NUF2450MUT2G

## NUF2450 

## 2 Line EMI Filter with ESD Protection 

This device is a 2 line EMI filter array for audio applications. Greater than −30 dB attenuation is obtained at frequencies from 800 MHz to 5.0 GHz. The NUF2450MU has a cut−off frequency of 20 MHz and minimal line resistance, making it ideal for applications requiring low bandpass attenuation. This UDFN package is specifically designed to enhance EMI filtering for low−profile or slim design electronics especially where space and height is a premium. It also offers ESD protection−clamping transients from static discharges. ESD protection is provided across all capacitors. 

## **Features** 

- EMI Filtering and ESD Protection 

- Integration of 10 Discrete Components 

- Compliance with IEC61000−4−2 (Level 4) 20 kV (Contact) 

## **www.onsemi.com** 

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- UDFN Package, 1.2 x 1.8 mm 

- Moisture Sensitivity Level 1 

- ESD Ratings: Machine Model = C 

   - Human Body Model = 3B 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Benefits** 

- Reduces EMI/RFI Emissions on Audio Lines 

- Low Profile Package; Typical Height of 0.5 mm 

- Design−Friendly and Easy−to−Use Pin Configurations, Particularly for Portable Electronics 

- Integrated Solution Offers Cost and Space Savings in UDFN Package 

- Reduces Parasitic Inductances Which Offer a More “Ideal” Low Pass Filter Response 

- Integrated Solution Improves System Reliability 

- Excellent ESD Performance with Large GND Pad 

## **Applications** 

- Headsets, MP3 Players, and PDAs 

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8<br>MARKING<br>wy 1 DIAGRAM<br>UDFN8 24 M<br>CASE 517AD<br>1<br>24 = Specific Device Code<br>M = Month Code<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


## **PIN CONNECTIONS** 

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- Portable DVDs 

- Hands−Free Interface 

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ORDERING INFORMATION<br>**----- End of picture text -----**<br>


**Device Package Shipping**[†] NUF2450MUT2G UDFN8 3000 / Tape & Reel (Pb−Free) ~~==~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

© Semiconductor Components Industries, LLC, 2017 **February, 2017 − Rev. 1** 

**NUF2450/D** 

**NUF2450** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Value**|**Unit**|
|ESD Discharge IEC61000−4−2<br>Contact Discharge<br>Machine Model<br>Human Body Model|VPP|20<br>1.6<br>16|kV|
|Operating Temperature Range|TOP|−40 to 85|°C|
|Storage Temperature Range|TSTG|−55 to 150|°C|
|Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s)|TL|260|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERIST**|**ICS**(TJ= 2|5°C unless otherwise noted)|||||
|---|---|---|---|---|---|---|
|**Parameter**|**Symbol**|**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**|
|Maximum Reverse Working Voltage|<br>VRWM||−|−|5.0|V|
|Breakdown Voltage|VBR|IR= 1.0 mA|6.0|7.0|8.0|V|
|Leakage Current|IR|VRWM= 3.3 V|−|−|100|nA|
|Inductance|L||−|2.3|−|nH|
|Series Resistance|RS||0.9|1.3|1.7|�|
|Capacitance (Note 1)|Cline|VR= 0 V, f = 1.0 MHz|190|240|290|pF|
|Cut−Off Frequency (Note 2)|f3dB|Above this frequency,<br>Appreciable Attenuation Occurs|−|20|−|MHz|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Measured at 25 ° C. 

2. 50 � source and 50 � load termination. 

## **TYPICAL CHARACTERISTICS** 

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0 0<br>−5<br>−10<br>−10<br>−15 −20<br>−20<br>−30<br>−25<br>−40<br>−30<br>−35<br>−50<br>−40<br>−60<br>−45<br>−50 −70<br>1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10<br>FREQUENCY (Hz) FREQUENCY (Hz)<br>S21 (dB) S41 (dB)<br>**----- End of picture text -----**<br>


**Figure 1. Typical Insertion Loss Characteristics (S21 Measurement)** 

**Figure 2. Analog Crosstalk Curve (S41 Measurement)** 

**www.onsemi.com** 

**2** 

**NUF2450** 

## **PACKAGE DIMENSIONS** 

**UDFN8, 1.8x1.2, 0.4P** CASE 517AD ISSUE D 

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MOLD CMPD<br>D A EXPOSED Cu NOTES:<br>1. DIMENSIONING AND TOLERANCING PER<br>2X B ÇÇ ASME Y14.5M, 1994.<br>0.10 C 2. CONTROLLING DIMENSION: MILLIMETERS.<br>3. DIMENSION b APPLIES TO PLATED TERMINAL<br>A1 ÉÉ A3 AND IS MEASURED BETWEEN 0.15 AND<br>REFERENCEPIN ONE ÉÉÉ E DETAIL B 4. 0.30 mm FROM TERMINAL.COPLANARITY APPLIES TO THE EXPOSED<br>cul, ALTERNATE PAD AS WELL AS THE TERMINALS.<br>2X ÉÉÉ CONSTRUCTIONS<br>MILLIMETERS<br>eT 0.10 C DIM MIN MAX<br>TOP VIEW A 0.45 0.55<br>A1 0.00 0.05<br>0.05 MIN A3 0.13 REF<br>DETAIL B A b 0.15 0.25<br>0.05 C (A3) D 1.80 BSC<br>E 1.20 BSC<br>e 0.40 BSC<br>(0.10) D2 0.90 1.10<br>8X 0.05 C DETAIL A E2 0.20 0.30<br>NOTE 4 SIDE VIEWA1 C [SEATING] PLANE KJ 0.19 REF0.20 TYP<br>L L 0.20 0.30<br>Buy = L1 −−− 0.10<br>J<br>DETAIL A<br>8X L D2 L1 SOLDERING FOOTPRINT*<br>1 E2 DETAIL A 1.10<br>OPTIONAL 8X<br>CONSTRUCTION 7X 0.25 0.45<br>PACKAGE<br>8X K 8 8X b OUTLINE<br>e 0.10 C A B<br>e/2 0.05 C NOTE 3 1.50<br>BOTTOM VIEW<br>0.35<br>1<br>Saace t e ibe<br>0.35<br>"eo 0.40 PITCH |<br>DIMENSIONS: MILLIMETERS<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


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