NRVB230LSFT1G

## MBR230LSFT1G 

## Surface Mount Schottky Power Rectifier **Plastic SOD−123 Package** 

This device uses the Schottky Barrier principle with a large area metal−to−silicon power diode. Ideally suited for low voltage, high frequency rectification or as free wheeling and polarity protection diodes in surface mount applications where compact size and weight are critical to the system. This package also provides an easy to work with alternative to leadless 34 package style. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC−DC and DC−DC converters, reverse battery protection, and “Oring” of multiple supply voltages and any other application where performance and size are critical. 

## **Features** 

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**SCHOTTKY BARRIER RECTIFIER 2.0 AMPERES, 30 VOLTS** 

**SOD−123FL CASE 498** 

- Guardring for Stress Protection 

- Low Forward Voltage 

- 125°C Operating Junction Temperature 

- Epoxy Meets UL 94 V−0 

- Package Designed for Optimal Automated Board Assembly 

- ESD Ratings: Machine Model, C 

   - Human Body Model, 3B 

- NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free and are RoHS Compliant 

## **Mechanical Characteristics** 

- Reel Options: MBR230LSFT1G = 3,000 per 7 in reel/8 mm tape 

- Device Marking: L3N 

- Polarity Designator: Cathode Band 

- Weight: 11.7 mg (approximately) 

- Case: Epoxy, Molded 

- Lead Finish: 100% Matte Sn (Tin) 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds 

**MARKING DIAGRAM** 

L3N M ql .p L3N = Specific Device Code M = Date Code = Pb−Free Package 

(Note: Microdot may be in either location) 

**ORDERING INFORMATION** 

**Device Package Shipping**[†] MBR230LSFT1G SOD−123FL 3000/Tape & Reel (Pb−Free) NRVB230LSFT1G SOD−123FL 3000/Tape & Reel (Pb−Free) ~~=~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

- Device Meets MSL 1 Requirements 

Publication Order Number: **MBR230LSFT1/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **July, 2014 − Rev. 1** 

**MBR230LSFT1G** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|30|V|
|Average Rectified Forward Current (At Rated VR, TL= 105°C)|IO|2.0|A|
|Peak Repetitive Forward Current<br>(At Rated VR, Square Wave, 100 kHz, TL= 95°C)|IFRM|4.0|A|
|Non−Repetitive Peak Surge Current<br>(Non−Repetitive peak surge current, halfwave, single phase, 60 Hz)|IFSM|40|A|
|Storage Temperature|Tstg|−55 to 150|°C|
|Operating Junction Temperature|TJ|−55 to 125|°C|
|Voltage Rate of Change (Rated VR, TJ= 25°C)|dv/dt|10,000|V/�s|
|**THERMAL CHARACTERISTICS**||||
|Thermal Resistance, Junction−to−Lead (Note 1)<br>Thermal Resistance, Junction−to−Lead (Note 2)<br>Thermal Resistance, Junction−to−Ambient (Note 1)<br>Thermal Resistance, Junction−to−Ambient (Note 2)|Rtjl<br>Rtjl<br>Rtja<br>Rtja|26<br>21<br>325<br>82|°C/W|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Mounted with minimum recommended pad size, PC Board FR4. 2. Mounted with 1 in. copper pad (Cu area 700 mm[2] ). 

## **ELECTRICAL CHARACTERISTICS** 

|**ELECTRICAL CHARACTERISTICS**|||||
|---|---|---|---|---|
|Maximum Instantaneous Forward Voltage (Note 3)<br>(IF= 1.0 A)<br>(IF= 2.0 A)|VF|**TJ = 25**°**C**|**TJ = 100**°**C**|V|
|||0.38<br>0.43|0.30<br>0.37||
|Maximum Instantaneous Reverse Current (Note 3)<br>(VR= 30 V)|IR|**TJ = 25**°**C**|**TJ = 100**°**C**|mA|
|||1.0|25||



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width ≤ 250 � s, Duty Cycle ≤ 2%. 

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**2** 

**MBR230LSFT1G** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
10 10<br>TJ = 125 ° C<br>1 1 TJ = 125 ° C<br>TJ = 100 ° C<br>TJ = 100 ° C<br>TJ = 25 ° C<br>TJ = −55 ° C TJ = 25 ° C TJ = −55 ° C<br>0.1 0.1<br>0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.10 0.20 0.30 0.40 0.50 0.60 0.70<br>VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD<br>VOLTAGE (VOLTS)<br>Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage<br>100E−3 1E+0<br>TJ = 125 ° C<br>10E−3<br>1E−3 TJ = 100 ° C 100E−3 TJ = 125 ° C<br>100E−6<br>10E−3<br>10E−6 TJ = 25 ° C TJ = 100 ° C<br>1E−3<br>1E−6<br>100E−9 TJ = −55 ° C TJ = 25 ° C<br>100E−6<br>10E−9 TJ = −55 ° C<br>1E−9 10E−6<br>0 10 20 30 0 10 20 30<br>VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)<br>Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current<br>3.5 1.6<br>dc<br>3 1.4<br>dc<br>square wave<br>1.2<br>2.5 Ipk/IO = p<br>square wave freq = 20 kHz 1.0<br>2 Ipk/IO = p Ipk/IO = 5<br>0.8<br>1.5 Ipk/IO = 5<br>0.6<br>1<br>0.4<br>0.5 0.2<br>0<br>0<br>25 35 45 55 65 75 85 95 105 115 125 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5<br>TL, LEAD TEMPERATURE ( ° C) IO, AVERAGE FORWARD CURRENT (AMPS)<br>Figure 5. Current Derating Figure 6. Forward Power Dissipation<br>CURRENT (AMPS) CURRENT (AMPS)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>IF IF<br>, REVERSE CURRENT (AMPS)<br>IR<br>, MAXIMUM REVERSE CURRENT (AMPS)<br>IR<br>, AVERAGE FORWARD CURRENT (AMPS) , AVERAGE POWER DISSIPATION (WATTS)<br>IO FO<br>P<br>**----- End of picture text -----**<br>


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**MBR230LSFT1G** 

## **TYPICAL CHARACTERISTICS** 

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125<br>120 R � JA = 25.6  = 25.6  ° C/W<br>115<br>110<br>105 R � JA = 130  = 130  ° C/W<br>100<br>95<br>90<br>85 R � JA = 235  = 235  ° C/W<br>80<br>75 R � JA = 324.9  = 324.9  ° C/W<br>70 R � JA = 400  = 400  ° C/W<br>65<br>0 2 4 6 8 10 12 14 16 18 20<br>VR, DC REVERSE VOLTAGE (VOLTS)R, DC REVERSE VOLTAGE (VOLTS), DC REVERSE VOLTAGE (VOLTS)<br>Figure 8. Typical Operating Temperature<br>Derating<br>C)<br>°<br>, DERATED OPERATING TEMPERATURE (<br>J<br>T<br>**----- End of picture text -----**<br>


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1000 125<br>TJ = 25  ° C 120 R � JA = 25.6  = 25.6  ° C/W<br>115<br>110<br>105 R � JA = 130  = 130  ° C/W<br>100<br>100 95<br>90<br>R � JA = 235  = 235  ° C/W<br>85<br>80<br>75 R � JA = 324.9  = 324.9  ° C/W<br>70 R � JA = 400  = 400  ° C/W<br>10 65<br>0 5 10 15 20 25 30 0 2 4 6 8 10 12 14 16 18 20<br>VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS)R, DC REVERSE VOLTAGE (VOLTS), DC REVERSE VOLTAGE (VOLTS)<br>Figure 7. Capacitance Figure 8. Typical Operating Temperature<br>Derating<br>1000<br>D = 0.5<br>100 0.2<br>0.1<br>0.05<br>10 P(pk)<br>0.01<br>t 1<br>t 2<br>1 DUTY CYCLE, D = t1/t2<br>SINGLE PULSE<br>Test Type > Min Pad < Die Size 38x38 @ 75% mils � JA = 321.8  ° C/W<br>0.1<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000<br>t1, TIME (sec)<br>°<br>C, CAPACITANCE (pF)<br>, DERATED OPERATING TEMPERATURE (<br>J<br>T<br>r(t), TRANSIENT THERMAL RESISTANCE<br>**----- End of picture text -----**<br>


**Figure 9. Thermal Response** 

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**4** 

**MBR230LSFT1G** 

## **PACKAGE DIMENSIONS** 

**SOD−123LF** CASE 498 ISSUE D 

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E<br>f y<br>D<br>1 2<br>A1<br>POLARITY INDICATOR<br>OPTIONAL AS NEEDED A<br>a e HO<br>TOP VIEW END VIEW<br>HE a4 c<br>SIDE VIEW<br>2X L<br>2X b<br>Ho BOTTOM VIEW |<br>**----- End of picture text -----**<br>


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NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: MILLIMETER.<br>3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.<br>4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION<br>OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.<br>MILLIMETERS INCHES<br>DIM MIN NOM MAX MIN NOM MAX<br>A 0.90 0.95 0.98 0.035 0.037 0.039<br>A1 0.00 0.05 0.10 0.000 0.002 0.004<br>b === 0.70 0.90 1.10 0.028 == 0.035 0.043<br>c 0.10 0.15 0.20 0.004 0.006 0.008<br>D 1.50 1.65 1.80 0.059 0.065 0.071<br>E 2.50 2.70 2.90 0.098 0.106 0.114<br>L 0.55 0.75 0.95 0.022 0.030 0.037<br>H E 3.40 3.60 3.80 0.134 0.142 0.150<br>0° − 8° 0° − 8°<br>————<br>**----- End of picture text -----**<br>


## **RECOMMENDED SOLDERING FOOTPRINT*** 

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4.20<br>2X<br>1.25<br>ÉÉÉÉ ÉÉÉÉ<br>2X 1.22 ÉÉÉÉ ÉÉÉÉ<br>ÉÉÉÉ ÉÉÉÉ<br>| LT .ET<br>ÉÉÉÉ ÉÉÉÉ<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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**MBR230LSFT1/D** 

**5**