NHP120SFT3G

## NHP120SF, NRVHP120SF 

## Surface Mount Ultrafast Power Rectifier **Plastic SOD−123FL Package** 

This SOD−123FL ultrafast rectifier provides fast switching performance with soft recovery in a compact thermally efficient package. Its compact footprint makes it ideally suited to portable and automotive applications where board space is at a premium. Its low profile makes it a good option for flat panel display and other applications with limited vertical clearance. The device offers low leakage over temperature making it a good match for applications requiring low quiescent current. 

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**ULTRAFAST RECTIFIER 1.0 AMPERES 200 VOLTS** 

## **Features** 

- Fast Soft Switching for Reduced EMI and Higher Efficiency 

- Low Profile − Maximum Height of 1.0 mm 

- Small Footprint − Footprint Area of 5.94 mm[2] 

- NRV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable 

- These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant 

## **Mechanical Characteristics:** 

- Case: Molded Epoxy 

- Epoxy Meets UL 94 V−0 @ 0.125 in 

- Weight: 11.7 mg (Approximately) 

- Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Maximum for 10 Seconds 

**SOD−123FL CASE 498** 

**MARKING DIAGRAM** 

P12M ql "p P12 = Specific Device Code M = Date Code = Pb−Free Package (Note: Microdot may be in either location) 

- MSL 1 

**ORDERING INFORMATION** 

## **Applications** 

- Instrumentation 

- Output Rectification in Switching Power Supplies Including Mini Adaptors and Flat Panel Display 

- LED Lighting 

- Freewheeling Diode Where Space is at a Premium 

**Device Package Shipping**[†] NHP120SFT3G SOD−123 10000 / Tape & (Pb−Free) Reel NRVHP120SFT3G SOD−123 10000 / Tape & (Pb−Free) Reel ~~=o~~ †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. 

Publication Order Number: **NHP120SF/D** 

**1** 

© Semiconductor Components Industries, LLC, 2014 **December, 2014 − Rev. 0** 

**NHP120SF, NRVHP120SF** 

## **MAXIMUM RATINGS** 

|**MAXIMUM RATINGS**||||
|---|---|---|---|
|**Rating**|**Symbol**|**Value**|**Unit**|
|Peak Repetitive Reverse Voltage<br>Working Peak Reverse Voltage<br>DC Blocking Voltage|VRRM<br>VRWM<br>VR|200|V|
|Average Rectified Forward Current<br>(TL= 158°C)|IO|1.0|A|
|Peak Repetitive Forward Current<br>(Square Wave, 20 kHz, TL= 155°C)|IFRM|2.0|A|
|Non−Repetitive Peak Surge Current<br>(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)|IFSM|30|A|
|Storage and Operating Junction Temperature Range (Note 1)|Tstg, TJ|−65 to +175|°C|



Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/R � JA. 

## **THERMAL CHARACTERISTICS** 

|**THERMAL CHARACTERISTICS**||||
|---|---|---|---|
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Thermal Resistance, Junction−to−Lead (Note 2)|�JCL|23|°C/W|
|Thermal Resistance, Junction−to−Ambient (Note 2)|R�JA|85|°C/W|
|Thermal Resistance, Junction−to−Ambient (Note 3)|R�JA|330|°C/W|
|**ELECTRICAL CHARACTERISTICS**||||
|**Characteristic**|**Symbol**|**Value**|**Unit**|
|Maximum Instantaneous Forward Voltage (Note 4)<br>(IF= 1.0 A, TJ= 25°C)<br>(IF= 2.0 A, TJ= 25°C)<br>(IF= 1.0 A, TJ= 125°C)<br>(IF= 2.0 A, TJ= 125°C)|VF|1.0<br>1.1<br>0.85<br>0.95|V|
|Maximum Instantaneous Reverse Current (Note 4)<br>(Rated dc Voltage, TJ= 25°C)<br>(Rated dc Voltage, TJ= 125°C)|IR|0.5<br>25|�A|
|Reverse Recovery Time<br>IF= 1.0 A, VR= 30 V, dl/dt = 50 A/�s, TJ= 25°C|trr|25|ns|
|Reverse Recovery Time<br>IF= 1.0 A, VR= 30 V, dl/dt = 50 A/�s, TJ= 50°C|trr|50|ns|



Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 

2. Mounted with 700 mm[2] copper pad size (Approximately 1 in[2] ) 1 oz FR4 Board. 

3. Mounted with pad size approximately 20 mm[2] copper, 1 oz FR4 Board. 

4. Pulse Test: Pulse Width ≤ 380 � s, Duty Cycle ≤ 2.0%. 

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**2** 

**NHP120SF, NRVHP120SF** 

## **TYPICAL CHARACTERISTICS** 

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**----- Start of picture text -----**<br>
100 100<br>10 TA = 175 ° C 10<br>TA = 150 ° C TA = 175 ° C<br>T A  = 125 ° C T A  = 150 ° C<br>1 1<br>TA = 125 ° C<br>0.1 0.1<br>TA = 25 ° C T A  = 25 ° C<br>0.01 0.01<br>TA = −40 ° C T A  = −40 ° C<br>0.001 0.001<br>0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4<br>VF, INSTANTANEOUS FORWARD VOLTAGE (V) VF, INSTANTANEOUS FORWARD VOLTAGE (V)<br>Figure 1. Typical Instantaneous Forward Figure 2. Maximum Instantaneous Forward<br>Characteristics Characteristics<br>1.E−03 1.E−03<br>1.E−04 TA = 175 ° C 1.E−04 TA = 175 ° C<br>1.E−05<br>1.E−06 TA = 150 ° C T A  = 125 ° C 1.E−05 TA = 150 ° C TA = 125 ° C<br>1.E−07 TA = 25 ° C 1.E−06 TA = 25 ° C<br>1.E−08 1.E−07<br>1.E−09<br>1.E−10 TA = −40 ° C 1.E−08 TA = −40 ° C<br>1.E−09<br>1.E−11<br>1.E−12 1.E−10<br>0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180 200<br>VR, INSTANTANEOUS REVERSE VOLTAGE (V) VR, INSTANTANEOUS REVERSE VOLTAGE (V)<br>Figure 3. Typical Reverse Characteristics Figure 4. Maximum Reverse Characteristics<br>1000<br>2.0<br>T J  = 25 ° C<br>DC<br>1.5<br>100<br>Square Wave<br>1.0<br>10<br>0.5<br>R � JC = 23 ° C/W<br>1 0<br>0 20 40 60 80 100 120 140 160 180 200 0 20 40 60 80 100 120 140 160 180<br>VR, REVERSE VOLTAGE (V) TC, CASE TEMPERATURE ( ° C)<br>CURRENT (A) CURRENT (A)<br>, INSTANTANEOUS FORWARD , INSTANTANEOUS FORWARD<br>iF iF<br>, INSTANTANEOUS REVERSE CURRENT (A) , INSTANTANEOUS REVERSE CURRENT (A)<br>IR IR<br>C, JUNCTION CAPACITANCE (pF) , AVERAGE FORWARD CURRENT (A)<br>IF(AV)<br>**----- End of picture text -----**<br>


**Figure 5. Typical Junction Capacitance** 

**Figure 6. Current Derating** 

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**3** 

**NHP120SF, NRVHP120SF** 

## **TYPICAL CHARACTERISTICS** 

**==> picture [249 x 156] intentionally omitted <==**

**----- Start of picture text -----**<br>
3.0<br>IPK/IAV = 20 IPK/IAV = 10<br>2.5 T J = 175 ° C<br>2.0<br>1.5 I PK /I AV = 5<br>1.0<br>DC<br>0.5<br>Square Wave<br>0<br>0 0.2 0.4 0.6 0.8 1.0 1.2<br>, AVERAGE FORWARD<br>F(AV) POWER DISSIPATION (W)<br>P<br>**----- End of picture text -----**<br>


**==> picture [160 x 10] intentionally omitted <==**

**----- Start of picture text -----**<br>
IF(AV), AVERAGE FORWARD CURRENT (A)<br>**----- End of picture text -----**<br>


**Figure 7. Forward Power Dissipation** 

**==> picture [490 x 394] intentionally omitted <==**

**----- Start of picture text -----**<br>
1000<br>50% (DUTY CYCLE)<br>100 25%<br>10%<br>5.0%<br>10 2.0%<br>1.0%<br>1.0<br>0.1<br>SINGLE PULSE<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>PULSE TIME (s)<br>Figure 8. Thermal Response, Junction−to−Ambient (20 mm [2]  pad)<br>100<br>50% (DUTY CYCLE)<br>25%<br>10 10%<br>5.0%<br>2.0%<br>1.0<br>1.0%<br>0.1<br>SINGLE PULSE<br>0.01<br>0.000001 0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000<br>PULSE TIME (s)<br>R(t) (C/W)<br>R(t) (C/W)<br>**----- End of picture text -----**<br>


**Figure 9. Thermal Response, Junction−to−Ambient (1 in[2] pad)** 

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**4** 

**NHP120SF, NRVHP120SF** 

## **PACKAGE DIMENSIONS** 

**SOD−123FL** CASE 498 

ISSUE D 

|NOTES:<br>1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.<br>2. CONTROLLING DIMENSION: MILLIMETER.<br>3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.<br>4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION<br>OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.<br>**D**<br>**E**<br>**A**<br>**A1**<br>**POLARITY INDICATOR**<br>**OPTIONAL AS NEEDED**<br>**DIM**<br>**A**<br>**MIN**<br>**NOM**<br>**MAX**<br>**MIN**<br>**MILLIMETERS**<br>0.90<br>0.95<br>0.98<br>0.035<br>**INCHES**<br>**A1**<br>0.00<br>0.05<br>0.10<br>0.000<br>**b**<br>0.70<br>0.90<br>1.10<br>0.028<br>**c**<br>0.10<br>0.15<br>0.20<br>0.004<br>0.037<br>0.039<br>0.002<br>0.004<br>0.035<br>0.043<br>0.006<br>0.008<br>**NOM**<br>**MAX**<br>**TOP VIEW**<br>**END VIEW**<br>**1**<br>**2**<br>~~ra~~r<br>~~*~~<br>~~a-~~|
|---|
|**D**<br>1.50<br>1.65<br>1.80<br>0.059<br>**E**<br>2.50<br>2.70<br>2.90<br>0.098<br>**L**<br>0.55<br>0.75<br>0.95<br>0.022<br>0.065<br>0.071<br>0.106<br>0.114<br>0.030<br>0.037<br>3.40<br>3.60<br>3.80<br>0.134<br>0.142<br>0.150<br>**HE**<br>−<br>−<br>0°<br>8°<br>0°<br>8°<br>~~a~~==Sl===|



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-— HE +# c<br>SIDE VIEW<br>2X L<br>2X b<br>emy e<br>BOTTOM VIEW<br>**----- End of picture text -----**<br>


**RECOMMENDED SOLDERING FOOTPRINT*** 

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4.20<br>2X<br>1.25<br>ÉÉÉ ÉÉÉ<br>ÉÉÉ ÉÉÉ<br>2X 1.22 ÉÉÉ ÉÉÉ<br>TLS<br>ÉÉÉ ÉÉÉ<br>DIMENSIONS: MILLIMETERS<br>**----- End of picture text -----**<br>


*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. 

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**NHP120SF/D** 

**5**