NUF2042XV6T1G
EMI Filter, 2-Channel, ESD Protection, USB Upstream Terminator, SOT-563
- Manufacturer: ONSEMI
- Product type: Integrated Passive Filters
- EMI Filter Type:USB Upstream and Terminator EMI Filter with ESD; No. of Data Lines:3 Data Lines; Filter Circuit:RC Pi Filter; Filter Case Style:SOT-563; No. of Pins:6Pins; Product
- SVHC: No SVHC (25-Jun-2025)
- No. of Pins: 6Pins
- Product Range: -
- Filter Circuit: RC Pi Filter
- EMI Filter Type: USB Upstream and Terminator EMI Filter with ESD
- No. of Data Lines: 2 Data Lines
- Filter Case / Package: SOT-563
| Delivery and price | |
|---|---|
| Units per pack | 2000 |
| Price | 0.223 € |
| Current stock | 1000+ |
| Lead time | 30 days |
## NUF2030XV6, NUF2042XV6 ## USB Upstream Terminator with ESD Protection These devices are designed for applications requiring **Line Termination** , **EMI Filtering** and **ESD Protection** . They are intended for use in upstream USB ports, cellular phones, wireless equipment and computer applications. These devices offer an integrated solution in a small package (SOT−563) reducing PCB space and cost. ## **Features:** - Provides USB Line Termination, Filtering and ESD Protection - Single IC Offers Cost Savings - Bidirectional EMI Filtering Prevents Noise from Entering/Leaving the System - Compliance with IEC61000−4−2 (Level 4) - 8 kV (Contact) 15 kV (Air) - ESD Ratings: Machine Model = C : Human Body Model = 3B - These are Pb−Free Devices ## **Benefits:** ## **http://onsemi.com** **==> picture [102 x 8] intentionally omitted <==** **----- Start of picture text -----**<br> CIRCUIT DESCRIPTION<br>**----- End of picture text -----**<br> **==> picture [129 x 140] intentionally omitted <==** **----- Start of picture text -----**<br> D1(0) VBUS D2(0)<br>6 5 4<br>RS C1 C1 RS<br>1 2 3<br>D1(i) GND D2(i)<br>**----- End of picture text -----**<br> - SOT−563 Package Minimizes PCB Space - Integrated Circuit Increases System Reliability versus Discrete Component Implementation - TVs Devices Provide ESD Protection That is Better than a Discrete Implementation because the Small IC minimizes Parasitic Inductances ## **Typical Applications:** **==> picture [44 x 56] intentionally omitted <==** **----- Start of picture text -----**<br> 6<br>1<br>SOT−563<br>CASE 463A<br>**----- End of picture text -----**<br> - USB Hubs - Computer Peripherals Using USB **MAXIMUM RATINGS** (TA = 25 ° C) **Rating Symbol Value Unit** Steady State Power PD 225 mW Maximum Junction Temperature TJ(max) 125 ° C Operating Temperature Range TJ −55 to +125 ° C Storage Temperature Range Tstg −55 to +125 ° C Lead Solder Temperature TL 260 ° C (10 second duration) ~~===~~ Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. ## **MARKING DIAGRAM** **==> picture [148 x 82] intentionally omitted <==** **----- Start of picture text -----**<br> xx M<br>1<br>xx = Specific Device Code<br>(see table on page 5)<br>M = Month Code<br>= Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br> ## **ORDERING INFORMATION** See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Publication Order Number: **NUF2030XV6/D** **1** © Semiconductor Components Industries, LLC, 2005 **July, 2005 − Rev. 2** **NUF2030XV6, NUF2042XV6** ## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) |**ELECTRICAL CHARACT**|**ERISTI**|**CS**(TA= 25°C unless ot|**CS**(TA= 25°C unless ot|**CS**(TA= 25°C unless ot|herwise noted)|herwise noted)|||||||| |---|---|---|---|---|---|---|---|---|---|---|---|---|---| |**Device**|**VRWM**<br>**(V)**|**VBR@ 1 mA**<br>**(V)**|||**IR @ 3.3**<br>**(nA)**||**V**|**Line Capacitance**<br>**Vdc = 2.5 V**<br>**f = 1 MHz**<br>**(pF)**(Note 1)|||**Series Resistor**<br>**RS (**�**)**||| |||**Min**|**Typ**|**Max**|**Min**|**Typ**|**Max**|**Min**|**Typ**|**Max**|**Min**|**Typ**|**Max**| |NUF2030XV6T1|5.25|5.6|6.8|8.0|−|10|100|−|30|36|17.6|22|26.4| |NUF2042XV6T1|5.25|5.6|6.8|8.0|−|10|100|37.6|42|56.4|17.6|22|26.4| 1. Measured between pins 1, 3, 4, 6 and ground with pin 5 also grounded. 2. For other resistance value (e.g. 33 � ), please contact your local ON Semiconductor sales representative. **http://onsemi.com** **2** **NUF2030XV6, NUF2042XV6** ## **TYPICAL CHARACTERISTICS** **==> picture [491 x 393] intentionally omitted <==** **----- Start of picture text -----**<br> 0 0<br>−10<br>−5<br>−20<br>−10<br>−30<br>−15 −40<br>−50<br>−20<br>−60<br>−25<br>−70<br>−30 −80<br>1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10<br>FREQUENCY (Hz) FREQUENCY (Hz)<br>Figure 1. Insertion Loss Characteristics Figure 2. Analog Cross−Talk (NUF2030)<br>(NUF2030)<br>0 0<br>−10<br>−5<br>−20<br>−10<br>−30<br>−15 −40<br>−50<br>−20<br>−60<br>−25<br>−70<br>−30 −80<br>1.E+06 1.E+07 1.E+08 1.E+09 1.E+10 1.E+06 1.E+07 1.E+08 1.E+09 1.E+10<br>FREQUENCY (Hz) FREQUENCY (Hz)<br>S21 (dB) S41 (dB)<br>S21 (dB) S41 (dB)<br>**----- End of picture text -----**<br> **Figure 3. Insertion Loss Characteristics (NUF2042)** **Figure 4. Analog Cross−Talk (NUF2042)** **==> picture [488 x 180] intentionally omitted <==** **----- Start of picture text -----**<br> 60 80<br>70<br>50<br>60<br>40<br>50<br>30 40<br>30<br>20<br>20<br>10<br>10<br>0 0<br>0 1 2 3 4 5 0 1 2 3 4 5<br>REVERSE VOLTAGE (V) REVERSE VOLTAGE (V)<br>CAPACITANCE (pF) CAPACITANCE (pF)<br>**----- End of picture text -----**<br> **Figure 5. Typical Capacitance (NUF2030)** **Figure 6. Typical Capacitance (NUF2042)** **http://onsemi.com** **3** **NUF2030XV6, NUF2042XV6** **==> picture [241 x 201] intentionally omitted <==** **----- Start of picture text -----**<br> 24.5<br>RS = Typical<br>24.0<br>23.5<br>23.0<br>22.5<br>22.0<br>21.5<br>−20 −10 0 10 20 30 40 50 60 70<br>TEMPERATURE ( ° C)<br>Figure 7. RS versus Temperature<br>(NUF2030 and NUF2042)<br>) �<br> (<br>S<br>R<br>**----- End of picture text -----**<br> **http://onsemi.com** **4** **NUF2030XV6, NUF2042XV6** ## **ORDERING INFORMATION** |**ORDERING INFORMATION**|||| |---|---|---|---| |**Device**|**Device**<br>**Marking**|**Package**|**Shipping**†| |NUF2030XV6T1|30|SOT−563*|4000 / Tape & Reel| |NUF2030XV6T1G|30|SOT−563*|4000 / Tape & Reel| |NUF2042XV6T1|22|SOT−563*|4000 / Tape & Reel| |NUF2042XV6T1G|22|SOT−563*|4000 / Tape & Reel| - †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. - *These packages are inherently Pb−Free. **http://onsemi.com** **5** **NUF2030XV6, NUF2042XV6** ## **PACKAGE DIMENSIONS** **SOT−563, 6 LEAD** CASE 463A−01 ISSUE E **==> picture [410 x 128] intentionally omitted <==** **----- Start of picture text -----**<br> NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI<br>Y14.5M, 1982.<br>D 2. CONTROLLING DIMENSION: MILLIMETERS<br>−X− A 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD<br>L FINISH THICKNESS. MINIMUM LEAD THICKNESS<br>IS THE MINIMUM THICKNESS OF BASE MATERIAL.<br>6 5 4 MILLIMETERS INCHES<br>−Y−E HE DIMA 0.50 MIN NOM 0.55 MAX 0.60 0.020 MIN 0.021 NOM 0.023 MAX<br>1 2 3 b 0.17 0.22 0.27 0.007 0.009 0.011<br>C 0.08 0.12 0.18 0.003 0.005 0.007<br>m e tf ee<br>D 1.50 1.60 1.70 0.059 0.062 0.066<br>b 6 5 PL C E 1.10 1.20 1.30 0.043 0.047 0.051<br>e 0.08 (0.003) M X Y Le 0.10 0.5 BSC0.20 0.30 0.004 0.02 BSC0.008 0.012<br>HE 1.50 1.60 1.70 0.059 0.062 0.066<br>**----- End of picture text -----**<br> ## **SOLDERING FOOTPRINT*** **==> picture [153 x 169] intentionally omitted <==** **----- Start of picture text -----**<br> 0.3<br>0.0118<br>Ty<br>0.45<br>0.0177<br>1.0<br>THe, 1.35 0.0394<br>0.0531<br>Lape<br>| __| 0.5 ___ 0.5 |<br>0.0197 0.0197<br>SCALE 20:1 mm<br>_ inches<br>**----- End of picture text -----**<br> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. **ON Semiconductor** and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **PUBLICATION ORDERING INFORMATION** **ON Semiconductor Website** : http://onsemi.com **LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : http://onsemi.com Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082−1312 USA **Order Literature** : http://www.onsemi.com/litorder **Phone** : 480−829−7710 or 800−344−3860 Toll Free USA/Canada **Japan** : ON Semiconductor, Japan Customer Focus Center **Fax** : 480−829−7709 or 800−344−3867 Toll Free USA/Canada 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 For additional information, please contact your **Email** : orderlit@onsemi.com **Phone** : 81−3−5773−3850 local Sales Representative. ## **LITERATURE FULFILLMENT** : **http://onsemi.com** **NUF2030XV6/D** **6**
Updated at April 28, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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