NZF220TT1G

## NZF220TT1 

## EMI Filter with ESD Protection 

## **Features:** 

- EMI/RFI Bi−directional “Pi” Low−Pass Filters 

- ESD Protection Meets IEC61000−4−2 

- Diode Capacitance: 7 − 10 pF 

- Zener/Resistor Line Capacitance: 22 ± 20% pF 

**http://onsemi.com CIRCUIT DESCRIPTION** 

- Low Zener Diode Leakage: 1 A Maximum | 

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1 toe 3 2<br>3 MARKING<br>DIAGRAM<br>1 [2]<br>SC−75 X6 M<br>CASE 463<br>STYLE 4<br>" 1 &<br>X6 = Device Code<br>M = Date Code*<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>*Date  Code orientation may vary depending<br>upon manufacturing location.<br>**----- End of picture text -----**<br>


- Zener Breakdown Voltage; 6 − 8 Volts 

- Pb−Free Package is Available 

## **Benefits:** 

- Designed to Suppress EMI/RFI Noise in Systems Subjected to Electromagnetic Interference 

- Small Package Size Minimizes Parasitic Inductance, Thus a More “Ideal” Low Pass Filtering Response 

## **Applications:** 

- Cellular Phones 

- Communication Systems 

- Computers 

• Portable Products with Input/Output Conductors 

= Pb−Free Package **MAXIMUM RATINGS** (Note: Microdot may be in either location) **Rating Symbol Value Unit** *Date  Code orientation may vary depending upon manufacturing location. Peak Power Dissipation (Note 1) PPK 14 W 8 × 20 s Pulse Maximum Junction Temperature TJ 150 ° C **ORDERING INFORMATION** ~~55s—~~ Stresses exceeding Maximum Ratings may damage the device. Maximum **Device Package Shipping**[†] Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the NZF220TT1 SC−75 3000/Tape & Reel Recommended Operating Conditions may affect device reliability. 1. All diodes under power NZF220TT1G SC−75 3000/Tape & Reel (Pb−Free) ~~=~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2006 **1** Publication Order Number: **March, 2006 − Rev. 3 NZF220TT1/D** 

**NZF220TT1** 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|Zener Breakdown Voltage, @ IZT= 1 mA|VZ|6.0|−|8.0|V|
|Zener Leakage Current, @ VR= 3 V|Ir|N/A|−|1.0|�A|
|Zener Forward Voltage, @ IF= 50 mA|VF|N/A|−|1.25|V|
|Zener Internal Capacitance, @ 0 V Bias|C|7.0|−|10|pF|
|Zener/Resistor Array Line Capacitance|C|17.6|−|26.4|pF|
|Resistance|R|90|−|110|�|
|Cutoff Frequency|FC(Note 2)|−|220|−|MHz|



2. 50 � Source and 50 � Lead Termination per Figure 2 

## **Applications Information** 

## **Suppressing Noise at the Source** 

- Filter all I/O signals leaving the noisy environment 

- Locate I/O driver circuits close to the connector 

- Use the longest rise/fall times possible for all digital signals 

## **Reducing Noise at the Receiver** 

- Filter all I/O signals entering the unit 

- Locate the I/O filters as close as possible to the connector 

## **Minimizing Noise Coupling** 

- Use multilayer PCBs to minimize power and ground inductance 

- Keep clock circuits away from the I/O connector 

- Ground planes should be used whenever possible 

- Minimize the loop area for all high speed signals 

- Provide for adequate power decoupling 

## **ESD Protection** 

- Locate the suppression devices as close to the I/O connector as possible 

- Minimize the PCB trace length to the suppression device 

- Minimize the PCB trace length for the ground return for the suppression device 

**http://onsemi.com** 

**2** 

**NZF220TT1** 

## **Frequency Response Specification** 

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TG OUTPUT RF INPUT<br>TEST BOARD<br>NZF220T<br>**----- End of picture text -----**<br>


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TRACKING SPECTRUM<br>GENERATOR ANALYZER<br>50  �<br>NZF220T<br>50  �<br>VG Vin Vout<br>Test Conditions:<br>Source Impedance = 50  �<br>Load Impedance = 50  �<br>Input Power = 0 dB<br>**----- End of picture text -----**<br>


**Figure 1. Measurement Conditions** 

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−6.3<br>�<br>� OUTPUT<br>3 dB = 220 MHz<br>−50<br>1.0 10 100 1000 3000<br>f, FREQUENCY (MHz)<br>GAIN (dB)<br>**----- End of picture text -----**<br>


**Figure 2. Typical EMI Filter Response (50** � **Source and 50** � **Lead Termination)** 

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**3** 

**NZF220TT1** 

## **OUTLINE DIMENSIONS** 

**SC−75/SOT−416** CASE 463−01 ISSUE F 

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TT −E−<br>2<br>3<br>e −D−<br>1<br>b 3 PL<br>0.20 (0.008) M D<br>HE 0.20 (0.008) E<br>a<br>C<br>A<br>L A1<br>**----- End of picture text -----**<br>


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NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: MILLIMETER.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 0.70 0.80 0.90 0.027 0.031 0.035<br>A1 0.00 0.05 0.10 0.000 0.002 0.004<br>b 0.15 0.20 0.30 0.006 0.008 0.012<br>C 0.10 0.15 0.25 0.004 0.006 0.010<br>D 1.55 1.60 1.65 0.059 0.063 0.067<br>FSSEEEE E 0.70 0.80 0.90 0.027 0.031 0.035<br>e 1.00 BSC 0.04 BSC<br>L 0.10 0.15 0.20 0.004 0.006 0.008<br>HE 1.50 1.60 1.70 0.061 0.063 0.065<br>STYLE 4:<br>PIN 1. CATHODE<br> 2. CATHODE<br> 3. ANODE<br>**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

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0.356<br>0.014<br>a<br>1.803 0.787<br>0.071 0.031<br>7 Mm _<br>_ 0.508 a<br>0.020 1.000<br>0.039<br>SCALE 10:1 mm<br>(—) inches<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


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## **LITERATURE FULFILLMENT** : 

**NZF220TT1/D** 

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