NSR20F30NXT5G

NSR20F30NXT5G 

## Schottky Barrier Diode 

These Schottky barrier diodes are optimized for low forward voltage drop and low leakage current and are offered in a Chip Scale Package (CSP) to reduce board space. The low thermal resistance enables designers to meet the challenging task of achieving higher efficiency and meeting reduced space requirements. 

**http://onsemi.com** 

## **Features** 

- Very Low Forward Voltage Drop − 480 mV @ 2.0 A 

- Low Reverse Current − 20 A @ 10 V VR 

## **30 V SCHOTTKY BARRIER DIODE** 

- 2.0 A of Continuous Forward Current 

- Power Dissipation of 665 mW with Minimum Trace 

- ESD Rating − Human Body Model: Class 3B ESD Rating − Machine Model: Class C 

- Very High Switching Speed 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Typical Applications** 

- LCD and Keypad Backlighting 

- Camera Photo Flash 

- Buck and Boost dc−dc Converters 

- Reverse Voltage and Current Protection 

- Clamping & Protection 

**==> picture [138 x 125] intentionally omitted <==**

**----- Start of picture text -----**<br>
1 2<br>CATHODE ANODE<br>2 MARKING<br>DIAGRAM<br>PIN 1<br>2 1<br>20F30<br>DSN2 YYY<br>(0603)<br>CASE 152AB<br>**----- End of picture text -----**<br>


**==> picture [117 x 17] intentionally omitted <==**

**----- Start of picture text -----**<br>
20F30 = Specific Device Code<br>YYY = Year Code<br>**----- End of picture text -----**<br>


## **Markets** 

- Mobile Handsets 

- MP3 Players 

- Digital Camera and Camcorders 

- Notebook PCs & PDAs 

- GPS 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Reverse Voltage|VR|30|V|
|Forward Current (DC)|IF|2.0|A|
|Forward Surge Current<br>(60 Hz @ 1 cycle)|IFSM|28|A|
|Repetitive Peak Forward Current<br>(Pulse Wave = 1 sec, Duty Cycle = 66%)|IFRM|4.0|A|
|ESD Rating:<br>Human Body Model<br>Machine Model|ESD|> 8<br>> 400|kV<br>V|



## **ORDERING INFORMATION** 

**Device Package Shipping** † NSR20F30NXT5G DSN2 5000 / Tape & Reel (Pb−Free) ~~ae~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

Publication Order Number: **NSR20F30/D** 

**1** 

© Semiconductor Components Industries, LLC, 2013 **October, 2013 − Rev. 3** 

**NSR20F30NXT5G** 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|Thermal Resistance<br>Junction−to−Ambient (Note 1)<br>Total Power Dissipation @ TA= 25°C|R�JA<br>PD|||213<br>586|°C/W<br>mW|
|Thermal Resistance<br>Junction−to−Ambient (Note 2)<br>Total Power Dissipation @ TA= 25°C|R�JA<br>PD|||80<br>1.56|°C/W<br>W|
|Storage Temperature Range|Tstg|||−40 to +125|°C|
|Junction Temperature|TJ|||+150|°C|



1. Mounted onto a 4 in square FR−4 board 50 mm sq. 1 oz. Cu 0.06” thick  single sided. Operating to steady state. 

2. Mounted onto a 4 in square FR−4 board 1 in sq. 1 oz. Cu 0.06” thick  single sided. Operating to steady state. 

## **ELECTRICAL CHARACTERISTICS** (TA = 25 ° C unless otherwise noted) 

|**ELECTRICAL CHARACTERISTICS**(TA= 25°C unless otherwise note|d)|||||
|---|---|---|---|---|---|
|**Characteristic**|**Symbol**|**Min**|**Typ**|**Max**|**Unit**|
|Reverse Leakage<br>(VR= 10 V)<br>(VR= 30 V)|IR|||20<br>150|�A|
|Forward Voltage<br>(IF= 1.0 A)<br>(IF= 2.0 A)|VF|||0.42<br>0.48|V|



**==> picture [488 x 377] intentionally omitted <==**

**----- Start of picture text -----**<br>
10 100000 150 ° C<br>10000<br>TJ = 125 ° C 125 ° C<br>1 1000<br>TJ = 150 ° C 100 75 ° C<br>0.1 10<br>25 ° C<br>1<br>0.01 0.1<br>−25 ° C<br>0.01<br>75 ° C 25 ° C −25 ° C<br>0.0010.0 0.1 0.2 0.3 0.4 0.5 0.0010 5 10 15 20 25 30<br>VF, FORWARD VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>Figure 1. Forward Voltage Figure 2. Typical Reverse Current<br>450<br>TA = 25 ° C<br>400<br>350<br>300<br>250<br>200<br>150<br>100<br>50<br>0<br>0 5 10 15 20 25 30<br>VR, REVERSE VOLTAGE (V)<br>A)<br>�<br>, FORWARD CURRENT (A) , REVERSE CURRENT (<br>IF IR<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 3. Typical Capacitance** 

**http://onsemi.com** 

**2** 

**NSR20F30NXT5G** 

## **PACKAGE DIMENSIONS** 

**DSN2, 1.6x0.8, 0.9P, (0603)** CASE 152AB ISSUE B 

**==> picture [437 x 362] intentionally omitted <==**

**----- Start of picture text -----**<br>
NOTES:<br>0.05 C 1. DIMENSIONING AND TOLERANCING PER<br>ASME Y14.5M, 1994.<br>D A B 2. CONTROLLING DIMENSION: MILLIMETERS.<br>MILLIMETERS<br>"Pot DIM MIN MAX<br>E A1A 0.25−−− 0.310.05<br>0.05 C Db 0.551.60 BSC0.65<br>TOP VIEW E 0.80 BSC<br>L 1.45 1.55<br>0.05 C L2 0.90 1.00<br>4 L3 0.25 0.35<br>| coe ==<br>A<br>0.05 C CATHODE BAND MONTH CODING<br>A1<br>ay C [SEATING] PLANE DEC NOV OCT<br>SIDE VIEW<br>SEP<br>0.05 C A B XXXX DEVICE CODE<br>L JUN<br>L/2 MAR YYY YEAR CODE<br>b<br>rey CF<br>FEB<br>JAN<br>1 0.05 C A B<br>L2 XXXX<br>L3 (EXAMPLE)<br>BOTTOM VIEW Y09<br>MOUNTING FOOTPRINT*<br>INDICATES AUG 2009<br>1.70<br>0.52 0.80<br>PIN 1<br>atl<br>0.70<br>OY 1.05<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


See Application Note AND8464/D for more mounting details 

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**ON Semiconductor** and          are registered trademarks of Semiconductor Components Industries, LLC (SCILLC).  SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf.  SCILLC reserves the right to make changes without further notice to any products herein.  SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time.  All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts.  SCILLC does not convey any license under its patent rights nor the rights of others.  SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.  Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.  SCILLC is an Equal Opportunity/Affirmative Action Employer.  This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **N. American Technical Support** : 800−282−9855 Toll Free **ON Semiconductor Website** : **www.onsemi.com** Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 5163, Denver, Colorado 80217 USA **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada Phone: 421 33 790 2910 **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Japan Customer Focus Center** For additional information, please contact your local **Email** : orderlit@onsemi.com Phone: 81−3−5817−1050 Sales Representative 

## **LITERATURE FULFILLMENT** : 

**NSR20F30/D** 

**http://onsemi.com 3** 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**DSN2, 1.6x0.8, 0.9P, (0603)** CASE 152AB ISSUE C 

**==> picture [440 x 282] intentionally omitted <==**

**----- Start of picture text -----**<br>
DATE 30 APR 2017<br>NOTES:<br>0.05 C 1. DIMENSIONING AND TOLERANCING PER<br>ASME Y14.5M, 1994.<br>D A B 2. CONTROLLING DIMENSION: MILLIMETERS.<br>MILLIMETERS<br>DIM MIN MAX<br>0 E A1A 0.25−−− 0.310.05<br>ep 0.05 C Db 0.551.60 BSC0.65<br>TOP VIEW E 0.80 BSC<br>L 1.45 1.55<br>0.05 C L2 0.90 1.00<br>4 L3 0.25 0.35<br>ee = =<br>A GENERIC GENERIC<br>0.05 C MARKING DIAGRAM1* MARKING DIAGRAM2*<br>a A1 Hr C [SEATING] PLANE PIN 1 PIN 1<br>SIDE VIEW<br>XXXX<br>XXM<br>YYY<br>0.05 C A B<br>O man 1<br>L XXXX = Specific Device Code XX = Specific Device Code<br>L/2 YYY = Year Code M = Date Code<br>b<br>*This information is generic. Please refer<br>1 0.05 C A B to device data sheet for actual partmarking. Pb−Free indicator, “G”, may<br>L2 or not be present. Some products may<br>L3 not follow the Generic Marking.<br>BOTTOM VIEW CATHODE BAND MONTH<br>**----- End of picture text -----**<br>


**==> picture [42 x 7] intentionally omitted <==**

**----- Start of picture text -----**<br>
SCALE 8:1<br>**----- End of picture text -----**<br>


## **CODING** 

**==> picture [133 x 95] intentionally omitted <==**

**----- Start of picture text -----**<br>
MOUNTING FOOTPRINT*<br>1.70<br>0.52 0.80<br>PIN 1<br>0.70 #8<br>1.05 ~<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


See Application Note AND8464/D for more mounting details 

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

**==> picture [178 x 152] intentionally omitted <==**

**----- Start of picture text -----**<br>
NOV OCT<br>DEC<br>SEP<br>XXXX DEVICE CODE<br>JUN<br>MAR YYY YEAR CODE<br>FEB<br>JAN hart<br>XXXX<br>(EXAMPLE)<br>Y09<br>INDICATES AUG 2009<br>**----- End of picture text -----**<br>


**==> picture [222 x 27] intentionally omitted <==**

**----- Start of picture text -----**<br>
|||
|---|---|
|DOCUMENT NUMBER:|98AON40452E|
|DESCRIPTION:|DSN2, 1.6X0.8, 0.9P, (0603)|

**----- End of picture text -----**<br>


Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. 

**PAGE 1 OF 1** 

ON Semiconductor and          are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others. 

www.onsemi.com 

© Semiconductor Components Industries, LLC, 2019 

**onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 

## **PUBLICATION ORDERING INFORMATION** 

**LITERATURE FULFILLMENT** : **TECHNICAL SUPPORT Email Requests to:** orderlit@onsemi.com **North American Technical Support: Europe, Middle East and Africa Technical Support:** Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 00421 33 790 2910 **onsemi Website:** www.onsemi.com Phone: 011 421 33 790 2910 For additional information, please contact your local Sales Representative 

◊ 

**==> picture [232 x 43] intentionally omitted <==**