NUF2441FCT1G

## NUF2441FC 

## Integrated Passive Filter with ESD Protection 

This device is designed for cell phone applications requiring **Headset and Speaker Phone** , **EMI Filtering** and **ESD Protection** . This device offers an integrated solution in a small package reducing PCB space and cost. 

## **http://onsemi.com** 

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CIRCUIT DESCRIPTION<br>**----- End of picture text -----**<br>


## **Features:** 

- Provides EMI Filtering and ESD Protection 

- Single IC Offers Cost Savings by Replacing 2 Inductors, 4 Capacitors, and 4 TVs Diodes 

- Compliance with IEC61000--4--2, (Level 4) 30 kV (Contact), 30 kV (air) 

- Flip--Chip Package 

- Moisture Sensitivity Level 1 

- ESD Ratings: Machine Model = C ESD Ratings: Human Body Model = 3B 

- Pb--Free Package is Available* 

## **Benefits:** 

- Flip--Chip Package Minimizes PCB Space 

- Integrated Circuit Increases System Reliability versus Discrete Component Implementation 

- TVs Devices Provide ESD Protection That is Better than a Discrete Implementation because the Small IC minimizes Parasitic Inductances 

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B2<br>C1 L C2<br>B1 B3<br>A1 A3<br>L<br>C1 C2<br>Ap<br>A2<br>MARKING<br>DIAGRAM<br>e =,<br>A1<br>2441AYWW<br>Flip--Chip<br>CASE 499J<br>2441 = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>**----- End of picture text -----**<br>


## **Typical Applications:** 

- Cell Phones 

## **PIN CONFIGURATION** 

- Communication Circuits 

## **MAXIMUM RATINGS** (TA = 25C) 

|**MAXIMUM RATINGS** (TA = 25C)A = 25C)= 25C)C)C)|(TA = 25C)A = 25C)= 25C)C)C)|||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|ESD Discharge IEC61000--4--2<br>Contact Discharge<br>Air Discharge|Vpp|30<br>30|kV|
|Operating Temperature Range|TJ|--40 to +125|C|
|Storage Temperature Range|Tstg|--55 to +150|C|
|Lead Solder Temperature<br>(10 second duration)|TL|260|C|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

- *For additional information on our Pb--Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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(Bump View) 

## **ORDERING INFORMATION** 

|**Package**|**Device**|**Shipping**†|
|---|---|---|
|NUF2441FCT1|Flip--Chip|3000/Tape & Reel|
|NUF2441FCT1G|Flip--Chip<br>(Pb--Free)|3000/Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: 

**1** 

 Semiconductor Components Industries, LLC, 2010 **November, 2010 -- Rev. 5** 

**NUF2441FC/D** 

**NUF2441FC** 

**ELECTRICAL CHARACTERISTICS** (TA = 25C) 

|**Device**|**Device**<br>**Marking**|**VRWM**<br>**(Volts)**|**VBR @**<br>**1 mA**<br>**(Volts)**|**VBR @**<br>**1 mA**<br>**(Volts)**|**Max IR @**<br>**VRWM = 12 V**<br>**I/O Pin**<br>**(mA)**|**Typical**<br>**Capacitance**<br>**C1 + C2 (pF)**<br>(Notes 1, 3, 4)|**Typical**<br>**Pass--Band**<br>**Inductance**<br>**L (nH)**|**Equivalent**<br>**Series Resistance**<br>**RS (Ω)**(Note 2)|**Equivalent**<br>**Series Resistance**<br>**RS (Ω)**(Note 2)|
|---|---|---|---|---|---|---|---|---|---|
||||**Min**|**Max**||||**Typ**|**Max**|
|NUF2441FCT1G|2441|12|13.7|17.7|0.1|250|2.9|0.28|0.35|



1. Measured at 25C, VR = 0, f = 1 MHz, Source A1, GND A2, Open A3. 

2. Measured at room temperature. 

3. Tolerance = 20%. 

4. Measured under zero light conditions. 

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5 0<br>0<br>--10<br>--5<br>--10 --20<br>--15<br>--30<br>--20<br>--25 --40<br>--30<br>--50<br>--35<br>--40 --60<br>1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10 1.0E+06 1.0E+07 1.0E+08 1.0E+09 1.0E+10<br>FREQUENCY (Hz) FREQUENCY (Hz)<br>Figure 1. Insertion Loss Characteristic Figure 2. Analog Crosstalk<br>300 0.35<br>0.34<br>250<br>0.33<br>0.32<br>200<br>0.31<br>150 0.30<br>0.29<br>100<br>0.28<br>0.27<br>50<br>0.26<br>0 0.25<br>0 2 4 6 8 10 12 14 0 10 20 30 40 50 60 70 80 90<br>REVERSE VOLTAGE (V) TEMPERATURE (C)<br>Figure 3. Typical Line Capacitance vs. Reverse Figure 4. Typical Resistance vs. Temperature<br>Bias Voltage<br>(S21) dB (S41) dB<br>) Ω<br>RESISTANCE (<br>CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**http://onsemi.com** 

**2** 

**NUF2441FC** 

## **PACKAGE DIMENSIONS** 

**6 PIN FLIP--CHIP CSP** CASE 499J--01 ISSUE O 

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4 X D A B<br>0.10 C<br>a L] Pere<br>E<br>TERMINAL A1<br>LOCATOR |<br>eS<br>TOP VIEW<br>A2<br>A1<br>0.10 C<br>Zz i v e C<br>A<br>ipo e t<br>0.05 C<br>SIDE VIEW<br>e l T N O SEATING<br>PLANE<br>L_] D1<br>|_| e<br>B<br>6 X b A<br>0.05 C A B 1 2 3 e<br>o oj 0.03 T C o BOTTOM VIEW .<br>**----- End of picture text -----**<br>


NOTES: 

1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: MILLIMETERS. 

3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. 

|**DIM**|**MILLIMETERS**|**MILLIMETERS**|
|---|---|---|
||**MIN**|**MAX**|
|**A**|------|0.700|
|**A1**|0.210|0.270|
|**A2**|0.380|0.430|
|**D**<br>**E**|1.720 BSC<br>1.220 BSC||
|**E**<br>**b**|0.290<br>0.340<br>1.220 BSC||
|**e**|0.500 BSC||
|**D1**|1.000 BSC||



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## **PUBLICATION ORDERING INFORMATION** 

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