NRVTS5100ETFSTAG
Schottky Rectifier, 100 V, 5 A, Single Triple Anode Quad Cathode, WDFN, 8 Pins, 1 V
- Manufacturer: ONSEMI
- Product type: Schottky Rectifier Diodes
- SVHC: No SVHC (15-Jan-2018)
- No. of Pins: 8Pins
- Product Range: -
- Qualification: AEC-Q101
- Diode Mounting: Surface Mount
- Diode Case Style: WDFN
- Diode Configuration: Single Triple Anode Quad Cathode
- Forward Voltage Max: 1V
- Forward Surge Current: 80A
- Average Forward Current: 5A
- Operating Temperature Max: 175°C
- Repetitive Peak Reverse Voltage: 100V
| Delivery and price | |
|---|---|
| Units per pack | 1500 |
| Price | 0.191 € |
| Current stock | 10+ |
| Lead time | 30 days |
## NRVTS5100ETFS ## Trench Surface Mount Schottky Rectifier This " 8FL flat lead Trench Schottky rectifier provides fast switching performance with soft recovery in a compact thermally efficient package. Its compact footprint makes it ideally suited to portable and automotive applications where board space is at a premium. Its low profile makes it a good option for flat panel display and other applications with limited vertical clearance. The device offers low leakage over temperature making it a good match for applications requiring low quiescent current. **www.onsemi.com** **TRENCH SCHOTTKY RECTIFIER 5.0 AMPERE 100 VOLTS** ## **Features** - Fast Soft Switching for Reduced EMI and Higher Efficiency **==> picture [470 x 259] intentionally omitted <==** **----- Start of picture text -----**<br> • Low Profile − Maximum Height of 1.1 mm<br>• Small Footprint − Footprint Area of 13.5 mm [2] 1<br>• NRV Prefix for Automotive and Other Applications Requiring<br>WDFN8<br>Unique Site and Control Change Requirements; AEC−Q101Qualified and PPAP Capable \) oses CASE 511AB( 8FL)<br>• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS FLAT LEAD<br>Compliant<br>A WS<br>Mechanical Characteristics: © se MARKING DIAGRAM Fand<br>• Case: Molded Epoxy 1<br>• Epoxy Meets UL 94 V−0 @ 0.125 in A C<br>Oa > A 3 T510 | C<br>• Weight: 95 mg (Approximately) A AYWW C<br>• Lead and Mounting Surface Temperature for Soldering Purposes: NC C<br>260°C Maximum for 10 Seconds°C Maximum for 10 SecondsC Maximum for 10 Seconds Geese 7 .<br>• MSL 1 T510 = Specific Device Code<br>\ « Ne S A = Assembly Location — _<br>Applications Y = Year<br>• Switching Power Supplies including Mini−adapters and Displays v Ksoe Sasoe Sas Sas WW = Work Week<br>• Instrumentation = Pb−Free Package<br>eS Q Wh (Note: Microdot may be in either location) .<br>**----- End of picture text -----**<br> - Epoxy Meets UL 94 V−0 @ 0.125 in Oa - • Weight: 95 mg (Approximately) • Lead and Mounting Surface Temperature for Soldering Purposes: Geese - 260°C Maximum for 10 Seconds°C Maximum for 10 SecondsC Maximum for 10 Seconds - • MSL 1 \ « Ne S - **Applications** • Switching Power Supplies including Mini−adapters and Displays v Ksoe Sasoe Sas Sas • Instrumentation • Engine Control Recirculation Diodes eS Q Wh • Freewheeling Diode Where Space is at a Premium os x[\] ## **ORDERING INFORMATION** |**Device**|**Package**|**Shipping**†| |---|---|---| |NRVTS5100ETFSTAG|WDFN8<br>(Pb−Free)|1500 / Tape<br>& Reel| |NRVTS5100ETFSWFTAG||| |NRVTS5100ETFSTWG|WDFN8<br>(Pb−Free)|5000 / Tape<br>& Reel| |NRVTS5100ETFSWFTWG||| - †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Publication Order Number: **NRVTS5100ETFS/D** **1** © Semiconductor Components Industries, LLC, 2018 **May, 2024 − Rev. 1** **NRVTS5100ETFS** ## **MAXIMUM RATINGS** |**MAXIMUM RATINGS**|||| |---|---|---|---| |**Rating**|**Symbol**|**Value**|**Unit**| |Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|100|V| |Average Rectified Forward Current<br>(TL= TBD°C)|IO|5.0|A| |Peak Repetitive Forward Current<br>(Rated VR, Square Wave, 20 kHz) TL= 161°C|IFRM|5.6|A| |Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|80|A| |Storage Temperature Range|Tstg|−65 to +175|°C| |Operating Junction Temperature|TJ|−65 to +175|°C| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. ## **THERMAL CHARACTERISTICS** ||**THERMAL CHARACTERISTICS**|||| |---|---|---|---|---| ||**Characteristic**|**Symbol**|**Value**|**Unit**| ||Thermal Resistance, Junction−to−Tab (Note 1)|�JCT|3.3|°C/W| ||Thermal Resistance, Junction−to−Ambient (Note 1)|R�JA|50.2|°C/W| |1. 1 inch square pad size (1×0.5 inch) for each lead on FR4 board.||||| |**THERMAL CHARACTERISTICS**|||||| |---|---|---|---|---|---| |**Characteristic**|**Symbol**||**Value**||**Unit**| |Thermal Resistance, Junction−to−Tab (Note 1)|�JCT||3.3||°C/W| |Thermal Resistance, Junction−to−Ambient (Note 1)|R�JA||50.2||°C/W| |1. 1 inch square pad size (1×0.5 inch) for each lead on FR4 board.|||||| |**ELECTRICAL CHARACTERISTICS**|||||| |**Characteristic**|**Symbol**|**Typ**||**Max**|**Unit**| |Instantaneous Forward Voltage (Note 1)<br>(iF= 5 Amps, TJ= 25°C)<br>(iF= 5 Amps, TJ= 125°C)|vF|0.95<br>0.70||1.00<br>0.80|V| |Reverse Current (Note 1)<br>(Rated dc Voltage, TJ= 25°C)<br>(Rated dc Voltage, TJ= 125°C)|iR|1.50<br>1.29||50<br>7.5|�A<br>mA| |Diode Capacitance<br>(Rated dc Voltage, TJ= 25°C, f = 1 MHz)|Cd|26.5|||pF| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 1. Pulse Test: Pulse Width = 300 � s, Duty Cycle ≤ 2.0%. **==> picture [34 x 31] intentionally omitted <==** **www.onsemi.com** **2** **NRVTS5100ETFS** ## **TYPICAL CHARACTERISTICS** **==> picture [491 x 591] intentionally omitted <==** **----- Start of picture text -----**<br> 100 100<br>TA = 175 ° C T A = 175 ° C<br>10 TA = 150 ° C 10 TA = 150 ° C<br>TA = 125 ° C TA = 125 ° C<br>1 1<br>T T A A = 85 = 25 ° ° C C TTAA = = 2585 °° CC<br>0.1 TA = −55 ° C 0.1 TA = −55 ° C<br>0.1 0.3 0.5 0.7 0.9 1.1 1.3 0.1 0.3 0.5 0.7 0.9 1.1 1.3<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Instantaneous Forward Figure 2. Maximum Instantaneous Forward<br>Characteristics Characteristics<br>1.E−01 1.E−01<br>1.E−02 TA = 175 ° C 1.E−02 T A = 175 ° C<br>1.E−03 TA = 150 ° C 1.E−03 TA = 150 ° C<br>TA = 125 ° C TA = 125 ° C<br>1.E−04 1.E−04<br>1.E−05 TA = 85 ° C 1.E−05 TA = 85 ° C<br>1.E−06 TA = 25 ° C 1.E−06 TA = 25 ° C<br>1.E−07 1.E−07<br>1.E−08 T A = −55 ° C 1.E−08 TA = −55 ° C<br>1.E−09 1.E−09<br>1.E−10 1.E−10<br>10 20 30 40 50 60 70 80 90 100 10 20 30 40 50 60 70 80 90 100<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics<br>1000 10<br>TJ = 25 ° C R � JC = 3.3 ° C/W<br>DC<br>8<br>100<br>6 Square Wave<br>4<br>10<br>2<br>1 0<br>0.1 1 10 100 0 25 50 75 100 125 150 175<br>VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE ( ° C)<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>iF iF<br>, INSTANTANEOUS REVERSE CURRENT (A) , INSTANTANEOUS REVERSE CURRENT (A)<br>IR IR<br>C, JUNCTION CAPACITANCE (pF) , AVERAGE FORWARD CURRENT (A)<br>IF(AV)<br>**----- End of picture text -----**<br> **Figure 5. Typical Junction Capacitance** **Figure 6. Current Derating per Diode** **www.onsemi.com** **3** **NRVTS5100ETFS** ## **TYPICAL CHARACTERISTICS** **==> picture [491 x 427] intentionally omitted <==** **----- Start of picture text -----**<br> 7<br>IPK/IAV = 10 IPK/IAV = 5<br>6<br>5 IPK/IAV = 20<br>DC<br>4<br>3<br>Square Wave<br>2<br>1<br>0<br>0 1 2 3 4 5 6 7<br>IF(AV), AVERAGE FORWARD CURRENT (A)<br>Figure 7. Forward Power Dissipation<br>100<br>50% Duty Cycle<br>20%<br>10<br>10%<br>5%<br>2%<br>1 1%<br>0.1<br>Single Pulse<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>PULSE TIME (sec)<br>Figure 8. Thermal Characteristics<br>, AVERAGE FORWARD<br>F(AV) POWER DISSIPATION (W)<br>P<br>C/W)<br>°<br> (<br>JA<br>�<br>R<br>**----- End of picture text -----**<br> **www.onsemi.com** **4** MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** ## **WDFN8 3.3x3.3, 0.65P** CASE 511AB ISSUE D **==> picture [31 x 25] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>**----- End of picture text -----**<br> ## DATE 23 APR 2012 **==> picture [42 x 7] intentionally omitted <==** **----- Start of picture text -----**<br> SCALE 2:1<br>**----- End of picture text -----**<br> **==> picture [292 x 306] intentionally omitted <==** **----- Start of picture text -----**<br> 2X<br>0.20 C<br>D A<br>D1 B 2X<br>8 7 6 5 0.20 C<br>4X<br>E1 E �<br>1 2 3 4 c A1<br>TOP VIEW<br>0.10 C<br>A 6X C<br>0.10 C e SEATING<br>PLANE<br>SIDE VIEW DETAIL A DETAIL A<br>8X b<br>0.10 C A B<br>0.05 C<br>4X L e/2<br>1 4<br>K<br>E2<br>E3 M<br>8 5<br>L1<br>G D2<br>BOTTOM VIEW<br>**----- End of picture text -----**<br> |NOT<br>1. <br>2. <br>3.|ES:<br> DIMEN<br> CONT<br> DIMEN<br>PROT|1.40<br>1.50<br>0<br>−−−<br>�<br>1.60<br>12�<br>SIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>ROLLING DIMENSION: MILLIMETERS.<br>SION D1 AND E1 DO NOT INCLUDE MOLD FLASH<br>RUSIONS OR GATE BURRS.<br>**MIN**<br>**NOM**<br>**MILLIMETERS**<br>0.70<br>0.75<br>0.00<br>−−−<br>0.23<br>0.30<br>0.15<br>0.20<br>2.95<br>3.05<br>1.98<br>2.11<br>2.95<br>3.05<br>1.47<br>1.60<br>0.65 BSC<br>0.30<br>0.41<br>0.65<br>0.80<br>0.30<br>0.43<br>0.06<br>0.13<br>**MAX**<br>0.80<br>0.05<br>0.40<br>0.25<br>3.15<br>2.24<br>3.15<br>1.73<br>0.51<br>0.95<br>0.56<br>0.20<br>0.055<br>0.059<br>0<br>−−−<br>�<br>0.063<br>12�<br>0.028<br>0.030<br>0.000<br>−−−<br>0.009<br>0.012<br>0.006<br>0.008<br>0.116<br>0.120<br>0.078<br>0.083<br>0.116<br>0.120<br>0.058<br>0.063<br>0.026 BSC<br>0.012<br>0.016<br>0.026<br>0.032<br>0.012<br>0.017<br>0.002<br>0.005<br>0.031<br>0.002<br>0.016<br>0.010<br>0.124<br>0.088<br>0.124<br>0.068<br>0.020<br>0.037<br>0.022<br>0.008<br>**MIN**<br>**NOM**<br>**INCHES**<br>**MAX**<br>3.30 BSC<br>3.30 BSC<br>0.130 BSC<br>0.130 BSC<br>0.23<br>0.30<br>0.40<br>0.009<br>0.012<br>0.016|1.40<br>1.50<br>0<br>−−−<br>�<br>1.60<br>12�<br>SIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>ROLLING DIMENSION: MILLIMETERS.<br>SION D1 AND E1 DO NOT INCLUDE MOLD FLASH<br>RUSIONS OR GATE BURRS.<br>**MIN**<br>**NOM**<br>**MILLIMETERS**<br>0.70<br>0.75<br>0.00<br>−−−<br>0.23<br>0.30<br>0.15<br>0.20<br>2.95<br>3.05<br>1.98<br>2.11<br>2.95<br>3.05<br>1.47<br>1.60<br>0.65 BSC<br>0.30<br>0.41<br>0.65<br>0.80<br>0.30<br>0.43<br>0.06<br>0.13<br>**MAX**<br>0.80<br>0.05<br>0.40<br>0.25<br>3.15<br>2.24<br>3.15<br>1.73<br>0.51<br>0.95<br>0.56<br>0.20<br>0.055<br>0.059<br>0<br>−−−<br>�<br>0.063<br>12�<br>0.028<br>0.030<br>0.000<br>−−−<br>0.009<br>0.012<br>0.006<br>0.008<br>0.116<br>0.120<br>0.078<br>0.083<br>0.116<br>0.120<br>0.058<br>0.063<br>0.026 BSC<br>0.012<br>0.016<br>0.026<br>0.032<br>0.012<br>0.017<br>0.002<br>0.005<br>0.031<br>0.002<br>0.016<br>0.010<br>0.124<br>0.088<br>0.124<br>0.068<br>0.020<br>0.037<br>0.022<br>0.008<br>**MIN**<br>**NOM**<br>**INCHES**<br>**MAX**<br>3.30 BSC<br>3.30 BSC<br>0.130 BSC<br>0.130 BSC<br>0.23<br>0.30<br>0.40<br>0.009<br>0.012<br>0.016|1.40<br>1.50<br>0<br>−−−<br>�<br>1.60<br>12�<br>SIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>ROLLING DIMENSION: MILLIMETERS.<br>SION D1 AND E1 DO NOT INCLUDE MOLD FLASH<br>RUSIONS OR GATE BURRS.<br>**MIN**<br>**NOM**<br>**MILLIMETERS**<br>0.70<br>0.75<br>0.00<br>−−−<br>0.23<br>0.30<br>0.15<br>0.20<br>2.95<br>3.05<br>1.98<br>2.11<br>2.95<br>3.05<br>1.47<br>1.60<br>0.65 BSC<br>0.30<br>0.41<br>0.65<br>0.80<br>0.30<br>0.43<br>0.06<br>0.13<br>**MAX**<br>0.80<br>0.05<br>0.40<br>0.25<br>3.15<br>2.24<br>3.15<br>1.73<br>0.51<br>0.95<br>0.56<br>0.20<br>0.055<br>0.059<br>0<br>−−−<br>�<br>0.063<br>12�<br>0.028<br>0.030<br>0.000<br>−−−<br>0.009<br>0.012<br>0.006<br>0.008<br>0.116<br>0.120<br>0.078<br>0.083<br>0.116<br>0.120<br>0.058<br>0.063<br>0.026 BSC<br>0.012<br>0.016<br>0.026<br>0.032<br>0.012<br>0.017<br>0.002<br>0.005<br>0.031<br>0.002<br>0.016<br>0.010<br>0.124<br>0.088<br>0.124<br>0.068<br>0.020<br>0.037<br>0.022<br>0.008<br>**MIN**<br>**NOM**<br>**INCHES**<br>**MAX**<br>3.30 BSC<br>3.30 BSC<br>0.130 BSC<br>0.130 BSC<br>0.23<br>0.30<br>0.40<br>0.009<br>0.012<br>0.016|1.40<br>1.50<br>0<br>−−−<br>�<br>1.60<br>12�<br>SIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>ROLLING DIMENSION: MILLIMETERS.<br>SION D1 AND E1 DO NOT INCLUDE MOLD FLASH<br>RUSIONS OR GATE BURRS.<br>**MIN**<br>**NOM**<br>**MILLIMETERS**<br>0.70<br>0.75<br>0.00<br>−−−<br>0.23<br>0.30<br>0.15<br>0.20<br>2.95<br>3.05<br>1.98<br>2.11<br>2.95<br>3.05<br>1.47<br>1.60<br>0.65 BSC<br>0.30<br>0.41<br>0.65<br>0.80<br>0.30<br>0.43<br>0.06<br>0.13<br>**MAX**<br>0.80<br>0.05<br>0.40<br>0.25<br>3.15<br>2.24<br>3.15<br>1.73<br>0.51<br>0.95<br>0.56<br>0.20<br>0.055<br>0.059<br>0<br>−−−<br>�<br>0.063<br>12�<br>0.028<br>0.030<br>0.000<br>−−−<br>0.009<br>0.012<br>0.006<br>0.008<br>0.116<br>0.120<br>0.078<br>0.083<br>0.116<br>0.120<br>0.058<br>0.063<br>0.026 BSC<br>0.012<br>0.016<br>0.026<br>0.032<br>0.012<br>0.017<br>0.002<br>0.005<br>0.031<br>0.002<br>0.016<br>0.010<br>0.124<br>0.088<br>0.124<br>0.068<br>0.020<br>0.037<br>0.022<br>0.008<br>**MIN**<br>**NOM**<br>**INCHES**<br>**MAX**<br>3.30 BSC<br>3.30 BSC<br>0.130 BSC<br>0.130 BSC<br>0.23<br>0.30<br>0.40<br>0.009<br>0.012<br>0.016|1.40<br>1.50<br>0<br>−−−<br>�<br>1.60<br>12�<br>SIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>ROLLING DIMENSION: MILLIMETERS.<br>SION D1 AND E1 DO NOT INCLUDE MOLD FLASH<br>RUSIONS OR GATE BURRS.<br>**MIN**<br>**NOM**<br>**MILLIMETERS**<br>0.70<br>0.75<br>0.00<br>−−−<br>0.23<br>0.30<br>0.15<br>0.20<br>2.95<br>3.05<br>1.98<br>2.11<br>2.95<br>3.05<br>1.47<br>1.60<br>0.65 BSC<br>0.30<br>0.41<br>0.65<br>0.80<br>0.30<br>0.43<br>0.06<br>0.13<br>**MAX**<br>0.80<br>0.05<br>0.40<br>0.25<br>3.15<br>2.24<br>3.15<br>1.73<br>0.51<br>0.95<br>0.56<br>0.20<br>0.055<br>0.059<br>0<br>−−−<br>�<br>0.063<br>12�<br>0.028<br>0.030<br>0.000<br>−−−<br>0.009<br>0.012<br>0.006<br>0.008<br>0.116<br>0.120<br>0.078<br>0.083<br>0.116<br>0.120<br>0.058<br>0.063<br>0.026 BSC<br>0.012<br>0.016<br>0.026<br>0.032<br>0.012<br>0.017<br>0.002<br>0.005<br>0.031<br>0.002<br>0.016<br>0.010<br>0.124<br>0.088<br>0.124<br>0.068<br>0.020<br>0.037<br>0.022<br>0.008<br>**MIN**<br>**NOM**<br>**INCHES**<br>**MAX**<br>3.30 BSC<br>3.30 BSC<br>0.130 BSC<br>0.130 BSC<br>0.23<br>0.30<br>0.40<br>0.009<br>0.012<br>0.016|1.40<br>1.50<br>0<br>−−−<br>�<br>1.60<br>12�<br>SIONING AND TOLERANCING PER ASME Y14.5M, 1994.<br>ROLLING DIMENSION: MILLIMETERS.<br>SION D1 AND E1 DO NOT INCLUDE MOLD FLASH<br>RUSIONS OR GATE BURRS.<br>**MIN**<br>**NOM**<br>**MILLIMETERS**<br>0.70<br>0.75<br>0.00<br>−−−<br>0.23<br>0.30<br>0.15<br>0.20<br>2.95<br>3.05<br>1.98<br>2.11<br>2.95<br>3.05<br>1.47<br>1.60<br>0.65 BSC<br>0.30<br>0.41<br>0.65<br>0.80<br>0.30<br>0.43<br>0.06<br>0.13<br>**MAX**<br>0.80<br>0.05<br>0.40<br>0.25<br>3.15<br>2.24<br>3.15<br>1.73<br>0.51<br>0.95<br>0.56<br>0.20<br>0.055<br>0.059<br>0<br>−−−<br>�<br>0.063<br>12�<br>0.028<br>0.030<br>0.000<br>−−−<br>0.009<br>0.012<br>0.006<br>0.008<br>0.116<br>0.120<br>0.078<br>0.083<br>0.116<br>0.120<br>0.058<br>0.063<br>0.026 BSC<br>0.012<br>0.016<br>0.026<br>0.032<br>0.012<br>0.017<br>0.002<br>0.005<br>0.031<br>0.002<br>0.016<br>0.010<br>0.124<br>0.088<br>0.124<br>0.068<br>0.020<br>0.037<br>0.022<br>0.008<br>**MIN**<br>**NOM**<br>**INCHES**<br>**MAX**<br>3.30 BSC<br>3.30 BSC<br>0.130 BSC<br>0.130 BSC<br>0.23<br>0.30<br>0.40<br>0.009<br>0.012<br>0.016| |---|---|---|---|---|---|---|---| ||**DIM**|**MILLIMETERS**|||**INCHES**||| |||**MIN**|**NOM**|**MAX**|**MIN**|**NOM**|**MAX**| ||**A**|0.70|0.75|0.80|0.028|0.030|0.031| ||**A1**<br>**b**|0.00<br>023|−−−<br>030|0.05<br>040|0.000<br>0009|−−−<br>0012|0.002<br>0016| ||**c**|.<br>0.15|.<br>0.20|.<br>0.25|.<br>0.006|.<br>0.008|.<br>0.010| ||**D**<br>|3.30 BSC|||0.130 BSC||| ||**D1**<br>**D2**|2.95<br>1.98|3.05<br>2.11|3.15<br>2.24|0.116<br>0.078|0.120<br>0.083|0.124<br>0.088| ||**E**|3.30 BSC|||0.130 BSC||| ||**E1**|295|305|315|0116|0120|0124| ||**E2**|.<br>1.47|.<br>1.60|.<br>1.73|.<br>0.058|.<br>0.063|.<br>0.068| ||**E3**|0.23|0.30|0.40|0.009|0.012|0.016| ||**e**<br><br>|0.65 BSC<br><br><br><br><br><br>|||0.026 BSC<br><br><br><br><br><br>||| ||**G**<br>**K**|0.30<br>0.65|0.41<br>0.80|0.51<br>0.95|0.012<br>0.026|0.016<br>0.032|0.020<br>0.037| ||**L**|0.30|0.43|0.56|0.012|0.017|0.022| ||**L1**|006|013|020|0002|0005|0008| ||**M**<br>|1.40<br>.|1.50<br>.|1.60<br>.|0.055<br>.|0.059<br>.|0.063<br>.| ||**�**|0<br>�|−−−|12�|0<br>�|−−−|12�| ## **SOLDERING FOOTPRINT*** **==> picture [179 x 145] intentionally omitted <==** **----- Start of picture text -----**<br> 8X<br>0.42 0.65 4X<br>PITCH 0.66<br>PACKAGE<br>OUTLINE<br>3.60<br>2.30<br>0.75 0.57<br>0.47 2.37<br>3.46<br>DIMENSION: MILLIMETERS<br>**----- End of picture text -----**<br> ## **GENERIC** ## **MARKING DIAGRAM*** **==> picture [44 x 39] intentionally omitted <==** **----- Start of picture text -----**<br> 1<br>XXXXX<br>AYWW �<br>�<br>**----- End of picture text -----**<br> *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. XXXXX = Specific Device Code A = Assembly Location Y = Year WW = Work Week � = Pb−Free Package - *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. **==> picture [492 x 37] intentionally omitted <==** **----- Start of picture text -----**<br> Electronic versions are uncontrolled except when accessed directly from the Document Repository.<br>DOCUMENT NUMBER: 98AON30561E Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.<br>DESCRIPTION: WDFN8 3.3X3.3, 0.65P PAGE 1 OF 1<br>**----- End of picture text -----**<br> **onsemi** and are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. www.onsemi.com Semiconductor Components Industries, LLC, 2019 **onsemi** , , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “ **onsemi** ” or its affiliates and/or subsidiaries in the United States and/or other countries. **onsemi** owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of **onsemi** ’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. **onsemi** reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and **onsemi** makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using **onsemi** products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by **onsemi** . “Typical” parameters which may be provided in **onsemi** data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. **onsemi** does not convey any license under any of its intellectual property rights nor the rights of others. **onsemi** products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use **onsemi** products for any such unintended or unauthorized application, Buyer shall indemnify and hold **onsemi** and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that **onsemi** was negligent regarding the design or manufacture of the part. **onsemi** is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **ADDITIONAL INFORMATION** **TECHNICAL PUBLICATIONS** : **ONLINE SUPPORT** : www.onsemi.com/support **Technical Library:** www.onsemi.com/design/resources/technical−documentation **For additional information, please contact your local Sales Representative at onsemi Website:** www.onsemi.com www.onsemi.com/support/sales **==> picture [232 x 43] intentionally omitted <==**
Updated at June 4, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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