NRVBS360BNT3G

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## Surface Mount Schottky Power Rectifier 

## MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BNT3 

## **SCHOTTKY BARRIER RECTIFIERS 3.0 AMPERES, 60 VOLTS** 

**==> picture [130 x 17] intentionally omitted <==**

**----- Start of picture text -----**<br>
SMC  2-LEAD SMB<br>CASE 403AC CASE 403A-03<br>**----- End of picture text -----**<br>


## **MARKING DIAGRAMS** 

This device employs the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. 

## **Features** 

- Small Compact Surface Mountable Package with J-Bend Leads 

- Rectangular Package for Automated Handling 

- Highly Stable Oxide Passivated Junction 

- Excellent Ability to Withstand Reverse Avalanche Energy Transients 

- Guard-Ring for Stress Protection 

- NRVBS Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable* 

- These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Mechanical Characteristics** 

- Case: Epoxy, Molded, Epoxy Meets UL 94 V-0 

- Weight: 217 mg (Approximately), SMC 

95 mg (Approximately), SMB 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260 °C Max. for 10 Seconds 

- Polarity: Polarity Band on Plastic Body Indicates Cathode Lead 

AYWW AYWW B36 B36 B36 = Specific Device Code A = Assembly Location** Y = Year WW = Work Week = Pb-Free Package (Note: Microdot may be in either location) 

- **The Assembly Location code (A) is front side optional. In cases where the Assembly Location is stamped in the package, the front side assembly code may be blank. 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MBRS360T3G|SMC<br>(Pb-Free)|2,500 /<br>Tape & Reel|
|MBRS360BT3G|SMB<br>(Pb-Free)|2,500 /<br>Tape & Reel|
|NRVBS360T3G*|SMC<br>(Pb-Free)|2,500 /<br>Tape & Reel|
|NRVBS360BNT3G*|SMB<br>(Pb-Free)|2,500 /<br>Tape & Reel|



      - For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

- Device Meets MSL 1 Requirements 

- ESD Ratings: 

   - ♦ Machine Model, C 

   - ♦ Human Body Model, 3B 

Publication Order Number: **MBRS360T3/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **September, 2025 − Rev. 17** 

## **MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BNT3** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|60|V|
|Average Rectified Forward Current|IF(AV)|3.0 @ TL= 137°C<br>4.0 @ TL= 127°C|A|
|Nonrepetitive Peak Surge Current<br>(Surge applied at rated load conditions halfwave, single phase, 60 Hz)|IFSM|125|A|
|Storage Temperature Range|Tstg|−65 to +175|°C|
|Operating Junction Temperature (Note 1)|TJ|−65 to +175|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dPD/dTJ < 1/R JA.. 

JA.. **THERMAL CHARACTERISTICS Characteristic Symbol Value Unit** Thermal Resistance, Junction-to-Lead (Note 2) R JL ° C/W SMC Package 11 SMB Package 15 ~~Bs~~ Thermal Resistance, Junction-to-Ambient (Note 2) R JA ° C/W SMC Package 136 SMB Package 145 Thermal Resistance, Junction-to-Ambient (Note 3) R JA ° C/W SMC Package 71 SMB Package (Note 4) 73 **ELECTRICAL CHARACTERISTICS** Maximum Instantaneous Forward Voltage (Note 5) VF V (iF = 3.0 A, TJ = 25 ° C) 0.63 Maximum Instantaneous Reverse Current (Note 5) iR mA (Rated dc Voltage, TJ = 25 ° C) 0.1 (Rated dc Voltage, TJ = 100 ° C) 12 ~~I~~ Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 2. Mounted with minimum recommended pad size, PC Board FR4. 

3. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 

4. Typical Value; 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board. 

5. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%. 

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## **TYPICAL ELECTRICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
10 10<br>TJ = 150  ° C<br>SS SS S SS TJ = 175  S ° C S<br>TJ = 175  ° C<br>1 V A 1 Ld OE e t<br>TJ = 100  ° C TJ = 150  ° C<br>F f " Gf<br>eS TJ = 25  ° C FO TJ = 25  ° C<br>Af aFFee A 4d [| -—1—L_| | 7AAF f/|fTfi f EE<br>0.1 0.1 TJ = 100  ° C<br>A e e ee 4 eeeee<br>ooffoy Afofee p TJ = −40  ee ° C e PRs ffff fo TJ = −40  ° C<br>0.01 ASE | | | 0.01 | [Y/i/|] f HE | | |<br>0.0 0.2 0.4 0.6 0.8 0.0 0.2 0.4 0.6 0.8<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>1.0E+00<br>1.0E−01 TJ = 175  ° C<br>—<br>1.0E−02 =————— TJ = 150  ° C<br>——ES<br>1.0E−03 TJ = 100  ° C<br>ee<br>1.0E−04<br>SS [—————_—]<br>1.0E−05 SSS TJ = 25  ° C<br>= =<br>1.0E−06<br>=_=__- ====<br>1.0E−07 p o<br>0 10 20 30 40 50 60<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Current<br>1.0E+00<br>TJ = 175  ° C<br>===<br>1.0E−01 eeee—<br>TJ = 150  ° C<br>1.0E−02<br>=————  a S<br>1.0E−03 =——— TJ = 100  ° C<br>1.0E−04 =——————<br>TJ = 25  ° C<br>1.0E−05<br>1.0E−06 —=—————————<br>1.0E−07<br>————<br>0 10 20 30 40 50 60<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>IF IF<br>CURRENT (A)<br>, INSTANTANEOUS REVERSE<br>IR<br>CURRENT (A)<br>, INSTANTANEOUS REVERSE<br>IR<br>**----- End of picture text -----**<br>


**Figure 4. Maximum Reverse Current** 

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**==> picture [486 x 186] intentionally omitted <==**

**----- Start of picture text -----**<br>
5 4<br>eee dc ee eSe Nene 3.5 naa TJ = 175  ° C SQUARE<br>WAVE<br>4<br>PEEP TPN 3 Ppp de ph Uw<br>SQUARE WAVE<br>dc<br>SERRE eeee SSea eee a<br>3 2.5<br>a LS<br>2<br>2 EECCA Ce<br>1.5<br>PTT TTT TA 1 I BO<br>1<br>SSGSGeceeeeeeel 4a<br>0.5<br>R JL = 15  ° C/W<br>0 SURRRSERRRRRRREERY 0 A)<br>POPPE) eo | tT | | |<br>0 20 40 60 80 100 120 140 160 180 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5<br>TL, LEAD TEMPERATURE ( ° C) IO, AVERAGE FORWARD CURRENT (A)<br>Figure 5. Current Derating Figure 6. Forward Power Dissipation<br>, AVERAGE FORWARD CURRENT (A) , AVERAGE POWER DISSIPATION (W)<br>FO<br>IF(AV) P<br>**----- End of picture text -----**<br>


**==> picture [240 x 170] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>TJ = 25  ° C<br>—S S<br>a a<br>(a a<br>100<br>NEE<br>—_———<br>a ee<br>10 ptt<br>0 10 20 | 30 40 tt 50 60 70<br>VR, REVERSE VOLTAGE (V)<br>C, CAPACITANCE (pF)<br>**----- End of picture text -----**<br>


**Figure 7. Typical Capacitance** 

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**==> picture [489 x 389] intentionally omitted <==**

**----- Start of picture text -----**<br>
100 SS eeee<br>SEE<br>D = 0.5<br>r t<br>10 Poe 0.2 — -— — se eno || |<br>0.1 ee<br>= es [=22] er es OO SS A OO 8 egr ee ee<br>a a os 8 a a<br>0.05 ooa a} eee etee ee P(pk) [|||<br>1 p__|__}_{ee | a reeeSeee lLY<br>SSS ee Test Type > min pad 1 oz :<br>0.01 a ce a t1 R JC = min pad 1 oz C/W CT}<br>FEE CEE rH —— 6 [T]<br>cea < t2 > |<br>SINGLE PULSE DUTY CYCLE, D = t1/t2<br>0.1<br>0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t, TIME (s)<br>Figure 8. Thermal Response, Junction-to-Ambient, SMC Package<br>100<br>50% Duty Cycle ———————PTEE | |meer | eei TT| ree<br>20%<br>10 Ss 10% ee | ||<br>5% a es — se<br>SE = [oes] see ce 0 eB cid Le<br>See tee | TI ee<br>2%<br>re ee Mi<br>1 et rN P(pk) ill<br>SS rr EHH<br>1%<br>BR ae te HH<br>a a TTTatT ccee KS i eePte Test Type > min pad 1 oz LHml<br>0.1 OE | | t1 — R 6 JC = min pad 1 oz C/W |<br>t2<br>a a ee ee ee ry<br>= Single Pulse ee a a a ee ee DUTY CYCLE, D = t1/t2 TTI<br>0.01 Feu EEE EH EE il<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>PULSE TIME (s)<br>r(t), TRANSIENT THERMAL RESPONSE<br>C/W)<br>°<br>R(t) (<br>**----- End of picture text -----**<br>


**Figure 9. Typical Thermal Response, Junction-to-Ambient, SMB Package** 

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## **REVISION HISTORY** 

|**Revision**<br>**Description of Changes**<br>**Date**<br>17<br>Removal of NRVBS360BT3G and NRVBS360BT3G-VF01 device from the data sheet.<br>9/8/2025<br>This document has undergone updates prior to the inclusion of this revision history table. The changes tracked here only reflect updates made<br>~~—~~|
|---|
|on the noted approval dates.|



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MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SMB** CASE 403A−03 ISSUE J 

**SCALE 1:1 SCALE 1:1 Polarity Band Non−Polarity Band** 

DATE 19 JUL 2012 

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**----- Start of picture text -----**<br>
HE<br>E<br>b D<br>POLARITY INDICATOR<br>OPTIONAL AS NEEDED<br>A<br>A1<br>L L1 c<br>**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

**==> picture [234 x 133] intentionally omitted <==**

**----- Start of picture text -----**<br>
2.261<br>0.089<br>2.743<br>0.108<br>2.159<br>0.085<br>SCALE 8:1<br>� inches [mm] �<br>**----- End of picture text -----**<br>


NOTES: 

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 

2. CONTROLLING DIMENSION: INCH. 

3. DIMENSION b SHALL BE MEASURED WITHIN DIMENSION L1. 

|**DIM**|**MILLIMETERS**|**MILLIMETERS**|**MILLIMETERS**|**INCHES**|**INCHES**|**INCHES**|
|---|---|---|---|---|---|---|
||**MIN**|**NOM**|**MAX**|**MIN**|**NOM**|**MAX**|
|**A**|1.95|2.30|2.47|0.077|0.091|0.097|
|**A1**|0.05|0.10|0.20|0.002|0.004|0.008|
|**b**|1.96|2.03|2.20|0.077|0.080|0.087|
|**c**|015|023|031|0006|0009|0012|
|**D**|.<br>3.30|.<br>3.56|.<br>3.95|.<br>0.130|.<br>0.140|.<br>0.156|
|**E**|4.06|4.32|4.60|0.160|0.170|0.181|
|**HE**|5.21|5.44|5.60|0.205|0.214|0.220|
|**L**|0.76|1.02|1.60|0.030|0.040|0.063|
|**L1**|0.51 REF|||0.020 REF|||



## **GENERIC MARKING DIAGRAM*** 

**==> picture [159 x 135] intentionally omitted <==**

**----- Start of picture text -----**<br>
AYWW AYWW<br>XXXXX � XXXXX �<br>� �<br>Polarity Band Non−Polarity Band<br>XXXXX = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>� = Pb−Free Package<br>(Note: Microdot may be in either location)<br>**----- End of picture text -----**<br>


   - *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

- *For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

|**DOCUMENT NUMBER:**|**98ASB42669B**|
|---|---|
|**DESCRIPTION:**|**SMB**|



Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **PAGE 1 OF 1** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2019 

MECHANICAL CASE OUTLINE **PACKAGE DIMENSIONS** 

**SMC 2−LEAD** CASE 403AC ISSUE B 

**SCALE 1:1** 

## DATE 27 JUL 2017 

NOTES: 

**==> picture [251 x 171] intentionally omitted <==**

**----- Start of picture text -----**<br>
HE<br>E<br>D<br>A1 c<br>DETAIL A<br>TOP VIEW<br>DETAIL A<br>A2 A<br>L b<br>SIDE VIEW END VIEW<br>**----- End of picture text -----**<br>


1. DIMENSIONING AND TOLERANCING PER ANME Y14.5M, 1994. 

2. CONTROLLING DIMENSION: INCHES. 

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.254mm PER SIDE. 

||||**RECOMMENDED**<br>4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.<br>5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA<br>DETERMINED BY DIMENSION L.<br>**SOLDERING FOOTPRINT***<br>8.750<br>0.344<br>2.250<br>0.089<br>~~�~~mm<br>inches<br>~~�~~SCALE 4:1<br>**DIM**<br>**A2**<br>**MIN**<br>**MAX**<br>**MIN**<br>**MILLIMETERS**<br>1.90<br>2.41<br>0.075<br>**INCHES**<br>**A1**<br>0.05<br>0.20<br>0.002<br>**b**<br>2.90<br>3.20<br>0.114<br>**c**<br>0.15<br>0.41<br>0.006<br>**D**<br>5.55<br>6.25<br>0.219<br>**E**<br>6.60<br>7.15<br>0.260<br>**L**<br>0.75<br>1.60<br>0.030<br>0.095<br>0.008<br>0.126<br>0.016<br>0.246<br>0.281<br>0.063<br>**MAX**<br>7.75<br>8.15<br>0.305<br>0.321<br>**HE**<br>2X<br>**A**<br>1.95<br>2.61<br>0.077<br>0.103|**RECOMMENDED**<br>4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.<br>5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA<br>DETERMINED BY DIMENSION L.<br>**SOLDERING FOOTPRINT***<br>8.750<br>0.344<br>2.250<br>0.089<br>~~�~~mm<br>inches<br>~~�~~SCALE 4:1<br>**DIM**<br>**A2**<br>**MIN**<br>**MAX**<br>**MIN**<br>**MILLIMETERS**<br>1.90<br>2.41<br>0.075<br>**INCHES**<br>**A1**<br>0.05<br>0.20<br>0.002<br>**b**<br>2.90<br>3.20<br>0.114<br>**c**<br>0.15<br>0.41<br>0.006<br>**D**<br>5.55<br>6.25<br>0.219<br>**E**<br>6.60<br>7.15<br>0.260<br>**L**<br>0.75<br>1.60<br>0.030<br>0.095<br>0.008<br>0.126<br>0.016<br>0.246<br>0.281<br>0.063<br>**MAX**<br>7.75<br>8.15<br>0.305<br>0.321<br>**HE**<br>2X<br>**A**<br>1.95<br>2.61<br>0.077<br>0.103|**RECOMMENDED**<br>4. DIMENSIONS D AND E TO BE DETERMINED AT DATUM H.<br>5. DIMENSION b SHALL BE MEASURED WITHIN THE AREA<br>DETERMINED BY DIMENSION L.<br>**SOLDERING FOOTPRINT***<br>8.750<br>0.344<br>2.250<br>0.089<br>~~�~~mm<br>inches<br>~~�~~SCALE 4:1<br>**DIM**<br>**A2**<br>**MIN**<br>**MAX**<br>**MIN**<br>**MILLIMETERS**<br>1.90<br>2.41<br>0.075<br>**INCHES**<br>**A1**<br>0.05<br>0.20<br>0.002<br>**b**<br>2.90<br>3.20<br>0.114<br>**c**<br>0.15<br>0.41<br>0.006<br>**D**<br>5.55<br>6.25<br>0.219<br>**E**<br>6.60<br>7.15<br>0.260<br>**L**<br>0.75<br>1.60<br>0.030<br>0.095<br>0.008<br>0.126<br>0.016<br>0.246<br>0.281<br>0.063<br>**MAX**<br>7.75<br>8.15<br>0.305<br>0.321<br>**HE**<br>2X<br>**A**<br>1.95<br>2.61<br>0.077<br>0.103|
|---|---|---|---|---|---|
|||||8.750||
|||||||
|||||||
|3.|790<br>149|||||
|0.||||||
|||||||
|||||||
|||||||



## **GENERIC MARKING DIAGRAM*** 

**==> picture [115 x 98] intentionally omitted <==**

**----- Start of picture text -----**<br>
AYWW<br>XXXX �<br>�<br>XXXX = Specific Device Code<br>A = Assembly Location<br>Y = Year<br>WW = Work Week<br>� = Pb−Free Package<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the **onsemi** Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

(Note: Microdot may be in either location) 

- *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “ � ”, may or may not be present. Some products may not follow the Generic Marking. 

|**DOCUMENT NUMBER:**|**98AON97675F**|
|---|---|
|**DESCRIPTION:**|**SMC 2−LEAD**|



Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed  versions are uncontrolled  except when stamped  “CONTROLLED COPY” in red. **PAGE 1 OF 1** 

**onsemi** and                     are trademarks of Semiconductor Components Industries, LLC dba **onsemi** or its subsidiaries in the United States and/or other countries. **onsemi** reserves the right to make changes without further notice to any products herein. **onsemi** makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does **onsemi** assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. **onsemi** does not convey any license under its patent rights nor the rights of others. 

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© Semiconductor Components Industries, LLC, 2015 

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**==> picture [232 x 43] intentionally omitted <==**

