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NHQM103B375T5
NTC THERMISTOR, 10K, 0805
⚠️ Reference pricing provided. In case of supply shortages, we will connect you with our trusted procurement partners to ensure your project's continuity.
- Manufacturer: AMPHENOL ADVANCED SENSORS
- Product type: Temperature Sensing / Compensation NTC Thermistors
| Delivery and price | |
|---|---|
| Units per pack | 30000 |
| Price | 0.992 € |
| Current stock | 50+ |
| Lead time | 7 days |
Datasheet
**==> picture [206 x 37] intentionally omitted <==** ## NTC Type SMD ## Thermometrics Surface Mount Devices **==> picture [332 x 160] intentionally omitted <==** **----- Start of picture text -----**<br> EIA Style 1206 Nickel barrier solder coated<br>0.5 mm (0.02 in) 3 sided wrap around<br>typical<br>1.27 mm<br>(0.05 in) 1.6 mm ±0.2 mm<br>maximum (0.063 mm ±0.008 in)<br> 3.2 mm ±0.2 mm<br>(0.126 in ±0.008 in)<br>**----- End of picture text -----**<br> ## **Features** - Nickel barrier tin plated terminations for soldering - High sensitivity to changes in temperature - Wide operating temperature range -40°F to 257°F (-40°C to 125°C) - Rugged construction - Suitable for standard soldering techniques - Excellent solderability without “tombstoning” - Ceramic between electrodes glass coated for improved stability - Supplied in tape-and-reel packaging - Available in other material systems - Intended for temperature measurement, control and compensation ## **Amphenol Advanced Sensors** ## Type NHQ Specification Surface mount chip 1206 size ## Description A range of 1206 size surface mount NTC chip thermistors.The terminations are nickel barrier with tin plating. ## General ## **Soldering Recommendations** - Maximum storage time in closed package: One year - Maximum storage time exposed to ambient conditions of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30 days - Drying prior to soldering: Not to exceed 48h at 176°F (80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C) - Flux type: R or RMA ## **Flow Soldering Conditions** - Preheat temperature: 176°F to 302°F (80°C to 150°C) - Maximum rate of temperature change: 4.5°F/s or 2.5°C/s - Maximum solder temperature: 509°F (265°C) - Maximum dwell time: 10 seconds - Cooling in ambient or air flow of 5m/s ## **Reflow Soldering Conditions** - Method infrared, hot gas, vapor - Maximum rate of preheat temperature change: 4.5°F/s or 2.5°C/s - Maximum temperature: 437°F (225°C) - Maximum time above: 392°F (200°C) 30 seconds **==> picture [235 x 196] intentionally omitted <==** **----- Start of picture text -----**<br> 0.5 mm ±0.2 mm<br>(0.0197 in ±0.008 in)<br>3.2 mm ±0.2 mm<br>(0.126 in ±0.008 in)<br>NTC Type NHQ Outline Drawing<br>(0.063 in ±0.008 in) 1.6 mm ±0.2 mm<br>maximum<br>1.2 mm (0.0472 in)<br>**----- End of picture text -----**<br> **==> picture [215 x 17] intentionally omitted <==** **----- Start of picture text -----**<br> Code R25 W B (25/85)<br>**----- End of picture text -----**<br> ||NHQ202B410T5|2000|4100| |---|---|---|---| ||NHQ222B410T5|2200|4100| ||NHQ252B410T5|2500|4100| ||NHQ302B410T5|3000|4100| ||NHQ472B355T5|4700|3550| ||NHQ502B355T5|5000|3550| ||NHQ103B375T5|10000|3750| ||NHQ153B400T5|15000|4000| ||NHQ203B400T5|20000|4000| ||NHQ223B400T5|22000|4000| ||NHQ303B400T5|30000|4000| ||NHQ333B400T5|33000|4000| ||NHQ473B400T5|47000|4000| ||NHQ503B400T5|50000|4000| ||NHQ104B425T5|100000|4250| ||NHQ154B425T5|150000|4250| ||NHQ304B435T5|300000|4350| ||NHQ474B435T5|470000|4350| ||NHQ504B435T5|500000|4350| - Maximum radiant flux: (0.1 to 100 W µ) 5 W/ cm2 - Maximum hot air temperature: 527°F (275°C) at 4 m/s - Maximum vapor temperature: 419°F (215°C) - Maximum rate of cooling: 4.5°F/s or 2.5°C/s ## **Cleaning** Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158°F (70°C) for 7 minutes (recommended). ## Data - Resistance tolerance at 77°F (25°C) ±5%; for ±10% replace T5 by T10 in code. - Tolerance on B value ±200 K - Minimum temperature: -40°F (-40°C) - Maximum temperature: 257°F (125°C) - Dissipation factor: 3 mW/K - Time constant: 8 seconds maximum 2 ## Type NHQM Specification Surface mount chip 0805 size ## Description A range of 0805 size surface mount NTC chip thermistors.The terminations are nickel barrier with tin plating. ## General ## **Soldering Recommendations** - Maximum storage time in closed package: One year - Maximum storage time exposed to ambient conditions of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30 days - Drying prior to soldering: Not to exceed 48h at 176°F (80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C) - Flux type: R or RMA ## **Flow Soldering Conditions** - Preheat temperature: 176°F to 302°F (80°C to 150°C) - Maximum rate of temperature change: 4.5°F/s or 2.5°C/s - Maximum solder temperature: 509°F (265°C) - Maximum dwell time: 10 seconds - Cooling in ambient or air flow of 5m/s ## **Reflow Soldering Conditions** - Method infrared, hot gas, vapor - Maximum rate of preheat temperature change: 4.5°F/s or 2.5°C/s - Maximum temperature: 437°F (225°C) - Maximum time above: 392°F (200°C) 30 seconds - Maximum radiant flux: (0.1 to 100 Wµ) 5 W µ/cm2 - Maximum hot air temperature: 527°F (275°C) at 4 m/s - Maximum vapor temperature: 419°F (215°C) - Maximum rate of cooling: 4.5°F/s or 2.5°Cs **==> picture [222 x 195] intentionally omitted <==** **----- Start of picture text -----**<br> 0.4 mm ±0.2 mm<br>(0.0157 in ±0.008 in)<br>2 mm ±0.2 mm<br>(0.0787 in ±0.008 in)<br>NTC Type NHQM Outline Drawing<br>1.25 mm ±0.2 mm<br>(0.0492 in ±0.008 in)<br>maximum<br>1.2 mm (0.0472 in)<br>**----- End of picture text -----**<br> **==> picture [214 x 17] intentionally omitted <==** **----- Start of picture text -----**<br> Code R25 W B (25/85°C)<br>**----- End of picture text -----**<br> ||NHQM202B410T5|2000|4100| |---|---|---|---| ||NHQM252B410T5|2500|4100| ||NHQM272B410T5|2700|4100| ||NHQM302B410T5<br>NHQM472B355T5<br>NHQM502B355T5|3000<br>4700<br>5000|4100<br>3550<br>3550| ||NHQM682B375T5|6800|3750| ||NHQM103B375T5|10000|3750| ||NHQM153B400T5|15000|4000| ||NHQM203B400T5|20000|4000| ||NHQM223B400T5|22000|4000| ||NHQM273B400T5|27000|4000| ||NHQM303B400T5|30000|4000| ||NHQM333B400T5<br>NHQM473B415T5<br>NHQM503B415T5|33000<br>47000<br>50000|4000<br>4150<br>4150| ||NHQM104B425T5|100000|4250| ||NHQM154B425T5|150000|4250| ||NHQM304B425T5|300000|4250| ||NHQM474B435T5|470000|4350| ||NHQM504B435T5|500000|4350| ## **Cleaning** Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158°F (70°C) for 7 minutes (recommended). ## Data - Resistance tolerance at 77°F (25°C) ±5%; for ±10% replace T5 by T10 in code. - Tolerance on B value ±200 K - Minimum temperature: -40°F (-40°C) - Maximum temperature: 257°F (125°C) - Dissipation factor: 1.5 mW/K - Time constant: 5 seconds maximum 3 ## Type NHQMM Specification Surface mount chip 0603 size ## Description A range of 0603 size surface mount NTC chip thermistors.The terminations are nickel barrier with tin plating. ## General ## **Soldering Recommendations** - Maximum storage time in closed package: One year - Maximum storage time exposed to ambient conditions of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30 days - Drying prior to soldering: Not to exceed 48h at 176°F (80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C) - Flux type: R or RMA ## **Flow Soldering Conditions** - Preheat temperature: 176°F to 302°F (80°C to 150°C) - Maximum rate of temperature change: 4.5°F/s or 2.5°C/s - Maximum solder temperature: 509°F (265°C) - Maximum dwell time: 10 seconds - Cooling in ambient or air flow of 5m/s ## **Reflow Soldering Conditions** - Method infrared, hot gas, vapor - Maximum rate of preheat temperature change: 4.5°F/s or 2.5°C/s - Maximum temperature: 437°F (225°C) - Maximum time above: 392°F (200°C) 30 seconds **==> picture [241 x 180] intentionally omitted <==** **----- Start of picture text -----**<br> 0.3 mm ± 0.2 mm<br>(0.012 in ± 0.008 in)<br>1.6 mm ± 0.2 mm<br>(0.063 in ± 0.008 in)<br>(0.031 in ± 0.08 in) 0.8 mm ± 2 mm<br>1 mm max<br>(0.039 in max)<br>**----- End of picture text -----**<br> NTC Type NHQMM Outline Drawing **==> picture [236 x 17] intentionally omitted <==** **----- Start of picture text -----**<br> Code R25 W B (25/85)<br>**----- End of picture text -----**<br> |NHQMM202B410T5|2000|4100| |---|---|---| |NHQMM222B410T5|2200|4100| |NHQMM302B410T5|3000|4100| |NHQMM332B410T5|3300|4100| |NHQMM472B355T5|4700|3550| |NHQMM502B355T5|5000|3550| |NHQMM682B355T5|6800|3550| |NHQMM103B375T5|10000|3750| |NHQMM153B380T5|15000|3800| |NHQMM203B380T5|20000|3800| |NHQMM223B380T5|22000|3800| |NHQMM303B400T5|30000|4000| |NHQMM333B400T5|33000|4000| |NHQMM473B400T5|47000|4000| |NHQMM503B400T5|50000|4000| |NHQMM683B400T5|68000|4000| |NHQMM104B415T5|100000|4150| |NHQMM154B425T5|150000|4250| |NHQMM204B425T5|200000|4250| - Maximum radiant flux: (0.1 to 100 Wµ) 5 Wµ/cm[2] - Maximum hot air temperature: 527°F (275°C) at 4 m/s - Maximum vapor temperature: 419°F (215°C) - Maximum rate of cooling: 4.5°F/s or 2.5°C/s ## **Cleaning** Ultrasonic cleaning in methanol or isopropanol not exceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158°F (70°C) for 7 minutes (recommended). ## Data - Resistance tolerance at 77°F (25°C) ±5%; for ±10% replace T5 by T10 in code - Tolerance on B value ±200 K - Minimum temperature: -40°F (-40°C) - Maximum temperature: 257°F (125°C) - Dissipation factor: 1.2 mW/K - Time constant: 4 seconds maximum 4 ## Type NHQT Specification Surface mount chip 0402 size ## Description A range of 0402 size surface mount NTC chip thermistors.The terminations are nickel barrier with tin plating. ## General ## **Soldering Recommendations** - Maximum storage time in closed package: One year **==> picture [241 x 198] intentionally omitted <==** **----- Start of picture text -----**<br> 0.2 mm ±0.1 mm<br>(0.078 in ±0.004 in)<br>1 mm ±0.15 mm<br>(0.0394 in ±0.006 in)<br>NTC Type NHQT Outline Drawing<br>(0.0196 in ±0.006 in) 0.5 mm ±0.15 mm<br>(0.0177 in ±0.006 in) 0.45 mm ±0.15 mm<br>**----- End of picture text -----**<br> - Maximum storage time exposed to ambient conditions of 59°F to 86°F (15°C to 30°C), 15% to 70% RH: 30 days - Drying prior to soldering: Not to exceed 48h at 176°F (80°C) or 16h at 212°F (100°C) or 8h at 257°F (125°C) - Flux type: R or RMA ## **Flow Soldering Conditions** - Preheat temperature: 176°F to 302°F (80°C to 150°C) - Maximum rate of temperature change: 4.5°F/s or 2.5°C/s - Maximum solder temperature: 509°F (265°C) - Maximum dwell time: 10 seconds - Cooling in ambient or air flow of 5m/s ## **Reflow Soldering Conditions** - Method infrared, hot gas, vapor **==> picture [248 x 17] intentionally omitted <==** **----- Start of picture text -----**<br> Code R25 W B (25/85)<br>**----- End of picture text -----**<br> ||NHQT500B285T5|50|2850| |---|---|---|---| ||NHQT202B410T5|2000|4100| ||NHQT252B410T5|2500|4100| ||NHQT332B410T5|3300|4100| ||NHQT352B410T5|3500|4100| ||NHQT402B410T5|4000|4100| ||NHQT652B410T5|6500|4100| ||NHQT153B380T5|15000|3800| ||NHQT203B380T5|20000|3800| ||NHQT223B380T5|22000|3800| ||NHQT303B400T5|30000|4000| ||NHQT473B400T5|47000|4000| ||NHQT683B400T5|68000|4000| ||NHQT154B425T5|150000|4250| - Maximum rate of preheat temperature change: 4.5°F/s or 2.5°C/s - Maximum temperature: 437°F (225°C) - Maximum time above: 392°F (200°C) 30 seconds - Maximum radiant flux: (0.1 to 100 Wµ) 5 Wµ/cm2 - Maximum hot air temperature: 527°F (275°C) at 4 m/s - Maximum vapor temperature: 419°F (215°C) - Maximum rate of cooling: 4.5°F/s or 2.5°C/s ## Data - Resistance tolerance at 77°F (25°C) ±5%; - for ±10% replace T5 by T10 in code - Tolerance on B value ±200 K - Minimum temperature: -40°F (-40°C) - Maximum temperature: 257°F (125°C) - Dissipation factor: 1.5 mW/K - Time constant: 4 seconds maximum ## **Cleaning** Ultrasonic cleaning in methanol or isopropanol notexceeding 40 kHz for 5 minutes, or aqueous cleaning not exceeding 158°F (70°C) for 7 minutes (recommended). 5 6 7 ## **Amphenol Advanced Sensors** ## www.amphenol-sensors.com © 2017 Amphenol Corporation. All Rights Reserved. Specifications are subject to change without notice. Other company names and product names used in this document are the registered trademarks or trademarks of their respective owners. **AAS-920-324F - 03/2017**
Updated at February 9, 2023
Amphenol Advanced Sensors is a leading innovator in sensor technologies and measurement solutions, serving the highly regulated and demanding needs of the transportation, medical, and industrial markets. Through its renowned legacy brands—including Thermometrics for temperature sensing, NovaSensor for pressure, and Telaire for air quality—the company delivers a diverse portfolio of critical components designed to provide accurate environmental data for real-time decision-making. The core of this manufacturer's offering focuses heavily on highly reliable circuit protection and transducer components. Engineers will find an extensive selection of temperature sensing and compensation NTC thermistors, alongside a comprehensive range of high-performance pressure sensors and transducers. These precision-engineered devices are essential for ensuring thermal stability, accurate fluid measurement, and reliable operational feedback in complex commercial and industrial applications. Beyond these primary lines, the selection includes vital power management devices such as inrush current limiting (ICL) NTC thermistors and PTC thermistors engineered to safeguard sensitive electronics. The portfolio is further complemented by specialized temperature sensors, light sensors, and dataloggers, providing a robust, integrated suite of measurement and protection solutions for modern hardware design.
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