NB21K00103KBB

Thermistor, NTC, 10 kohm, NB21 Series, 3630 K, SMD, 0603 [1608 Metric]

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Manufacturer: KYOCERA AVX
Product type:
Zero Power Resistance at 25°C:10kohm; Product Range:NB21 Series; Thermistor Mounting:SMD; Beta Value (K):3630K; Thermistor Case Style:0603 [1608 Metric]; Thermistor Terminals:-; Operating Temp
SVHC: No SVHC (17-Jan-2023)
B-Constant: 3630K
Lead Length: -
NTC Mounting: Surface Mount
NTC Case Size: 0603 [1608 Metric]
Product Range: NB21 Series
Qualification: AEC-Q200
Probe Diameter: -
Probe Material: -
Thermistor Type: NTC
Resistance (25°C): 10kohm
Thermistor Mounting: SMD
B-Constant Tolerance: ± 3%
Thermistor Case Style: 0603 [1608 Metric]
Operating Temperature Max: 150°C
Operating Temperature Min: -55°C
Resistance Tolerance (25°C): ± 10%
Thermal Time Constant (in Air): 4s

Delivery and price
Units per pack	4000
Price	0.131 €
Current stock	10+
Lead time	30 days

Datasheet

## **NTC SMD Thermistors** 

## **With Nickel Barrier Termination NB 21 - NB 23** 

Chip thermistors are high quality and low cost devices especially developed for surface mounting applications. They are widely used for temperature compensation but can also achieve temperature control of printed circuits. 

A nickel barrier metallization provides outstanding qualities of solderability and enables this chip to meet the requirements of the most severe soldering processes. 

**NB 21 NB 23 Types IEC SIZE : 0603 IEC SIZE : 0402** ~~ee ee~~ 1.0 ± 0.1 (0.04 ± 0.004) 1.6 (.063)  0.2 (.008) 0.40 ± 0.1 **DIMENSIONS:** 0.8 (.031) (0.02 ±0.004) ±0.2 (.008) **millimeters (inches)** 0.8 (.031) 0.60 (0.024) max ±0.2 (.008) 0.2 (.008) min 0.2 (.008) min 0.25 (0.10) min 0.25 (0.10) min Terminations Nickel Barrier Marking On packaging only Climatic category 40/125/56 ~~a~~ Operating temperature -55°C to +150°C Tolerance on Rn (25°C) ±5%, ±10%, ±20% ~~a~~ Maximum dissipation at 25°C 0.07 W 0.06 W ~~a~~ Thermal dissipation factor 1 mW/°C 0.8 mW/°C Thermal time constant 4 s 3 s ~~eea~~ Resistance - Temperature characteristics: pages 36 to 40. 

## **APPLICATIONS** 

- LCD compensation 

- Battery packs 

- Mobile phones 

- CD players 

- Heating systems 

- Air-conditioning systems 

- Temperature control of Switch Mode Power Supplies 

- Compensation of pressure sensors 

- Protection of power transistors in various electronic circuits 

## **HOW TO ORDER** 

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NB 21 K 0 0103 M BB<br>aa Type Material Code | Resistance | Tolerance | Suffix: Packaging |<br>K 10,000 Ω M (±20%) – –: Bulk<br>(See tables page 15) J (±5%) BB: Cardboard tape<br>K (±10%) (180mm diam. reel)<br>BF: Cardboard tape (1/2 reel)<br>BD: Cardboard tape<br>(330mm diam. reel)<br>**----- End of picture text -----**<br>


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## **NTC SMD Thermistors** 

## **With Nickel Barrier Termination NB 21 - NB 23** 

## **TABLE OF VALUES** 

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NB 21<br>IEC SIZE : 0603<br>Rn at 25°C Material B (K) � at 25°C<br>Types ( Ω ) Code ( � B/B            (1) ± 5%(2) ± 3%) (%/°C)<br>NB 21 KC 0 470 47<br>NB 21 KC 0 101 100 KC 3470 ± 5% – 3.9<br>NB 21 KC 0 471 470<br>NB 21 MC 0 102 1,000 MC 3910 ± 3% – 4.4<br>NB 21 J 0 0472 4,700 J 3480 ± 3% – 3.9<br>NB 21 J 5 0682 6,800 3480 ± 3% – 3.9<br>J5<br>NB 21 J 5 0103 10,000 3480 ± 3% – 3.9<br>NB 21 K 0 0103 10,000 K 3630 ± 3% – 4.0<br>NB 21 K 0 0153 15,000<br>NB 21 L 0 0223 22,000 L 3790 ± 3% – 4.2<br>NB 21 M 0 0333 33,000 M 3950 ± 3% – 4.4<br>NB 21 M 0 0473 47,000<br>NB 21 L 2 0683 68,000 L2 3805 ± 3% – 4.1<br>NB 21 N 0 0683 68,000 N 4080 ± 3% – 4.6<br>NB 21 N 5 0104 100,000 N5 4160 ± 3% – 4.7<br>NB 21 P 0 0154 150,000 P 4220 ± 3% – 4.7<br>NB 21 Q 0 0334 330,000 Q 4300 ± 3% – 4.7<br>NB 21 Q 0 0474 470,000<br>**----- End of picture text -----**<br>


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NB 23<br>IEC SIZE : 0402<br>Rn at 25°C Material B (K) � at 25°C<br>Types ( Ω ) Code ( � B/B            (1) ± 5%(2) ± 3%) (%/°C)<br>NB 23 NC 0 103 10,000 NC 4080 ± 3% – 4.6<br>NB 23 RC 0 103 10,000 RC 4340 ± 3% – 4.7<br>NB 23 NC 0 153 15,000<br>NC 4080 ± 3% – 4.6<br>NB 23 NC 0 223 22,000<br>NB 23 RC 0 223 22,000 RC 4340 ± 3% – 4.7<br>NB 23 RC 0 333 33,000<br>NB 23 NE 0 473 47,000 NE 4100 ± 3% – 4.6<br>NB 23 RC 0 473 47,000<br>NB 23 RC 0 683 68,000 RC 4340 ± 3% – 4.7<br>NB 23 RC 0 104 100,000<br>**----- End of picture text -----**<br>


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## **Packaging for Automatic Insertion** 

## **NTC Chip Thermistors / NC/NB Series** 

## **AUTOMATIC INSERTION** 

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Cover Tape Hole 1 (.039) +0.2 (.008)-0<br>Max<br>Super 8 Plastic Tape Packaging: 3° A1<br>The mechanical and dimensional reel characteristics are in<br>5.5 (.217) B0 B1<br>accordance with the IEC publication 286-3. ±0.2 (.008) F W<br>Max<br>3° D0 P2<br>E<br>30µ ± 5µ P0<br>T<br>K Max3° Max3° Direction ofunreeling<br>A0<br>R = 0.3 (.012) Max.<br>**----- End of picture text -----**<br>


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Designation Symbol Value Tolerance<br>Tape width W 8 ±0.2<br>Tape thickness T 0.4 max.<br>—— Pitch of the sprocket holes P0 4 ±0.1<br>Diameter of the sprocket holes D0 1.5 ±0.1<br>-0<br>Distance E 1.75 ±0.1<br>Distance (center to center) F 3.5 ±0.05<br>Distance (center to center) P2 2 ±0.1<br>Sizes of the       NC 12 (0805) A0 1.5 ±0.1<br>cavities B0 2.4 ±0.1<br>K 1.4 max. K ±0.1<br>(size is adjustable)<br>(K = t1 +0.2)<br>NC 20 (1206) A0 1.95 ±0.1<br>B0 3.55 ±0.1<br>K 1.5 max. K ±0.1<br>(size is adjustable)<br>(K = t1 +0.2)<br>/ a ee<br>+ 0<br>ø180 (7.09) - 2 (.079)<br>ø 12.75 (.502)  [+ 0.15 (.006)] - 0 Reel<br>Upper side<br>Bottom side<br>Reel<br>14.4 (.567) w max. +0.15 (.006)8.4 (.331)  e according toISO/DIS 3639-2 i e<br>ø 20.5 (.087)  [+ 0.5 (.020)] - 0<br> 1.5 (.059)<br>ø 62 (2.44) ±<br>Direction of  unreeling<br>**----- End of picture text -----**<br>


## **QUANTITY PER REEL** 

|**Type**|**Suffix**|**Qty Per Reel**|
|---|---|---|
|NC - NB 12|BA<br>BE|4000<br>2000|
|NC 20 - NB 20|BA<br>BE|3000<br>1500|



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## **Packaging for Automatic Insertion** 

## **NTC Chip Thermistors / NC/NB Series** 

## **AUTOMATIC INSERTION** 

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10 PITCHES CUMULATIVE<br>8mm Paper Tape Packaging: P0 TOLERANCE ON TAPE<br>The mechanical and dimensional reel characteristics T D0 P2 0.20mm (0.008)<br>are in accordance with the IEC publication 286-3.<br>E1<br>BOTTOM  TOP<br>COVER COVER F W<br>TAPE TAPE B0 E2<br>G<br>T1 A0 P1<br>a5 T1 CAVITY SIZE el A CENTER LINES d e m = “L]<br>SEE NOTE 1 OF CAVITY User Direction of Feed<br>**----- End of picture text -----**<br>


**Designation Symbol Value Tolerance** ~~ee~~ TaTappe widthe thickness ~~ee~~ WT ~~ee~~ 1.1 max.8 -.0.1/+0.3 ~~es~~ Pitch of the sprocket holes P0 4 ±0.1 Diameter of the sprocket holes 1.5 D0 ±0.1 ~~ee~~ -0/+0.1 Distance E1 1.75 ±0.1 ~~a~~ Distance (center to center) ~~ee~~ F ~~ee~~ 3.5 ±0.05 Distance (center to center) P2 2 ±0.05 ~~es~~ Cover tape thickness T1 0.10 max. Distance E2 6.25 min. Distance G 0.75 min. ~~a~~ Component pitch 0805/0603 4 ±0.1 P1 0402 2 ±0.1 ~~res ce ee~~ 

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+ 0<br>ø180 (7.09) - 2 (.079)<br>ø 12.75 (.502)  [+ 0.15 (.006)] - 0<br>Reel<br>14.4 (.567) i max. +0.15 (.006)8.4 (.331)  e according toISO/DIS 3639-2<br>ø 20.5 (.087)  [+ 0.5 (.020)] - 0<br> 1.5 (.059)<br>ø 62 (2.44) ±<br>**----- End of picture text -----**<br>


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Reel<br>Upper side<br>Bottom side<br>| e<br>Direction of  unreeling<br>**----- End of picture text -----**<br>


## **QUANTITY PER REEL** 

|**Type**|**Suffix**|**Qty Per Reel**|
|---|---|---|
|NB - NC 12<br>NB 21|BB<br>BF|4000<br>2000|
|NB 23|BB<br>BF|10000<br>5000|



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## **Surface Mounting Guide** 

## **Chip Thermistor – Application Notes** 

## **STORAGE** 

Good solderability is maintained for at least twelve months, provided the components are stored in their “as received” packaging at less than 40°C and 70% RH. 

## **SOLDERABILITY / LEACHING** 

Terminations to be well soldered after immersion in a 60/40 tin/lead solder bath at 235 ± 5°C for 2 ± 1 seconds. 

Terminations will resist leaching for at least the immersion times and conditions recommendations shown below. 

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P/N Termination Solder Solder Immersion<br>Type Tin/Lead Temp ºC Time Seconds<br>NC AgPdPt 60/40 260 ± 5 15 max<br>NB Nickel Barrier 60/40 260 ± 5 30 ± 1<br>**----- End of picture text -----**<br>


NB products are compatible with a wide range of soldering conditions consistent with good manufacturing practice for surface mount components. This includes Pb free reflow processes with peak temperatures up to 270ºC. Recommended profiles for reflow and wave soldering are shown below for reference. 

NC products are recommended for lead soldering application or gluing techniques. 

## **Reflow** 

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300<br>Preheat Natural<br>Cooling<br>250<br>200<br>220ºC<br>150 to<br>250ºC<br>100<br>  50<br>    0<br>1min 1min 10 sec. max<br>(Minimize soldering time)<br>Solder Temp.<br>**----- End of picture text -----**<br>


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300<br>250<br>200<br>150<br>100<br>50<br>0<br>0 50 100 150 200 250 300<br>• Pre-heating: 150°C ±15°C / 60-90s Time (s)<br>• Max. Peak Gradient: 2.5°C/s<br>Temperature °C<br>**----- End of picture text -----**<br>


- Peak Temperature: 245°C ±5°C 

- Time at >230°C: 40s Max. 

## **Wave** 

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300<br>Preheat<br>Natural<br>250 Cooling<br>200 T<br>150 230ºCto<br>250ºC<br>100<br>  50<br>    0<br>1 to 2 min 3 sec. max<br>(Preheat chips before soldering)<br>T/maximum 150°C<br>Solder Temp.<br>**----- End of picture text -----**<br>


- a)  The visual standards used for evaluation of solder joints will need to be modified as lead free joints are not as bright as with tin-lead pastes and the fillet may not be as large. 

- b)  Resin color may darken slightly due to the increase in temperature required for the new pastes. 

- c)  Lead-free solder pastes do not allow the same self alignment as lead containing systems. Standard mounting pads are acceptable, but machine set up may need to be modified. 

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D2<br>RECOMMENDED<br>SOLDERING PAD  D1 D3<br>LAYOUT<br>D4<br>Dimensions in<br>mm (inches)<br>D5<br>**----- End of picture text -----**<br>


## **REFLOW SOLDERING** 

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Case<br>P/N D1 D2 D3 D4 D5<br>Size<br>1.70 0.60 0.50 0.60 0.50<br>0402 NB23<br>(.067) (.024) (.020) (.024) (.020)<br>2.30 0.80 0.70 0.80 0.75<br>0603 NB21<br>(.091) (.031) (.028) (0.31) (.030)<br>3.00 1.00 1.00 1.00 1.25<br>0805 NB12<br>(.118) (.039) (.039) (.039) (.049)<br>4.00 1.00 2.00 1.00 2.50<br>1206 NB20<br>(.157) (.039) (.079) (.039) (.098)<br>**----- End of picture text -----**<br>


## **WAVE SOLDERING** 

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Case<br>P/N D1 D2 D3 D4 D5<br>Size<br>3.10 1.20 0.70 1.20 0.75<br>0603 NB21<br>(.122) (.047) (.028) (.047) (.030)<br>4.00 1.50 1.00 1.50 1.25<br>0805 NB12<br>(.157) (.059) (.039) (.059) (.049)<br>5.00 1.50 2.00 1.50 1.60<br>1206 NB20<br>(.197) (.059) (.079) (.059) (.063)<br>**----- End of picture text -----**<br>


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Updated at June 8, 2026

KYOCERA AVX is a globally recognized leader in the design, development, and manufacturing of advanced electronic components. For over 50 years, the company has provided innovative solutions across the automotive, industrial, medical, military, consumer electronics, and communications markets. Supported by an extensive international network of research and production facilities, KYOCERA AVX is renowned for delivering highly reliable components that meet the stringent demands of modern engineering. The manufacturer's extensive portfolio is strongly anchored in high-performance passive components, with a particular emphasis on advanced capacitive solutions. Their offering features a comprehensive selection of polymer capacitors, RF capacitors, and supercapacitors engineered for demanding power and high-frequency requirements. This core lineup is further supported by a variety of film and aluminium electrolytic capacitors, alongside precision power inductors. Beyond passive components, KYOCERA AVX excels in robust circuit protection and discrete semiconductors. Their expertise in transient voltage suppression is demonstrated by a wide array of TVS varistors and TVS diodes, complemented by temperature-sensing NTC thermistors and reliable Schottky diodes. The product ecosystem is completed by precision timing devices, including crystals and resonators, as well as specialized RF antennas, providing engineers with a versatile and dependable foundation for next-generation technology.

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