NRVTSA4100T3G
Schottky Rectifier, 100 V, 4 A, Single, DO-214AC (SMA), 2 Pins, 660 mV
- Manufacturer: ONSEMI
- Product type: Schottky Rectifier Diodes
- Repetitive Reverse Voltage Vrrm Max:100V; Forward Current If(AV):4A; Diode Configuration:Single; Diode Case Style:DO-214AC; No. of Pins:2Pins; Forward Voltage VF Max:660mV; Forwar
- SVHC: No SVHC (15-Jan-2018)
- No. of Pins: 2Pins
- Product Range: -
- Qualification: AEC-Q101
- Diode Mounting: Surface Mount
- Diode Case Style: DO-214AC (SMA)
- Diode Configuration: Single
- Forward Voltage Max: 660mV
- Forward Surge Current: 50A
- Average Forward Current: 4A
- Operating Temperature Max: 150°C
- Repetitive Peak Reverse Voltage: 100V
| Delivery and price | |
|---|---|
| Units per pack | 1000 |
| Price | 0.151 € |
| Current stock | 10+ |
| Lead time | 30 days |
NTSA4100, NRVTSA4100 ## Low Forward Voltage, Low Leakage Trench-based Schottky Rectifier ## **Features** ## **www.onsemi.com** - Fine Lithography Trench−based Schottky Technology for Very Low Forward Voltage and Low Leakage **SCHOTTKY BARRIER RECTIFIERS 4 AMPERES 100 VOLTS** - Fast Switching with Exceptional Temperature Stability - Low Power Loss and Lower Operating Temperature - Higher Efficiency for Achieving Regulatory Compliance - High Surge Capability - NRVTSA Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 **MARKING** Qualified and PPAP Capable **DIAGRAMS** Unique Site and Control Change Requirements; AEC−Q101 **MARKING** Qualified and PPAP Capable **DIAGRAMS** • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS **SMA** Compliant **CASE 403D** TH41 **STYLE 1** AYWW **Typical Applications** • Switching Power Supplies including Wireless, Smartphone and Notebook Adapters TH41 = Specific Device Code • High Frequency and DC−DC Converters A = Assembly Location Y = Year • Freewheeling and OR−ing diodes WW = Work Week • Reverse Battery Protection = Pb−Free Package • Instrumentation (Note: Microdot may be in either location) • LED Lighting **Mechanical Characteristics: ORDERING INFORMATION** • Case: Epoxy, Molded • Epoxy Meets Flammability Rating UL 94−0 @ 0.125 in. **Device Package Shipping** † • Lead Finish: 100% Matte Sn (Tin) NTSA4100T3G SMA 5000 / (Pb−Free) Tape & Reel • Lead and Mounting SurfaceTemperature for Soldering Purposes: 260°C Max. for 10 Seconds NRVTSA4100T3G SMA 5000 / (Pb−Free) Tape & Reel • ~~_~~ Device Meets MSL 1 Requirements †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: **NTSA4100/D** **1** © Semiconductor Components Industries, LLC, 2015 **October, 2015 − Rev. 2** **NTSA4100, NRVTSA4100** ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|100|V| |Average Rectified Forward Current<br>(TL= 118°C)|IF(AV)|4.0|A| |Peak Repetitive Forward Current,<br>(Square Wave, 20 kHz, TL= 110°C)|IFRM|8.0|A| |Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|50|A| |Storage Temperature Range|Tstg|−65 to +150|°C| |Operating Junction Temperature|TJ|−55 to +150|°C| |ESD Rating (Human Body Model)||1B|| |ESD Rating (Machine Model)||M3|| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ## **THERMAL CHARACTERISTICS** |**THERMAL CHARACTERISTICS**||||| |---|---|---|---|---| |**Characteristic**|**Symbol**|**Typ**|**Max**|**Unit**| |Thermal Resistance, Junction−to−Lead, Steady State<br>(Assumes 600 mm21 oz. copper bond pad, on a FR4 board)|RθJL|−|16.2|°C/W| |Thermal Resistance, Junction−to−Ambient, Steady State<br>(Assumes 600 mm21 oz. copper bond pad, on a FR4 board)|RθJA|−|90|°C/W| |**ELECTRICAL CHARACTERISTICS**||||| |Instantaneous Forward Voltage (Note 1)<br>(iF= 1.0 A, TJ= 25°C)<br>(iF= 4.0 A, TJ= 25°C)<br>(iF= 1.0 A, TJ= 125°C)<br>(iF= 4.0 A, TJ= 125°C)|vF|0.43<br>0.59<br>0.35<br>0.53|−<br>0.66<br>−<br>0.58|V| |Reverse Current (Note 1)<br>(Rated dc Voltage, TJ= 25°C)<br>(Rated dc Voltage, TJ= 125°C)|iR|1.3<br>0.13|25<br>9|�A<br>mA| |Diode Capacitance<br>(Rated dc Voltage, TJ= 25°C, f = 1 MHz)|Cd|54.7||pF| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. **www.onsemi.com** **2** **NTSA4100, NRVTSA4100** ## **TYPICAL CHARACTERISTICS** **==> picture [491 x 591] intentionally omitted <==** **----- Start of picture text -----**<br> 100 100<br>TA = 150 ° C<br>TA = 150 ° C<br>10 TA = 125 ° C 10 TA = 125 ° C<br>T A = 85 ° C T A = 85 ° C<br>1 1<br>TA = 25 ° C TA = 25 ° C<br>0.1 TA = −55 ° C 0.1 TA = −55 ° C<br>0 0.2 0.4 0.6 0.8 1.0 0 0.2 0.4 0.6 0.8 1.0 1.2<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Instantaneous Forward Figure 2. Maximum Instantaneous Forward<br>Characteristics Characteristics<br>1.E−01 1.E−01<br>1.E−02 TA = 150 ° C 1.E−02 T A = 150 ° C<br>1.E−03 TA = 125 ° C 1.E−03 T A = 125 ° C<br>1.E−04 TA = 85 ° C<br>TA = 85 ° C<br>1.E−04<br>1.E−05<br>1.E−06 TA = 25 ° C 1.E−05 TA = 25 ° C<br>1.E−07 1.E−06<br>10 20 30 40 50 60 70 80 90 100 10 20 30 40 50 60 70 80 90 100<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics<br>1000 8<br>TJ = 25 ° C<br>7<br>DC<br>6<br>5 Square Wave<br>100 4<br>3<br>2<br>1 R � JL = 16.2 ° C/W<br>10 0<br>0.1 1 10 100 0 20 40 60 80 100 120 140<br>VR, REVERSE VOLTAGE (V) TC, LEAD TEMPERATURE ( ° C)<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>iF iF<br>, INSTANTANEOUS REVERSE CURRENT (A) , INSTANTANEOUS REVERSE CURRENT (A)<br>IR IR<br>C, JUNCTION CAPACITANCE (pF) , AVERAGE FORWARD CURRENT (A)<br>IF(AV)<br>**----- End of picture text -----**<br> **Figure 5. Typical Junction Capacitance** **Figure 6. Current Derating** **www.onsemi.com** **3** **NTSA4100, NRVTSA4100** ## **TYPICAL CHARACTERISTICS** **==> picture [240 x 175] intentionally omitted <==** **----- Start of picture text -----**<br> 8<br>IPK/IAV IPK/IAV = 10<br>7 = 20<br>6 I PK /I AV = 5<br>5<br>4 Square Wave<br>3<br>DC<br>2<br>1<br>0<br>0 1 2 3 4 5<br>IF(AV), AVERAGE FORWARD CURRENT (A)<br>, AVERAGE FORWARD<br>F(AV) POWER DISSIPATION (W)<br>P<br>**----- End of picture text -----**<br> **Figure 7. Forward Power Dissipation** **==> picture [491 x 176] intentionally omitted <==** **----- Start of picture text -----**<br> 1000<br>100 50% Duty Cycle<br>20%<br>10%<br>10 5%<br>2%<br>1 1%<br>0.1<br>Single Pulse<br>0.01<br>0.001<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, PULSE TIME (S)<br>C/W)<br>°<br>RESISTANCE (<br>, TYPICAL TRANSIENT THERMAL<br>(t)<br>R<br>**----- End of picture text -----**<br> **Figure 8. Typical Transient Thermal Response, Junction−to−Ambient** **www.onsemi.com** **4** **NTSA4100, NRVTSA4100** ## **PACKAGE DIMENSIONS** **SMA** CASE 403D−02 ISSUE G **HE** NOTES: 1. **E** 1982. 2. 3. ~~=~~ **DIM MIN NOM b D A** 1.97 2.10 **A1** 0.05 0.10 **b** 1.27 1.45 **c** 0.15 0.28 **D** 2.29 2.60 ~~j~~ a **POLARITY INDICATOR** ~~:~~ **OPTIONAL AS NEEDED** ~~bay~~ **E** 4.06 4.32 **(SEE STYLES) H E** 4.83 5.21 **L** 0.76 1.14 **A A1** ~~=,~~ **L c** ~~=n~~ **SOLDERING FOOTPRINT*** 4.000 0.157 2.000 0.079 ~~ot oe~~ 2.000 ~~a~~ 0.079 SCALE 8:1 mm ~~(—)~~ inches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. - NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. **==> picture [195 x 83] intentionally omitted <==** **----- Start of picture text -----**<br> 3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 1.97 2.10 2.20 0.078 0.083 0.087<br>A1 0.05 0.10 0.20 0.002 0.004 0.008<br>b 1.27 1.45 1.63 0.050 0.057 0.064<br>c 0.15 0.28 0.41 0.006 0.011 0.016<br>D 2.29 2.60 2.92 0.090 0.103 0.115<br>S=SSSa E 4.06 4.32 4.57 0.160 0.170 = 0.180<br>H E 4.83 5.21 5.59 0.190 0.205 0.220<br>L 0.76 1.14 1.52 0.030 0.045 0.060<br>**----- End of picture text -----**<br> **==> picture [127 x 131] intentionally omitted <==** **----- Start of picture text -----**<br> 4.000<br>0.157<br>2.000<br>0.079<br>ot<br>oe<br>2.000<br>a<br>0.079<br>SCALE 8:1 mm<br>(—) inches<br>**----- End of picture text -----**<br> ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **PUBLICATION ORDERING INFORMATION** ## **LITERATURE FULFILLMENT** : Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com **N. American Technical Support** : 800−282−9855 Toll Free USA/Canada **ON Semiconductor Website** : **www.onsemi.com** **Europe, Middle East and Africa Technical Support: Order Literature** : http://www.onsemi.com/orderlit Phone: 421 33 790 2910 **Japan Customer Focus Center** For additional information, please contact your local Phone: 81−3−5817−1050 Sales Representative **www.onsemi.com** **NTSA4100/D** **5**
Updated at June 4, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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