NFAM3065L4BT
Intelligent Power Module (IPM), IGBT, 650 V, 30 A, 2.5 kV, DIP 39, SPM31
- Manufacturer: ONSEMI
- Product type: Intelligent Power Modules
- SVHC: No SVHC (25-Jun-2025)
- IPM Series: SPM31
- Product Range: SPM31 Series
- IPM Case Style: DIP 39
- IPM Power Device: IGBT
- Isolation Voltage: 2.5kV
- Current Rating (Ic / Id): 30A
- Voltage Rating (Vces / Vdss): 650V
| Delivery and price | |
|---|---|
| Units per pack | 250 |
| Price | 11.57 € |
| Current stock | 10+ |
| Lead time | 30 days |
## NFAM3065L4BT ## _Advance Information_ Intelligent Power Module (IPM), 650 V, 30 A ## **General Description** The NFAM3065L4B is a fully-integrated inverter power module consisting of an independent High side gate driver, LVIC, six IGBT’s and a temperature sensor (VTS or Thermistor (T)), suitable for driving permanent magnet synchronous (PMSM) motors, brushless DC (BLDC) motors and AC asynchronous motors. The IGBT’s are configured in a three-phase bridge with separate emitter connections for the lower legs for maximum flexibility in the choice of control algorithm. **www.onsemi.com** The power stage has undervoltage lockout protection (UVP). Internal boost diodes are provided for high side gate boost drive. ## **Features** - Three-phase 650 V, 30 A IGBT Module with Independent Drivers - Active Logic Interface - Built-in Undervoltage Protection (UVP) - Integrated Bootstrap Diodes and Resistors - Separate Low-side IGBT Emitter Connections for Individual Current Sensing of Each Phase ## **DIP39 54.5 x 31.0 CASE MODGC** ## **MARKING DIAGRAM** - Temperature Sensor (VTS or Thermistor (T)) - UL: E339285 - This is a Pb-Free Device ## **Typical Applications** - Industrial Drives - Industrial Pumps - Industrial Fans - Industrial Automation Device marking is on package top side NFAM3065L4BT = Specific Device Code ZZZ = Assembly Input Ordering Code AT = Assembly Site= Test Site T = Test Site Y = Year Code WW = Work Week **==> picture [493 x 168] intentionally omitted <==** **----- Start of picture text -----**<br> RTH VTH P U V W<br>ZZZ = Assembly Input Ordering Code<br>VDD(UH)VS(U)VB(U) High SideHVIC1 HS1 AT = Assembly Site= Test Site<br>HIN(U) Y = Year Code<br>VDD(VH)VS(V)VB(V) High SideHVIC2 HS2 HS1 HS2 HS3 WW = Work Week<br>HIN(V)<br>VDD(WH)VS(W)VB(W) am High SideHVIC3 e HS3 anaes ORDERING INFORMATION<br>HIN(W)<br>VTS LS1 LS2 LS3 Device Package Shipping<br>LIN(U)<br>LIN(V) Low Side LS1 NFAM3065L4BT DIP39 90 / Box<br>LIN(W)CFODVFOCIN ProtectionLVICwith LS2LS3 54.5 x 31.0(Pb-Free)<br>VSS<br>VDD(L) a 4 4 4 | SSE<br>NU NV NW<br>**----- End of picture text -----**<br> **Figure 1. Application Schematic** This document contains information on a new product. Specifications and information herein are subject to change without notice. Publication Order Number: **NFAM3065L4BT/D** **1** © Semiconductor Components Industries, LLC, 2019 **April, 2019 − Rev. P1** **NFAM3065L4BT** ## **APPLICATION SCHEMATIC** **==> picture [485 x 476] intentionally omitted <==** **----- Start of picture text -----**<br> 5V line<br>RTH (39)<br>* NTC Thermistor<br>VB(U) (3) VTH (38)<br>VS(U) (1) P (37)<br>CS + C1<br>VB<br>HIN(U) (6) HIN HOUT<br>VDD(UH) (4) VDD HVIC1<br>U (36)<br>VSS VS<br>VB(V) (9)<br>VS(V) (7)<br>VB<br>HIN(V) (12) HIN HOUT<br>VDD(VH) (10) VDD HVIC2<br>V (35)<br>VSS VS Motor<br>VB(W) (15)<br>VS(W) (13)<br>MCU VB<br>HIN(W) (18) HIN HOUT<br>VDD(WH) (16) VDD HVIC3<br>W (34)<br>VSS VS<br>VTS (20) VTS<br>LIN(U) (21) LIN(U) OUT(U)<br>LIN(V) (22) LIN(V) NU (33)<br>LIN(W) (23)<br>LIN(W)<br>5V line<br>LVIC<br>VFO (24) VFO OUT(V)<br>CFOD (25) CFOD NV (32)<br>CIN (26) CIN<br>15V line<br>VDD(L) (28) VDD<br>VSS (27) VSS OUT(W)<br>NW (31)<br>Signal for over current trip<br>Phase current<br>**----- End of picture text -----**<br> **Figure 2. Application Schematic − Adjustable Option** **www.onsemi.com** **2** **NFAM3065L4BT** ## **BLOCK DIAGRAM** **==> picture [442 x 541] intentionally omitted <==** **----- Start of picture text -----**<br> RTH (39)<br>* NTC Thermistor<br>VTH (38)<br>VS(U) (1)<br>P (37)<br>VB(U) (3)<br>VB<br>VDD(UH) (4) VDD HOUT<br>HVIC1<br>HIN(U) (6) HIN<br>VSS VS U (36)<br>VS(V) (7)<br>VB(V)(9)<br>VB<br>VDD(VH) (10) VDD HOUT<br>HVIC2<br>HIN(V) (12) HIN<br>VSS VS V (35)<br>VS(W) (13)<br>VB(W) (15)<br>VB<br>VDD(WH) (16) VDD HOUT<br>HVIC3<br>HIN(W) (18) HIN<br>VSS VS W (34)<br>VTS (20) VTS OUT(U)<br>LIN(U) (21) LIN(U)<br>NU (33)<br>LIN(V) (22) LIN(V)<br>LIN(W) (23) LIN(W)<br>VFO (24) VFO OUT(V)<br>LVIC<br>CFOD (25) CFOD<br>NV (32)<br>CIN (26) CIN<br>VSS (27) VSS<br>VDD(L) (28) VDD OUT(W)<br>NW (31)<br>**----- End of picture text -----**<br> **Figure 3. Equivalent Block Diagram** **www.onsemi.com** **3** **NFAM3065L4BT** ## **PIN FUNCTION DESCRIPTION** |**Pin**|**Name**|**Description**| |---|---|---| |1|VS(U)|High-Side Bias Voltage GND for U phase IGBT Driving| |(2)|−|Dummy| |3|VB(U)|High-Side Bias Voltage for U phase IGBT Driving| |4|VDD(UH)|High-Side Bias Voltage for U phase IC| |(5)|−|Dummy| |6|HIN(U)|Signal Input for High-Side U Phase| |7|VS(V)|High-Side Bias Voltage GND for V phase IGBT Driving| |(8)|−|Dummy| |9|VB(V)|High-Side Bias Voltage for V phase IGBT Driving| |10|VDD(VH)|High-Side Bias Voltage for V phase IC| |(11)|−|Dummy| |12|HIN(V)|Signal Input for High-Side V Phase| |13|VS(W)|High-Side Bias Voltage GND for W phase IGBT Driving| |(14)|−|Dummy| |15|VB(W)|High-Side Bias Voltage for W phase IGBT Driving| |16|VDD(WH)|High-Side Bias Voltage for W phase IC| |(17)|−|Dummy| |18|HIN(W)|Signal Input for High-Side W Phase| |(19)|−|Dummy| |20|VTS|Voltage Output for LVIC Temperature Sensing Unit| |21|LIN(U)|Signal Input for Low-Side U Phase| |22|LIN(V)|Signal Input for Low-Side V Phase| |23|LIN(W)|Signal Input for Low-Side W Phase| |24|VFO|Fault Output| |25|CFOD|Capacitor for Fault Output Duration Selection| |26|CIN|Input for Current Protection| |27|VSS|Low-Side Common Supply Ground| |28|VDD(L)|Low-Side Bias Voltage for IC and IGBTs Driving| |(29)|−|Dummy| |(30)|−|Dummy| |31|NW|Negative DC-Link Input for U Phase| |32|NV|Negative DC-Link Input for V Phase| |33|NU|Negative DC-Link Input for W Phase| |34|W|Output for U Phase| |35|V|Output for V Phase| |36|U|Output for W Phase| |37|P|Positive DC-Link Input| |38|VTH|Thermistor Bias Voltage (T) / Not connection| |39|RTH|Series Resister for Thermistor (Temperature Detection) *optional for T| **www.onsemi.com** **4** **NFAM3065L4BT** ## **ABSOLUTE MAXIMUM RATINGS** (TC = 25 ° C) (Note 1) |**ABSOLUTE M**|**AXIMUM RATINGS**(TC= 25°C) (Note|1)||| |---|---|---|---|---| |**Symbol**|**Rating**|**Conditions**|**Value**|**Unit**| |VPN|Supply Voltage|P−NU, NV, NW|450|V| |VPN(surge)|Supply Voltage (Surge)|P−NU, NV, NW (Note 2)|500|V| |VPN(PROT)|Self Protection Supply Voltage Limit<br>(Short-Circuit Protection Capability)|VDD = VBS = 13.5 V to 16.5 V,<br>Tj = 150°C, VCES < 650 V,<br>Non-Repetitive, < 2�s|400|V| |Vces|Collector-emitter Voltage||650|V| |VRRM|Maximum Repetitive Revers Voltage||650|V| |±Ic|Each IGBT Collector Current||±30|A| |±Icp|Each IGBT Collector Current (Peak)|Under 1ms Pulse Width|±60|A| |VDD|Control Supply Voltage|VDD(H), VDD(L)−VSS|−0.3 to 20|V| |VBS|High-Side Control Bias voltage|VB(U)−VS(U), VB(V)−VS(V),<br>VB(W)−VS(W)|−0.3 to 20|V| |VIN|Input Signal Voltage|HIN(U), HIN(V), HIN(W), LIN(U), LIN(V),<br>LIN(W)–VSS|−0.3 to VDD|V| |VFO|Fault Output Supply Voltage|VFO–VSS|−0.3 to VDD|V| |IFO|Fault Output Current|Sink Current at VFO pin|2|mA| |VCIN|Current Sensing Input Voltage|CIN–VSS|−0.3 to VDD|V| |Pc|Corrector Dissipation|Per One Chip|113|W| |Tj|Operating Junction Temperature||−40 to +150|°C| |Tstg|Storage Temperature||−40 to +125|°C| |Tc|Module Case Operation<br>Temperature||−40 to +125|°C| |Viso|Isolation Voltage|60 Hz, Sinusoidal, AC 1 minute,<br>Connection Pins to Heat Sink Plate|2500|V rms| Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe Operating parameters. 2. This surge voltage developed by the switching operation due to the wiring inductance between P and NU, NV, NW terminal. ## **THERMAL CHARACTERISTICS** |**Symbol**|**Rating**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Rth(j-c)Q|Junction-to-Case Thermal<br>Resistance|Inverter IGBT Part (per 1/6 module)|−|−|1.1|°C/W| |Rth(j-c)F||Inverter FWD Part (per 1/6 module)|−|−|2.2|°C/W| 3. Refer to ELECTRICAL CHARACTERISTICS, RECOMMENDED OPERATING RANGES and/or APPLICATION INFORMATION for Safe Operating parameters. **www.onsemi.com** **5** **NFAM3065L4BT** ## **RECOMMENDED OPERATING CONDITIONS** |**Symbol**|**Rating**|**Conditions**|**Conditions**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---|---| |VPN|Supply Voltage|P to NU, NV, NW||0|−|400|V| |VDD|Gate Driver Supply<br>Voltages|VDD(HU,HV,HW), VDD(L) to VSS||13.5|15|16.5|V| |VBS||VB(U) to VS(U), VB(V) to VS(V),<br>VB(W) to VS(W)||13.0|15|18.5|V| |dVDD / dt,<br>dVBS / dt|Supply Voltage Variation|||−1|−|1|V/�s| |fPWM|PWM Frequency|||1|−|20|kHz| |DT|Dead Time|Turn-off to Turn-on (external)||1.5|−|−|�s| |Io|Allowable r.m.s. Current|VCC = 300 V,<br>VD = 15 V,<br>P.F. = 0.8<br>Tc≤100°C,<br>Tj≤150°C<br>(Note 5)|fPWM= 5 kHz|−|25.7|−|A rms| ||||fPWM= 15 kHz|−|18.8|−|| |PWIN (on)|Allowable Input Pulse<br>Width|VCC = 450 V, VD = 18.5 V<br>Ic = 30 A, Tc = 100°C||0.7|−|−|�s| |PWIN (off)||||1.5|−|−|| ||Package Mounting Torque|M3 type screw||0.6|0.7|0.9|Nm| Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 4. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 5. Allowable r.m.s current depends on the actual conditions. 6. Flatness tolerance of the heatsink should be within −50 � m to +100 � m. ## **ELECTRICAL CHARACTERISTICS** (TC = 25 ° C, VD = 15 V, VDB = 15 V, unless otherwise specified.) (Note 7) |**ELECTRICAL**|**CHARACTERISTICS**(TC= 25|**CHARACTERISTICS**(TC= 25|°C, VD = 15 V, VDB = 15 V, unless otherwise specif|ied.) (Not|e 7)||| |---|---|---|---|---|---|---|---| |**Symbol**|**Parameter**||**Test Conditions**|**Min**|**Typ**|**Max**|**Unit**| |**INVERTER SECTION**|||||||| |Ices|Collector-Emitter Leakage<br>Current||Vce = Vces, Tj = 25°C|−|−|1|mA| ||||Vce = Vces, Tj = 150°C|−|−|10|mA| |VCE(sat)|Collector-Emitter Saturation<br>Voltage||VDD = VBS = 15 V, IN = 5 V<br>Ic = 30 A, Tj = 25°C|−|1.60|2.30|V| ||||VDD = VBS = 15 V, IN = 5 V<br>Ic = 30 A, Tj = 150°C|−|1.80|−|V| |VF|FWDi Forward Voltage||IN = 0 V, Ic = 30 A, Tj = 25°C|−|2.00|2.40|V| ||||IN = 0 V, Ic = 30 A, Tj = 150°C|−|2.00|−|V| |ton|Switching Times|High Side|VPN = 300 V, VDD(H) = VDD(L) = 15 V<br>Ic = 30 A, Tj = 25°C, IN = 0⇔5 V<br>Inductive Load|0.80|1.25|1.85|�s| |tc(on)||||−|0.25|0.65|�s| |toff||||−|1.60|2.20|�s| |tc(off)||||−|0.25|0.75|�s| |trr||||−|0.15|−|�s| |ton||Low Side|VPN = 300 V, VDD(H) = VDD(L) = 15 V<br>Ic = 30 A, Tj = 25°C, IN = 0⇔5 V<br>Inductive Load|0.80|1.40|2.00|�s| |tc(on)||||−|0.25|0.55|�s| |toff||||−|1.60|2.20|�s| |tc(off)||||−|0.25|0.75|�s| |trr||||−|0.10|−|�s| **www.onsemi.com** **6** ## **NFAM3065L4BT** **ELECTRICAL CHARACTERISTICS** (TC = 25 ° C, VD = 15 V, VDB = 15 V, unless otherwise specified.) (Note 7) (continued) |**ELECTRICAL**|**CHARACTERISTICS**(TC= 25|°C, VD = 15 V, VDB = 15 V, unless otherwise specif|°C, VD = 15 V, VDB = 15 V, unless otherwise specif|ied.) (Not|e 7) (cont|inued)|| |---|---|---|---|---|---|---|---| |**Symbol**|**Parameter**|**Test Conditions**||**Min**|**Typ**|**Max**|**Unit**| |**DRIVER SECTION**|||||||| |IQDDH|Quiescent VDD Supply<br>Current|VDD(UH,VH,WH) = 15 V,<br>HIN(U,V,W) = 0 V|VDD(UH)−VSS<br>VDD(VH)−VSS<br>VDD(WH)−VSS|−|−|0.30|mA| |IQDDL||VDD(L) = 15 V,<br>LIN(U,V,W) = 0 V|VDD(L)−VSS|−|−|3.50|mA| |IPDDH|Operating VCC Supply<br>Current|VDD(UH,VH,WH) = 15 V,<br>fPWM= 20 kHz, Duty = 50%,<br>Applied to one PWM Signal<br>Input for High-Side|VDD(UH)−VSS<br>VDD(VH)−VSS<br>VDD(WH)−VSS|−|−|0.40|mA| |IPDDL||VDD(L) = 15 V,<br>fPWM= 20 kHz, Duty = 50%,<br>Applied to one PWM Signal<br>Input for Low-Side|VDD(L)−VSS|−|−|6.00|mA| |IQBS|Quiescent VBS Supply<br>Current|VBS = 15 V,<br>HIN(U,V,W) = 0 V|VB(U)−VS(U)<br>VB(V)−VS(V)<br>VB(W)−VS(W)|−|−|0.30|mA| |IPBS|Operating VBS Supply<br>Current|VDD = VBS = 15 V,<br>fPWM= 20 kHz, Duty = 50%,<br>Applied to one PWM Signal<br>Input for High-Side|VB(U)−VS(U)<br>VB(V)−VS(V)<br>VB(W)−VS(W)|−|−|5.00|mA| |VIN(ON)|ON Threshold Voltage|HIN(U,V,W)−VSS, LIN(U,V,W)−VSS||−|−|2.6|V| |VIN(OFF)|OFF Threshold Voltage|||0.8|−|−|V| |VCS(ref)|Short Circuit Trip Level|VDD = 15 V, CIN−VSS||0.45|0.48|0.51|V| |UVDDD|Supply Circuit<br>Under-Voltage Protection|Detection Level||10.3|−|12.5|V| |UVDDR||Reset Level||10.8|−|13.0|V| |UVBSD||Detection Level||10.0|−|12.0|V| |UVBSR||Reset Level||10.5|−|12.5|V| |VTS|Voltage Output for LVIC<br>Temperature Sensing Unit|VTS−VSS = 10 nF, Temp. = 25°C||(0.905)|(1.030)|(1.155)|V| |VFOH|Fault Output Voltage|VDD = 0 V, CIN = 0 V,<br>VFO Circuit: 10 k�to 5 V Pull-up||4.9|−|−|V| |VFOL||VDD = 0 V, CIN = 1 V,<br>VFO Circuit: 10 k�to 5 V Pull-up||−|−|0.95|V| |tFOD|Fault-Output Pulse Width|CFOD = 22 nF||1.6|2.4|−|ms| |**BOOTSTRAP SECTION**|||||||| |VF|Bootstrap Diode Forward<br>Current|If = 0.1 A||3.4|4.6|5.8|V| |RBOOT|Built-in Limiting Resistance|||30|38|46|�| Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 7. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TJ = TA = 25 � C. Low duty cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible. 8. The fault-out pulse width tFOD depends on the capacitance value of CFOD according to the following approximate equation: tFOD = (TBD) × 106 × CFOD (s). 9. Values based on design and/or characterization. **www.onsemi.com** **7** **NFAM3065L4BT** ## **Temperature of LVIC versus VTS Characteristics** **==> picture [361 x 210] intentionally omitted <==** **----- Start of picture text -----**<br> 4,0<br>3,5<br>3,0<br>2,5<br>2,0<br>1,5<br>1,0<br>40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 125 130<br>LVIC Temperature ( � C)<br>VTS Output Voltage (V)<br>**----- End of picture text -----**<br> **Figure 4. Temperature of LVIC versus VTS Characteristics** **Table 1. THERMISTOR CHARACTERISTICS (INCLUDED ONLY IN NFAM3060L4BT)** |**Parameter**|**Symbol**|**Condition**|**Min**|**Typ**|**Max**|**Unit**| |---|---|---|---|---|---|---| |Resistance|R25|Tc = 25°C|46.530|47|47.47|k�| |Resistance|R125|Tc = 100°C|1.344|1.406|1.471|k�| |B-Constant (25−50°C)|−|B|4009.5|4050|4090.5|K| |Temperature range|−|−|−40|−|+125|°C| **==> picture [376 x 226] intentionally omitted <==** **----- Start of picture text -----**<br> 10000<br>1000<br>min<br>typ<br>100 max<br>10<br>1<br>−40 −30 −20 −10 0 10 20 30 40 50 60 70 80 90 100 110 120 130<br>LVIC Temperature ( � C)<br>VTS Output Voltage (V)<br>**----- End of picture text -----**<br> **Figure 5. Thermistor Resistance versus Case Temperature** **www.onsemi.com** **8** **NFAM3065L4BT** ## **PACKAGE DIMENSIONS** **MINI DIP39, 31.0x54.5** CASE MODGC ISSUE A **==> picture [48 x 75] intentionally omitted <==** **www.onsemi.com** **9** **NFAM3065L4BT** ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. 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ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ## **PUBLICATION ORDERING INFORMATION** ## **LITERATURE FULFILLMENT** : Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA **Phone** : 303−675−2175 or 800−344−3860 Toll Free USA/Canada **Fax** : 303−675−2176 or 800−344−3867 Toll Free USA/Canada **Email** : orderlit@onsemi.com **N. American Technical Support** : 800−282−9855 Toll Free USA/Canada **Europe, Middle East and Africa Technical Support:** Phone: 421 33 790 2910 **ON Semiconductor Website** : **www.onsemi.com** **Order Literature** : http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative ◊ **NFAM3065L4BT/D** **www.onsemi.com** **10**
Updated at April 27, 2026
onsemi is a premier global supplier of intelligent power and sensing technologies, driving disruptive innovations across the automotive, industrial, and cloud infrastructure markets. Recognized for their commitment to sustainability and reliable supply chains, the company accelerates advancements in vehicle electrification, industrial automation, and 5G networks by solving the industry's most complex design challenges. At the core of their portfolio is an industry-leading selection of discrete semiconductors. This extensive range features thousands of high-performance bipolar transistors, single and dual MOSFETs, and a comprehensive array of diodes, including Zener, Schottky, and fast-recovery rectifiers. Engineered for superior thermal performance and energy efficiency, these foundational components are critical for demanding power conversion, switching, and signal conditioning applications. Beyond essential discretes, onsemi provides a robust suite of advanced power management and circuit protection solutions. Their lineup includes intelligent power modules, single IGBTs, and transient voltage suppression (TVS) diodes designed to safeguard sensitive circuitry. Complimented by integrated passive filters, AC/DC LED driver ICs, and specialized sub-2.4GHz RF transceivers, onsemi equips engineers with the scalable, high-quality technologies needed to build a cleaner, smarter, and more connected world.
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