NUF2114MNT1G

## NUF2114 

## 2 Line Audio EMI Filter with ESD Protection 

This device is a 2 line audio EMI filter array designed for speaker applications. It offers greater than −30 dB attenuation at frequencies from 900 MHz to 3.0 GHz. This device also offers ESD protection−clamping transients from static discharges and ESD protection is provided across all capacitors. 

## **Features** 

- Provides EMI Filtering and ESD Protection 

- Integration of 10 Discretes 

- Compliance with IEC61000−4−2 (Level 4) 30 kV (Contact) 

## **http://onsemi.com** 

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- DFN8, 2x2 mm Package 

- Moisture Sensitivity Level 1 

- ESD Ratings: Machine Model = C 

   - Human Body Model = 3B 

- Matching Series Impedances for Speaker Applications 

- This is a Pb−Free Device 

## **Applications** 

- Wireless Phones 

- MP3s 

- PDAs 

- Digital Cameras 

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MARKING<br>DIAGRAM<br>DFN8 1<br>CASE 506AA U4M<br>&<br>1<br>U4 = Specific Device Code<br>M = Date Code<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


- Portable DVDs 

## **PIN CONNECTIONS** 

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OUT1 8 1 IN1<br>NC 7 2 NC<br>GND<br>NC 6 3 NC<br>OUT2 5 4 IN2<br>**----- End of picture text -----**<br>


(Bottom View) 

**ORDERING INFORMATION** 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**Device Package Shipping**[†] NUF2114MNT1G DFN8 3000 / Tape & Reel (Pb−Free) ~~re~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: **NUF2114/D** 

**1** 

© Semiconductor Components Industries, LLC, 2011 **October, 2011 − Rev. 0** 

**NUF2114** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Parameter**|**Symbol**|**Value**|**Unit**|
|ESD Discharge IEC61000−4−2<br>Contact Discharge|VPP|30|kV|
|Steady−State Power per Resistor @ 25°C|PR|180|mW|
|Steady−State Power per Package @ 25°C|PT|360|mW|
|Operating Temperature Range|TOP|−40 to 85|°C|
|Storage Temperature Range|Tstg|−55 to 150|°C|
|Maximum Lead Temperature for Soldering Purposes (1.8 in from case for 10 s)|TL|260|°C|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

## **ELECTRICAL CHARACTERISTICS** (TJ = 25 ° C unless otherwise noted) 

|**Parameter**|**Test Conditions**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|---|---|---|---|---|---|---|
|Maximum Reverse Working Voltage||VRWM|−|−|12|V|
|Breakdown Voltage|IR= 1.0 mA|VBR|13.7|15.7|17.7|V|
|Leakage Current|VRWM= 12 V|IR|−|−|0.1|�A|
|Resistance|IF= 40 mA|R|8.1|9.0|9.9|�|
|Capacitance per Diode (Notes 1, 3)||Cd|51|60|66|pF|
|Cut−Off Frequency (Note 2)|Above this frequency,<br>appreciable attenuation occurs|f3dB||50||MHz|



1. Measured at 25 ° C, VR = 0 V, f = 1.0 MHz. 

2. 50 � source and 50 � load termination. 

3. Total line capacitance is 2 times the diode capacitance (Cd). 

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**2** 

**NUF2114** 

## **TYPICAL PERFORMANCE CURVES** 

(TA = 25 ° C unless otherwise specified) 

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0 0<br>−5 −10<br>−10<br>−20<br>−15<br>−30<br>−20<br>−40<br>−25<br>−50<br>−30<br>−60<br>−35<br>−40 −70<br>−45 −80<br>1.0E+6 10E+6 100E+6 1.0E+9 10E+9 1.0E+6 10E+6 100E+6 1.0E+9 10E+9<br>FREQUENCY (Hz) FREQUENCY (Hz)<br>Figure 1. Insertion Loss Characteristics Figure 2. Analog Cross−Talk<br>8.7 130<br>120<br>8.6<br>110<br>8.5 100<br>90<br>8.4<br>80<br>8.3 70<br>60<br>8.2<br>50<br>8.1 40<br>−40 −15 10 35 60 85 −12 −8 −4 0 4 8 12<br>TEMPERATURE ( ° C) REVERSE VOLTAGE (VOLTS)<br>(S21) dB (S41) dB<br>CAPACITANCE (pF)<br>RESISTANCE (OHMS)<br>**----- End of picture text -----**<br>


**Figure 3. Typical Resistance over Temperature** 

**Figure 4. Typical Line Capacitance vs. Reverse Bias Voltage** 

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**3** 

**NUF2114** 

## **PACKAGE DIMENSIONS** 

**DFN8 2x2, 0.5P** CASE 506AA ISSUE E 

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D A NOTES:<br>L L 1. DIMENSIONING AND TOLERANCING PER<br>B ASME Y14.5M, 1994 .<br>2. CONTROLLING DIMENSION: MILLIMETERS.<br>L1 3. DIMENSION b APPLIES TO PLATED<br>TERMINAL AND IS MEASURED BETWEEN<br>0.15 AND 0.20 MM FROM TERMINAL TIP.<br>REFERENCEPIN ONE ÇÇÇ m ae E t o f DETAIL AOPTIONAL uf 4. COPLANARITY APPLIES TO THE EXPOSEDPAD AS WELL AS THE TERMINALS.<br>CONSTRUCTIONS<br>2X 0.10 C ÇÇÇ MILLIMETERS<br>DIM MIN MAX<br>ee ÇÇÇ r A 0.80 1.00<br>A1 0.00 0.05<br>2X 0.10 C EXPOSED Cu MOLD CMPD A3 0.20 REF<br>TOP VIEW ÉÉÉ b 0.20 0.30<br>D 2.00 BSC<br>ÉÉÉ D2 1.10 1.30<br>a 0.10 T C DETAIL B A S DETAIL B ey E2E 0.702.00 BSC0.90<br>OPTIONAL e 0.50 BSC<br>CONSTRUCTION K 0.30 REF<br>L 0.25 0.35<br>0.08 C (A3) L1 −−− 0.10<br>a NOTE 4 SIDE VIEW A1 C SEATINGPLANE RECOMMENDED<br>SOLDERING FOOTPRINT*<br>DETAIL A 8X<br>D2 1.30 0.50<br>8X L PACKAGE<br>1 4 OUTLINE<br>E2<br>0.90 2.30<br>K 8 5<br>8X b 1<br>e/2<br>e 0.10 C A B 0.308X 0.50<br>0.05 C NOTE 3 PITCH<br>aif oo m d“ a e k<br>BOTTOM VIEW DIMENSIONS: MILLIMETERS<br>*For additional information on our Pb−Free strategy and soldering<br>details, please download the ON Semiconductor Soldering and<br>Mounting Techniques Reference Manual, SOLDERRM/D.<br>**----- End of picture text -----**<br>


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## **PUBLICATION ORDERING INFORMATION** 

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## **LITERATURE FULFILLMENT** : 

**NUF2114/D** 

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