0| |**Default**|1<br>1<br>1<br>1<br>1<br>1<br>1<br>1|||||||| © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **8 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **7.5 I/O port** When an I/O is configured as an input, FETs Q1 and Q2 are off, which creates a high-impedance input. The input voltage may be raised above VDD to a maximum of 5.5 V. If the I/O is configured as an output, Q1 or Q2 is enabled, depending on the state of the Output port register. In this case, there are low-impedance paths between the I/O pin and either VDD(P) or VSS. The external voltage applied to this I/O pin should not exceed the recommended levels for proper operation. **==> picture [381 x 284] intentionally omitted <==** **----- Start of picture text -----**<br> data from output port<br>shift register register data<br>configuration<br>register<br>VDD(P)<br>data from D Q Q1<br>shift register<br>FF<br>write<br>D Q<br>configuration CK Q<br>pulse FF<br>P0 to P7<br>write pulse CK Q2 ESD<br>protection<br>output port diode<br>register input port<br>register VSS<br>D Q<br>input port<br>FF register data<br>read pulse CK<br>to INT<br>polarity<br>inversion<br>register<br>data from<br>D Q polarity<br>shift register inversion<br>FF register data<br>write polarity<br>CK<br>pulse<br>002aaf824<br>**----- End of picture text -----**<br> On power-up or reset, all registers return to default values. **Fig 7. Simplified schematic of P0 to P7** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **9 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **7.6 Power-on reset** When power (from 0 V) is applied to VDD(P), an internal power-on reset holds the PCA6408A in a reset condition until VDD(P) has reached VPOR. At that time, the reset condition is released and the PCA6408A registers and I[2] C-bus/SMBus state machine initialize to their default states. After that, VDD(P) must be lowered to below VPORF and back up to the operating voltage for a power-reset cycle. See Section 9.2 “Power-on reset ” requirements . ## **7.7 Reset input (RESET)** The RESET input can be asserted to initialize the system while keeping the VDD(P) at its operating level. A reset can be accomplished by holding the RESET pin LOW for a minimum of tw(rst). The PCA6408A registers and I[2] C-bus/SMBus state machine are changed to their default state once RESET is LOW (0). When RESET is HIGH (1), the I/O levels at the P port can be changed externally or through the master. This input requires a pull-up resistor to VDD(I2C-bus) if no active connection is used. ## **7.8 Interrupt output (INT)** An interrupt is generated by any rising or falling edge of the port inputs in the Input mode. After time tv(INT), the signal INT is valid. Resetting the interrupt circuit is achieved when data on the port is changed to the original setting or when data is read from the port that generated the interrupt (see Figure 11). Resetting occurs in the Read mode at the acknowledge (ACK) or not acknowledge (NACK) bit after the rising edge of the SCL signal. Interrupts that occur during the ACK or NACK clock pulse can be lost (or be very short) due to the resetting of the interrupt during this pulse. Each change of the I/Os after resetting is detected and is transmitted as INT. A pin configured as an output cannot cause an interrupt. Changing an I/O from an output to an input may cause a false interrupt to occur, if the state of the pin does not match the contents of the Input port register. The INT output has an open-drain structure and requires a pull-up resistor to VDD(P) or VDD(I2C-bus) depending on the application. INT should be connected to the voltage source of the device that requires the interrupt information. © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **10 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **8. Bus transactions** The PCA6408A is an I[2] C-bus slave device. Data is exchanged between the master and PCA6408A through write and read commands using I[2] C-bus. The two communication lines are a serial data line (SDA) and a serial clock line (SCL). Both lines must be connected to a positive supply via a pull-up resistor when connected to the output stages of a device. Data transfer may be initiated only when the bus is not busy. ## **8.1 Write commands** Data is transmitted to the PCA6408A by sending the device address and setting the Least Significant Bit (LSB) to a logic 0 (see Figure 5 for device address). The command byte is sent after the address and determines which register receives the data that follows the command byte. There is no limitation on the number of data bytes sent in one write transmission. **==> picture [423 x 134] intentionally omitted <==** **----- Start of picture text -----**<br> SCL 1 2 3 4 5 6 7 8 9<br>STOP<br>condition<br>slave address command byte data to port<br>AD<br>SDA S 0 1 0 0 0 0 0 A 0 0 0 0 0 0 0 1 A DATA 1 A P<br>DR<br>START condition R/W acknowledge acknowledge acknowledge<br>from slave from slave from slave<br>write to port<br>tv(Q)<br>data out from port DATA 1 VALID<br>002aaf825<br>**----- End of picture text -----**<br> **Fig 8. Write to Output port register** **==> picture [409 x 91] intentionally omitted <==** **----- Start of picture text -----**<br> SCL 1 2 3 4 5 6 7 8 9<br>STOP<br>condition<br>slave address command byte data to register<br>AD<br>SDA S 0 1 0 0 0 0 0 A 0 0 0 0 0 0 1 1/0 A DATA 1 A P<br>DR<br>START condition R/W acknowledge acknowledge acknowledge<br>from slave from slave from slave<br>002aaf826<br>**----- End of picture text -----**<br> **Fig 9. Write to Configuration or Polarity inversion registers** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **11 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **8.2 Read commands** To read data from the PCA6408A, the bus master must first send the PCA6408A address with the least significant bit set to a logic 0 (see Figure 5 for device address). The command byte is sent after the address and determines which register is to be accessed. After a restart the device address is sent again, but this time the LSB is set to a logic 1. Data from the register defined by the command byte then is sent by the PCA6408A (see Figure 10 and Figure 11). Data is clocked into the register on the rising edge of the ACK clock pulse. There is no limit on the number of data bytes received in one read transmission, but on the final byte received the bus master must not acknowledge the data. **==> picture [497 x 469] intentionally omitted <==** **----- Start of picture text -----**<br> slave address command byte<br>SDA S 0 1 0 0 0 0 AD 0 A 0 0 0 0 0 0 1 1/0 A (cont.)<br>DR<br>START condition R/W acknowledge<br>acknowledge from slave<br>from slave<br>slave address data from register data from register<br>(cont.) S 0 1 0 0 0 0 DRAD 1 A DATA (first byte) A DATA (last byte) NA P<br>(repeated) R/W acknowledge no acknowledge STOP<br>START condition acknowledge from master from master condition<br>from slave<br>at this moment master-transmitter becomes master-receiver<br>and slave-receiver becomes slave-transmitter<br>002aaf827<br>Fig 10. Read from register<br>SCL 1 2 3 4 5 6 7 8 9<br>no acknowledge<br>from master<br>slave address data from port data from port<br>SDA S 0 1 0 0 0 0 AD 1 A DATA 1 A DATA 4 1 P<br>DR<br>START condition R/W acknowledge from slave acknowledge from master STOP<br>read from condition<br>port<br>data into<br>DATA 1 DATA 2 DATA 3 DATA 4 DATA 5<br>port<br>th(D) tsu(D) INT is cleared by<br>read from port<br>INT STOP not needed<br>to clear INT<br>tv(INT) trst(INT) 002aaf828<br>Transfer of data can be stopped at any time by a STOP condition. When this occurs, data present at the latest acknowledge<br>phase is valid (output mode). It is assumed that the command byte has previously been programmed with 00h (read Input port<br>register).<br>This figure eliminates the command byte transfer, a restart, and slave address call between the initial slave address call and<br>actual data transfer from P port (see Figure 10).<br>Fig 11. Read Input port register<br>**----- End of picture text -----**<br> All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. PCA6408A **Rev. 1 — 27 September 2012** **Product data sheet** **12 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **9. Application design-in information** **==> picture [379 x 322] intentionally omitted <==** **----- Start of picture text -----**<br> VDD(I2C-bus) VDD(P)<br>VDD(I2C-bus) = 1.8 V<br>10 kΩ 10 kΩ 10 kΩ 10 kΩ 10 kΩ (× 3)<br>VDD VDD(I2C-bus) VDD(P) ALARM [(1) ]<br>MASTER P0 SUBSYSTEM 1<br>CONTROLLER (e.g., alarm system)<br>SCL SCL<br>SDA SDA A<br>INT INT<br>RESET RESET P1 enable controlled<br>switch<br>VSS B<br>PCA6408A<br>P2<br>P3<br>ADDR P4<br>KEYPAD<br>P5<br>P6<br>P7<br>VSS<br>002aaf829<br>Device address configured as 0100 000x for this example.<br>P0 and P2 through P4 are configured as inputs.<br>P1 and P5 through P7 are configured as outputs.<br>(1) Resistors are required for inputs (on P port) that may float. If a driver to an input will never let the<br>input float, a resistor is not needed. Outputs (in the P port) do not need pull-up resistors.<br>**----- End of picture text -----**<br> **==> picture [117 x 10] intentionally omitted <==** **----- Start of picture text -----**<br> Fig 12. Typical application<br>**----- End of picture text -----**<br> ## **9.1 Minimizing IDD when I/Os control LEDs** When the I/Os are used to control LEDs, normally they are connected to VDD(P) through a resistor as shown in Figure 12. The LED acts as a diode, so when the LED is off, the I/O VI is about 1.2 V less than VDD(P). The IDD parameter in Table 15 “Static characteristics” shows how IDD(P) increases as VI becomes lower than VDD(P). Designs that must minimize current consumption, such as battery power applications, should consider maintaining the I/O pins greater than or equal to VDD(P) when the LED is off. Figure 13 shows a high-value resistor in parallel with the LED. Figure 14 shows VDD(P) less than the LED supply voltage by at least 1.2 V. Both of these methods maintain the I/O VI at or above VDD(P) and prevent additional supply current consumption when the LED is off. © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **13 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **==> picture [397 x 166] intentionally omitted <==** **----- Start of picture text -----**<br> 3.3 V 5 V<br>VDD<br>VDD(P) LED 100 kΩ VDD(P) LED<br>Pn Pn<br>002aah278 002aah279<br>Fig 13. High-value resistor in parallel Fig 14. Device supplied by a lower voltage<br>with the LED<br>**----- End of picture text -----**<br> ## **9.2 Power-on reset requirements** In the event of a glitch or data corruption, PCA6408A can be reset to its default conditions by using the power-on reset feature. Power-on reset requires that the device go through a power cycle to be completely reset. This reset also happens when the device is powered on for the first time in an application. The two types of power-on reset are shown in Figure 15 and Figure 16. **==> picture [381 x 116] intentionally omitted <==** **----- Start of picture text -----**<br> VDD(P)<br>ramp-up ramp-down re-ramp-up<br>td(rst)<br>time<br>(dV/dt)r (dV/dt)f time to re-ramp (dV/dt)r<br>when VDD(P) drops<br>below 0.2 V or to VSS 002aag960<br>Fig 15. VDD(P) is lowered below 0.2 V or 0 V and then ramped up to VDD(P)<br>**----- End of picture text -----**<br> **==> picture [336 x 93] intentionally omitted <==** **----- Start of picture text -----**<br> VDD(P)<br>ramp-down ramp-up<br>VI drops below POR levels td(rst)<br>time<br>time to re-ramp<br>(dV/dt)f (dV/dt)r<br>when VDD(P) drops<br>to VPOR(min) − 50 mV 002aag961<br>**----- End of picture text -----**<br> **Fig 16. VDD(P) is lowered below the POR threshold, then ramped back up to VDD(P)** Table 11 specifies the performance of the power-on reset feature for PCA6408A for both types of power-on reset. © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **14 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **Table 11. Recommended supply sequencing and ramp rates** _Tamb = 25_ _C (unless otherwise noted). Not tested; specified by design._ |**Symbol**<br>**Parameter**|**Condition**<br>**Min**<br>**Typ**<br>**Max**<br>**Unit**| |---|---| |(dV/dt)f<br>fall rate of change of voltage|Figure 15<br>0.1<br>-<br>2000<br>ms| |(dV/dt)r<br>rise rate of change of voltage|Figure 15<br>0.1<br>-<br>2000<br>ms| |td(rst)<br>reset delay time|Figure 15<br>;re-ramp time when<br>VDD(P)drops to VSS<br>1<br>-<br>-<br>s| ||Figure 16<br>;re-ramp time when<br>VDD(P)drops to VPOR(min)50 mV<br>1<br>-<br>-<br>s| |VDD(gl)<br>glitch supply voltage difference|Figure 17<br>[1]<br>-<br>-<br>1.0<br>V| |tw(gl)VDD<br>supply voltage glitch pulse width|Figure 17<br>[2]<br>-<br>-<br>10<br>s| |VPOR(trip)<br>power-on reset trip voltage|falling VDD(P)<br>0.7<br>-<br>-<br>V| ||rising VDD(P)<br>-<br>-<br>1.4<br>V| [1] Level that VDD(P) can glitch down to with a ramp rate of 0.4 s/V, but not cause a functional disruption when tw(gl)VDD < 1 s. [2] Glitch width that will not cause a functional disruption when VDD(gl) = 0.5 VDD(P). Glitches in the power supply can also affect the power-on reset performance of this device. The glitch width (tw(gl)VDD) and glitch height (VDD(gl)) are dependent on each other. The bypass capacitance, source impedance, and device impedance are factors that affect power-on reset performance. Figure 17 and Table 11 provide more information on how to measure these specifications. **==> picture [360 x 92] intentionally omitted <==** **----- Start of picture text -----**<br> VDD(P)<br>∆VDD(gl)<br>time<br>tw(gl)VDD 002aag962<br>Fig 17. Glitch width and glitch height<br>**----- End of picture text -----**<br> VPOR is critical to the power-on reset. VPOR is the voltage level at which the reset condition is released and all the registers and the I[2] C-bus/SMBus state machine are initialized to their default states. The value of VPOR differs based on the VDD(P) being lowered to or from 0 V. Figure 18 and Table 11 provide more details on this specification. **==> picture [281 x 147] intentionally omitted <==** **----- Start of picture text -----**<br> VDD(P)<br>VPOR (rising VDD(P))<br>VPOR (falling VDD(P))<br>POR<br>Fig 18. Power-on reset voltage (VPOR)<br>**----- End of picture text -----**<br> **==> picture [32 x 74] intentionally omitted <==** **----- Start of picture text -----**<br> time<br>time<br>002aag963<br>**----- End of picture text -----**<br> All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. PCA6408A **Product data sheet** **Rev. 1 — 27 September 2012** **15 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **10. Limiting values** ## **Table 12. Limiting values** _In accordance with the Absolute Maximum Rating System (IEC 60134)._ |**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Max**<br>**Unit**|**Conditions**<br>**Min**<br>**Max**<br>**Unit**| |---|---|---| |VDD(I2C-bus)<br>I2C-bus supply voltage||0.5<br>+6.5<br>V| |VDD(P)<br>supply voltage port P||0.5<br>+6.5<br>V| |VI<br>input voltage||[1]<br>0.5<br>+6.5<br>V| |VO<br>output voltage||[1]<br>0.5<br>+6.5<br>V| |IIK<br>input clamping current|ADDR,|RESET<br>, SCL; VI< 0 V<br>-<br>20<br>mA| |IOK<br>output clamping current|INT<br>; VO< 0 V<br>-<br>20<br>mA|| |IIOK<br>input/output clamping current|P port; VO< 0 V or VO> VDD(P)<br>-<br>20<br>mA|| ||SDA; VO< 0 V or VO> VDD(I2C-bus)<br>-<br>20<br>mA|| |IOL<br>LOW-level output current|continuous; P port; VO= 0 V to VDD(P)<br>-<br>50<br>mA|| ||continuous; SDA, INT<br>; VO= 0 V to VDD(I2C-bus)<br>-<br>25<br>mA|| |IOH<br>HIGH-level output current|continuous; P port; VO= 0 V to VDD(P)<br>-<br>25<br>mA|| |IDD<br>supply current|continuous through VSS<br>-<br>200<br>mA|| |IDD(P)<br>supply current port P|continuous through VDD(P)<br>-<br>160<br>mA|| |IDD(I2C-bus)<br>I2C-bus supply current|continuous through VDD(I2C-bus)<br>-<br>10<br>mA|| |Tstg<br>storage temperature|65<br>+150<br>C|| |Tj(max)<br>maximum junction temperature|-<br>125<br>C|| [1] The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. ## **11. Recommended operating conditions** ## **Table 13. Operating conditions** |**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Max**<br>**Unit**|**Conditions**<br>**Min**<br>**Max**<br>**Unit**| |---|---|---| |VDD(I2C-bus) I2C-bus supply voltage||1.65<br>5.5<br>V| |VDD(P)<br>supply voltage port P||1.65<br>5.5<br>V| |VIH<br>HIGH-level input voltage|SCL, SDA,|RESET<br>0.7VDD(I2C-bus)<br>5.5<br>V| ||ADDR, P7 to P0<br>0.7VDD(P)<br>5.5<br>V|| |VIL<br>LOW-level input voltage|SCL, SDA,|RESET<br>0.5<br>0.3VDD(I2C-bus)<br>V| ||ADDR, P7 to P0<br>0.5<br>0.3VDD(P)<br>V|| |IOH<br>HIGH-level output current|P7 to P0<br>-<br>10<br>mA|| |IOL<br>LOW-level output current|P7 to P0<br>-<br>25<br>mA|| |Tamb<br>ambient temperature|operating in free air<br>40<br>+85<br>C|| © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **16 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **12. Thermal characteristics** **Table 14. Thermal characteristics** |**Symbol**<br>**Parameter**|**Conditions**<br>**Max**<br>**Unit**| |---|---| |Zth(j-a)<br>transient thermal impedance from junction to ambient|TSSOP16 package<br>[1]<br>108<br>K/W| ||HVQFN16 package<br>[1]<br>53<br>K/W| ||XQFN16 package<br>[1]<br>184<br>K/W| [1] The package thermal impedance is calculated in accordance with JESD 51-7. ## **13. Static characteristics** ## **Table 15. Static characteristics** _Tamb =_ _40_ _C to +85_ _C; VDD(I2C-bus) = 1.65 V to 5.5 V; unless otherwise specified._ |**Symbol**<br>**Parameter**|**Conditions**<br>**Min**<br>**Typ[1]**<br>**Max**<br>**Unit**| |---|---| |VIK<br>input clamping voltage|II=18 mA<br>1.2<br>-<br>-<br>V| |VPOR<br>power-on reset voltage|VI= VDD(P)or VSS; IO= 0 mA<br>-<br>1.1<br>1.4<br>V| |VOH<br>HIGH-level output<br>voltage|P port| ||IOH=8 mA; VDD(P)= 1.65 V<br>[2]<br>1.2<br>-<br>-<br>V| ||IOH=10 mA; VDD(P)= 1.65 V<br>[2]<br>1.1<br>-<br>-<br>V| ||IOH=8 mA; VDD(P)= 2.3 V<br>[2]<br>1.8<br>-<br>-<br>V| ||IOH=10 mA; VDD(P)= 2.3 V<br>[2]<br>1.7<br>-<br>-<br>V| ||IOH=8 mA; VDD(P)= 3.0 V<br>[2]<br>2.6<br>-<br>-<br>V| ||IOH=10 mA; VDD(P)= 3.0 V<br>[2]<br>2.5<br>-<br>-<br>V| ||IOH=8 mA; VDD(P)= 4.5 V<br>[2]<br>4.1<br>-<br>-<br>V| ||IOH=10 mA; VDD(P)= 4.5 V<br>[2]<br>4.0<br>-<br>-<br>V| |VOL<br>LOW-level<br>output voltage|P port; IOL= 8 mA| ||VDD(P)= 1.65 V<br>[2]<br>-<br>-<br>0.45<br>V| ||VDD(P)= 2.3 V<br>[2]<br>-<br>-<br>0.25<br>V| ||VDD(P)= 3 V<br>[2]<br>-<br>-<br>0.25<br>V| ||VDD(P)= 4.5 V<br>[2]<br>-<br>-<br>0.2<br>V| |IOL<br>LOW-level<br>output current|VOL= 0.4 V; VDD(P)= 1.65 V to 5.5 V| ||SDA<br>[3]<br>3<br>-<br>-<br>mA| ||INT<br>[3]<br>3<br>15[4]<br>-<br>mA| ||P port| ||VOL= 0.5 V; VDD(P)= 1.65 V<br>[3]<br>8<br>10<br>-<br>mA| ||VOL= 0.7 V; VDD(P)= 1.65 V<br>[3]<br>10<br>13<br>-<br>mA| ||VOL= 0.5 V; VDD(P)= 2.3 V<br>[3]<br>8<br>10<br>-<br>mA| ||VOL= 0.7 V; VDD(P)= 2.3 V<br>[3]<br>10<br>13<br>-<br>mA| ||VOL= 0.5 V; VDD(P)= 3.0 V<br>[3]<br>8<br>14<br>-<br>mA| ||VOL= 0.7 V; VDD(P)= 3.0 V<br>[3]<br>10<br>19<br>-<br>mA| ||VOL= 0.5 V; VDD(P)= 4.5 V<br>[3]<br>8<br>17<br>-<br>mA| ||VOL= 0.7 V; VDD(P)= 4.5 V<br>[3]<br>10<br>24<br>-<br>mA| All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. PCA6408A **Rev. 1 — 27 September 2012** **Product data sheet** **17 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **Table 15. Static characteristics** _…continued_ _Tamb =_ _40_ _C to +85_ _C; VDD(I2C-bus) = 1.65 V to 5.5 V; unless otherwise specified._ |**Symbol**<br>**Parameter**|**Conditions**|**Conditions**|**Min**<br>**Typ[1]**<br>**Max**<br>**Unit**| |---|---|---|---| |II<br>input current|VDD(P)= 1.65||V to 5.5 V| ||SCL, SDA,||RESET<br>; VI= VDD(I2C-bus)or VSS<br>-<br>-<br>1<br>A| ||ADDR; VI=||VDD(P)or VSS<br>-<br>-<br>1<br>A| |IIH<br>HIGH-level input current|P port; VI= VDD(P); VDD(P)= 1.65 V to 5.5 V<br>-<br>-<br>1<br>A||| |IIL<br>LOW-level input current|P port; VI= VSS; VDD(P)= 1.65 V to 5.5 V<br>-<br>-<br>1<br>A||| |IDD<br>supply current|IDD(I2C-bus)+ IDD(P);<br>SDA, P port, ADDR,RESET<br>;<br>VIon SDA and RESET<br>= VDD(I2C-bus)or VSS;<br>VIon P port and ADDR = VDD(P);<br>IO= 0 mA; I/O = inputs; fSCL= 400 kHz||| ||VDD(P)= 3.6 V to 5.5 V<br>-<br>10<br>25<br>A||| ||VDD(P)= 2.3 V to 3.6 V<br>-<br>6.5<br>15<br>A||| ||VDD(P)= 1.65 V to 2.3 V<br>-<br>4<br>9<br>A||| ||IDD(I2C-bus)+ IDD(P);<br>SCL, SDA, P port, ADDR,RESET<br>;<br>VIon SCL, SDA and RESET<br>= VDD(I2C-bus)or VSS;<br>VIon P port and ADDR = VDD(P);<br>IO= 0 mA; I/O = inputs; fSCL= 0 kHz||| ||VDD(P)= 3.6 V to 5.5 V<br>-<br>1.5<br>7<br>A||| ||VDD(P)= 2.3 V to 3.6 V<br>-<br>1<br>3.2<br>A||| ||VDD(P)= 1.65 V to 2.3 V<br>-<br>0.5<br>1.7<br>A||| ||Active mode; IDD(I2C-bus)+ IDD(P);<br>P port,ADDR, RESET<br>;<br>VIon RESET<br>= VDD(I2C-bus);<br>VIon P port and ADDR = VDD(P);<br>IO= 0 mA; I/O = inputs;<br>fSCL= 400 kHz, continuous register read||| ||VDD(P)=|3.6 V to 5.5 V<br>-<br>60<br>125<br>A|| ||VDD(P)=|2.3 V to 3.6 V<br>-<br>40<br>75<br>A|| ||VDD(P)=|1.65 V to 2.3 V<br>-<br>20<br>45<br>A|| |IDD<br>additional quiescent<br>supply current|SCL, SDA, RESET<br>;<br>one input at VDD(I2C-bus)0.6 V,<br>other inputs at VDD(I2C-bus)or VSS;<br>VDD(P)= 1.65 V to 5.5 V<br>-<br>-<br>25<br>A||| ||P port, ADDR; one input at VDD(P)0.6 V,<br>other inputs at VDD(P)or VSS;<br>VDD(P)= 1.65 V to 5.5 V<br>-<br>-<br>80<br>A||| |Ci<br>input capacitance|VI= VDD(I2C-bus)or VSS; VDD(P)= 1.65 V to 5.5 V<br>-<br>6<br>7<br>pF||| |Cio<br>input/output capacitance|VI/O= VDD(I2C-bus)or VSS; VDD(P)= 1.65 V to 5.5 V<br>-<br>7<br>8<br>pF||| ||VI/O= VDD(P)or VSS; VDD(P)= 1.65 V to 5.5 V<br>-<br>7.5<br>8.5<br>pF||| - [1] For IDD, all typical values are at nominal supply voltage (1.8 V, 2.5 V, 3.3 V, 3.6 V or 5 V VDD) and Tamb = 25 C. Except for IDD, the typical values are at VDD(P) = VDD(I2C-bus) = 3.3 V and Tamb = 25 C. - [2] The total current sourced by all I/Os must be limited to 80 mA. - [3] Each I/O must be externally limited to a maximum of 25 mA, for a device total of 200 mA. - [4] Typical value for Tamb = 25 C. VOL = 0.4 V and VDD = 3.3 V. Typical value for VDD < 2.5 V, VOL = 0.6 V. All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. PCA6408A **Rev. 1 — 27 September 2012** **Product data sheet** **18 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **13.1 Typical characteristics** **==> picture [497 x 213] intentionally omitted <==** **----- Start of picture text -----**<br> 20 002aag973 1400 002aag974<br>(μA)IDD IDD(stb)<br>(nA)<br>16 VDD(P) = 5.5 V<br>VDD(P) = 5.5 V5.0 V 1000 5.0 V3.6 V<br>12 33.3 V.6 V 800 3.3 V<br>2.5 V<br>2.3 V<br>600<br>8<br>400<br>2.5 V<br>4 2.3 V<br>VDD(P) = 1.8 V1.65 V 200 1.8 V1.65 V<br>0 0<br>−40 −15 10 35 60 85 −40 −15 10 35 60 85<br>Tamb (°C) Tamb (°C)<br>IDD = IDD(I2C-bus) + IDD(P)<br>Fig 19. Supply current versus ambient temperature Fig 20. Standby supply current versus<br>ambient temperature<br>**----- End of picture text -----**<br> **==> picture [322 x 184] intentionally omitted <==** **----- Start of picture text -----**<br> 20 002aag975<br>IDD<br>(μA)<br>16<br>12<br>8<br>4<br>0<br>1.5 2.5 3.5 4.5 5.5<br>VDD(P) (V)<br>Tamb = 25 C<br>IDD = IDD(I2C-bus) + IDD(P)<br>**----- End of picture text -----**<br> **Fig 21. Supply current versus supply voltage** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **19 of 40** **PCA6408A** **NXP Semiconductors** ## **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf578<br>35<br>Isink<br>(mA)<br>30<br>Tamb = −40 °C<br>25 25 ° C<br>85 °C<br>20<br>15<br>10<br>5<br>0<br>0 0.1 0.2 0.3<br>VOL (V)<br>**----- End of picture text -----**<br> ## a. VDD(P) = 1.65 V **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf579<br>35<br>Isink<br>(mA)<br>30<br>Tamb = −40 °C<br>25 25 °C<br>85 °C<br>20<br>15<br>10<br>5<br>0<br>0 0.1 0.2 0.3<br>VOL (V)<br>**----- End of picture text -----**<br> ## b. VDD(P) = 1.8 V **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf580<br>50<br>Isink<br>(mA)<br>40<br>Tamb = −40 °C<br>25 °C<br>30 85 °C<br>20<br>10<br>0<br>0 0.1 0.2 0.3<br>VOL (V)<br>**----- End of picture text -----**<br> **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf581<br>60<br>Isink Tamb = − 40 ° C<br>(mA) 25 °C<br>85 °C<br>40<br>20<br>0<br>0 0.1 0.2 0.3<br>VOL (V)<br>**----- End of picture text -----**<br> ## c. VDD(P) = 2.5 V d. VDD(P) = 3.3 V **==> picture [481 x 171] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf582 002aaf583<br>70 70<br>Isink Isink<br>(mA) 60 Tamb = −40 ° C (mA) 60 Tamb = −40 °C<br>25 °C 25 °C<br>50 85 ° C 50 85 ° C<br>40 40<br>30 30<br>20 20<br>10 10<br>0 0<br>0 0.1 0.2 0.3 0 0.1 0.2 0.3<br>VOL (V) VOL (V)<br>e. VDD(P) = 5.0 V f. VDD(P) = 5.5 V<br>**----- End of picture text -----**<br> **Fig 22. I/O sink current versus LOW-level output voltage** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **20 of 40** **PCA6408A** **NXP Semiconductors** ## **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf561<br>30<br>Isource<br>(mA) Tamb = −40 °C<br>25 °C<br>20 85 °C<br>10<br>0<br>0 0.2 0.4 0.6<br>VDD(P) − VOH (V)<br>**----- End of picture text -----**<br> ## a. VDD(P) = 1.65 V **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf562<br>35<br>Isource<br>(mA) 30 Tamb = −40 ° C<br>25 °C<br>25 85 ° C<br>20<br>15<br>10<br>5<br>0<br>0 0.2 0.4 0.6<br>VDD(P) − VOH (V)<br>**----- End of picture text -----**<br> ## b. VDD(P) = 1.8 V **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf563<br>60<br>Isource<br>(mA)<br>Tamb = −40 °C<br>25 °C<br>40<br>85 °C<br>20<br>0<br>0 0.2 0.4 0.6<br>VDD(P) − VOH (V)<br>**----- End of picture text -----**<br> **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf564<br>70<br>Isource<br>(mA) 60 Tamb = −40 ° C<br>25 °C<br>50 85 ° C<br>40<br>30<br>20<br>10<br>0<br>0 0.2 0.4 0.6<br>VDD(P) − VOH (V)<br>**----- End of picture text -----**<br> c. VDD(P) = 2.5 V d. VDD(P) = 3.3 V **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf565<br>90<br>Isource(mA) T amb = −40 °C<br>25 °C<br>85 °C<br>60<br>30<br>0<br>0 0.2 0.4 0.6<br>VDD(P) − VOH (V)<br>**----- End of picture text -----**<br> e. VDD(P) = 5.0 V **==> picture [233 x 149] intentionally omitted <==** **----- Start of picture text -----**<br> 002aaf566<br>90<br>Isource(mA) T amb = −40 °C<br>25 °C<br>85 °C<br>60<br>30<br>0<br>0 0.2 0.4 0.6<br>VDD(P) − VOH (V)<br>**----- End of picture text -----**<br> f. VDD(P) = 5.5 V **Fig 23. I/O source current versus HIGH-level output voltage** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **21 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **==> picture [481 x 169] intentionally omitted <==** **----- Start of picture text -----**<br> 002aah056 002aah057<br>120 200<br>(mV)VOL VDD(P) − VOH (mV)<br>100<br>160<br>(1)<br>80<br>120 V DD(P) = 1.8 V<br>5 V<br>60<br>(2) 80<br>40<br>(4) 40<br>20<br>(3)<br>0 0<br>−40 −15 10 35 60 85 −40 −15 10 35 60 85<br>Tamb (°C) Tamb (°C)<br>(1) VDD(P) = 1.8 V; Isink = 10 mADD(P) = 1.8 V; Isink = 10 mA = 1.8 V; Isink = 10 mAsink = 10 mA = 10 mA Isource = 10 mA<br>**----- End of picture text -----**<br> - (1) VDD(P) = 1.8 V; Isink = 10 mADD(P) = 1.8 V; Isink = 10 mA = 1.8 V; Isink = 10 mAsink = 10 mA = 10 mA - (2) VDD(P) = 5 V; Isink = 10 mA - (3) VDD(P) = 1.8 V; Isink = 1 mA - (4) VDD(P) = 5 V; Isink = 1 mA **Fig 24. LOW-level output voltage versus temperature Fig 25. I/O high voltage versus temperature** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **22 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **14. Dynamic characteristics** **Table 16. I[2] C-bus interface timing requirements** _Over recommended operating free air temperature range, unless otherwise specified. See Figure 26._ |**Symbol**<br>**Parameter**<br>**Conditions**|**Standard-mode**<br>**I2C-bus**<br>**Min**<br>**Max**|**Standard-mode**<br>**I2C-bus**<br>**Min**<br>**Max**|**Fast-mode**<br>**I2C-bus**|**Fast-mode**<br>**I2C-bus**|**Unit**| |---|---|---|---|---|---| |||**Max**|**Min**|**Max**|| |fSCL<br>SCL clock frequency|0<br>100<br>0<br>400<br>kHz||||| |tHIGH<br>HIGH period of the SCL clock|4<br>-<br>0.6<br>-<br>s||||| |tLOW<br>LOW period of the SCL clock|4.7<br>-<br>1.3<br>-<br>s||||| |tSP<br>pulse width of spikes that must<br>be suppressed by the input filter|0<br>50<br>0<br>50<br>ns||||| |tSU;DAT<br>data set-up time|250<br>-<br>100<br>-<br>ns||||| |tHD;DAT<br>data hold time|0<br>-<br>0<br>-<br>ns||||| |tr<br>rise time of both SDA and SCL signals|-<br>1000<br>20<br>300<br>ns||||| |tf<br>fall time of both SDA and SCL signals|-<br>300<br>20<br>(VDD/ 5.5 V)<br>300<br>ns||||| |tBUF<br>bus free time between a STOP and<br>START condition|4.7<br>-<br>1.3<br>-<br>s||||| |tSU;STA<br>set-up time for a repeated START<br>condition|4.7<br>-<br>0.6<br>-<br>s||||| |tHD;STA<br>hold time (repeated) START condition|4<br>-<br>0.6<br>-<br>s||||| |tSU;STO<br>set-up time for STOP condition|4<br>-<br>0.6<br>-<br>s||||| |tVD;DAT<br>data valid time<br>SCL LOW<br>to SDA output valid|-<br>3.45<br>-<br>0.9<br>s||||| |tVD;ACK<br>data valid acknowledge time<br>ACK signal<br>from SCL LOW<br>to SDA (out) LOW|-<br>3.45<br>-<br>0.9<br>s||||| ## **Table 17. Reset timing requirements** _Over recommended operating free air temperature range, unless otherwise specified. See Figure 29._ |**Symbol**<br>**Parameter**<br>**Conditions**|**Standard-mode**<br>**I2C-bus**|**Standard-mode**<br>**I2C-bus**|**Fast-mode**<br>**I2C-bus**|**Fast-mode**<br>**I2C-bus**|**Unit**| |---|---|---|---|---|---| ||**Min**|**Max**|**Min**|**Max**|| |tw(rst)<br>reset pulse width|30<br>-<br>30<br>-<br>ns||||| |trec(rst)<br>reset recovery time|200<br>-<br>200<br>-<br>ns||||| |trst<br>reset time|600<br>-<br>600<br>-<br>ns||||| © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **23 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **Table 18. Switching characteristics** _Over recommended operating free air temperature range; CL_ _100 pF; unless otherwise specified. See Figure 28._ |**Symbol**<br>**Parameter**<br>**Conditions**|**Standard-mode**<br>**I2C-bus**|**Standard-mode**<br>**I2C-bus**|**Fast-mode**<br>**I2C-bus**|**Fast-mode**<br>**I2C-bus**|**Unit**| |---|---|---|---|---|---| ||**Min**|**Max**|**Min**|**Max**|| |tv(INT)<br>valid time on pin INT<br>from P port to INT|-<br>1<br>-<br>1<br>s||||| |trst(INT)<br>reset time on pin INT<br>from SCL to INT|-<br>1<br>-<br>1<br>s||||| |tv(Q)<br>data output valid time<br>from SCL to P port|-<br>400<br>-<br>400<br>ns||||| |tsu(D)<br>data input set-up time<br>from P port to SCL|0<br>-<br>0<br>-<br>ns||||| |th(D)<br>data input hold time<br>from P port to SCL|300<br>-<br>300<br>-<br>ns||||| ## **15. Parameter measurement information** **==> picture [447 x 395] intentionally omitted <==** **----- Start of picture text -----**<br> VDD(I2C-bus)<br>RL = 1 kΩ<br>SDA<br>DUT<br>CL = 50 pF<br>002aag977<br>a. SDA load configuration<br>two bytes for read Input port register [(1)]<br>STOP START Address Address R/W ACK Data Data STOP<br>condition condition Bit 7 Bit 1 Bit 0 (A) Bit 7 Bit 0 condition<br>(P) (S) (MSB) (LSB) (MSB) (LSB) (P)<br>002aag952<br>b. Transaction format<br>tLOW tHIGH tSP<br>0.7 × VDD(I2C-bus)<br>SCL<br>0.3 × VDD(I2C-bus)<br>tBUF tr tf tVD;DATtf(o) tVD;ACK tSU;STA tSU;STO<br>0.7 × VDD(I2C-bus)<br>SDA<br>0.3 × VDD(I2C-bus)<br>tf tr tVD;ACK<br>tHD;STA tSU;DAT tHD;DAT<br>repeat START condition<br>STOP condition<br>002aag978<br>c. Voltage waveforms<br>CL includes probe and jig capacitance. tf(o) is measured with CL of 10 pF or 400 pF.<br>All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns.<br>All parameters and waveforms are not applicable to all devices.<br>**----- End of picture text -----**<br> Byte 1 = I[2] C-bus address; Byte 2 = Input register port data. - (1) See Figure 11. **Fig 26. I[2] C-bus interface load circuit and voltage waveforms** All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. PCA6408A **Product data sheet** **Rev. 1 — 27 September 2012** **24 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **==> picture [445 x 405] intentionally omitted <==** **----- Start of picture text -----**<br> VDD(I2C-bus)<br>RL = 4.7 kΩ<br>INT<br>DUT<br>CL = 100 pF<br>002aag979<br>a. Interrupt load configuration<br>acknowledge acknowledge no acknowledge<br>from slave from slave from master<br>START condition R/W STOP<br>8 bits (one data byte) condition<br>slave address from port data from port<br>AD<br>SDA S 0 1 0 0 0 0 1 A DATA 1 A DATA 2 1 P<br>DR<br>SCL 1 2 3 4 5 6 7 8 9<br>B<br>trst(INT) trst(INT) B<br>INT<br>A<br>tv(INT) A tsu(D)<br>data into<br>ADDRESS DATA 1 DATA 2<br>port<br>0.7 × VDD(I2C-bus)<br>INT 0.5 × VDD(I2C-bus) SCL R/W A<br>0.3 × VDD(I2C-bus)<br>tv(INT) trst(INT)<br>Pn 0.5 × VDD(P) INT 0.5 × VDD(I2C-bus)<br>View A - A View B - B<br>002aag980<br>**----- End of picture text -----**<br> ## b. Voltage waveforms ## CL includes probe and jig capacitance. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. All parameters and waveforms are not applicable to all devices. ## **Fig 27. Interrupt load circuit and voltage waveforms** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **25 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **==> picture [289 x 360] intentionally omitted <==** **----- Start of picture text -----**<br> Pn 500 Ω<br>DUT 2 × VDD(P)<br>CL = 50 pF 500 Ω<br>002aag981<br>0.7 × VDD(I2C-bus)<br>SCL P0 A P7<br>0.3 × VDD(I2C-bus)<br>SDA<br>tv(Q)<br>Pn<br>unstable last stable bit<br>data<br>002aag982<br>= 0)<br>0.7 × VDD(I2C-bus)<br>SCL P0 A P7<br>0.3 × VDD(I2C-bus)<br>tsu(D) th(D)<br>Pn 0.5 × VDD(P)<br>002aag983<br>**----- End of picture text -----**<br> ## a. P port load configuration ## b. Write mode (R/W = 0) ## c. Read mode (R/W = 1) ## CL includes probe and jig capacitance. tv(Q) is measured from 0.7 VDD on SCL to 50 % I/O (Pn) output. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. The outputs are measured one at a time, with one transition per measurement. All parameters and waveforms are not applicable to all devices. ## **Fig 28. P port load circuit and voltage waveforms** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **26 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **==> picture [451 x 303] intentionally omitted <==** **----- Start of picture text -----**<br> VDD(I2C-bus)<br>RL = 1 kΩ<br>SDA Pn 500 Ω<br>DUT DUT 2 × VDD(P)<br>CL = 50 pF CL = 50 pF 500 Ω<br>002aag977 002aag981<br>a. SDA load configuration b. P port load configuration<br>START<br>SCL ACK or read cycle<br>SDA<br>0.3 × VDD(I2C-bus)<br>trst<br>RESET 0.5 × VDD(I2C-bus)<br>trec(rst) tw(rst) trec(rst)<br>trst<br>Pn 0.5 × VDD(P)<br>002aag984<br>**----- End of picture text -----**<br> ## c. RESET timing ## CL includes probe and jig capacitance. All inputs are supplied by generators having the following characteristics: PRR 10 MHz; Zo = 50 ; tr/tf 30 ns. The outputs are measured one at a time, with one transition per measurement. I/Os are configured as inputs. All parameters and waveforms are not applicable to all devices. **Fig 29. Reset load circuits and voltage waveforms** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **27 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **16. Package outline** **TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm** **SOT403-1** **==> picture [479 x 570] intentionally omitted <==** **----- Start of picture text -----**<br> D E A<br>X<br>c<br>y HE v M A<br>Z<br>16 9<br>Q<br>A2 (A )3 A<br>pin 1 index A1<br>θ<br>L p<br>L<br>1 8<br>detail X<br>w M<br>e b p<br>0 2.5 5 mm<br>scale<br>DIMENSIONS (mm are the original dimensions)<br>UNIT max.A A1 A2 A3 bp c D [(1)] E [(2)] e HE L Lp Q v w y Z (1) θ<br>mm 1.1 0.150.05 0.950.80 0.25 0.300.19 0.20.1 5.14.9 4.54.3 0.65 6.66.2 1 0.750.50 0.40.3 0.2 0.13 0.1 0.400.06 80oo<br>Notes<br>1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.<br>2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.<br>OUTLINE REFERENCES EUROPEAN<br>ISSUE DATE<br>VERSION IEC JEDEC JEITA PROJECTION<br>99-12-27<br> SOT403-1 MO-153<br>03-02-18<br>**----- End of picture text -----**<br> **Fig 30. Package outline SOT403-1 (TSSOP16)** PCA6408A All information provided in this document is subject to legal disclaimers. All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. **Product data sheet Rev. 1 — 27 September 2012** **28 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm** **==> picture [43 x 8] intentionally omitted <==** **----- Start of picture text -----**<br> SOT758-1<br>**----- End of picture text -----**<br> **==> picture [478 x 559] intentionally omitted <==** **----- Start of picture text -----**<br> D B A<br>terminal 1<br>index area<br>E A<br>A1<br>c<br>detail X<br>e1 C<br>1/2 e<br>v M C A B y1 C y<br>e b<br>w M C<br>5 8<br>L<br>4 9<br>e<br>Eh e2<br>1/2 e<br>1 12<br>terminal 1 16 13<br>index area Dh<br>X<br>0 2.5 5 mm<br>scale<br>DIMENSIONS (mm are the original dimensions)<br>A [(1)]<br>UNIT max. A1 b c D [(1)] Dh E [(1)] Eh e e1 e2 L v w y y1<br>0.05 0.30 3.1 1.75 3.1 1.75 0.5<br>mm 1 0.2 0.5 1.5 1.5 0.1 0.05 0.05 0.1<br>0.00 0.18 2.9 1.45 2.9 1.45 0.3<br>Note<br>1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.<br>OUTLINE REFERENCES EUROPEAN<br>ISSUE DATE<br>VERSION IEC JEDEC JEITA PROJECTION<br>02-03-25<br> SOT758-1 - - - MO-220 - - -<br>02-10-21<br>**----- End of picture text -----**<br> **Fig 31. Package outline SOT758-1 (HVQFN16)** PCA6408A All information provided in this document is subject to legal disclaimers. All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. **Product data sheet Rev. 1 — 27 September 2012** **29 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **XQFN16: plastic, extremely thin quad flat package; no leads; 16 terminals; body 1.80 x 2.60 x 0.50 mm** **SOT1161-1** **==> picture [481 x 556] intentionally omitted <==** **----- Start of picture text -----**<br> X<br>D B A<br>terminal 1<br>index area<br>E A<br>A1<br>A3<br>detail X<br>e1<br>C<br>v C A B<br>e b<br>w C y1 C y<br>5 8<br>L<br>4 9<br>e<br>e2<br>1 1 2<br>terminal 1<br>index area<br>16 13<br>L1<br>0 1 2 mm<br>scale<br>Dimensions<br>Unit [(1)] A A1 A3 b D E e e1 e2 L L1 v w y y1<br>max 0.5 0.05 0.25 1.9 2.7 0.45 0.55<br>mm nom 0.127 0.20 1.8 2.6 0.4 1.2 1.2 0.40 0.50 0.1 0.05 0.05 0.05<br>min 0.00 0.15 1.7 2.5 0.35 0.45<br>Note<br>1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. sot1161-1_po<br>Outline References European Issue date<br>version IEC JEDEC JEITA projection<br>09-12-28<br>SOT1161-1 - - - - - - - - - 09-12-29<br>**----- End of picture text -----**<br> ## **Fig 32. Package outline SOT1161-1 (XQFN16)** All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. PCA6408A **Rev. 1 — 27 September 2012** **Product data sheet** **30 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **17. Soldering of SMD packages** This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note _AN10365 “Surface mount reflow soldering description”_ . ## **17.1 Introduction to soldering** Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. ## **17.2 Wave and reflow soldering** Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: - Through-hole components - Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: - Board specifications, including the board finish, solder masks and vias - Package footprints, including solder thieves and orientation - The moisture sensitivity level of the packages - Package placement - Inspection and repair - Lead-free soldering versus SnPb soldering ## **17.3 Wave soldering** Key characteristics in wave soldering are: - Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave - Solder bath specifications, including temperature and impurities © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **31 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **17.4 Reflow soldering** Key characteristics in reflow soldering are: - Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 33) than a SnPb process, thus reducing the process window - Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board - Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 19 and 20 ## **Table 19. SnPb eutectic process (from J-STD-020C)** |**Package thickness (mm)**|**Package reflow temperature (****C)**|**Package reflow temperature (****C)**| |---|---|---| ||**Volume (mm3)**|| ||**< 350**|**350**| |< 2.5|235<br>220|| |2.5|220<br>220|| ## **Table 20. Lead-free process (from J-STD-020C)** |**Package thickness (mm)**|**Package reflow temperature (****C)**|**Package reflow temperature (****C)**|**Package reflow temperature (****C)**| |---|---|---|---| ||**Volume (mm3)**||| ||**< 350**|**350 to 2000**|**> 2000**| |< 1.6|260<br>260<br>260||| |1.6 to 2.5|260<br>250<br>245||| |> 2.5|250<br>245<br>245||| Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 33. © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **32 of 40** **PCA6408A** **NXP Semiconductors** ## **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **==> picture [352 x 223] intentionally omitted <==** **----- Start of picture text -----**<br> maximum peak temperature<br>= MSL limit, damage level<br>temperature<br>minimum peak temperature<br>= minimum soldering temperature<br>peak<br> temperature<br>time<br>001aac844<br>MSL: Moisture Sensitivity Level<br>Fig 33. Temperature profiles for large and small components<br>**----- End of picture text -----**<br> For further information on temperature profiles, refer to Application Note _AN10365 “Surface mount reflow soldering description”_ . © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **33 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **18. Soldering: PCB footprints** **Footprint information for reflow soldering of HVQFN16 package** ## **SOT758-1** **==> picture [481 x 565] intentionally omitted <==** **----- Start of picture text -----**<br> Hx<br>Gx<br>D P 0.025<br>0.025<br>C<br>(0.105)<br>SPx<br>nSPx<br>SPy<br>Hy Gy nSPy SLy By Ay<br>SPx tot<br>SLx<br>Bx<br>Ax<br>solder land<br>solder paste deposit<br>solder land plus solder paste<br>occupied area nSPx nSPy<br>2 2<br>Dimensions in mm<br>P Ax Ay Bx By C D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy<br>0.50 4.00 4.00 2.20 2.20 0.90 0.24 1.50 1.50 0.90 0.90 0.30 0.30 3.30 3.30 4.25 4.25<br>12-03-07<br>Issue date 12-03-08 sot758-1_fr<br>SPy tot<br>**----- End of picture text -----**<br> **Fig 34. PCB footprint for SOT758-1 (HVQFN16); reflow soldering** All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. PCA6408A **Rev. 1 — 27 September 2012** **Product data sheet** **34 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **Footprint information for reflow soldering of TSSOP16 package** **==> picture [38 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> SOT403-1<br>**----- End of picture text -----**<br> **==> picture [481 x 565] intentionally omitted <==** **----- Start of picture text -----**<br> Hx<br>Gx<br>P2<br>(0.125) (0.125)<br>Hy Gy By Ay<br>C<br>D2 (4x) P1 D1<br>Generic footprint pattern<br>Refer to the package outline drawing for actual layout<br>solder land<br>occupied area<br>DIMENSIONS in mm<br>P1 P2 Ay By C D1 D2 Gx Gy Hx Hy<br>0.650 0.750 7.200 4.500 1.350 0.400 0.600 5.600 5.300 5.800 7.450<br>sot403-1_fr<br>**----- End of picture text -----**<br> **Fig 35. PCB footprint for SOT403-1 (TSSOP16); reflow soldering** © NXP B.V. 2012. All rights reserved. PCA6408A **Product data sheet** All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **35 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **Footprint information for reflow soldering of XQFN16 package** **==> picture [42 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> SOT1161-1<br>**----- End of picture text -----**<br> **==> picture [481 x 565] intentionally omitted <==** **----- Start of picture text -----**<br> 2.35<br>2.1 CU<br>1.65<br>0.4 (12 × ) 0.45<br>0.22<br>CU<br>(16 × )<br>1.8 2.9<br>3.15 1.65<br>CU CU<br>0.9<br>CU<br>1<br>CU<br>placement area solder land plus solder paste<br>solder land solder resist, 0.0625 around copper<br>−<br>solder paste deposit, 0.02 around copper,<br>stencil thickness 0.1 clearance, 0.125 around occupied area<br>occupied area Dimensions in mm sot1161-1_fr<br>**----- End of picture text -----**<br> **Fig 36. PCB footprint for SOT1161-1 (XQFN16); reflow soldering** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **36 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **19. Abbreviations** **Table 21. Abbreviations** |**Acronym**|**Description**| |---|---| |ESD|ElectroStatic Discharge| |FET|Field-Effect Transistor| |GPIO|General Purpose Input/Output| |I2C-bus|Inter-Integrated Circuit bus| |I/O|Input/Output| |LED|Light-Emitting Diode| |LSB|Least Significant Bit| |MSB|Most Significant Bit| |PCB|Printed-Circuit Board| |POR|Power-On Reset| |SMBus|System Management Bus| ## **20. Revision history** |**Table 22.**|**Revision**|**history**|||| |---|---|---|---|---|---| |**Document**|**ID**|**Release date**|**Data sheet status**|**Change notice**|**Supersedes**| |PCA6408A|v.1|20120927|Product data sheet|-|-| © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **37 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **21. Legal information** ## **21.1 Data sheet status** |**Document status[1]**<br>**[2]**|**Product statu**~~**s**~~**[3]**|**Definition**| |---|---|---| |Objective [short] data sheet|Development|This document contains data from the objective specification for product development.| |Preliminary [short] data sheet|Qualification|This document contains data from the preliminary specification.| |Product [short] data sheet|Production|This document contains the product specification.| [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. ## **21.2 Definitions** **Suitability for use —** NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. **Draft —** The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. **Short data sheet —** A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. **Applications —** Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. **Product specification —** The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. ## **21.3 Disclaimers** **Limited warranty and liability —** Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. **Limiting values —** Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. **Terms and conditions of commercial sale —** NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the _Terms and conditions of commercial sale_ of NXP Semiconductors. **Right to make changes —** NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. **No offer to sell or license —** Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **38 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** **Export control —** This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. **Non-automotive qualified products —** Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. **Translations —** A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. ## **21.4 Trademarks** Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. **I[2] C-bus —** logo is a trademark of NXP B.V. ## **22. Contact information** For more information, please visit: **http://www.nxp.com** For sales office addresses, please send an email to: **salesaddresses@nxp.com** © NXP B.V. 2012. All rights reserved. PCA6408A All information provided in this document is subject to legal disclaimers. **Rev. 1 — 27 September 2012** **Product data sheet** **39 of 40** **PCA6408A** **NXP Semiconductors** **Low-voltage, 8-bit I[2] C-bus and SMBus I/O expander** ## **23. Contents** |**1**|**General description . . . . . . . . . . . . . . . . . . . . . . 1**| |---|---| |**2**|**Features and benefits . . . . . . . . . . . . . . . . . . . . 2**| |**3**|**Ordering information. . . . . . . . . . . . . . . . . . . . . 3**| |3.1|Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 3| |**4**|**Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3**| |**5**|**Pinning information. . . . . . . . . . . . . . . . . . . . . . 4**| |5.1|Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4| |5.2|Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5| |**6**|**Voltage translation. . . . . . . . . . . . . . . . . . . . . . . 6**| |**7**|**Functional description . . . . . . . . . . . . . . . . . . . 6**| |7.1|Device address. . . . . . . . . . . . . . . . . . . . . . . . . 6| |7.2|Interface definition . . . . . . . . . . . . . . . . . . . . . . 7| |7.3|Pointer register and command byte . . . . . . . . . 7| |7.4|Register descriptions . . . . . . . . . . . . . . . . . . . . 8| |7.4.1|Input port register (00h) . . . . . . . . . . . . . . . . . . 8| |7.4.2|Output port register (01h) . . . . . . . . . . . . . . . . . 8| |7.4.3|Polarity inversion register (02h) . . . . . . . . . . . . 8| |7.4.4|Configuration register (03h) . . . . . . . . . . . . . . . 8| |7.5|I/O port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9| |7.6|Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 10| |7.7|Reset input (RESET<br>). . . . . . . . . . . . . . . . . . . 10| |7.8|Interrupt output (INT<br>) . . . . . . . . . . . . . . . . . . . 10| |**8**|**Bus transactions . . . . . . . . . . . . . . . . . . . . . . . 11**| |8.1|Write commands. . . . . . . . . . . . . . . . . . . . . . . 11| |8.2|Read commands . . . . . . . . . . . . . . . . . . . . . . 12| |**9**|**Application design-in information . . . . . . . . . 13**| |9.1|Minimizing IDDwhen I/Os control LEDs . . . . . 13| |9.2|Power-on reset requirements . . . . . . . . . . . . . 14| |**10**|**Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16**| |**11**|**Recommended operating conditions. . . . . . . 16**| |**12**|**Thermal characteristics . . . . . . . . . . . . . . . . . 17**| |**13**|**Static characteristics. . . . . . . . . . . . . . . . . . . . 17**| |13.1|Typical characteristics . . . . . . . . . . . . . . . . . . 19| |**14**|**Dynamic characteristics . . . . . . . . . . . . . . . . . 23**| |**15**|**Parameter measurement information . . . . . . 24**| |**16**|**Package outline . . . . . . . . . . . . . . . . . . . . . . . . 28**| |**17**|**Soldering of SMD packages . . . . . . . . . . . . . . 31**| |17.1|Introduction to soldering . . . . . . . . . . . . . . . . . 31| |17.2|Wave and reflow soldering . . . . . . . . . . . . . . . 31| |17.3|Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 31| |17.4|Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 32| |**18**|**Soldering: PCB footprints. . . . . . . . . . . . . . . . 34**| |**19**|**Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 37**| |**20**|**Revision history. . . . . . . . . . . . . . . . . . . . . . . . 37**| |**21**|**Legal information . . . . . . . . . . . . . . . . . . . . . . 38**| |---|---| |21.1|Data sheet status . . . . . . . . . . . . . . . . . . . . . . 38| |21.2|Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 38| |21.3|Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . 38| |21.4|Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 39| |**22**|**Contact information . . . . . . . . . . . . . . . . . . . . 39**| |**23**|**Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40**| Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. **© NXP B.V. 2012.** **All rights reserved.** For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com **Date of release: 27 September 2012 Document identifier: PCA6408A**
Updated at February 9, 2023
NXP Semiconductors is a global leader in secure connectivity solutions, driving innovation across the automotive, industrial, IoT, mobile, and communications infrastructure markets. By developing advanced, purpose-built technologies, NXP enables devices to sense, think, connect, and act intelligently, delivering rigorously tested components that make the connected world safer and more efficient. Within the semiconductor space, NXP is highly regarded for its extensive range of high-performance integrated circuits and discrete devices. The brand's portfolio excels in drivers and interfaces, featuring a comprehensive selection of I/O expanders designed to streamline complex system architectures. For demanding high-frequency and wireless applications, NXP provides industry-leading RF FETs and RF/PIN diodes engineered to deliver exceptional signal integrity, efficiency, and reliability. The NXP product lineup further extends to essential discrete components, including versatile bipolar transistors, JFETs, and small signal diodes optimized for precision switching and amplification. Additionally, the portfolio supports advanced automation and smart applications with precision IC sensors, such as MEMS accelerometers, alongside specialized power management solutions like AC/DC LED driver ICs and single MOSFETs for cutting-edge electronics design.
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