NRVBS3201T3G

## MBRS3201T3G, NRVBS3201T3G 200 V, 3 A Schottky 

## Fast Soft-Recovery Power Rectifier **SMC Power Surface Mount Package** 

## **Features** 

- Lower Forward Voltage than any Ultrafast Rectifier: VF < 0.59 V at 150  C 

## **http://onsemi.com** 

**SCHOTTKY RECTIFIER 3 AMPS, 200 VOLTS** 

- Fast Switching Speed: Reverse Recovery Time (tRR) < 35 ns 

- Soft Recovery Characteristics: Softness Factor (tb/ta)  1 

- Highly Stable Over Temperature 

- AEC−Q101 Qualified and PPAP Capable 

- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements 

**SMC CASE 403 PLASTIC** 

- These are Pb−Free Packages* 

## **Benefits** 

- Significantly Reduced EMI 

## **MARKING DIAGRAM** 

- Eliminates the Need of Snubber Circuits 

- Low Switching and Heat Losses 

- Improved Thermal Management 

## **Applications** 

- Engine and Convenience Control Systems 

- Motor Controls 

- Battery Chargers and Switching Power Supplies 

## **Mechanical Characteristics** 

- Small Compact Surface Mount Package with J-Bend Leads 

||AYWW<br>B321<br>[~~5~~|AYWW<br>B321<br>[~~5~~|
|---|---|---|
|B321|= Specific Device Code||
|A|= Assembly Location||
|Y|= Year||
|WW|= Work Week||
||= Pb−Free Package||



(Note: Microdot may be in either location) 

- Rectangular Package for Automated Handling 

- Weight: 217 mg (Approximately) 

- Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable 

- ESD Ratings: 

   - Machine Model = A 

   - Human Body Model = 1C 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260  C Maximum for 10 Seconds 

- Polarity: Notch in Plastic Body Indicates Cathode Lead 

## **ORDERING INFORMATION** 

|**Device**|**Package**|**Shipping**†|
|---|---|---|
|MBRS3201T3G|SMC<br>(Pb−Free)|2500 /<br>Tape & Reel|
|NRVBS3201T3G|SMC<br>(Pb−Free)|2500 /<br>Tape & Reel|



- †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

> *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

Publication Order Number: **MBRS3201T3/D** 

**1** 

 Semiconductor Components Industries, LLC, 2012 **January, 2012 − Rev. 3** 

**MBRS3201T3G, NRVBS3201T3G** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|200|V|
|Average Rectified Forward Current (Rated VR, TC= 70C)|IF(AV)|3|A|
|Nonrepetitive Peak Surge Current|IFSM|100|A|
|Operating Junction Temperature|TJ<br>−|55 to +150|C|



Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Lead|R�JL|12|C/W|
|Thermal Resistance, Junction−to−Ambient|R�JA|60|C/W|



## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage<br>(IF= 3 A, TJ= 25C)<br>(IF= 3 A, TJ= 150C)|VF|0.84<br>0.59|V|
|Maximum Instantaneous Reverse Current (Rated VR)<br>(Rated DC Voltage, TJ= 25C)<br>(Rated DC Voltage, TJ= 150C)|IR|1.0<br>5.0|mA<br>mA|
|Maximum Reverse Recovery Time<br>(IF= 1 A, di/dt = 100 A/us, VR= 30 V)|trr|35|ns|



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**----- Start of picture text -----**<br>
100<br>10<br>25C<br>1.0 150C<br>100C<br>0.1<br>0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2<br>VF, INSTANTANEOUS VOLTAGE (V)<br>, FORWARD CURRENT (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 1. Typical Forward Voltage** 

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**----- Start of picture text -----**<br>
100<br>10<br>25C<br>1.0 150C<br>100C<br>0.1<br>0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2<br>VF, INSTANTANEOUS VOLTAGE (V)<br>, FORWARD CURRENT (A)<br>IF<br>**----- End of picture text -----**<br>


**Figure 2. Maximum Forward Voltage** 

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**2** 

**MBRS3201T3G, NRVBS3201T3G** 

**==> picture [490 x 175] intentionally omitted <==**

**----- Start of picture text -----**<br>
1E−1 1.0E−01<br>1E−2<br>1.0E−02<br>1E−3 150C<br>TC = 150C<br>1E−4<br>1.0E−03<br>1E−5 100C T C  = 25C<br>1E−6 1.0E−04<br>1E−7<br>1.0E−05<br>1E−8 25C<br>1E−9 1.0E−06<br>0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (V) VR, REVERSE VOLTAGE (V)<br>, REVERSE CURRENT (A)<br>IR<br>, MAXIMUM REVERSE CURRENT (A)<br>IR<br>**----- End of picture text -----**<br>


**Figure 3. Typical Reverse Current** 

**Figure 4. Maximum Reverse Current** 

**==> picture [492 x 388] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>100<br>10<br>1.0<br>0 20 40 60 80 100 120 140 160 180 200<br>VR, REVERSE VOLTAGE (V)<br>Figure 5. Typical Capacitance<br>4.0<br>7<br>3.5<br>6<br>3.0 DC<br>5<br>2.5 SQUARE<br>4 SQUAREWAVE<br>2.0<br>DC<br>3<br>1.5<br>2<br>1.0<br>0.5 1<br>0 0<br>0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 80 90 100 110 120 130 140 150 160<br>IO, AVERAGE FORWARD CURRENT TL, LEAD TEMPERATURE (C)<br>C, CAPACITANCE (pF)<br>, AVERAGE POWER DISSIPATION (W)<br>, AVERAGE FORWARD CURRENT (A)<br>FO IF<br>P<br>**----- End of picture text -----**<br>


**Figure 6. Power Dissipation** 

**Figure 7. Derating Curve** 

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**3** 

**MBRS3201T3G, NRVBS3201T3G** 

## **PACKAGE DIMENSIONS** 

**SMC** CASE 403−03 

ISSUE E 

**==> picture [488 x 168] intentionally omitted <==**

**----- Start of picture text -----**<br>
||||||||||
|---|---|---|---|---|---|---|---|---|
|HE|NOTES:1.|DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.|
|2.|CONTROLLING DIMENSION: INCH.|
|E|3.|D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.|
|=|4.|403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.|
|MILLIMETERS|INCHES|
|||DIM|MIN|NOM|MAX|MIN|NOM|MAX|
|=|A|1.90|2.13|2.41|0.075|0.084|0.095|
|b|D|A1|0.05|0.10|0.15|0.002|0.004|0.006|
|b|2.92|3.00|3.07|0.115|0.118|0.121|
|c|0.15|0.23|0.30|0.006|0.009|0.012|
|D|5.59|5.84|6.10|0.220|0.230|0.240|
|E|6.60|6.86|7.11|0.260|0.270|0.280|
|H|E|7.75|7.94|8.13|0.305|0.313|0.320|
|L|0.76|1.02|1.27|0.030|0.040|0.050|
|-—_-—__t__1_____l1|L1|0.51 REF|0.020 REF|_1__|
|4|
|A|
|c|A1|
|L|L1|

**----- End of picture text -----**<br>


## **SOLDERING FOOTPRINT*** 

**==> picture [209 x 114] intentionally omitted <==**

**----- Start of picture text -----**<br>
4.343<br>0.171<br>4<br>——<br>3.810<br>0.150<br>2.794<br>—<br>0.110<br>SCALE 4:1 mm<br>(—) inches<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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**MBRS3201T3/D**